1291845 • 4 1 ‘玖、發明說明： I[号务明所属抒々貝^ 技術領域 本發明係有關於具有含有碳纖維之中心樹脂層之印刷 5 基板及其製造方法。 【先前技術3 * 背景技術 如日本專利公開公報特開2〇〇1〜332828號所示，異有 含有碳纖維之中心樹脂層的印刷基板已廣為人知。於該印 10刷基板重疊2片中心樹脂層。因中心樹脂層的作用，可減低 印刷基板整體的熱膨脹。 此種印刷基板係使其中一中心樹脂層之表面與另一中 心樹脂層之裡面相對。由於中心樹脂層作成相同形狀，故 其中一中心樹脂層的表面會完全被另一中心樹脂層覆蓋。 15同樣地後者之中心樹脂層的裡面也會完全被前者之中心 , 月日層覆蓋。另’僅其中_中心樹脂層之裡面或另一中心 _ 樹脂層之表面可形成電極。 - 專利文獻1 曰本專利公開公報特開200丨—3 3 2 8 2 8號 2〇 專利文獻2 曰本專利公開公報特開2000 — 13 8453號 專利文獻3 曰本專利公開公報特開昭60 — 14089 8號 專利文獻4 5 1291845 曰本專利公開公報特開平11〜40902號 C 明内】 發明之揭示 本發明有鑑於上述情形，以提供一種可增加電極配置 5的自由度，結果可擴大用途之印刷基板為目的。本發明之 目的在於提供可排除熱膨脹的影響並實現更細微的配線構 % 造之印刷基板。 φ 為了達成上述目的，根據第1發明，提供下述印刷基 板，該印刷基板包含有：第1基板，係具有含有碳纖維之第 10 1中心樹脂層；及第2基板，係積層於前述第1基板表面，且 具有含有碳纖維之第2中心樹脂層，又，前述第2基板之輪 廓與前述第1基板之輪廓不同。 网 於上述印刷基板中，第2基板的輪麻與第1基板的輪庵 不同。如此一來，於第i基板之表面會形成段差面。因H u不僅第1基板之裡面或第2基板之表面，於段差面亦可形成 • €極’而可從段差面讀取信號。相較於單純地重疊相同形 ' 狀之基板’可提高配置電極的自由度。結果，可擴大印刷 • 基板的用途。於該印刷基板中，第2基板可配置於較第成 板之輪麻更内側的位置。 2〇 *且’第1及第2中心樹腊層中含有碳纖維布。藉由採 用該碳纖維布可抑制第1及第2基板的熱膨脹。不管溫度變 化與否’仍可阻止電極位置偏移。另外，碳纖維布可較習 知技術的陶瓷便宜。 前述第2中心樹脂層可包括：第1樹脂層，係由含有碳 6 1291845 3維之樹脂材料所構成，且於狀位址設有貫通孔；絕緣 2係積層於第！樹脂層表面，且由含有玻璃纖維之樹脂特 二斤構成’及第2樹脂層，係積層於絕緣層表面，且由含有 =纖維之樹脂材料所構成。又，於第2樹脂層上可形成與第 5 1樹脂層之貫通孔重疊的貫通孔。 、 前述印刷基板亦可具有積層於第2基板表面，且由絕緣 層及導電圖案所構成之堆積層。因該堆積層的作用，可實 現電極的細微化。該印刷基板可對應例如安裝於印刷基板 之電子零件的電極之細微化。另一方面，迄今，在印刷基 10板採用具玻璃纖維之預浸體的多層構造時，無法確立細微 的配線構造。該印刷基板無法對應電子零件之電極的細微 化。於堆積層表面亦可露出導電墊。第丨基板亦可包括積層 於第1中心樹脂層表面且含有玻璃纖維之絕緣層，及配置於 絕緣層表面之導電圖案。 15 在製造上述印刷基板時，可實施下列步驟：將具有含 有碳纖維之第2中心樹脂層之第2基板積層於具有含有碳纖 維之第1中心樹脂層之第丨基板；及於前述第丨基板之輪廓的 内侧削出前述第2基板的輪廓。 根據第2發明，提供一種印刷基板，該印刷基板包含 20有：第1基板，係具有含有碳纖維之第1中心樹脂層；第2基 板，係積層於刚述第1基板表面，且具有含有碳纖維之第2 中心樹脂層；及堆積層，係積層於前述第2基板表面，且由 絕緣層及導電圖案所構成。 於該印刷基板中，藉由採用碳纖維布可抑制第丨及第2 7 1291845 土板的熱膨脹。無論溫度是否變化，仍可阻止電極位置偏 为’碳纖維布可較習知技術之陶瓷便宜。而且，因堆 積層的作用，可實現電極之細微化。該印刷基板可對應例 $如安裝於印刷基板之電子零件的電極之細微化。 第2中心樹脂層亦可包括：第1樹脂層，係由含有碳纖 維之树脂材料所構成，且於預定位址設有貫通孔；絕緣層， 係積層於前述第1樹脂層表面，且由含有玻璃纖維之樹脂材 料所構成；及第2樹脂層，係積層於前述絕緣層表面，且由 s有妷纖維之樹脂材料所構成，又，於前述第2樹脂層上形 成與4述第1樹脂層之貫通孔重疊的貫通孔。於第2樹脂層 亦可形成與第1樹脂層之貫通孔重疊之貫通孔。於堆積層之 表面可路出導電墊。第1基板亦可包括積層於前述第1中心 樹脂層表面且含有玻璃纖維之絕緣層及配置於絕緣層表面 之導電圖案。 15 在製造與上述第1及第2發明相關之印刷基板時，可實 施下列步驟：準備至少2片用以設置貫通孔之纖維強化樹脂 板，於前述纖維強化樹脂板之間插入樹脂板；及一面至少 加熱前述樹脂板一面朝其中一纖維強化樹脂板按壓另一纖 維強化樹脂板，且於前述貫通孔填入前述樹脂板之樹脂材 20 料。 根據上述製造方法，樹脂板中含有之樹脂材料會藉由 按壓的方式注入纖維強化樹脂板的貫通孔。可於貫通孔内 確實地填滿樹脂材料，以防止空隙產生。然後，於貫通孔 内亦可形成穿孔。在穿孔内實施電鍍。由於穿孔的外壁與 8 1291845 、纖維強化樹脂板之間填滿樹脂材料，故穿孔可完全與纖維 強化树脂板隔絕。於上述製造方法中，纖維強化樹脂板可 含有例如碳纖維。 另一方面，迄今在形成中心樹脂層時，首先，會黏合2 5片纖維強化樹脂板。於纖維強化樹脂板在預定位置形成貫 通孔。若在黏合了纖維強化樹脂板後形成貫通孔，則貫通 孔内谷易產生空隙。當在貫通孔内侧形成穿孔時 ，穿孔會 進入空隙。因此’穿孔會與纖維強化樹脂板中之碳纖維電 連接。如此一來，穿孔與碳纖維之間則無法絕緣。 10圖式簡單說明 第1圖係概略性地顯示與本發明一具體例子相關之印 刷基板，即，探針卡之外觀的透視圖。 第2®m第1圖之2-2線之放大垂直截面圖。 第3圖係沿著第！圖之3_3線之放大垂直截面圖。 15 第4®細示於纖維強化樹脂板間插讀脂板時之放 大部分截面圖。 第5圖係顯不形成中心樹脂層時，朝其中一纖維強化樹 月曰板按壓另-纖維強化樹脂板時之放大部分截面圖。 第6圖係顯不形成第1基板時，於第1中心樹脂層及積層 20板間插入樹脂板時之放大部分截面圖。 第7圖係顯示朝第1中心樹脂層按壓樹脂板及積層板時 之放大部分截面圖。 第8圖係顯示形成穿孔時之放大部分截面圖。 第9圖係顯示形成第2基板時，於第2中心樹脂層及積層 9 1291845 * 板間插入樹脂板時之放大部分截面圖。 第10圖係顯示朝第2中心樹脂層按壓樹脂板及積層板 時之放大部分截面圖。 第11圖係顯示形成穿孔時之放大部分截面圖。 5 第12圖係顯示於第1基板表面積層第2基板時之放大部 分截面圖。 第13圖係顯示形成堆積層時，於第2基板表面形成絕緣 層時之放大部分截面圖。 Φ 第14圖係顯示於絕緣層表面形成鍍銅晶種層及電阻膜 \〇 時之放大部分截面圖。 第15圖係顯示於鍍銅晶種層表面形成鍍銅層時之放大 部分截面圖。 第16圖係顯示形成導電圖案及通孔時之放大部分截面 圖。 15 【實施方式】 實施發明之最佳形態 Φ 以下，一面參照所附圖式一面說明本發明之實施形態。 第1圖係概略性地顯示與本發明一具體例子相關之印 刷基板’即，探針卡11的構造。該探針卡η包括第丨基板12 2〇及積層於第1基板12表面之第2基板13。第2基板13的輪廓與 第1基板12的輪廓不同。第2基板13配置於較第丨基板12之輪 廓更内側的位置。如此一來，於第丨基板12表面會形成段差 面14。於此，第1基板12之輪廓形成為例如八角形。另一方 面，第2基板13之輪廓則形成為圓形。第2基板13之直徑設 10 1291845 定為例如200mm。但，除了第2基板13配置於較第1基板12 之輪廓更内侧的位置以外，第1及第2基板12、13亦可形成 為其他形狀。 於第1基板12之裡面積層有堆積層15。於第2基板13之 5 表面積層有堆積層16。於堆積層15、16之表面露出多個導 電墊17。同樣地，於第1基板12之表面，即，於段差面14露 出多個導電墊18。該等導電墊17、18可由例如銅之導電性 材料所構成。1291845 • 4 1 ‘玖, 发明说明: I [号号] The present invention relates to a printing 5 substrate having a central resin layer containing carbon fibers and a method of manufacturing the same. [Prior Art 3 * Background Art A printed circuit board having a central resin layer containing carbon fibers is widely known as shown in Japanese Laid-Open Patent Publication No. Hei. Two central resin layers were superposed on the printed substrate. The thermal expansion of the entire printed substrate can be reduced by the action of the central resin layer. Such a printed substrate has a surface of one of the central resin layers opposed to the inside of the other central resin layer. Since the central resin layer is formed in the same shape, the surface of one of the central resin layers is completely covered by the other central resin layer. 15 Similarly, the inside of the central resin layer of the latter will be completely covered by the center of the former, the moon layer. Further, only the inside of the _ center resin layer or the other center _ the surface of the resin layer may form an electrode. - Patent Document 1 曰 专利 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 The present invention has been made in view of the above circumstances to provide an increase in the degree of freedom of the electrode arrangement 5, and as a result, the use can be expanded. The purpose of printing a substrate. SUMMARY OF THE INVENTION An object of the present invention is to provide a printed circuit board which can eliminate the influence of thermal expansion and realize a finer wiring structure. In order to achieve the above object, according to the first aspect of the invention, there is provided a printed circuit board comprising: a first substrate having a 10 1st central resin layer containing carbon fibers; and a second substrate laminated on the first The surface of the substrate has a second central resin layer containing carbon fibers, and the outline of the second substrate is different from the contour of the first substrate. In the above printed circuit board, the wheel of the second substrate is different from the rim of the first substrate. As a result, a step surface is formed on the surface of the i-th substrate. Since H u is not only the inside of the first substrate or the surface of the second substrate, but also a ± pole ' can be formed on the step surface to read the signal from the step surface. The degree of freedom in arranging the electrodes can be improved as compared with simply superposing the substrate of the same shape. As a result, the use of the printing substrate can be expanded. In the printed circuit board, the second substrate can be disposed at a position inside the wheel of the first plate. 2〇 *and 'The first and second central tree wax layers contain carbon fiber cloth. The thermal expansion of the first and second substrates can be suppressed by using the carbon fiber cloth. The electrode position shift can be prevented regardless of temperature change or not. In addition, carbon fiber cloth can be cheaper than ceramics of the prior art. The second central resin layer may include a first resin layer composed of a resin material containing carbon 6 1291845 three-dimensional, and having a through hole at the shape of the address; The surface of the resin layer is composed of a resin containing a glass fiber and a second resin layer, which is laminated on the surface of the insulating layer and composed of a resin material containing = fiber. Further, a through hole that overlaps with the through hole of the fifth resin layer can be formed on the second resin layer. The printed circuit board may have a buildup layer formed of an insulating layer and a conductive pattern laminated on the surface of the second substrate. Due to the action of the buildup layer, the electrode can be made fine. The printed substrate can correspond to, for example, the miniaturization of the electrodes of the electronic components mounted on the printed substrate. On the other hand, when a multilayer structure of a glass fiber prepreg is used for the printing substrate 10, a fine wiring structure cannot be established. The printed substrate cannot correspond to the miniaturization of the electrodes of the electronic component. A conductive pad may also be exposed on the surface of the buildup layer. The second substrate may further include an insulating layer laminated on the surface of the first central resin layer and containing glass fibers, and a conductive pattern disposed on