1291084 ▲邊19曰修^#換頁) 九、發明說明： 【發明所屬之技術領域】 之月？有關於一種半導體積體電路晶圓製程平台 構的技術領域，尤指-種可於製程發生異常 ^刀始^:即時的發現及排除，而藉以大幅降低不良率之 產生之晶圓製程平台之安全監控機構者。 【先前技中]1291084 ▲Bian 19曰修^#换页) Nine, invention description: [Technical field of invention] Month? The technical field of a semiconductor integrated circuit wafer processing platform structure, in particular, a wafer processing platform capable of significantly reducing the defect rate in the process of abnormality of the process Security monitoring agency. [previous technique]
^ 一般半導體積體電路晶圓（以下簡稱晶圓）之製作， 從乳化（QXldatlQn)、擴散（Diffuse)、微影（Photo)、 餘刻（Etch)、化學氣相沉積（CVD)至金屬線義（㈣i 細恤）等等製程係需多次重覆循環，因此在該多樣化 及複雜性之晶圓製程中，如不運用系統化及自動化的系统 將前後«之製程整合在—起，則便會對產品之質量及製 作成本產生非常大的影響，因為晶圓能夠迅速的處理並於 真空％丨兄下傳送，以避免曝露於空氣中受污染，則便能夠 有效的降低產品之不良率產生及能減少設備裝置之佔地 面積。而目前該種將晶圓之數個製程整合於一起之平台， 係包括有 Precisi〇n5〇〇〇、Endura、Centura、以及 Producer等數種，而上述之製成平台主要皆係為於一中 心運送室周圍設有複數個處理各製程之反應室，且並於該 中心運送室中具有一供將晶圓於各反應室間傳送之移载 裝置而成者，其間之差別則僅係在於反應室之製程種類、 數量及相關配合設備之不同而已。 例如第一圖所示係為Centura製程平台（1)，其主^ General semiconductor integrated circuit wafer (hereinafter referred to as wafer), from emulsification (QXldatlQn), diffusion (Diffuse), lithography (Photo), Ech (Etch), chemical vapor deposition (CVD) to metal lines Yi ((4) i tweezers) and other processes require multiple cycles, so in this diversified and complex wafer process, if you do not use systematized and automated systems, the process will be integrated. This will have a very large impact on the quality of the product and the cost of production, because the wafer can be quickly processed and transported under vacuum to avoid exposure to air, which can effectively reduce the product's defects. Rate generation and can reduce the footprint of equipment. At present, the platform for integrating several processes of wafers includes Precisi〇n5〇〇〇, Endura, Centura, and Producer, and the above-mentioned platforms are mainly used in one center. There are a plurality of reaction chambers for processing each process around the transport chamber, and there is a transfer device for transferring the wafers between the reaction chambers in the central transport chamber, and the difference is only in the reaction. The type, quantity and related equipment of the room are different. For example, the first picture shows the Centura process platform (1), the main
19曰修(更)1L替换頁 1291084 要係為於該中心連送室（1 〇 )之周圍設有四個反應室 1 )、一個冷卻室（1 2 )、一個氣壓清潔室（^ 3 )及兩 個負載室（1 4 )，其中該中心運送室（1 Q )中係具有 一供將晶圓於各反應室（1 i )間傳送之移載裝置%、1 5 )，而該四個反應室（1丄）則係可分別為蝕刻、化學 氣相沉積、高溫化學氣相沉積、及物理氣相沉積的製程^ 該兩個負載室（1 4 )並連接至一小型清潔室（^ 6 )， 7该小型清潔室（16)之另-侧則分別具有_晶圓载入 裝1 7)以提供欲處理之晶圓，然後再將該晶圓 載室（1 4 )傳送至該中心運送室（1 〇 )。 、 上述之何種製程平台，其中皆係利用—移载裝 ^載晶圓，並將該晶圓於各反應室間傳送，而目前之 丰=置通常係為一機械手臂，而該移載裝置仍係存在著二 化、磨損及製作組裝誤差之問題，一旦該; =該零件老化、磨損及製作組裝誤差之問題時，、^ 曰到晶圓之製作，其可能 由：衫 取出時，發生與並夕麻上_ 應至或由反應室 造成晶圓刮傷之而°患室之人口、框架等碰觸而 誤差乃係二： 零件老化、磨損及製作組裝 生，所以#t:二大量發生，而會逐漸-點-滴的產 才會在檢測製程中:二現其:能圓之所有製程完成後 有問題的晶圓數量5亥製程平台所完成之 圓製程中之不良率大=力夕了’如此則便會使得晶 【發明内容】 l29l〇8419 曰 repair (more) 1L replacement page 12910084 is to have four reaction chambers around the center (1 〇) 1), a cooling chamber (1 2), a pressure cleaning room (^ 3) And two load chambers (1 4 ), wherein the central