I291565 九、發明說明： 【發明所屬之技術領域】 本發明係與晶片的檢測方法有關，尤指___圖像㈣ 作為LCD控制晶片良窥之判斷基準的測試方法及其設備。 【先前技術】 按’目前晶片的構造’係依内部電子電路之布局，向外部延 •伸出複數之導電部(或導電端子）’做為曰後與電路板(PCB)、電線 板(PWB)或1C插座(IC Socket)等組件行電性連接；且為了避免晶 片固定於前雜件後，才發現晶w部 .功能或導電不佳等問題，故每顆晶片於產製完成後戈並= 組件做電性連接前，均必需對晶片進行檢測，以確保每顆晶片都 能功能正常。 如第一圖所示，目前檢測LCD控制晶片（LCD Tv cffip)(工） •是運用一由檢測插座（21)及檢測機板（2 2)所組成的晶片 2測單元⑵’來檢測該LCD控制晶片⑴的請；惟，目 則之SB 測單70 ( 2 )雖能達咖期檢測的功效，但由於該晶 片檢測單元⑵於檢測後，直接將檢測信號送至人機介面的工 料台二上，並運狂作人㈣視力觀看螢幕（s_)，藉以得知 每-測試晶片的良窥，而此種檢視作業，不僅使檢測效率低落而 、卜工作人員亦因長時間的觀看或眼睛的酸溫等因素， 而降低檢視品質。 5 !291565 【發明内容】 • 為此’發明人基於不斷研發之發明精神，認為應有一種方法 來改善先前技術的缺失，於是設計出一種以比對像素資料作為檢 測LCD控制晶片之方法，其主要係將一晶片檢測單元輸出的檢測 信號轉換為像素資料（PixelData)，並以一標準晶片之原像素資料 (RawPixel Data)作為比對之基礎，藉以比對出像素差異之處， 進而判讀出該測試晶片之良窳，而此一方法，除能根絕習用檢測 • 方法所衍生之缺失外，亦具有增益產品質量及節省人力等諸多效 盈，是為本發明主要目的。 本發明之另一目的在於提供一種以比對像素資料作為檢測 LCD控制以之信號轉換II，該信號轉換係採肖傳 鲁比對像素資料作為檢測LCD控制晶片之方法及其信號轉換器，直 中該方法主要包括： 11 卜連接-信號轉換器於-晶片檢測單元之信號輪出端，以 輸介面及USB介面等元件，藉明益傳輸速歧大量資料的處 理，以令本發明具有資料處理速度快及檢測品質高等諸多功效。 本發明為了解決先前問題所使用之技術手段，係提供一種以 掏取檢測信號； ，並與該信號轉換器中内建 同傳輸出至一比對軟體中， 2、 轉換該測檢信號為像素資料， 一標準晶片之原像素資料一同 以對兩像素資料進行比對；及 3、 輸出一比對資料。 6 1291565 【實施方式】 _ 町魏於前勒容，所提出之較佳實關，n由圖式說明 本發明之構造Μ寺點及實施例，俾供f審查人員對本案有進一 步認識。 請參閱第二圖所示，本發明以比對像素資料作為檢測LCD控 制晶片之方法，其主要包括： 1連接一k號轉換器於一晶片檢測單元（2 )(圖中未示) ⑩之^號輸出端，以擷取檢測信號； 2轉換忒測檢號為像素資料(pixeiData)，並與該信號轉換 • 為中内建-才示準晶片之原像素資料(Raw pixel Data)一同傳輸出至 -比對軟體中’以對兩像素資料進行比對(pixd如獅 Comparison);及 3、輸出一比對資料。 其中孩步‘ 1之剷，该晶片檢測單元（2 )係可接設cVBS、 • S-VIDE〇、YPbPr、VGA或HDMI等多種不同信號做為輸入信號， 而該晶片檢測單元（2 )係於測試一 LCD控制晶片（LCDTVCHIP) 後輸出一檢測彳§號，而該檢測信號係為一低電壓差動信號I291565 IX. Description of the Invention: [Technical Field] The present invention relates to a method for detecting a wafer, and more particularly to a method for testing a reference for a good control of an LCD control chip and a device thereof. [Prior Art] According to the layout of the internal electronic circuit according to the layout of the internal electronic circuit, a plurality of conductive portions (or conductive terminals) are extended to the outside as a circuit board (PCB) and a wiring board (PWB). ) or 1C socket (IC Socket) and other components are electrically connected; and in order to avoid the problem of crystal w. function or poor conductivity after the wafer is fixed to the front miscellaneous pieces, each wafer is produced after the production is completed. And = Before the components are electrically connected, the wafer must be inspected to ensure that each wafer is functional. As shown in the first figure, the LCD control wafer (LCD) is currently detected by using a wafer 2 measuring unit (2) consisting of a detecting socket (21) and a detecting board (2 2). LCD control chip (1) please; however, although the target SB test sheet 70 ( 2 ) can achieve the effect of the coffee period detection, but because the wafer detection unit (2) after detection, directly send the detection signal to the man-machine interface On the second stage, the madman (4) visually watched the screen (s_), so as to know the good glimpse of each test wafer, and this kind of inspection operation not only made the detection efficiency low, but also the staff also watched for a long time. Or the acid temperature of the eye and other factors, and reduce the quality of the inspection. 