the surface of the insulating layer. When the printed substrate is manufactured, the second substrate having the second central resin layer containing carbon fibers is laminated on the second substrate having the first central resin layer containing carbon fibers; and the second substrate is The inside of the outline cuts the outline of the second substrate. According to a second aspect of the invention, there is provided a printed circuit board comprising: a first substrate having a first central resin layer containing carbon fibers; and a second substrate laminated on the surface of the first substrate and having carbon fibers The second central resin layer and the buildup layer are laminated on the surface of the second substrate, and are composed of an insulating layer and a conductive pattern. In the printed circuit board, thermal expansion of the second and second 129, 918,545 earth plates can be suppressed by using a carbon fiber cloth. Regardless of whether the temperature changes, the position of the electrode can be prevented from being biased as 'carbon fiber cloth, which is cheaper than the ceramics of the prior art. Moreover, the electrode can be made fine by the action of the buildup layer. The printed substrate can correspond to the miniaturization of an electrode such as an electronic component mounted on a printed substrate. The second central resin layer may further include a first resin layer made of a resin material containing carbon fibers and having a through hole at a predetermined address, and an insulating layer laminated on the surface of the first resin layer and containing And the second resin layer is formed on the surface of the insulating layer and is made of a resin material having 妷 fibers, and the first resin is formed on the second resin layer. A through hole in which the through holes of the layer overlap. A through hole that overlaps with the through hole of the first resin layer may be formed in the second resin layer. A conductive pad can be formed on the surface of the buildup layer. The first substrate may include an insulating layer laminated on the surface of the first central resin layer and containing glass fibers, and a conductive pattern disposed on the surface of the insulating layer. In the production of the printed circuit board according to the first and second inventions described above, the following steps may be carried out: preparing at least two fiber-reinforced resin sheets for providing through-holes, and inserting a resin sheet between the fiber-reinforced resin sheets; At least one of the fiber-reinforced resin sheets is pressed against the other fiber-reinforced resin sheet while heating the resin sheet, and the resin material 20 of the resin sheet is filled in the through-hole. According to the above production method, the resin material contained in the resin sheet is injected into the through hole of the fiber-reinforced resin sheet by pressing. The resin material can be surely filled in the through holes to prevent voids from occurring. Then, a perforation can also be formed in the through hole. Electroplating is performed within the perforations. Since the perforated outer wall is filled with resin material between the 8 1291845 and the fiber-reinforced resin sheet, the perforation can be completely insulated from the fiber-reinforced resin sheet. In the above production method, the fiber-reinforced resin sheet may contain, for example, carbon fibers. On the other hand, when forming the center resin layer, first, 25 sheets of fiber-reinforced resin sheets are bonded. The fiber reinforced resin sheet is formed with a through hole at a predetermined position. When a through hole is formed after the fiber-reinforced resin sheet is bonded, voids are likely to occur in the valleys in the through-hole. When a perforation is formed inside the through hole, the perforation enters the gap. Therefore, the perforation is electrically connected to the carbon fibers in the fiber-reinforced resin sheet. As a result, there is no insulation between the perforations and the carbon fibers. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view schematically showing the appearance of a printed circuit board, i.e., a probe card, relating to a specific example of the present invention. An enlarged vertical cross-sectional view of line 2-2 of the 2nd mth image. Figure 3 is along the first! An enlarged vertical section of the line 3_3 of the figure. 15 4® is a detailed view of most of the cross-sections inserted between the fiber-reinforced resin sheets. Fig. 5 is an enlarged partial cross-sectional view showing a state in which a fiber-reinforced resin slab is pressed against another fiber-reinforced resin sheet when a central resin layer is not formed. Fig. 6 is an enlarged partial cross-sectional view showing a state in which a resin sheet is interposed between the first central resin layer and the laminate 20 when the first substrate is not formed. Fig. 7 is an enlarged partial cross-sectional view showing a state in which a resin sheet and a laminate are pressed toward the first center resin layer. Fig. 8 is a partially enlarged cross-sectional view showing the formation of a perforation. Fig. 9 is an enlarged partial cross-sectional view showing a state in which a resin sheet is interposed between the second central resin layer and the laminate 9 1291845 * when the second substrate is formed. Fig. 10 is an enlarged partial cross-sectional view showing a state in which a resin sheet and a laminate are pressed toward the second center resin layer. Fig. 11 is a cross-sectional view showing an enlarged portion when a perforation is formed. 5 Fig. 12 is an enlarged cross-sectional view showing the second substrate of the first substrate surface layer. Fig. 13 is an enlarged partial cross-sectional view showing the formation of an insulating layer on the surface of the second substrate when the deposited layer is formed. Φ Fig. 14 is an enlarged partial cross-sectional view showing the formation of a copper-plated seed layer and a resistive film on the surface of the insulating layer. Fig. 15 is an enlarged partial cross-sectional view showing the formation of a copper plating layer on the surface of the copper plating seed layer. Fig. 16 is an enlarged partial cross-sectional view showing the formation of a conductive pattern and a via hole. [Embodiment] BEST MODE FOR CARRYING OUT THE INVENTION Φ Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a view schematically showing the configuration of a printing substrate 11, i.e., a probe card 11, relating to a specific example of the present invention. The probe card η includes a second substrate 12 2 and a second substrate 13 laminated on the surface of the first substrate 12. The outline of the second substrate 13 is different from the outline of the first substrate 12. The second substrate 13 is disposed at a position further inside than the outline of the second substrate 12. As a result, the step surface 14 is formed on the surface of the second substrate 12. Here, the outline of the first substrate 12 is formed, for example, in an octagonal shape. On the other hand, the outline of the second substrate 13 is formed in a circular shape. The diameter of the second substrate 13 is set to 10,129,845, for example, 200 mm. However, the first and second substrates 12 and 13 may be formed in other shapes than the second substrate 13 disposed on the inner side of the outline of the first substrate 12. A buildup layer 15 is formed on the inner layer of the first substrate 12. A buildup layer 16 is formed on the surface area of the second substrate 13 . A plurality of conductive pads 17 are exposed on the surfaces of the buildup layers 15, 16. Similarly, a plurality of conductive pads 18 are exposed on the surface of the first substrate 12, i.e., on the step surface 14. The conductive pads 17, 18 may be composed of a conductive material such as copper.
