1294323 九、發明說明： 【發明所屬之技術領域】1294323 IX. Description of invention: [Technical field to which the invention belongs]
本發明是有關於光熱式解焊機，特別是 適用範圍廣泛且加熱效能佳之解焊機妹構。 種體積 【先前技術】 見之解焊裝置，係指運用於將電路板上電子元 牛^^部份解除，以便於㈣電子元件取下，而可提供 致或維修服務之設備；目前較傳統之解焊設備，大 致刀有熱風搶、BGA處理器與小錫爐等三種，並中. 除的2搶：係熱風的原理直接吹拂於電路板上欲移 取該^子=’使其週邊之銲錫炫化’再利用真空裳置吸 件之件；惟此種熱風搶裝置因係直接環繞於電子元 熱風’所以只能適用於SMD之sop類型 控制，元件’且其設置距離與對應溫度不易 壞難以再利用之情形。 型電裂置:係為專用於BGA (表面接著)類 奸丄 牛斗接之裝置，如台灣專利公主第啼「 錫球陣列ic焊接及…心：J “弟383983旒「 陣列B G A f^ 公告第馳972號「錫球 ，1雖皆焊接裝置改良」等二新型專利案所揭示者 焊:功能，=:Γ球陣列BGA之焊接，亦兼具有解 之方歧其亦係採賴風直接吹於電子树周緣 杯锡’因此同樣地具有相同於前述熱風搶加執 1294323 不均勻、易破壞鄰近其他電子元件之缺點，且其整體造價 昂貴、應用範圍亦較窄。 小錫爐：一般至少設有一電源開關與一溫度控制旋鈕 ’且其頂部具有一橫向設置之除錫棒，利用該溫度控制旋 知控制該除錫棒之表面溫度，當利用該小錫爐解焊時，係 將待處理之電路板設置於該除錫棒上，並使欲解焊之電子 元件底部接腳接觸於該除錫棒，利用該除錫棒之熱量熔化 "亥黾子元件各接腳之銲錫，進而達到解焊之目的；惟此種 丨小锡爐因採直接接觸之加熱型式，僅能應用於電路板背面 直接接觸之形態，故只適用於〇〗p類型（接腳穿透式） 之電子元件解焊。 有鐘於上述傳統解焊設備具有各項使用上之缺失及侷 『適用乾圍之h形’本案發明人乃有一台灣專利公告第 41?530號及美國專利號碼us 6,3〇1，436 β1「光熱式解焊 機」之前案創作，其主要係於一控制台上設有開關與溫度 .控制旋鈕，且於該控制台頂部設有一向上開口之架體，於 忒木體内置一光源，架體頂部罩設一鋁反射板用以反射光 源且鋁反射板内面係設有溫度感應器用以感测表面溫度 ’該開關與溫度控制旋姐則供控制光源之亮度，當溫度感 應裔所感測到之表面溫度與溫度控制旋紐所設定之溫度相 同日:’、即控制切斷供應光源之電源，藉由光源產生熱傳導 式提供解悍所需之熱能溫度，形成—種間接式加熱形 =使其可適用於前述SMD、BGA類型（表面接著）The invention relates to a photothermal type de-soldering machine, in particular to a desoldering machine which has a wide range of application and good heating performance. Volume [Prior Art] See the desoldering device, which refers to the device used to remove the electronic components on the circuit board to facilitate (4) the removal of electronic components, and to provide equipment for maintenance or repair; The desoldering equipment, the general knife has hot air grab, BGA processor and small tin furnace, and so on. In addition to the 2 grab: the principle of hot air directly boasted on the circuit board to remove the ^ = = to make it The solder sleek 'reuses the vacuum to put the suction piece; but this hot air grab device is directly surrounded by the electronic element hot air' so it can only be applied to the SMD type of sop type control, the component 'and its set distance and corresponding temperature It is not easy to be broken and difficult to reuse. Type electric rupture: It is a device specially designed for BGA (surface-to-surface) traits, such as Taiwan Patent Princess 啼 " solder ball array ic soldering and ... heart: J " brother 383983 旒" array BGA f^ announcement The second type of patents such as the No. 972 "Pin ball, 1 improvement of the welding device" is disclosed. The welding function: =: The welding of the ball-arc array BGA is also the solution of the solution. Directly blowing on the periphery of the electronic tree, the cup tin is similarly the same as the above-mentioned hot air grabbing 1294323, which is uneven and easily damages other electronic components. The overall cost is high and the application range is narrow. Tin solder furnace: generally has at least one power switch and one temperature control knob' and has a laterally disposed tin removing rod at the top thereof, and uses the temperature control to control the surface temperature of the tin removing rod, when using the small tin furnace solution During soldering, the circuit board to be processed is placed on the tin-removing rod, and the bottom pin of the electronic component to be desoldered is contacted with the tin-removing rod, and the heat of the tin-removing rod is used to melt the The soldering of each pin can achieve the purpose