5!291565 [Summary of the Invention] • For this reason, the inventor believes that there should be a way to improve the lack of prior art based on the spirit of the invention, which is constantly researching and developing, so that a method for comparing the pixel data as a method for detecting the LCD control chip is designed. Mainly, the detection signal outputted by a wafer detecting unit is converted into pixel data (PixelData), and the raw pixel data of a standard wafer (RawPixel Data) is used as a basis for comparison, thereby comparing the pixel difference, and then reading out This test chip is good, and this method, in addition to the lack of learning and methods, also has many advantages such as gaining product quality and saving manpower, is the main purpose of the present invention. Another object of the present invention is to provide a signal conversion II for comparing LCD data by detecting pixel data, which is a method for detecting pixel control data and a signal converter thereof. The method mainly comprises the following steps: 11 The connection-signal converter is used in the signal round-out of the wafer-detecting unit, and the components such as the interface and the USB interface are processed by the Mingyi transmission speed differential data to make the invention have the data. The processing speed is fast and the detection quality is high. In order to solve the problem of the prior art, the present invention provides a method for capturing a detection signal, and transmitting the same to the software in the same manner as the signal converter, and converting the detection signal into a pixel. Data, the original pixel data of a standard chip is used to compare two pixels of data; and 3, output a comparison data. 6 1291565 [Embodiment] _ 魏 wei wei yu rong, the best practice proposed, n is illustrated by the schematic diagram of the structure of the present invention and the examples, and the reviewers have further knowledge of the case. Referring to the second figure, the present invention uses a comparison pixel data as a method for detecting an LCD control chip, which mainly comprises: 1 connecting a k-number converter to a wafer detecting unit (2) (not shown) 10 The output of the ^ number is used to capture the detection signal; 2 is converted to the pixel data (pixeiData), and is converted with the signal. • It is transmitted together with the raw pixel data (Raw pixel Data) of the built-in wafer. To - compare software 'to compare two-pixel data (pixd such as Lion's Comparison); and 3, output a comparison data. Among them, the chip detection unit (2) can be connected with a variety of different signals such as cVBS, • S-VIDE〇, YPbPr, VGA or HDMI as input signals, and the wafer detection unit (2) is After testing an LCD control chip (LCDTVCHIP), a detection signal is outputted, and the detection signal is a low voltage differential signal.