如第2圖所示，第1基板12具有含有碳纖維之平板狀的 10第1中心樹脂層21。第1中心樹脂層21包括平板狀之第1樹脂 層22、積層於第1樹脂層22表面之絕緣層23及積層於絕緣層 23表面之平板狀的第2樹脂層24。第1及第2樹脂層22、24由 含有碳纖維布之樹脂材料所構成。碳纖維布由例如碳纖維 紗所平織而成 15 饭纖維紗由1 〇 〇 〇條以上碳纖維的束所構 成。碳纖維的直徑設定在心m以下。另，於第丨及第2樹脂 層22、24亦可含有碳纖轉_或碳_製㈣布來取代 碳纖維布。該碳纖維布可佈滿第】及第2樹脂層22、24 碳纖維對第i及第2樹物2、24整體之含有率可設定為 20 上 。碳纖維的石墨化率可蚊為99[咖 上。树脂材料可使用例如 纖維布之樹脂材料所^㈣狐。絕緣層23由含有玻璃 全，樹浐材… 該玻璃纖維布可佈滿絕緣層23 王4奶日材财利㈣如環氧樹脂。 於第1中心樹脂層2】 、 緣層27。絕緣層27由含 ®及裡面積層有例如4層的絕 坡璃纖維布之樹脂材料所構成。 11 1291845 玻璃纖維布可佈滿絕緣層27全部。樹脂材料可利用例如環 氧樹脂。於絕緣層27之間配置導電圖案28。導電圖案28可 利用例如鋼之導電性材料。 堆積層15由絕緣層29及導電圖案31之積層體所構成。 5絕緣層29及導電圖案3丨交互積層。於絕緣層29使用例如環 氧樹脂。於導電圖案31使用例如銅之導電性材料。隔著絕 緣層29而重疊之預定的導電圖案31則透過通孔32電連接。 於堆積層15之表面露出前述導電墊17。於堆積層15之表面 在導電塾17以外的領域積層過度塗布層33。過度塗布層33 10可使用例如樹脂材料。 第2基板13具有含有碳纖維之平板狀的第2中心樹脂層 34。第2中心樹脂層34與第1中心樹脂層21相同，包括平板 狀之第1樹脂層35、積層於第1樹脂層35表面之絕緣層託及 積層於絕緣層36表面之平板狀的第2樹脂層37。第丨及第2樹 15月曰層35、37可與前述第1及第2樹脂層22、24用同樣的方式 構成。絕緣層36亦可與前述絕緣層23用同樣的方式構成。 於第2中心樹脂層34之表面及裡面積層絕緣層刊。絕緣 層38由含有玻璃纖維布之樹脂材料所構成。玻璃纖維布可 佈滿例如絕緣層38全部。樹脂材料可利用例如環氧樹脂。 2〇於絕緣層38之表面配置導電圖案39。導電圖案39可利用例 如銅之導電性材料。 堆積層16由絕緣層41及導電圖案42之積層體所構成。 緣層41及導電圖案42交互積層。絕緣層“可使用例如環 氧樹脂之樹脂材料。導電圖案42可使用例如銅之導電性材 12 1291845 料隔著絕緣層41而重疊之預定的導電圖案42則透過通孔 43電連接。於堆積層16之表面露出前述導電墊丨了。於堆積 層16之表面在導電墊17以外的領域積層過度塗布層44。過 度塗布層44可使用例如樹脂材料。 5 如第3圖所示’於第1基板12形成從表面延伸至裡面之 穿孔45。於第2基板13形成從表面延伸至裡面之穿孔46。於 第1及第2基板12、13形成從第2基板13之表面延伸至第以 板12之裡面的穿孔π。穿孔45、46、47由例如銅之導電性 材料所構成。穿孔45、46、47之内部空間可用例如環氧樹 10脂之樹脂材料來填充。該等穿孔45、46、47係電連接導電 墊28、39 〇 第1基板12上，於第1樹脂層22在預定位置設有貫通孔 48。 於第2樹脂層24在預定位置設有貫通孔49。貫通孔49與 貝通孔48重疊。同樣地，第2基板13上，於第1樹脂層35在 15預定位置設有貫通孔51。於第2樹脂層37在預定位置設有貫 通孔52。貫通孔52與貫通孔51重疊。穿孔45穿過貫通孔48、 49。 穿孔46穿過貫通孔51、52。穿孔47穿過貫通孔48、49、 51、52。於穿孔45、46、47之外壁與貫通孔48、49、51、 52之内壁之間填入絕緣材料。絕緣材料可使用例如環氧樹 2〇 脂之樹脂材料。藉該絕緣材料之作用，第1及第2樹脂層22、 24、35、37内之碳纖維布可確實地與穿孔45、46、47絕緣。 於前述探針卡11中，第1及第2樹脂層22、24、35、37 或絕緣層23、27、29、36、38、41可使用由下列化合物中 任何一個或該等化合物之組合所構成之樹脂材料，該等化 13 1291845 合物為環氧、聚礙、聚_、聚亞苯基楓'聚鄰苯二甲酿 胺、聚石夕脂亞胺、聚酮、聚縮趁、聚醯亞胺、聚碳酸醋、 變性聚二苯醚、聚氧化二甲基苯、聚對苯二甲酸丁二醇醋、 聚丙稀酸、聚續、聚苯硫化物、聚嶋酉同、四氣 ^ 5 酸脂及雙馬來醯亞胺。 ^ “探針卡11在帛1基板u之㈣絲於探針装置(未 - 示)。安裝時，導電塾17連接於探針裝置之電極端子。另二 # 方面，於第2基板13之表面，即，於堆積層16之表面搭載例 如半導體晶圓（未圖示）。搭載時，導電塾17連接於半導體曰 H)圓之凸塊電極。電流從探針裝置通過探針计流通: 體晶圓。半導體晶圓的溫度會上下變動。根據電流之流通 。讀取信號時，亦可利用例如配置於段差面14 之導電墊18。如此-來，可檢查半導體 層Μ面之導電塾Π可根_如探針裝^雜== 導體sa圓之凸塊電極的位置來配置。 導電:Γ= 卡11中，因堆積層15、16之作用，可實現 體晶圓之電極的細微化。另—方面木針=可對應例如半導 20 用具玻璃纖維之預浸體的多層構在印刷絲採 ㈣心u ^時’仍無法確立細微的 的細微Γ。。印刷基板無法對應半導體晶圓之電極 13的熱膨 14 1291845 脹。另，第1及第2基板12、13之熱膨脹率會併入半導體晶 圓之熱膨脹率。無論溫度變化與否，仍可阻止半導體晶圓 之凸塊電極與導電墊17之位置偏移。特料由於第2基板13 藉穿孔47與第1基板12相連接，故可抑制電阻值的變化。另 一方面，迄今，當於幻基板表面安裝_基板時，陶竞基 板會藉例如球端子連接於第丨基板，此—來，電阻值會變 化。而且，碳纖維布可較陶瓷便宜。As shown in Fig. 2, the first substrate 12 has a flat first 10th central resin layer 21 containing carbon fibers. The first center resin layer 21 includes a flat first resin layer 22, an insulating layer 23 laminated on the surface of the first resin layer 22, and a flat second resin layer 24 laminated on the surface of the insulating layer 23. The first and second resin layers 22 and 24 are made of a resin material containing a carbon fiber cloth. The carbon fiber cloth is woven by, for example, a carbon fiber yarn. 15 The rice fiber yarn is composed of a bundle of carbon fibers of 1 〇 〇 〇. The diameter of the carbon fiber is set below the heart m. Further, the second and second resin layers 22 and 24 may contain a carbon fiber _ or a carbon ray (four) cloth instead of the carbon fiber cloth. The carbon fiber cloth can be filled with the second and second resin layers 22 and 24, and the carbon fiber can be set to 20 on the entire i-th and second trees 2, 24. The graphitization rate of carbon fiber can be 99 [mosa]. As the resin material, for example, a resin material such as a fiber cloth can be used. Insulation layer 23 consists of glass full, tree coffin... The fiberglass cloth can be covered with insulating layer 23 Wang 4 milk daily material profit (four) such as epoxy resin. In the first center resin layer 2], the edge layer 27. The insulating layer 27 is composed of a resin material containing a layer of, for example, four layers of glazed fiberglass. 11 1291845 Glass fiber cloth can be covered with insulating layer 27 all. As the resin material, for example, an epoxy resin can be used. A conductive pattern 28 is disposed between the insulating layers 27. The conductive pattern 28 can utilize a conductive material such as steel. The buildup layer 15 is composed of a laminate of the insulating layer 29 and the conductive pattern 31. 5 The insulating layer 29 and the conductive pattern 3 are alternately laminated. For example, an epoxy resin is used for the insulating layer 29. A conductive material such as copper is used for the conductive pattern 31. The predetermined conductive patterns 31 which are overlapped by the insulating layer 29 are electrically connected through the via holes 32. The conductive pad 17 is exposed on the surface of the buildup layer 15. The overcoat layer 33 is laminated on the surface of the buildup layer 15 in a region other than the conductive crucible 17. The overcoat layer 33 10 may use, for example, a resin material. The second substrate 13 has a flat second central resin layer 34 containing carbon fibers. The second center resin layer 34 is the same as the first center resin layer 21, and includes a flat first resin layer 35, an insulating layer stack laminated on the surface of the first resin layer 35, and a second flat plate layer laminated on the surface of the insulating layer 36. Resin layer 37. The third and second trees The ruthenium layers 35 and 37 can be formed in the same manner as the first and second resin layers 22 and 24 described above. The insulating layer 36 may also be formed in the same manner as the insulating layer 23 described above. The surface of the second central resin layer 34 and the inner layer insulating layer are published. The insulating layer 38 is composed of a resin material containing a glass cloth. The glass fiber cloth can be filled with, for example, all of the insulating layer 38. The resin material can utilize, for example, an epoxy resin. A conductive pattern 39 is disposed on the surface of the insulating layer 38. The conductive pattern 39 can utilize a conductive material such as copper. The buildup layer 16 is composed of a laminate of the insulating layer 41 and the conductive pattern 42. The edge layer 41 and the conductive pattern 42 are alternately laminated. As the insulating layer, a resin material such as an epoxy resin can be used. The conductive pattern 42 can be electrically connected through the through hole 43 by using a predetermined conductive pattern 42 in which the conductive material 12 1291845 of the copper material is stacked via the insulating layer 41. The conductive pad is exposed on the surface of the layer 16. The overcoat layer 44 is laminated on the surface of the buildup layer 16 outside the conductive pad 17. For example, a resin material can be used for the overcoat layer 44. 5 As shown in Fig. 3 The substrate 12 is formed with a through hole 45 extending from the surface to the inside. The second substrate 13 is formed with a through hole 46 extending from the surface to the inside. The first and second substrates 12 and 13 are formed to extend from the surface of the second substrate 13 to the first surface. The perforations π in the inside of the plate 12. The perforations 45, 46, 47 are made of a conductive material such as copper. The inner space of the perforations 45, 46, 47 can be filled with a resin material such as epoxy 10 grease. 