of desoldering; however, the type of the small tin furnace can only be applied to the direct contact of the back of the circuit board due to the direct contact heating type, so it is only suitable for the type of p The foot-through type of electronic components are desoldered. There are bells in the above-mentioned traditional desoldering equipment that have various uses and the bureau's "applicable to the h-shaped". The inventor of this case has a Taiwan Patent Notice No. 41?530 and the US patent number us 6,3〇1,436 The β1 "photothermal desoldering machine" was created in the previous case. It is mainly equipped with a switch and temperature control knob on a console, and an upwardly open frame body is arranged on the top of the console, and a light source is built in the raft body. The top of the frame is covered with an aluminum reflector for reflecting the light source and the inner surface of the aluminum reflector is provided with a temperature sensor for sensing the surface temperature. The switch and the temperature control knob are used to control the brightness of the light source. The measured surface temperature is the same as the temperature set by the temperature control knob: ', that is, the power supply that cuts off the supply light source is controlled, and the heat conduction temperature required to provide the heat dissipation by the light source is formed to form an indirect heating shape. = Make it applicable to the aforementioned SMD, BGA type (surface followed by)
Ip類型（接腳穿透式）等各種電子元件，且具溫度 1294323 控制、避免電路板軟減鄰近電子元件損壞等優點；缺而 ’上述之㈣結構於實際應用上財功能過於簡單而難以 滿足較複雜作業需求之情形，因此，本案發明人乃再研究 改進之道，終於有本發明產生。 【發明内容】 本务明之主要目的在於提供一種光熱式解焊機，其具 有較精準之溫度控制及較佳之能_用效率，可達到極佳 之經濟效益。 本發明之另-目的在於提供—種光減解焊機，其整 體結構之體積極小，卻可處理A面積電路板之解焊作業， 具有極佳之空間利用效率。 包括 該加熱管上方蓋設-可聚熱保溫之聚熱板，另於該凹陷部 位底面設有-通風π對應於該上蓋板之部份風扇，可供導 入氣流’而該凹陷部位周侧則設有複數通風槽孔，可供熱 空氣向外排出’以降低該凹陷部位内之溫度，又該加熱罩 底侧係以複數銅柱支撐於前述上蓋板上方，使該加熱罩與 本發明為達成上述目的及功效，其所採行的技術手段 機车目，係頂侧開口之中空殼體，其内可供容置 一電源供應電路板，於該_之前難結合有複數 知鍵及至）-顯不裝置；—上蓋板，係蓋合於該機箱之開 口其中!又部位設有複數鏤空部，於各鐘空部底侧可分別 固定-向上排氣之風扇；—加熱罩，中央設—凹陷部位， 於該凹陷雜中段跨設有至少—可幅射發熱之加熱管，而 1294323 上盖板間形成具〜> Βθ 上之氣流可流通於；之結合’以便於由上蓋板之風扇向 向下傳遞至上• 熱罩之底側，隔離該加熱管之熱量 上，其包括二平行二1路板定位機構，鮮於該上蓋板 接桿上另設有複‘；且可相對滑移之銜接桿，且於各衝 寸之電路板錢乡之定位元件，以㈣㈣長寬尺 &位於前述聚熱板上方。Ip type (pin penetration type) and other electronic components, and temperature 1294323 control, to avoid the board soft reduction and adjacent electronic components damage; lack of 'the above (four) structure in practical applications, the financial function is too simple and difficult to meet In the case of more complicated operation requirements, therefore, the inventor of the present invention has studied the improvement and finally has the invention. SUMMARY OF THE INVENTION The main object of the present invention is to provide a photothermal type desoldering machine which has more precise temperature control and better energy efficiency, and can achieve excellent economic benefits. Another object of the present invention is to provide a light-reduction soldering machine which has a compact overall structure and can handle the desoldering operation of the A-area circuit board, and has excellent space utilization efficiency. The heating pipe is covered with a heat collecting plate capable of collecting heat and heat, and a bottom surface of the concave portion is provided with a ventilation fan π corresponding to a part of the fan of the upper cover plate for introducing a