transport chamber (1 Q ) has a transfer device %, 15 5 for transferring the wafer between the reaction chambers (1 i ), and the four The reaction chambers (1丄) are respectively processed by etching, chemical vapor deposition, high temperature chemical vapor deposition, and physical vapor deposition, and the two load chambers (14) are connected to a small clean room ( ^ 6 ), 7 the other side of the small clean room (16) has _ wafer loading device 1 7 respectively to provide the wafer to be processed, and then transfer the wafer carrier (1 4 ) to the Center transportation room (1 〇). Which of the above-mentioned process platforms utilizes the transfer of the wafer and transports the wafer between the reaction chambers, and the current device is usually a mechanical arm, and the transfer is performed. The device still has the problems of disintegration, wear and assembly error. Once the part is aging, wear and manufacturing assembly error, the wafer may be produced by the shirt. Occasionally and _ _ _ _ _ _ _ _ _ _ _ _ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ A large number of occurrences, and gradually - point-drip production will be in the inspection process: two present: the number of wafers that are problematic after all the processes of the process are completed. The non-performing rate in the round process completed by the 5Hai process platform is large. =力夕了', then it will make crystal [invention] l29l〇84
U修(更灣“ ’ ·_'ι—〜— | 丨-一^ 本發明之主要目的係在於提供―種可於晶圓 移載裝置發生異常之初始便能即時的發現及排除，: 大幅降低不良率產生之晶圓製程平台之安全監控機構曰者。 而本發明所述晶圓製程平台之安全監控機構 括： ’、匕 上 一振動感應器，係設於該晶圓製程平台之移 供偵測該移載裝置運作時所產生之振動； 衣 上 一耸音感應态，係設於該晶圓製程平台之移載裝置 供偵測該移載裝置運作時所產生之聲音· -形變感應器，係設於該晶圓製程平台之移載裝置 上，供偵測該移載裝置於運作時其移動路徑户斤產生之曲 或位移量： ' 、/ ▲判別杈組，係接收來自該振動感應器或聲音感應器 或形變感應器所偵測之振動或聲音或曲率或位移量，並將 其轉換成數位訊號，且與預先設定之標準訊號範圍作比對 分析； :::裝置，係於該判別模組比對分析出該振動感應 益’及聲曰感應器及形變感應器所偵測之數位訊號超過標 準訊號範圍或發生異常時，則即會產生一警示之聲音及燈 光以提醒工作人員。 且 如此，便可藉其而於該晶圓製程平台之移載裝置的運 ，發生異常之初始，便能即時的將其發現及排除，以藉此 月匕大幅降低晶圓製程中不良率之產生者。 【實施方式】 7U修(更湾' ' ·_'ι—~— 丨-一^ The main purpose of the present invention is to provide an instant detection and elimination that can be generated at the initial occurrence of an abnormality in the wafer transfer device: The safety monitoring mechanism of the wafer processing platform for reducing the defect rate is generated. The safety monitoring mechanism of the wafer processing platform of the present invention includes: ', a vibration sensor on the wafer, is disposed on the wafer processing platform For detecting the vibration generated by the operation of the transfer device; a sound-sensing state on the clothes is a sound generated by the transfer device of the wafer processing platform for detecting the operation of the transfer device. The sensor is disposed on the transfer device of the wafer processing platform for detecting the amount of curvature or displacement generated by the moving path of the transfer device during operation: ', / ▲ discriminating the group, receiving from The vibration or sound or curvature or displacement detected by the vibration sensor or the sound sensor or the deformation sensor, and converted