46, 47 are electrically connected to the conductive pads 28, 39. The first substrate 12 is provided with a through hole 48 at a predetermined position in the first resin layer 22. The through hole 49 is provided in the second resin layer 24 at a predetermined position. The hole 49 overlaps with the beacon hole 48. On the second substrate 13, a through hole 51 is provided at a predetermined position of the first resin layer 35. The second resin layer 37 is provided with a through hole 52 at a predetermined position. The through hole 52 overlaps the through hole 51. The through hole 45 is worn. Through holes 48, 49. The through holes 46 pass through the through holes 51, 52. The through holes 47 pass through the through holes 48, 49, 51, 52. The outer and through holes 48, 49, 51, 52 of the through holes 45, 46, 47 An insulating material is interposed between the inner walls. The insulating material may be a resin material such as epoxy 2 resin, and the carbon fiber cloth in the first and second resin layers 22, 24, 35, 37 may be used as the insulating material. It is surely insulated from the perforations 45, 46, 47. In the probe card 11, the first and second resin layers 22, 24, 35, 37 or the insulating layers 23, 27, 29, 36, 38, 41 can be used. a resin material composed of any one of the following compounds or a combination of the compounds, the equivalent of 12 1291845 is an epoxy, agglomerated, poly-, polyphenylene maple 'poly(phthalamide), poly stone Ester imine, polyketone, polycondensation, polyimine, polycarbonate, denatured polydiphenyl ether, polyoxymethylene benzene, polyterephthalic acid Glycol vinegar, polyacrylic acid, polycontinuum, polyphenyl sulfide, polyfluorene, tetrakis-5 acid ester and bismaleimide. ^ "Probe card 11 on 帛1 substrate u (4) silk Probe device (not shown). During installation, the conductive crucible 17 is connected to the electrode terminal of the probe device. On the other hand, for example, a semiconductor wafer (not shown) is mounted on the surface of the second substrate 13, that is, on the surface of the buildup layer 16. When mounted, the conductive crucible 17 is connected to the semiconductor bump H) round bump electrode. Current flows from the probe device through the probe meter: the body wafer. The temperature of the semiconductor wafer will vary up and down. According to the circulation of current. When the signal is read, for example, the conductive pad 18 disposed on the step surface 14 can also be utilized. In this way, it is possible to check the conductivity of the surface of the semiconductor layer, such as the position of the bump electrode of the conductor sa. Conduction: Γ = In the card 11, the electrode of the bulk wafer can be made fine by the action of the buildup layers 15 and 16. On the other hand, the wood needle = a multilayer structure which can correspond to, for example, a semi-conductive glass fiber prepreg, and it is still impossible to establish fine fine flaws when printing silk (4). . The printed substrate does not correspond to the thermal expansion of the electrode 13 of the semiconductor wafer 14 1291845. Further, the thermal expansion coefficients of the first and second substrates 12 and 13 are incorporated into the thermal expansion coefficient of the semiconductor wafer. The positional displacement of the bump electrode of the semiconductor wafer and the conductive pad 17 can be prevented regardless of the temperature change. In particular, since the second substrate 13 is connected to the first substrate 12 via the through hole 47, the change in the resistance value can be suppressed. On the other hand, when the substrate is mounted on the surface of the magic substrate, the ceramic substrate is connected to the second substrate by, for example, a ball terminal, and the resistance value changes. Moreover, carbon fiber cloth can be cheaper than ceramics.
另’第2基板U的輪廊與第丨基板u的輪磨不同。如此 -來，於第1基板12之表面會形成段差面14。因此，不僅第 H) i基板12之裡面或第2基板13之表面，於段差面亦可形成導 電細，即，電極，而可從段差面14讀取信號。相較於單 純地重疊相同形狀之基板，可提高配置電極的自由度，結 果，可擴大印刷基板的用途。 15 20 接著’說明前述探針卡11之製造方法。首先，形成第丄 及第2知樹闕21、34。在《時，準料塊碳纖維布。 奴纖維布由碳纖維紗所平織而成。碳纖維紗由麵條以上 碳纖維的束所構成。碳纖維的直徑設定在例如心爪以下。 如此所形成之碳纖維布浸泡在麻魏樹脂清漆。缺後， 使碳纖維布及魏樹脂祕賴。如此―來 如 0.15mm 〇 碳纖維布之樹料，即，預㈣。體的厚度設定2 ㉒例如8片的預浸體。—面加熱最上層的預浸 ?壓一=的預浸體按壓。按壓時，實施例如真空 祕。真空加壓實施例如1小時。加熱之顧峰溫度設定在例 15 1291845 如170C。如此一來，如第4圖所示，會形成纖維強化樹脂 板61a、61b。於纖維強化樹脂板61a在預定位置穿設貫通孔 62。同樣地，於纖維強化樹脂板61b在預定位置穿設貫通孔 63 °穿孔時，係使用例如鑽孔機。貫通孔62、63的直徑設 5定為例如0.60mm。纖維強化樹脂板61a、01b的厚度設定為 例如1.0mm。 接著，準備樹脂板，即，預浸體64。預浸體64中含有 玻璃纖維布。預次體64的厚度設定為例如〇 。在纖維 15 20 強化樹脂板61a、61b之間插入預浸體64。此時，於2片纖維 強化樹脂板61a、61b備有貫通孔62、63的位置。如第5圖所 不，一面至少加熱預浸體64，一面將其中一纖維強化樹脂 板61b朝另一纖維強化樹脂板61a按壓。此時，其中一纖維 強化樹脂板61b的表面被平坦面65擋住，而另—纖維強化樹 脂板61a的裡面被平坦_擋住，χ，貫通孔以、63的開口 被平坦面65、66堵住。按壓時係實施真空加壓。真空加壓 係實施例如1小時。加熱之嶺峰溫度設定在例如⑽。C。真 空加壓的壓力設定為例如3·92χ 1〇6[pa]。如此—來，預浸 體64中包含之環氧樹脂從纖維強化樹脂板6la、61b之間擠 出。因此，貫通孔62、63會填滿環氧樹脂。環氧樹脂藉由 加熱在貫通孔62、_硬化。如此—來，會 中心樹脂層21、34。但，預浸體64的數量可根據形成於纖 維強化樹脂板61a ' 61b之貫通孔62、63的總體積來設定。 即，可用預浸體64中包含之環氧樹脂來確實地填滿貫通孔 62、63。而且，預浸胸的數量會依照貫通孔a、幻之配 16 1291845 纖維強化樹脂板61a、61b相當於第i 35 ' 37。預浸體64相當於絕緣層23、 一 #於第1中心樹脂層21之表面及裡面如第6圖所 示，重疊前述預浸體64。於預浸體料表面重疊第i積層板 第積^板67包括前述預浸體64及配置於該預浸體64之 表面及裡面的導賴積層板67的厚度設定為例如The wheel rim of the second substrate U is different from the wheel mill of the second substrate u. Thus, a step surface 14 is formed on the surface of the first substrate 12. Therefore, not only the inside of the substrate 12 or the surface of the second substrate 13, but also the conductive thin, that is, the electrodes, can be formed on the step surface, and the signal can be read from the step surface 14. The degree of freedom in arranging the electrodes can be improved as compared with simply superimposing the substrates of the same shape, and the use of the printed circuit board can be expanded. 15 20 Next, the method of manufacturing the aforementioned probe card 11 will be described. First, the third and second knowledge trees 21, 34 are formed. At the time, the quasi-block carbon fiber cloth. The slave fiber cloth is made of carbon fiber yarn. The carbon fiber yarn is composed of a bundle of carbon fibers of noodles or more. The diameter of the carbon fiber is set, for example, below the claw. The carbon fiber cloth thus formed is immersed in the weiwei resin varnish. After the lack, the carbon fiber cloth and Wei resin are secret. So - such as 0.15mm 〇 carbon fiber cloth tree material, that is, pre (four). The thickness of the body is set to 2 22, for example, 8 sheets of prepreg. - Surface heating of the uppermost prepreg Pressing a = prepreg press. When pressing, for example, a vacuum is applied. Vacuum pressurization is carried out, for example, for 1 hour. The temperature of the heating peak is set in Example 15 1291845 such as 170C. As a result, as shown in Fig. 4, fiber-reinforced resin sheets 61a and 61b are formed. The through hole 62 is bored in the fiber-reinforced resin sheet 61a at a predetermined position. Similarly, when the fiber-reinforced resin sheet 61b is pierced through the through hole 63° at a predetermined position, for example, a drilling machine is used. The diameter of the through holes 62, 63 is set to, for example, 0.60 mm. The thickness of the fiber-reinforced resin sheets 61a and 01b is set to, for example, 1.0 mm. Next, a resin sheet, that is, a prepreg 64 is prepared. The prepreg 64 contains a glass fiber cloth. The thickness of the pre-substitution 64 is set to, for example, 〇. A prepreg 64 is inserted between the fibers 15 20 reinforced resin sheets 61a and 61b. At this time, the positions of the through holes 62 and 63 are provided in the two fiber-reinforced resin sheets 61a and 61b. As shown in Fig. 5, at least one of the fiber-reinforced resin sheets 61b is pressed toward the other fiber-reinforced resin sheet 61a while the prepreg 