gas flow and a circumferential side of the concave portion a plurality of ventilation slots are provided for allowing the hot air to be discharged outwardly to reduce the temperature in the recessed portion, and the bottom side of the heating cover is supported by the plurality of copper pillars above the upper cover plate, so that the heating cover and the present cover In order to achieve the above object and effect, the technical means of the locomotive is a hollow housing with a top side opening, in which a power supply circuit board can be accommodated, and it is difficult to combine the plurality of power supply boards before the _ The key and the)-display device; the upper cover is attached to the opening of the chassis; the part is provided with a plurality of hollow portions, and the fan can be fixedly and upwardly exhausted on the bottom side of each of the bells; a cover, the central portion is provided with a recessed portion, and at least a heating tube capable of radiating heat is disposed across the middle portion of the recessed portion, and a flow duct formed between the upper cover plates of 1294323 and having a flow rate of > θ θ can be circulated; Passed by the fan of the upper cover down to The bottom side of the heat shield separates the heat of the heating tube, and includes two parallel two-way board positioning mechanisms, and the upper cover is additionally provided with a complex '; and the relatively sliding connecting rod, And the positioning components of the circuit board of each inch of the inch, with (4) (four) length and width & located above the above-mentioned hot plate.
y至於本發詳細構造、 應用原理、作用與功效，則 參照下列依附圖所作之說明即可得到完全的瞭解：、 【實施方式】 、明參各圖可以很明顯地看出，本發明主要包括：機 箱1、上蓋板2、電路板定位機構3及加熱罩4等部份， 其中機箱1係一了員侧開口之中空殼體，其内可容置—電源 供應器1 2及一電路板1 1，於該機箱1前侧可結合一顯 示電路板1 3 ’讀顯示電路板1 3上設有複數按鍵1 3 1 及至少一顯示裝Ϊ1 3 2，再以面板1 4覆蓋於該顯示電 路板1 3表側’使其按鍵131、顯示裝置132可向外 展露’另於該機箱1一侧面設有一主電源開關1 6 1、二 輸出電源開關1 6 2組成之電源開關組1 6及複數密集排 列之侧通風孔1 7，而於機箱1背側則設有二輸入電源插 座1 5 1、一輸出電源插座1 5 2及一輸入訊號座1 5 3 組成之插座單元紐1 5，又於機箱1之開口周緣一侧設有 樞接孔1 8 ’上蓋板2之一侧設有複數樞接孔2 3，可供 一軸桿2 4貫穿迷伸入前述機箱1之樞接孔1 8形成樞接 9 1294323 杜：該上蓋板2可於機箱χ之開口上形成一可樞轉掀起之 二口於忒上盍板2之中央部位設有複數鏤空部，其中部 ，鏤空部可供結合一向上排氣之風扇2丄丄，而另一鎮空 部則可結合—導風罩2 21’該導風罩2 2 1頂端設有一 上開口 2 2 1 1，而該導風罩2 2 i底端則可結合至少一 几扇2 2 2 ’且使4風扇2 2 2恰位於機箱1之侧通風孔 1 7内方側，電路板定位機構3主要由一滑執固定架3 1 -滑軌座3 2、-第-滑軌組3 3及-第二滑執組3 4 組成，该二滑軌座3 2係以一滑軌固定架3 1固定於上蓋 板2上方二對侧’於該滑軌座3 2内設有二上方鏤空且沿 軸向平行延伸之導槽3 2 1、3 2 2，於該導槽3 2 1、 3 2 2中段横設-播止件3 2 3，該第―、二滑軌級3 3 、3 4係分別於一銜接桿3 3 3、3 4 3二端部設有平行 :伸之滑軌33 1、34 1，可分別伸入滑執座3 2之導 槽3 2 1、3 2 2内形成滑套，於各滑軌3 3丄、3 4工 另端部設有—凸部3 3 2、3 4 2，可受該擋止件3 2 3 ^止以限制该滑軌3 3 1、3 4 1之伸縮行程並防止其 向外脫落，而於該銜接桿3 3 3、3 4 3上則可分別套合 複數定位S件3 3 4、3 4 4 ’並於該定位元件3 3 4、 344上設有至少一鉤部335、345，加熱罩4之底 側係以複數銅柱4 6支撐於前述上蓋板2上方，使該加熱 罩4 14上盍板2間形成具一間隙之結合，於該加熱罩4中 央設一凹陷部位，於該凹陷部位其中二對側中段跨設有複 數加熱官4 3 1 (該加熱管43 1係為鹵素燈、石英燈或 1294323 炭素纖維燈之-或其錐合），且於另二對側設有鏤空之通 風槽孔4 1，而該加熟軍4頂侧周緣設有二平行延伸之夹 衿4 4，可供插人，具聚熱保溫功能之聚熱板4 4 1 (可 為陶竟玻璃或強化破瑞），於該聚熱板441中央可設置 -支撐架4 7，直該加熱罩4旁侧另設有—溫度感蜊元件 4 5延伸於該聚熱板4 4 1上方’而於加熱罩4底衛則設 有-通風口 4 2對應於該導風罩2 2 1之上開口 2 2 1工 使用時，以該鉤部3 3 5、3 4 5於該銜接桿3 3 3 、：3 4 3上滑移，配合滑軌3 3 1、3 4 1於滑執座3 2 之導槽3 2 1、3 2 2内滑移，可供夾持不同長寬尺寸之y As for the detailed structure, application principle, function and effect of the present invention, a complete understanding can be obtained by referring to the following description according to the drawings: [Embodiment] It can be clearly seen from the drawings of the present invention that the present invention mainly