into a digital signal, and compared with a preset standard signal range; ::: device , the discriminant mode When the comparison detects that the vibration sensor and the digital signal detected by the sonar sensor and the deformation sensor exceed the standard signal range or an abnormality occurs, a warning sound and a light are generated to remind the staff. By using the transfer device of the wafer processing platform, the initial occurrence of the abnormality can be immediately discovered and eliminated, thereby greatly reducing the defect rate in the wafer process. [Embodiment] 7
1291084 ' 請參看第二圖所示，係本發明所述晶圓製程平台之 、 安全監控機構之第一較佳實施例，包括·· 一振動感應器（3 )，係設於該晶圓製程平台之移載 ^置（2 )上’供偵測該移載裝置（2 )運作時所產生之 振動； 一聲音感應器（4 )，係設於該晶圓製程平台之移載 •裳置（2 )上’供偵測該移載裝置（2 )運作時所產生之 _ 聲音； 幵>、’交感應益（5 )，係設於該晶圓製程平台之移載 &置（2 )上’供偵測該移載裝置（2 )於運作時其移動 路徑所產生之曲率或位移量； 一判別模組（6 )，係包括一轉換單元（6 〇 )、一儲 存單凡（6 1 )及一運算單元（6 2)，該轉換單元（6 0 )係可供接收來自該振動感應器（3 )或聲音感應器（4 ) 或形變感應為（5 )所偵測之振動或聲音或曲率或位移 • 里，亚將其轉換成數位訊號，該儲存單元（6 1 )係可預 先儲存或設定標準訊號範圍【係正常範圍之振動頻率或聲 音頻率或曲率或位移量】，該運算單元（6 2 )係供針對 該轉換單元（6 0 )所接收轉換之數位訊號及該儲存單元 (6 1 )預先儲存或设疋之標準訊號範圍作異常之比對分 析，並且以曲率或位移量為較佳之判別計算方式； 一警示裝置C 7 )，係包含有一聲音警示器（7 〇 ) 及燈光警不裔（7 1 )，使其可於該判別模組（6 )比 對分析出動感應器（3 )或聲音感應器（4)或形變 12910841291084' Please refer to the second figure, which is a first preferred embodiment of the safety monitoring mechanism of the wafer processing platform of the present invention, comprising: a vibration sensor (3), which is disposed in the wafer process The transfer of the platform (2) is used to detect the vibration generated by the operation of the transfer device (2); a sound sensor (4) is disposed on the transfer process of the wafer processing platform. (2) The above-mentioned 'sound generated by detecting the operation of the transfer device (2); 幵>, 'Cross-sensing benefit (5), is placed on the wafer processing platform for transfer & 2) The above is used to detect the curvature or displacement generated by the moving path of the transfer device (2) during operation; a discriminating module (6) includes a converting unit (6 〇), a storage unit (6 1 ) and an arithmetic unit (6 2), the conversion unit (60) is receivable for receiving from the vibration sensor (3) or the sound sensor (4) or the deformation sensor is detected by (5) Vibration or sound or curvature or displacement • In Asia, it is converted into a digital signal. The storage unit (6 1 ) can be pre-stored or set to standard signal. The range [the vibration frequency or the sound frequency or the curvature or displacement amount of the normal range], the operation unit (6 2 ) is for the digital signal received by the conversion unit (60) and the storage unit (6 1 ) The standard signal range stored or set is analyzed for abnormality, and the curvature or displacement is the preferred method of discriminating; a warning device C 7 ) includes an audible alarm (7 〇) and a light alarm (7 1 ), making it possible to analyze the output sensor (3) or the sound sensor (4) or the deformation 1291084 in the discriminating module (6)