64 is heated at least. At this time, the surface of one of the fiber-reinforced resin sheets 61b is blocked by the flat surface 65, and the inside of the other fiber-reinforced resin sheet 61a is flat-blocked, and the opening of the through-hole 63 is blocked by the flat faces 65, 66. . Vacuum pressing is performed when pressing. The vacuum pressurization is carried out, for example, for 1 hour. The heating peak temperature is set, for example, at (10). C. The pressure of the vacuum press is set to, for example, 3·92 χ 1〇6 [pa]. As a result, the epoxy resin contained in the prepreg 64 is extruded from between the fiber-reinforced resin sheets 61a and 61b. Therefore, the through holes 62, 63 are filled with epoxy resin. The epoxy resin is hardened in the through holes 62 and _ by heating. In this way, the central resin layers 21, 34 are centered. However, the number of the prepregs 64 can be set in accordance with the total volume of the through holes 62, 63 formed in the fiber-reinforced resin sheets 61a' 61b. That is, the through holes 62, 63 can be surely filled with the epoxy resin contained in the prepreg 64. Further, the number of prepreg chests is in accordance with the through hole a, the magical match 16 1291845, and the fiber reinforced resin plates 61a and 61b correspond to the i 35 '37. The prepreg 64 corresponds to the insulating layer 23, a surface of the first central resin layer 21, and the inside thereof, as shown in Fig. 6, and the prepreg 64 is superposed. The i-th laminate is superposed on the surface of the prepreg. The first plate 67 includes the prepreg 64 and the thickness of the guide laminate 67 disposed on the surface and inside of the prepreg 64.
·1〇Π1 #著’於第1積層板67之表面再次重疊預浸體64。 於預浸體64之表㈣_積層板69。第2積層板仍包括前 述預J64、配置於_預浸體64之裡面的導電圖案沾及配 置於預X體64之表面的鋼箱71。銅_7ι可佈滿例如預浸體 64之表面。第2積層板69的厚度設定為例如0.10mm。於此， 導電圖案68可根據例如減色絲形成。The first prepreg 64 is again superposed on the surface of the first laminate 67. In the table (4) of the prepreg 64, the laminate 69 is provided. The second laminate still includes the pre-J64, and the conductive pattern disposed inside the prepreg 64 is adhered to the steel box 71 disposed on the surface of the pre-X body 64. Copper _7ι can be covered with, for example, the surface of the prepreg 64. The thickness of the second laminate 69 is set to, for example, 0.10 mm. Here, the conductive pattern 68 may be formed according to, for example, a color reducing wire.
置密度作調整。於此， 及第2樹脂層22、24、 36 〇 10 接著，如第7圖所示，一面加熱第丨及第2積層板67、69 15以及預次體64 ’ 一面朝第1中心樹脂層21之表面及裡面按壓 該第1及第2積層板67、69以及預浸體04。此時，其中一鋼 箔71之表面會被平坦面72擋住，而另一銅箔71之裡面會被 平坦面73擋住。按壓時，係實施真空加壓。真空加壓係實 施例如1小時。加熱之巔峰溫度設定在例如180°C。真空加 20壓的壓力設定為3.92X 106[Pa]。如此一來，預浸體64中包 έ之環氧樹脂會因加熱而硬化。環氧樹脂會黏合第1及第2 積層板67、69與第1中心樹脂層21。於此，預浸體64相當於 絕緣層27。導電圖案68相當於導電圖案28。 接耆’如第8圖所不’形成穿孔74。在形成穿孔74之前， 17 1291845 於表面形成電Μ(未_)。穿孔74f過·孔62、 側。穿孔74與貫通孔62、63同軸。穿孔時，係使用例如鑽 機穿孔74的直徑*定為例如Q 3Gmm。穿孔7 土 膠渣處理。 貝她去 5 然後，於穿孔74内形成鍍銅層75。形成時，係實 如=電解電鍍及電解電鍍。於此，鍍_75相當於穿孔L 接著，於穿孔74内注入樹脂材料77。樹脂材料77可利用例 # ^溶㈣之環氧樹脂，並加鋪脂材料，且加熱實施1小 時，又，加熱溫度設定於例如17叱。如此一來，樹脂材料 H) 77會硬化。從穿孔顺出之樹脂材料7稽由抛光研磨除 去然後，從表面的銅箔71形成導電圖案76。接著，於導 電圖案76之表面塗布前述樹脂材料77。如此一來會形成第丄 基板12。於此，第丨基板12的厚度設定為例如3 8mm。 接著，於第2中心樹脂層34之表面及裡面如第9圖所 15不，重疊前述預浸體64。於預浸體64之表面重疊鋼箔V。 參銅v|78的厚度設定為例如〇〇18mm。接著，如第忉圖所示， 一面加熱預浸體64及銅箔78, 一面朝第2中心樹脂層34之表 • 面及裡面按壓預浸體64及銅箔78。此時，其中一銅箔78之 表面會被平坦面79擋住，而另一銅箔78之裡面會被平坦面 20 81檔住。按壓時，係實施真空加壓。真空加壓係實施例 小時。加熱之巔峰溫度設定在例如18〇t：，而真空加壓的壓 力設定在3·92χ l〇6[Pa]。如此一來，預浸體64中包含之環 氧樹脂會因加熱而硬化。環氧樹脂會黏合銅箔78與第2中心 樹脂層34。於此，預浸體64相當於絕緣層38。 18 1291845 接著，如第11圖所示，形成穿孔82。在形成穿孔82之 =ΓΓ進行，。然後，穿，過二 々錯二!182與貝通孔62、63同軸。穿孔時，係使用例 如鐵孔機。穿孔82的直徑蚊為例如請咖。於穿孔82内 實施去膠ί查處理。 然後’於穿孔82内形成鍍鋼晶種層83。在形成時，係 實施無電解電鍍。接著，於鍍銅晶種層83之表面，藉電阻 . 膜(未圖示)形成導電圖案84之形狀的圖案。接著，於鐘銅晶 種層83之表面形成鍍銅層85。形成時，係實施電解電鑛。 1〇在除去電阻膜後，蝕刻銅箔78及鍍銅晶種層83。如此一來， 會形成導電圖案84及穿孔46。 接者’於穿孔82内注入樹脂材料86。同時，於導電圖 案84表面塗布樹脂材料％。樹脂材料86可使用例如溶劑型 之環氧樹脂。然後，加熱樹脂材料86。加熱係實施1小時。 15 加熱溫度設定為例如170°C。如此一來，樹脂材料86會硬 • 化。從穿孔82溢出之樹脂材料86藉拋光研磨去除。同時， 導電圖案84及樹脂材料86的表面藉研磨成為同一表面。如 * 此一來會形成第2基板12。於此，第2基板13的厚度設定為 例如2.3mm。 20 接著，如第12圖所示，於第1基板12表面積層第2基板 13。積層時，在第1及第2基板12、13之間插入前述預浸體 64。此時，在第1及第2基板12、13備有貫通孔62、63的位 置。接著，一面至少加熱預浸體64，一面朝第1基板12按壓 第2基板13。按壓時，係實施真空加壓。真空加壓係實施例 19 1291845 小時。加熱之巔峰溫度設定為例如180°C。真空加壓的 壓力設定為例如3·92χ 1()6[pa]。預浸體6钟包含之環氧樹 月曰會因加熱而硬化。環氧樹脂會黏合第1及第2基板12、13。 如此來，第2基板13會積層於第i基板12表面。 5 接者，於第1及第2基板U、13形成穿孔87。穿孔87係 穿過貫通孔62、63内側。穿孔時，係使用例如鑽孔機。穿 孔87的直#言免定為例如〇 3〇nim。於穿孔⑺内實施去膠潰處 理。然後，於穿孔87内形成鍍銅晶種層。在形成時，係實 施例如無電解電鍍。接著，於鍍銅晶種層之表面，藉電阻 10膜(未圖示)形成導電圖案之形狀的圖案。在形成圖案時，係 實施微影成像法。接著，於鍍銅晶種層之表©形成鍍銅層。 形成時，係實施電解電鍍。在除去電阻膜後，侧銅箱78 及鍵銅晶種層。如此一來，會形成穿孔47。接著，於穿孔 内注入樹脂材料88。樹脂材料88可使用例如溶劑型之環氧 15樹脂。然後，加熱樹脂材料88。加熱係實施丨小時。加熱溫 度5又疋為例如no c。如此一來，樹脂材料88會硬化。從穿 孔溢出之樹脂材料88藉拋光研磨去除。同時，導電圖案及 樹脂材料88的表面藉研磨成為同一表面。然後，穿孔87的 開口會因鍍銅而被鍍銅層89堵住。於此，第丨及第2基板12、 2〇 13的居度设定為例如6.2mm。 接著，於第1基板12之裡面及第2基板13之表面形成堆 積層15、16。堆積層15、16係同時形成。如第13圖所示， 首先，於第2基板13之表面重疊樹脂板91。一面加熱樹脂板 91一面朝第2基板13之表面按壓。按壓時，係實施真空加 1291845 堅真空加壓實施3〇分鐘。加熱溫度設定在例如170°C。樹 曰板91會因加熱而硬化。如此一來會形成絕緣層μ。絕緣 層的厚度設定為例如0.05mm。 接著，於絕緣層41之表面形成導電圖案42。形成導電 圖案42時，係實施半加成法。形成導電圖案π時，首先， 於絕緣層41之預定位置照射UV — YAG雷射。藉由照射該雷 射，以在絕緣層41形成孔92。接著，如第14圖所示，於絕 緣層41之表面及孔92内形成鍍銅晶種層93。形成時，係實 施無電解電*。於_晶種層93之表面在預定位置形成電 10阻膜94的圖案。 接著，如第15圖所示，於鍍銅晶種層93之表面形成鍍 銅層95。形成時，係實施電解電鍍。然後，如第“圖所示， 去除電阻膜94，並餘刻露出於電阻膜91之去除部分的鍛銅 曰曰種層93。如此一來，在絕緣層41之表面形成導電圖案a。 U於孔92内形成通孔43。然後，再次以預定次數反覆積層絕 緣層41至形成導電圖案42的步驟，於此，例如反覆*次。在 最表面形成前述導電塾17。如此一來，會在第2基板13之表 面積層堆積層15。 接著，於堆積層15之表面積層過度塗布層（未圖示）。過 20度塗布層可使用例如樹脂材料。形成過度塗布層時，可^ 施例如絲網印刷法或微影成像法。在過度塗布層之預定位 置形成開口。藉由該開口，以在堆積層表面露出前^ 墊17。 等電 接著，於第1基板12之輪廓的内側削出第2基板13的矜 21 1291845 廓。第2基板13係削成例如直徑2〇〇mm的圓形。切削時，可 實施例如機械加工。如此一來，在第丨基板12之表面會形成 段差面14。此時，在段差面14會露出配置於第丨基板q表面 之導電墊76。在段差面14上因導電墊76而形成導電墊μ。 5如此一來，可製造出探針卡11。 根據上述製造方法，在形成第1及第2中心樹脂層21、 34時’於纖維強化樹脂板61&、61b之間插入樹脂板料。一 % 面加熱樹脂板64，一面朝纖維強化樹脂板61a按壓纖維強化 才对月曰板61b。將樹脂板64中含有之樹脂材料注入貫通孔幻、 1〇 63。在貫通孔62、63内可確實地填滿樹脂材料。因此，即 使貫通孔62、63内形成穿孔45、46、47，穿孔45、46、47 之外壁與第1及第2中心樹脂層21、36内的碳纖維仍可確實 地絕緣。 另一方面，迄今在形成中心樹脂層時，首先，先黏合2 I5片纖維強化樹脂板。於纖維強化樹脂板在預定位置形成貫 擎通孔。若在黏合了纖維強化樹脂板後形成貫通孔，則貫通 孔内容易產生空隙。當在貫通孔内側形成穿孔時，穿孔的 * 鍍銅會進入空隙。因此，穿孔會與纖維強化樹脂板中之碳 纖維電連接。如此一來，穿孔與碳纖維之間則無法絕緣。 20 接著，本發明人檢驗如上所述所製造之探針卡n。檢 驗時，測量150°C以下的平均熱膨脹率。沿著測量對象的表 面朝平面方向測量平均熱膨脹率。預浸體64及積層板67、 69之積層體為I5.0[ppm/K]之值。第1及第2中心樹脂層21、 34單體為i.〇[ppm/K]之值。第χ基板12單體為2 〇[卯m/K]之 22 1291845 值。第2基板13單體為i.5[ppm/K]之值。第1及第2基板12、 13之積層體為2.〇[ppm/K]之值。堆積層15、16之絕緣層29、 4i單體為7〇.o[Ppm/K]之值。探針卡11整體為4.0[ppm/K]i 值。可知不只在形成探針卡丨丨後，在各製造步驟途中亦可 5充分地減少熱膨脹率。而且，可確認的是儘管例如預浸體 64及積層板67、69之積層體或堆積層15、16之絕緣層為較 大的值，探針卡11整體仍可充分地減少熱膨脹率。Set the density for adjustment. Here, and the second resin layers 22, 24, 36 〇 10, as shown in Fig. 7, the second and second laminate sheets 67, 69 15 and the pre-substrate 64' are heated toward the first center resin. The first and second buildup plates 67 and 69 and the prepreg 04 are pressed against the surface and the inside of the layer 21. At this time, the surface of one of the steel foils 71 is blocked by the flat surface 72, and the inside of the other copper foil 71 is blocked by the flat surface 73. When pressed, vacuum pressurization is performed. The vacuum pressurization system is carried out, for example, for 1 hour. The peak temperature of heating is set at, for example, 180 °C. The pressure of the vacuum plus 20 pressure was set to 3.92 X 106 [Pa]. As a result, the epoxy resin contained in the prepreg 64 is hardened by heating. The epoxy resin adheres the first and second laminates 67 and 69 to the first central resin layer 21. Here, the prepreg 64 corresponds to the insulating layer 27. The conductive pattern 68 corresponds to the conductive pattern 28. The nipples 'do not form a perforation 74 as shown in Fig. 8. Before forming the perforations 74, 17 1291845 forms an electric Μ (not _) on the surface. The perforations 74f pass through the holes 