includes : the chassis 1, the upper cover 2, the circuit board positioning mechanism 3 and the heating cover 4, etc., wherein the chassis 1 is a hollow housing with a side opening, which can be accommodated therein - a power supply 12 and a The circuit board 1 1 can be combined with a display circuit board on the front side of the chassis 1. The read display circuit board 13 is provided with a plurality of buttons 1 3 1 and at least one display device 1 3 2, and then covered by the panel 14 The display circuit board 13 has a front side of the display panel 131, and the display device 132 is exposed to the outside. A power switch group 1 composed of a main power switch 1 6 1 and a second output power switch 1 6 2 is disposed on one side of the chassis 1 6 and a plurality of densely arranged side vents 1 7 , and on the back side of the chassis 1 , there are two input power sockets 1 5 1 , an output power socket 1 5 2 and an input signal socket 1 5 3 5, on the side of the opening of the chassis 1 is provided with a pivot hole 1 8 ' One side of the board 2 is provided with a plurality of pivoting holes 2 3 for allowing a shaft rod 24 to extend into the pivot hole 18 of the chassis 1 to form a pivotal connection. 9 1294323 Du: The upper cover 2 can be placed in the chassis A pivotable pick-up is formed on the opening, and a plurality of hollow portions are provided at a central portion of the upper jaw plate 2, and a hollow portion is provided for combining the fan 2 向上 upwardly exhausted, and the other air portion The air hood 2 2 1 can be combined with an upper opening 2 2 1 1 , and the bottom end of the air hood 2 2 i can be combined with at least a few 2 2 2 ′ 4The fan 2 2 2 is located on the inner side of the ventilation hole 1 7 on the side of the chassis 1. The circuit board positioning mechanism 3 is mainly composed of a sliding bracket 3 1 - a slide rail 3 2 - a - slide rail group 3 3 and - The second sliding block 3 4 is composed of a sliding rail holder 3 1 fixed to the upper side of the upper cover 2 and two upper sides of the upper sliding cover 2 a guide groove 3 2 1 , 3 2 2 extending in parallel in the axial direction, and a middle portion of the guide groove 3 2 1 , 3 2 2 is arranged with a stop member 3 2 3 , the first and second slide stages 3 3 , 3 The 4 series are respectively arranged in parallel at the ends of a connecting rod 3 3 3, 3 4 3 The extension rails 33 1 and 34 1 can respectively extend into the guide grooves 3 2 1 and 3 2 2 of the sliding seat 3 2 to form a sliding sleeve, and the sliding rails are provided at the other ends of the sliding rails 3 3丄, 3 4 - the projections 3 3 2, 3 4 2 can be restrained by the stop member 3 2 3 to limit the telescopic stroke of the slide rails 3 3 1 , 3 4 1 and prevent them from falling outward, and the adapter rod 3 is 3 3, 3 4 3 can be respectively arranged with a plurality of positioning S pieces 3 3 4, 3 4 4 ' and at least one hook portion 335, 345 is provided on the positioning element 3 3 4, 344, the bottom of the heating cover 4 The side is supported by the plurality of copper pillars 46 on the upper cover plate 2, so that a combination of the gaps is formed between the upper jaws 2 of the heating cover 4 14 , and a recessed portion is disposed in the center of the heating cover 4 . Wherein the two opposite side middle sections are provided with a plurality of heating officials 