Voltage Differential Signaling ’ 簡稱 LVDS)，是知，藉由該低電壓 差動#號具有面速傳輸大量資料等特性，藉以增益處理資料的速 度。 又請參閱第二圖所示’其中該步驟2係以標準晶片之原像素 資料(Raw Pixel Data)做為比對基礎，以令與測試晶片之像素於比 7 1291565 對後，可得知兩像素資料差異之處，於該步驟3中輸出一比對資 料，使人們可得知“良好或有瑕鱗職結料，且同時亦可 輸出比對有誤之處，例如·· ERR 〇〇〇〇〇〇〇八〇〇HHMMSS 876測 等資訊’碱輯·係可接設—輸出單元如顯示單元（Screen) 或其它等。 再者，圖像(image)是由複數個像素(pixd或d〇t)所構成，例 如：解析度（Resolution)為1366X768之圖像，係指於一英对範 圍内係含有1049088個像素(Pixel)，意即卿_個像素資料，所 以解析度越高_像’其像素㈣亦會姆增大，故於該步驟2 中係將兩像素貧料轉換成USB 2.〇或更高傳輸速度之格式(f_叫 來傳送資料’使該步驟2中可將兩像素龍喊速不斷傳輸至該 比對軟體中。 清參閱第三圖所示，本發明係一種以比對像素資料作為檢測 LCD控制晶片之信號轉換器，其主要包括： 心：LCD傳輸介面（3 )，該LCD傳輸介面（3 )係與一晶片 ^測單元（2 )之域輸出端形成電氣連接，以接收檢測信號後， 以TTL^#b輸出，另，該檢測信號係為一低電壓差動信號等數位 信號。 中央處理單TL ( 4 )，其係接收該LCD傳輸介面⑶的 輸出信號’並轉碼轉換成—圖像資料，又該巾央處理單元⑷ 鱗接有—微處理⑽猶)⑷），而該微處理器（4 1)中内建有-標準晶片之原像素資料，以供該中央處理單元⑷ 1291565 擷取該原像素資料後，與解碼後的像素資料（Pixel Data) 一同輸 出；及 一 USB介面（5 )，其係將該中央處理單元（4 )之像素資 料以高速傳輸速率輸出，例如··以傳輸速率48〇mb/s之2 〇 或更高傳輸速度（480mb/s以上)之匯流排（bus)傳送，且無需使 用其它介面即可與其它週邊設備如電腦(pC)等形成連接。 續請參閱第三圖所示，其中該LCD傳輸介面（3 )係將輸入 ❿的低電壓差動信號轉換成TTL信號輸出，做為該中央處理單元 (4)的輸入信號；再者，該LVDS信號及該TTL信號皆可使用 於8bit、lObit、12bit，甚至更高的資料頻寬。 再請配合第三圖所示，該中央處理單元（4)係包括一 fpga (FieldProgramable Gate Array現場可程式化閘式陣列）元件（4 2 )及複數個 SRAM (Static Random Access Memory 静態隨機處 理記憶體）（4 3 )，以令資料的傳輸及處理可更為快速。 • 再者，該USB介面（5 )係以USB 2.0或以傳輸速度更高的 匯流排傳送資料，因而又進一步縮短資料處理的時間，就以解析 度1366X768之像素資料比對為例，其比對完成的時間不超過5〇〇 毫秒（ms)，若遇有1920X1080等更高解析度之圖像時，係可同 時使用二個信號轉換器，亦可與前述相同比對時間下完成工作， 以此類推，使本發明可配合科技的發展作更高解析度之像素資料 比對工作，且僅需增加信轉換器的數量即可，無需再另行研發更 高階的產品。 9 1291565 綜上所述，本_騎實耻果，絲驗·或公開使用， 符合專利要件，纽缺出專利申請。 /准上述所陳，為本發明產業上—較佳實施例，舉凡依本發明 申明專利錢所作之等效變化，皆屬本射請專利範圍之列。 1291565 【圖式簡單說明】 第一圖係習用技術中晶片檢測單元之示意圖 第二圖係;^發明中方法之流程圖 第三圖係本發明中信號傳輸介面之方塊圖 【主要元件符號說明】 (1) ·晶片 (2) :晶片檢測單元 (2 1 ):檢測插座 (2 2 ):檢測機板 (3) : LCD傳輸介面 (4 ) ··中央處理單元 (4 1 ):微處理器 (4 2 ): FPGA 元件 (43)· SRAM (5): USB 介面Voltage Differential Signaling (abbreviated as LVDS), it is known that the low-voltage differential # has the characteristics of transmitting a large amount of data at a surface speed, and the speed at which the data is processed by the gain. Please refer to the second figure, where the step 2 is based on the raw pixel data of the standard wafer (Raw Pixel Data), so that the pixels of the test chip are compared with the ratio of 7 1291565. In the difference of the pixel data, a comparison data is output in the step 3, so that people can know that "good or have a good job, and at the same time, the output may be wrong, for example, ERR 〇〇 〇〇〇〇〇 〇〇 〇〇 HHMMSS 876 test and other information 'alkali series · can be connected - output unit such as display unit (Screen) or other. In addition, the image is composed of a plurality of pixels (pixd or D〇t), for example, the resolution is 1366X768 image, which means that there are 1049088 pixels (Pixel) in the range of one inch, which means clear_pixel data, so the higher the resolution _ like 'the pixel (four) will also increase, so in step 2, the two-pixel lean material is converted to USB 2. 〇 or higher transmission speed format (f_call to transfer data 'this step 2 The two-pixel dragon can be continuously transmitted to the comparison software. See the third figure, the hair The invention relates to a signal converter for comparing LCD data as a detection LCD control chip, which mainly comprises: a core: an LCD transmission interface (3), and a field output of the LCD transmission interface (3) and a chip measurement unit (2) The terminal forms an electrical connection to receive the