'5 日修(更J正替換頁 感應器（5 )卢/W占、^ 显#处所偵测之數位訊號超過標準訊號範圍而發生 2U Ό果日寸’則即會產生一警示之聲音及燈光以提醒工 作人貝。 灶错^，閱第二圖所示，係本發明之第二較佳實施例，其 係大致與該第一較佳實施例相同，主要之差別僅 亥第：較佳實施例更包括有至少-攝影機（8)及至 =‘、、、員不态（9 )，該攝影機（8 )係可供拍攝該 =;運作過程，而該顯示器（9)則係可供顯示: ^機（8 )所拍攝之内容，其中該攝影機（8 )及顯示 m (9)係可於該製程平台啟動時即隨之開始工作，或 可於該判職組（6 )發現異f時啟動。 由於本發㈣可藉由該振動感舰（3 )或聲鹿 為（4)或形變感應器（5)隨時制該晶圓製程平 移載裝置（2 )的運作過程，因此於該移載裝置（2 )σ之 運作發生異常之初始，即能即時的被發現及排除，所以 因此大幅降低晶圓製程中不良率之產生者。 綜上所述’當知本發明具有產#上之利用性及 =而且在同類產品中均未見有類似之產品或發表而且二 新賴性’故已符合發日辑利之巾請要件，爰依法提出申請。 9 1291084 肊日敝)止替換頁'5 day repair (more J is replacing the page sensor (5) Lu / W account, ^ display # where the digital signal detected by the location exceeds the standard signal range and 2U results are generated, then a warning sound will be generated and The light is used to remind the worker. The second step is a second preferred embodiment of the present invention, which is substantially the same as the first preferred embodiment. The main difference is only the first: The preferred embodiment further includes at least a camera (8) and to = ',,, a member (9), the camera (8) is available for shooting the =; operation, and the display (9) is available Display: ^The content of the camera (8), wherein the camera (8) and the display m (9) can start working when the process platform starts, or can find differences in the judgment group (6) Starting at f. Since the present invention (4) can operate the wafer process translation carrier (2) at any time by the vibration ship (3) or the sound deer (4) or the deformation sensor (5), The initial operation of the transfer device (2) σ is abnormal, that is, it can be immediately discovered and eliminated, so the wafer process is greatly reduced. The producer of the non-performing rate. In summary, the 'when the invention has the availability of the product # and = and there is no similar product in the same product or published and the second new property' has been consistent with the Japanese version Please contact us in accordance with the law. 9 1291084 肊日敝)Replacement page
MjJl 【圖式簡单說明】 第一圖，係Centura製程平台之平面示意圖。 第二圖，係本發明第一較佳實施例之系統方塊圖。 第三圖，係本發明第一較佳實施例之系統方塊圖。 【主要元件符號說明】 (1 ) Centura製程平台 （10)中心運送室 (1 1 )反應室 (1 3 )氣壓清潔室 (1 5 )移載裝置 (1 7 )晶圓載入裝置 (3 )振乞感應器 (5 )形變感應器 (6 0 )轉換單元 (6 2 )運算單元 (7 0 )聲音警示器 (8)攝影機 (12)冷卻室 (1 4 )負載室 (1 6 )小型清潔室 (2)移載裝置 (4)聲音感應器 (6 )判別模組 (6 1 )儲存單元 (7 )警示裝置 (7 1 )燈光警示器 (9 )顯示器 10MjJl [Simple description of the diagram] The first picture is a schematic diagram of the Centura process platform. The second drawing is a system block diagram of a first preferred embodiment of the present invention. The third figure is a system block diagram of a first preferred embodiment of the present invention. [Main component symbol description] (1) Centura process platform (10) Center transfer chamber (1 1) Reaction chamber (1 3) Air pressure cleaning chamber (1 5) Transfer device (1 7) Wafer loading device (3) Vibrating sensor (5) Deformation sensor (60) Conversion unit (6 2 ) Operation unit (7 0 ) Acoustic alarm (8) Camera (12) Cooling chamber (1 4 ) Load chamber (1 6 ) Small cleaning Room (2) Transfer device (4) Sound sensor (6) Discriminating module (6 1 ) Storage unit (7) Warning device (7 1 ) Light warning device (9) Display 10