62 and the sides. The through holes 74 are coaxial with the through holes 62, 63. For perforation, for example, the diameter * of the drill perforation 74 is used, for example, as Q 3 Gmm. Perforation 7 soil slag treatment. She went to 5 and then formed a copper plating layer 75 in the perforations 74. When formed, it is as follows: electrolytic plating and electrolytic plating. Here, the plating_75 corresponds to the perforation L. Next, the resin material 77 is injected into the perforation 74. The resin material 77 can be made of an epoxy resin of Example #4, and a grease material is added, and the heating is carried out for 1 hour, and the heating temperature is set to, for example, 17 Torr. As a result, the resin material H) 77 hardens. The resin material 7 which is discharged from the perforations is removed by polishing and then, and a conductive pattern 76 is formed from the copper foil 71 on the surface. Next, the resin material 77 is applied to the surface of the conductive pattern 76. As a result, the second substrate 12 is formed. Here, the thickness of the second substrate 12 is set to, for example, 38 mm. Next, the prepreg 64 is superposed on the surface and the inside of the second center resin layer 34 as shown in Fig. 9. The steel foil V is superposed on the surface of the prepreg 64. The thickness of the reference copper v|78 is set to, for example, 〇〇18 mm. Then, as shown in the figure, the prepreg 64 and the copper foil 78 are heated, and the prepreg 64 and the copper foil 78 are pressed toward the front surface and the inside of the second center resin layer 34. At this time, the surface of one of the copper foils 78 is blocked by the flat surface 79, and the inside of the other copper foil 78 is blocked by the flat surface 20 81 . When pressed, vacuum pressurization is performed. Vacuum pressurization is carried out for hours. The peak temperature of the heating is set to, for example, 18 〇t:, and the pressure of the vacuum pressure is set at 3·92 χ l 〇 6 [Pa]. As a result, the epoxy resin contained in the prepreg 64 is hardened by heating. The epoxy resin bonds the copper foil 78 and the second central resin layer 34. Here, the prepreg 64 corresponds to the insulating layer 38. 18 1291845 Next, as shown in Fig. 11, a perforation 82 is formed. In the formation of the perforations 82, ΓΓ is performed. Then, wear, pass two wrong two! 182 and Betong hole 62, 63 coaxial. For perforation, for example, an iron hole machine is used. The diameter mosquito of the perforation 82 is, for example, a coffee maker. The degumming is performed in the perforation 82. A plated steel seed layer 83 is then formed in the perforations 82. At the time of formation, electroless plating is performed. Next, on the surface of the copper plating seed layer 83, a pattern of the shape of the conductive pattern 84 is formed by a resistor (not shown). Next, a copper plating layer 85 is formed on the surface of the copper seed crystal layer 83. At the time of formation, electrolysis is carried out. After removing the resistive film, the copper foil 78 and the copper plating seed layer 83 are etched. As a result, the conductive pattern 84 and the through holes 46 are formed. The connector 'inserts the resin material 86 into the perforations 82. At the same time, the surface of the conductive pattern 84 is coated with a resin material%. As the resin material 86, for example, a solvent type epoxy resin can be used. Then, the resin material 86 is heated. The heating system was carried out for 1 hour. 15 The heating temperature is set to, for example, 170 °C. As a result, the resin material 86 is hardened. The resin material 86 overflowing from the perforations 82 is removed by polishing. At the same time, the surfaces of the conductive pattern 84 and the resin material 86 are ground to the same surface. For example, the second substrate 12 is formed. Here, the thickness of the second substrate 13 is set to, for example, 2.3 mm. 20 Next, as shown in Fig. 12, the second substrate 13 is layered on the surface of the first substrate 12. At the time of lamination, the prepreg 64 is inserted between the first and second substrates 12 and 13. At this time, the first and second substrates 12 and 13 are provided with the through holes 62 and 63. Next, the second substrate 13 is pressed toward the first substrate 12 while the prepreg 64 is heated at least. When pressed, vacuum pressurization is performed. Vacuum Pressurization Example 19 1291845 hours. The peak temperature of heating is set to, for example, 180 °C. The pressure of the vacuum press is set to, for example, 3·92 χ 1 () 6 [pa]. The epoxy tree contained in the prepreg for 6 minutes will harden due to heating. The epoxy resin adheres the first and second substrates 12 and 13. As a result, the second substrate 13 is laminated on the surface of the i-th substrate 12. In the fifth embodiment, the through holes 87 are formed in the first and second substrates U and 13. The perforations 87 are passed through the inside of the through holes 62, 63. For perforation, for example, a drilling machine is used. The straight line of the hole 87 is for example 〇 3〇nim. The degumming treatment is carried out in the perforation (7). A copper plated seed layer is then formed in the perforations 87. At the time of formation, for example, electroless plating is carried out. Next, a pattern of a shape of a conductive pattern is formed on the surface of the copper plating seed layer by a resistor 10 film (not shown). When forming a pattern, a lithography method is performed. Next, a copper plating layer is formed on the surface of the copper plating seed layer. At the time of formation, electrolytic plating is performed. After removing the resistive film, the side copper box 78 and the key copper seed layer. As a result, the perforations 47 are formed. Next, a resin material 88 is injected into the perforations. As the resin material 88, for example, a solvent type epoxy 15 resin can be used. Then, the resin material 88 is heated. The heating system is carried out for a few hours. The heating temperature 5 is again referred to as no c. As a result, the resin material 88 hardens. The resin material 88 overflowing from the perforation is removed by polishing. At the same time, the conductive pattern and the surface of the resin material 88 are ground to the same surface. Then, the opening of the through hole 87 is blocked by the copper plating layer 89 due to copper plating. Here, the degree of the second and second substrates 12 and 2〇13 is set to, for example, 6.2 mm. Next, the buildup layers 15 and 16 are formed on the inner surface of the first substrate 12 and the surface of the second substrate 13. The buildup layers 15, 16 are formed simultaneously. As shown in Fig. 13, first, the resin plate 91 is superposed on the surface of the second substrate 13. The resin plate 91 is heated while pressing toward the surface of the second substrate 13. When pressing, vacuum is applied and 1291845 is applied under vacuum for 3 minutes. The heating temperature is set, for example, at 170 °C. The tree sill 91 will harden due to heating. As a result, the insulating layer μ is formed. The thickness of the insulating layer is set to, for example, 0.05 mm. Next, a conductive pattern 42 is formed on the surface of the insulating layer 41. When the conductive pattern 42 is formed, a semi-additive method is performed. When the conductive pattern π is formed, first, a UV-YAG laser is irradiated at a predetermined position of the insulating layer 