4 3 1 (the heating tubes 43 1 are halogen lamps, quartz lamps or 1294323 carbon fiber lamps - or cones thereof), and are hollowed out on the other two sides. Ventilation slot 4 1 , and the top edge of the top of the aging army 4 is provided with two parallel extending clips 4 4 for insertion, and a heat collecting plate with heat collecting function 4 4 1 (can be Tao Jing glass or Strengthening the ruin, in the heat collecting plate 441 Configurable-support frame 47, directly on the side of the heating cover 4, a temperature sensing element 4 5 extends above the heat collecting plate 4 4 1 and a heating port 4 is provided at the bottom of the heating cover 4 2 corresponding to the opening 2 2 1 above the air hood 2 2 1 , the hook portion 3 3 5, 3 4 5 is slipped on the connecting rod 3 3 3 , : 3 4 3 , and the sliding rail is matched 3 3 1 , 3 4 1 slides in the guide groove 3 2 1 , 3 2 2 of the sliding seat 3 2 for clamping different length and width dimensions
待解焊電路板5，而該加熱官4 3 1之熱量可經由聚熱板 4 4 1聚集後向上加熱該待解焊電路板5，以熔解其上之 焊錫（其加熱之溫度矸由溫度感測元件4 5感應，教回铲 至電路板1 1加以修疋，以確保穩定而避免過熱）， 支撐架4 7則可於聚熱板4 4 1上切於該待解 ， 5中央，以防止該待解焊電路板5中央受熱軟化 &板 此時，風扇2 2 2可經由側通風孔1 7 1、、、广而下垂， 7抽取機箱丄外 空氣，並經由導風罩221之上開D 9 0”、、. +之 22 11導入力口執 4内散熱，且該熱空氣可由通風槽子丨/， 热罩 曰礼41向外排出 低加熱罩4内之溫度，再配合由上蓄如η 以降 <板2之風扇2 ]] 取之向上氣流流通於該加熱罩4之启也^ 吸 卜 氏侧，可有效隔離 熱官4 3 1之熱量向下傳遞至上蓋；^ 9 邊力ϋ 奴2，以確保機箱Ί 各元件正常運作。 目丄内 11 1294323 本發明上述各加熱管4 3 1可為鹵素燈、石英燈或炭 素纖維燈之一或其組合（例如：炭素纖維燈置於中央，於 ^二旁分別設置鹵素燈或石英燈），以因應不同成本及功 能要求之組合差異；而複數按鍵i 3 i則可設定該電路板 1 1控制該加熱管4 3 1之多組加熱始末時間、溫度及加 熱時間長短，並於顯示裝置丄3 2隨時顯示操作:二及加 熱狀態，而於異常狀態時，可藉由電路板1丄内建之聲音 警報裝置發出警示聲音。 再者，本發明上述插座單元組i 5之二輪入電源插座 1 5 1係可供銜接二組電源線，並於該二電源線於極性相 同之連接狀悲下，该電路板11方可動作，藉以避免因電 流過大而造成單一電源線之過載危險情形，同時，二輸出 電源插座1 5 2係由二輸出電源開關i 6 2分別控制，以 便於控制電源輸出之銜接，而該輸入訊號座i 5 3則可供 以一訊號線1 9 1銜接外部預設之感溫元件i 9 2，且該 感溫元件1 9 2可設置於一具三點支撐之支架1 9 一端底 部，使該支架1 9可於設置感溫元件i g 2 —端側施以較 重之配重，可使該支架1 9對感溫元件1 Θ 2形成一穩固 之定位，利用該支架1 9可移動之特性，可使該感溫元件 1 9 2隨時依需要而被移至不同位置，以偵測待解焊電路 板5上不同位置之溫度，並回饋至電路板1 1以作為控制 之參數。 本發明藉由上述之構造，具有下列之特點： 1.利用遠紅外線之炭素纖維燈，配合陶瓷玻璃或強化玻璃 1294323 之聚熱特性，可達到較低的能源耗費及較佳之能源使用 效率。 2·利用至少一個以上之溫度感應裝置偵測不同位置之溫度 ’並回饋至電路板1 1作為控制之參數，因此，具有較 精準之溫度控制範圍。 3·利用電路板定位機構3之伸縮結構，可夾持不同長寬尺 寸之待解焊電路板5，具有小體積處理大面積待解焊電 路板5之特點。 1 4·可針對MICRO BGA進行拆取、回焊及植球等無鉛製程作 業。 5·雙面電路板於零件向下解焊時，其零件不會向下掉落。 6 ·由於係於非主要零件面加熱，因此，除了不易傷害主要 零件外，亦可有效避免待解焊電路板5上大面積之接地 銅、泊‘熱（大面積之接地銅箱必須以較高之熱量及溫度 解焊）而造成零件損害及松香油揮發（會降低助悍效果 r )。、、 由上所述可知，本發明之光熱式解焊機確實具有較精 準之>J2L度控制及較佳之能源利用效率，且可以較小之體積 結構處理大面積電路板之功效，確已具有產業上之利用性 、新穎性及進步性。 惟以上所述者，僅為本發明之一較佳實施例而已，並 非用來限定本發明實施之範圍。即凡依本發明申請專利範 圍所作之均等變化與修飾，皆為本發明專利範圍所涵蓋。 13 1294323 【圖式簡單說明】 第一圖係本發明之構造分解圖。 第二圖係本發明之組合示意圖。 第三圖係本發明之後侧組合外觀圖。 第四圖係本發明之整體組合剖面圖。 第五圖係本發明之上蓋掀起之動作示意圖。 【主要元件符號說明】 I .........機箱 _ II ........電路板 12 ........電源供應裔 ·* 13 ........顯示電路板 _ 131 .......按鍵 132 .......顯示裝置 14 ........面板 15 ........插座單元組 ^ 151 .......輸入電源插座 152 .......輸出電源插座 153 .......輸入訊號座 16 ........電源開關組 161 .......主電源開關 162 .......輸出電源開關 17 ........侧通風孔 18、23....樞接孔 14 1294323 19........支架 191 .......訊號線 192 .......感溫元件 2 .........上蓋板 211、222· ·風扇 221.......導風罩 2211......上開口 24........軸桿 3 .........電路板定位機構 31 ........滑軌固定架 32 ........滑軌座 321、322..導槽 323.......檔止件 33 ........第一滑執組 331、 341..