detection signal, and is output by TTL^#b, and the detection signal is a digital signal such as a low voltage differential signal. The central processing unit TL (4) receives the LCD transmission interface. (3) The output signal 'and transcoded into image data, and the towel processing unit (4) scaled with - micro processing (10) still) (4)), and the microprocessor (4 1) has a built-in standard chip The original pixel data is obtained by the central processing unit (4) 1291565, and then outputted together with the decoded pixel data (Pixel Data); and a USB interface (5), which is the central processing unit ( 4) The pixel data is output at a high-speed transmission rate, for example, a bus transmission at a transmission rate of 48 〇 mb/s or higher (480 mb/s or more) without using other interfaces. Can be used with other peripherals such as computers (pC) The connection is formed. Continued, as shown in the third figure, wherein the LCD transmission interface (3) converts the input low voltage differential signal into a TTL signal output as an input signal of the central processing unit (4); Furthermore, the LVDS signal and the TTL signal can be used for data bandwidths of 8 bits, 10 bits, 12 bits, or even higher. In addition, as shown in the third figure, the central processing unit (4) includes an fpga (FieldProgramable). Gate Array (programmable gate array) components (4 2 ) and a plurality of SRAM (Static Random Access Memory) (4 3 ) to make data transmission and processing faster. • In addition, the USB interface (5) transmits data with USB 2.0 or a bus with a higher transmission speed, thus further shortening the data processing time. For example, the resolution of the pixel data of resolution 1366X768 is taken as an example. The completion time is not more than 5 〇〇 milliseconds (ms). If there is a higher resolution image such as 1920X1080, two signal converters can be used at the same time, and the same comparison time can be used to complete the work. By analogy, the present invention can cooperate with the development of technology for higher resolution pixel data comparison, and only need to increase the number of letter converters, without further development of higher order products. 9 1291565 In summary, this _ riding real shame, silk test, or public use, in line with patent requirements, New Missing patent application. / The above-mentioned specifications are the industrial and preferred embodiments of the present invention, and the equivalent changes made by the patents according to the present invention are all within the scope of the patent application. 1291565 [Simple description of the diagram] The first diagram is a schematic diagram of the wafer detection unit in the conventional technology. The second diagram is a flowchart of the method in the invention. The third diagram is a block diagram of the signal transmission interface in the present invention. (1) • Wafer (2): Wafer detection unit (2 1 ): Detection socket (2 2 ): Detection board (3): LCD transmission interface (4) · Central processing unit (4 1 ): Microprocessor (4 2 ): FPGA component (43) · SRAM (5): USB interface