41. The hole 92 is formed in the insulating layer 41 by irradiating the laser. Next, as shown in Fig. 14, a copper plating seed layer 93 is formed on the surface of the insulating layer 41 and in the hole 92. When formed, electroless electricity* is implemented. A pattern of the electric resist film 94 is formed at a predetermined position on the surface of the seed layer 93. Next, as shown in Fig. 15, a copper plating layer 95 is formed on the surface of the copper plating seed layer 93. At the time of formation, electrolytic plating is performed. Then, as shown in the figure, the resistive film 94 is removed, and the forged copper seed layer 93 is exposed to the removed portion of the resistive film 91. Thus, a conductive pattern a is formed on the surface of the insulating layer 41. U A through hole 43 is formed in the hole 92. Then, the step of laminating the insulating layer 41 to the conductive pattern 42 is repeated a predetermined number of times, for example, by repeating * times. The conductive bead 17 is formed on the outermost surface. The layer 15 is deposited on the surface layer of the second substrate 13. Next, a layer (not shown) is overcoated on the surface layer of the buildup layer 15. For example, a resin material can be used for the over 20-degree coating layer. For example, a screen printing method or a lithography method, an opening is formed at a predetermined position of the overcoat layer, and the opening is used to expose the front pad 17 on the surface of the buildup layer. The isoelectric power is then on the inner side of the outline of the first substrate 12. The second substrate 13 is cut into a circular shape having a diameter of 2 mm. For example, machining can be performed at the time of cutting. Thus, the surface of the second substrate 12 is formed. Forming the step surface 14. At this time, The step surface 14 exposes the conductive pad 76 disposed on the surface of the second substrate q. The conductive pad μ is formed on the step surface 14 by the conductive pad 76. Thus, the probe card 11 can be manufactured. According to the above manufacturing method, When the first and second center resin layers 21 and 34 are formed, a resin sheet is inserted between the fiber-reinforced resin sheets 61 & 61b. The resin sheet 64 is heated by one surface, and the fiber-reinforced resin sheet 61a is pressed against the fiber-reinforced resin sheet 61a. In the case of the meniscus plate 61b, the resin material contained in the resin plate 64 is injected into the through hole phantom, 1〇63. The resin material can be surely filled in the through holes 62 and 63. Therefore, even the through holes 62 and 63 are formed. The perforations 45, 46, 47, the outer walls of the perforations 45, 46, 47 and the carbon fibers in the first and second central resin layers 21, 36 are still reliably insulated. On the other hand, when forming the central resin layer, first, First, a 2 I5 fiber reinforced resin sheet is bonded to the fiber reinforced resin sheet, and a through hole is formed at a predetermined position on the fiber reinforced resin sheet. If a through hole is formed after the fiber reinforced resin sheet is bonded, a void is easily formed in the through hole. Perforation when forming a perforation * Copper plating enters the gap. Therefore, the perforation is electrically connected to the carbon fiber in the fiber-reinforced resin sheet. Thus, the perforation and the carbon fiber cannot be insulated. 20 Next, the inventors examined the probe manufactured as described above. Card n. At the time of inspection, the average thermal expansion coefficient below 150 ° C was measured. The average thermal expansion coefficient was measured in the plane direction along the surface of the measuring object. The laminated body of the prepreg 64 and the laminated plates 67 and 69 was I5.0 [ppm/ The value of K] is the value of i. 〇 [ppm/K] of the first and second central resin layers 21 and 34. The second substrate 12 is a value of 22 1291845 of 2 〇 [卯m/K]. The second substrate 13 alone has a value of i.5 [ppm/K]. The laminate of the first and second substrates 12 and 13 has a value of 2. 〇 [ppm/K]. The insulating layers 29, 4i of the buildup layers 15, 16 are of a value of 7 〇.o [Ppm/K]. The probe card 11 as a whole has a value of 4.0 [ppm/K]i. It can be seen that not only the formation of the probe cassette, but also the thermal expansion rate can be sufficiently reduced in the middle of each manufacturing step. Further, it can be confirmed that although the insulating layer of the laminate or the laminated layers 15, 16 of the prepreg 64 and the laminates 67, 69 is of a large value, the probe card 11 as a whole can sufficiently reduce the coefficient of thermal expansion.
接著，本發明人測量如上所述所製造之探針卡u的彎 曲量。測量時，準備具體例及比較例。具體例由前述製造 10方法來製造。比較例則在第1及第2中心樹脂層使用BT樹 脂。第1及第2中心樹脂層以外的構成或構造則與前述探針 卡11利用相同的方法製造。在第2基板之表面所區割的 20·跨距測量彎曲量。與具體例相關之探針卡u測出心 _下的值。另-方面，與比較例相關之探針卡測出30_ 15的值。可確定的是相較於比較例，與具體例相關之探針卡 11中會減少彎曲量。 接者，本發明人實 20 娜斯上听返所製造之探針卡11# 度循環實驗。實_ ’準触前料_侧之探針卡! 探針卡11配置於氣相中。於氣相中，在—贼幻贼之 反覆溫度之升降(溫度循環)3⑻次。接著，本發明人實摊 溫放置實驗(燃燒實驗）。探針卡11放置在15(rc之大氣下 時麵小時。錢，對探針卡11料㈣配線之電阻僅 根據所測出之電阻值算出電阻變化率。在該電阻變化 中’顯量之電阻值⑽於依據設計之邏輯電阻 23 1291845 的乖離量。從電阻變化率固定 會確實地保持探針卡n之内部U0%看來，可以確定 何，可確定的是在探針卡_不备路無論前述溫度條件為 線不良的情形。 ㈢生内部配線斷線或配 接著，本發明人檢驗如上所 導體晶圓間之連接可靠性。檢驗時，=針卡11及半 具體例相關之探針卡u。 、月卜目同’準備與Next, the inventors measured the amount of bending of the probe card u manufactured as described above. At the time of measurement, specific examples and comparative examples were prepared. Specific examples are produced by the aforementioned manufacturing method 10. In the comparative example, BT resin was used for the first and second center resin layers. The configuration or structure other than the first and second center resin layers is produced by the same method as the probe card 11 described above. The amount of bending was measured at 20 spans cut by the surface of the second substrate. The probe card u associated with the specific example measures the value under the heart_. On the other hand, the probe card associated with the comparative example measured a value of 30-15. It is confirmed that the amount of bending is reduced in the probe card 11 associated with the specific example as compared with the comparative example. In addition, the inventor of the present invention 20 Nas listened to the probe card manufactured by the return of the 11 # degree cycle experiment. The probe card on the side of the pre-touch material is placed on the side! The probe card 11 is placed in the gas phase. In the gas phase, in the thief thief, the temperature rise and fall (temperature cycle) 3 (8) times. Next, the inventors gave a standstill experiment (combustion test). When the probe card 11 is placed at 15 (the atmosphere of the rc is small, the resistance of the probe card 11 material (4) wiring is calculated based on the measured resistance value. In this resistance change, the amount of the sensation is The resistance value (10) is based on the deviation of the designed logic resistance 23 1291845. The fixed rate of change from the resistor will surely maintain the internal U0% of the probe card n. It can be determined what can be determined in the probe card _ Regardless of the above-mentioned temperature condition, the line condition is poor. (3) The internal wiring of the raw wiring is disconnected or matched, and the inventors examined the reliability of the connection between the conductor wafers as above. In the inspection, the needle card 11 and the semi-specific examples are related. Needle card u.