滑執 332、 342. ·凸部The circuit board 5 is to be soldered, and the heat of the heating unit 433 can be heated up through the heat collecting plate 414 to heat the soldering circuit board 5 to melt the solder thereon (the temperature of the heating is 矸 by the temperature) The sensing component 45 senses, teaches the shovel to the circuit board 1 1 to be repaired to ensure stability and avoids overheating, and the support frame 47 can be cut on the heat collecting plate 4 4 1 to be solved, 5 center, In order to prevent the central portion of the circuit board 5 to be soldered from being softened and softened, the fan 2 2 2 can be sag wide through the side vents 1 7 1 , , and the outer air of the chassis is extracted and passed through the air hood 221 . On the top of the D 9 0",. +22 22 into the force port 4 heat dissipation, and the hot air can be exhausted from the ventilation slot , /, the heat cover 曰 41 41 out of the low heating cover 4 temperature, and then cooperate The upper airflow is circulated by the upper fan such as η to lower the temperature of the fan 2, and the upper airflow is circulated to the side of the heating cover 4, so that the heat of the heat official 433 can be effectively transmitted downward to the upper cover; ^ 9 Side force 奴 slave 2 to ensure that the components of the chassis 正常 are functioning properly. 目 11 1194323 The above heating tubes 4 3 1 of the present invention may be halogen One or a combination of quartz lamps or carbon fiber lamps (for example, carbon fiber lamps are placed in the center, and halogen lamps or quartz lamps are respectively disposed on the sides of the lamps) to meet the difference in the combination of different cost and functional requirements; 3 i can set the circuit board 1 1 to control the heating group 4 3 1 group of heating start time, temperature and heating time length, and display operation at the display device 丄 3 2 at any time: two and heating state, and in an abnormal state At the same time, the sound alarm device built in the circuit board 1 发出 can sound a warning sound. Furthermore, the second wheel-in power socket of the socket unit group i 5 of the present invention can be connected to two sets of power lines, and The second power cord is connected to the same polarity. The circuit board 11 can be operated to avoid overloading the single power cable due to excessive current. At the same time, the two output power sockets are connected by two output power switches. i 6 2 is separately controlled to control the connection of the power output, and the input signal socket i 5 3 can be connected to the external preset temperature sensing element i 9 2 by a signal line 1 9 1 , and the temperature sensing element 1 9 2 can be disposed at the bottom of one end of the bracket 1 9 with a three-point support, so that the bracket 19 can apply a heavier weight to the end side of the temperature sensing element ig 2, and the bracket 19 can be paired with the temperature sensing element. 1 Θ 2 forms a stable positioning, and the movable component of the bracket 19 can be moved to different positions as needed to detect different positions on the circuit board 5 to be soldered. The temperature is fed back to the circuit board 1 1 as a parameter of the control. The present invention has the following features by the above configuration: 1. The carbon fiber lamp using far infrared rays, combined with the heat collecting characteristics of ceramic glass or tempered glass 1294323 It can achieve lower energy consumption and better energy efficiency. 2. Use at least one temperature sensing device to detect the temperature of different locations' and feed back to the board 1 1 as a parameter of the control, thus having a more precise temperature control range. 