、/、體例相關之探針卡u中， ==桿接合於第2基板表面之導電塾。於探針卡U 10 奋t體晶® °半導體晶圓之電極被探針卡U上之接 觸才干擋住。如此一來，半導體晶 日日51之電極與接觸桿會電連 15 接。然後，在室溫及15叱之間反覆溫度的升降。此時，電 2從探針卡η通電至半賴晶圓。根據所通電之電流來測 讀針卡Η及半導體晶圓之電阻值。與上述相同，根據所 測得之電阻值來算出電阻變化率。從電阻變化率固定在小 於10%看來，可以確定在半導體晶圓之電極與接觸桿之間 會確實地維持接觸。無論前述溫度條件為何，可確定的是 在半導體晶圓與探針卡11之間不會發生接觸不良的情开）。 即，可確定不管半導體晶圓及探針卡⑽熱膨脹，仍可極 力抑制半導體晶圓之電極與接觸桿之位置偏移。 20 【圖簡明】 第1圖係概略性地顯示與本發明一具體例子相關之印 刷基板，即，探針卡之外觀的透視圖。 第2圖係沿著第1圖之2 —2線之放大垂直截面圖。 第3圖係沿著第1圖之3 —3線之放大垂直截面圖。 24 1291845 第4圖係顯示於纖維強化樹脂板間插入樹脂板時之放 大部分截面圖。 第5圖係顯示形成中心樹脂層時，朝其中一纖維強化樹 脂板按壓另一纖維強化樹脂板時之放大部分截面圖。 5 第6圖係顯示形成第1基板時，於第1中心樹脂層及積層 板間插入樹脂板時之放大部分截面圖。 第7圖係顯示朝第1中心樹脂層按壓樹脂板及積層板時 之放大部分截面圖。 第8圖係顯示形成穿孔時之放大部分截面圖。 1〇 第9圖係顯示形成第2基板時，於第2中心樹脂層及積層 板間插入樹脂板時之放大部分截面圖。 第10圖係顯示朝第2中心樹脂層按壓樹脂板及積層板 時之放大部分截面圖。 第11圖係顯示形成穿孔時之放大部分截面圖。 15 第12圖係顯示於第1基板表面積層第2基板時之放大部 分截面圖。 $ 13圖係顯示形成堆積層時，於第2基板表面形成絕緣 層時之放大部分截面圖。 $ 14圖係顯示於絕緣層表面形成鍍銅晶種層及電阻膜 2〇時之放大部分截面圖。 $ 15圖係顯示於鍍銅晶種層表面形成鍍銅層時之放大 部分截面圖。 $ 16圖係顯示形成導電圖案及通孔時之放大部分截面 圖0 25 1291845 【圖式之主要元件代表符號表】 11…探針卡 42.··導電圖案 12…第1基板 43…通孔 13…第2基板 44...過度塗布層 14...段差面 45、46、47···穿孔 15、16...堆積層 48、49、51、52、62、63·.·貫 17、18·.·導電墊 通孔 21…第1中心樹脂層 61a、61b…強化樹脂板 22…第1樹脂層 64...預浸體 23...絕緣層 65、66···平坦面 24…第2樹脂層 67…第1積層板 27...絕緣層 68...導電圖案 28…導電圖案 69...第2積層板 29...絕緣層 71…銅箔 31...導電圖案 72、73.··平坦面 32...通孔 74···穿孔 33...過度塗布層 75...鍍銅層 34·.·第2中心;樹脂層 76...導電圖案 35…第1樹脂層 77...樹脂材料 36...絕緣層 78...銅箔 37…第2樹脂層 79··.平坦面 38...絕緣層 81...平坦面 39...導電圖案 82···穿孔 41...絕緣層 83...鐘銅晶種層 26 1291845 84.. .導電圖案 85.. .鍍銅層 86…樹脂材料 87…穿孔 88.. .樹脂材料 89.. .鍍銅層 91…樹脂板 92···孔 93.. .鍍銅晶種層 94…電阻膜 95.. .鍍銅層In the probe card u related to the system, the == rod is bonded to the conductive crucible on the surface of the second substrate. The probe electrode U 10 is the body of the semiconductor wafer. The electrode of the semiconductor wafer is blocked by the contact on the probe card U. In this way, the electrode of the semiconductor crystal day 51 and the contact rod will be electrically connected. Then, the temperature rise and fall is repeated between room temperature and 15 Torr. At this time, the electricity 2 is energized from the probe card η to the wafer. The resistance of the pin chuck and the semiconductor wafer is measured based on the current applied. Similarly to the above, the resistance change rate is calculated based on the measured resistance value. From the viewpoint that the rate of change of resistance is fixed at less than 10%, it can be confirmed that the contact between the electrode of the semiconductor wafer and the contact rod is surely maintained. Regardless of the aforementioned temperature conditions, it can be determined that no contact failure occurs between the semiconductor wafer and the probe card 11). That is, it can be determined that the positional deviation of the electrode of the semiconductor wafer and the contact rod can be suppressed as much as possible irrespective of the thermal expansion of the semiconductor wafer and the probe card (10). 20 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view schematically showing the appearance of a printed substrate relating to a specific example of the present invention, i.e., a probe card. Fig. 2 is an enlarged vertical sectional view taken along line 2-2 of Fig. 1. Figure 3 is an enlarged vertical cross-sectional view taken along line 3 - 3 of Figure 1. 24 1291845 Fig. 4 shows a large cross-sectional view of the resin sheet inserted between the fiber-reinforced resin sheets. Fig. 5 is an enlarged partial cross-sectional view showing a state in which one of the fiber-reinforced resin sheets is pressed against another fiber-reinforced resin sheet when the center resin layer is formed. 5 Fig. 6 is an enlarged partial cross-sectional view showing a state in which a resin sheet is interposed between a first central resin layer and a laminate when a first substrate is formed. Fig. 7 is an enlarged partial cross-sectional view showing a state in which a resin sheet and a laminate are pressed toward the first center resin layer. Fig. 8 is a partially enlarged cross-sectional view showing the formation of a perforation. 1〇 Fig. 9 is an enlarged partial cross-sectional view showing a state in which a resin sheet is interposed between a second central resin layer and a laminate when a second substrate is formed. Fig. 10 is an enlarged partial cross-sectional view showing a state in which a resin sheet and a laminate are pressed toward the second center resin layer. Fig. 11 is a cross-sectional view showing an enlarged portion when a perforation is formed. 15 Fig. 12 is an enlarged cross-sectional view showing the second substrate of the first substrate surface layer. The $13 figure shows an enlarged partial cross-sectional view when an insulating layer is formed on the surface of the second substrate when the deposited layer is formed. The $14 image shows an enlarged partial cross-sectional view of the copper-plated seed layer and the resistive film 2〇 on the surface of the insulating layer. The $15 figure shows an enlarged partial cross-sectional view of the copper plated layer on the surface of the copper plated layer. Fig. 16 shows an enlarged partial cross-sectional view of a conductive pattern and a through hole. 0 25 1291845 [Main component representative symbol table of the drawing] 11...Probe card 42.·Conductive pattern 12...1st substrate 43...through hole 13...Second substrate 44...Overcoat layer 14...Step surface 45, 46, 47··Perforation 15, 16... Stacking layers 48, 49, 51, 52, 62, 63··· 17, 18·. conductive pad through hole 21... first central resin layer 61a, 61b... reinforced resin plate 22... first resin layer 64... prepreg 23... insulating layer 65, 66... flat Surface 24...second resin layer 67...first laminate 27...insulation layer 68...conductive pattern 28...conductive pattern 69...second laminate 29...insulation layer 71...copper foil 31.. Conductive Patterns 72, 73..... Flat Surfaces 32... Through Holes 74···Perforations 33...Overcoat Layer 75... Copper Plating Layer 34·.·Second Center; Resin Layer 76... Conductive pattern 35...first resin layer 77...resin material 36...insulation layer 78...copper foil 37...second resin layer 79·.flat surface 38...insulation layer 81...flat surface 39...conductive pattern 82···perforation 41...insulation layer 83...bell copper seed layer 26 1291845 84.. . Electrical pattern 85.. Copper plating layer 86... Resin material 87...Perforation 88.. Resin material 89.. Copper plating layer 91... Resin board 92··· Hole 93.. Copper plating seed layer 94...Resistance Film 95.. Copper plating
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