3. Using the telescopic structure of the circuit board positioning mechanism 3, the circuit board 5 to be desoldered can be clamped with different lengths and widths, and has the characteristics of small volume processing for a large area to be desoldered circuit board 5. 1 4· Lead-free process operations such as removal, reflow and ball placement for the MICRO BGA. 5. Double-sided circuit board does not drop down when the part is unwelded down. 6 ·Because it is heated on the surface of non-main parts, in addition to not easily damaging the main parts, it can also effectively avoid the large-area grounding copper and mooring heat on the circuit board 5 to be soldered (the large-area grounded copper box must be compared) High heat and temperature de-soldering cause damage to parts and volatilization of rosin oil (which will reduce the effect of assisting r). As can be seen from the above, the photothermal desoldering machine of the present invention does have a more accurate > J2L degree control and better energy utilization efficiency, and can handle the effect of a large-area circuit board with a small volume structure. It has industrial use, novelty and progress. However, the above description is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. That is, the equivalent changes and modifications made by the patent application scope of the present invention are covered by the scope of the invention. 13 1294323 [Simple description of the drawings] The first figure is an exploded view of the structure of the present invention. The second drawing is a schematic view of the combination of the present invention. The third figure is a combined view of the rear side of the present invention. The fourth drawing is a cross-sectional view of the overall combination of the present invention. The fifth figure is a schematic view of the action of the upper cover of the present invention. [Main component symbol description] I ......... Chassis _ II ........Circuit board 12 ........Power supply source ·* 13 ...... .. display circuit board _ 131 ....... button 132 ....... display device 14 ........ panel 15 ........ socket unit group ^ 151 . ... input power socket 152 .... output power socket 153 .... input signal socket 16 ........ power switch group 161 ... Main power switch 162 .... output power switch 17 ........ side vents 18, 23 .... pivot hole 14 1294323 19........ bracket 191 .......signal line 192 .......sensing element 2 ......... upper cover 211, 222 · fan 221....... air hood 2211...upper opening 24........shaft 3.........board positioning mechanism 31........slide holder 32.. ... slide rail seat 321, 322.. guide groove 323....... stall 33........ first slip group 331, 341.. slipper 332, 342. · convex
333、 343..銜接桿 334、 344..定位元件 335、 345..鉤部 4.........加熱罩 41 ........通風槽孔 42 ........通風口 431.......加熱管 44........夾槽 15 1294323 441.......聚熱板 45 ........溫度感測元件 46 ........銅柱 47 ........支撐架 5.........待解焊電路板333, 343.. connecting rod 334, 344.. positioning member 335, 345.. hook portion 4 ... heating cover 41 ..... ventilation slot 42 .... .... vent 431.......heating tube 44........clip slot 15 1294323 441.......heat collecting plate 45 ........temperature Sensing element 46 ........copper column 47 ........support 5 .... to be desoldered circuit board
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