TWI289241B - Manufacturing method of a cavity of a light guide plate - Google Patents

Manufacturing method of a cavity of a light guide plate Download PDF

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Publication number
TWI289241B
TWI289241B TW92137540A TW92137540A TWI289241B TW I289241 B TWI289241 B TW I289241B TW 92137540 A TW92137540 A TW 92137540A TW 92137540 A TW92137540 A TW 92137540A TW I289241 B TWI289241 B TW I289241B
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Taiwan
Prior art keywords
light guide
guide plate
manufacturing
plate mold
substrate
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TW92137540A
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Chinese (zh)
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TW200521639A (en
Inventor
Tsung-Wei Chiang
Ming-Chiang Tsai
Chun-Yu Lee
Ga-Lane Chen
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Hon Hai Prec Ind Co Ltd
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  • Planar Illumination Modules (AREA)

Abstract

The present invention relates to a manufacturing method of a cavity of a light guide plate. The method includes following steps: providing a substrate which comprises V-cut; forming a photo-resist layer on the substrate; exposing the photo-resist layer with a photo-mask and developing the photo-resist layer to form a photo-resist projection; sputtering a metal film on the substrate and the photo-resist projection; conducting electroless plating and forming a metal layer on the surface of the metal film; removing the substrate and the metal layer and forming a cavity with a structure to expel gas.

Description

1289241 五、發明說明(1) 【發明所屬之技術領域】 ^ ’X明係關於種模仁製造方法,尤指一種用於液晶 顯不裴置之導光板模仁製造方法。 【先前技術】1289241 V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention ^ ′X Ming is a method for manufacturing a mold core, and more particularly to a method for manufacturing a light guide plate mold for liquid crystal display. [Prior Art]

近年來,隨著液曰# - E 領域更為廣泛,如筆的彩色化及大型化,其應用 1。0、% - w / D I電恥、各種台式電腦、液晶電視 寺 口液日日顯不為係一種破動;从 , 而需利用一光源系統作為液曰 ’/、身不此發光’因 (Backught M〇duler K,器的光源’如背光模組 件之-,用以引導自光源疒出:先板係背光模組中重要元 或點光源轉換成面光源出、ς。先線之傳輪方向,將線光源 一般之導光板包括至少一 光面,為提高光線出射之均勺5及一 /、该底面相對之出 置表面微結構,如V型二句禮句性,一般於導光板之底面設 之均勻性,進而提昇 ^政射以提尚導光板出射光束 a _ ,攸幵月先板組之整體性能。 目刚’ ¥光板微結構之繫 板印刷式、噴砂愈钱列:::方法大致有以下幾種:網 式,其中光阻光刻S匕機;加工式及光阻光刻鑄模 光、顯影於基板上成型出微处構之板,光阻經曝 方式成型一模仁,再利 乂肖後’再以電鑄翻模 型導光板。 ㈣以仁以塑膠射出或熱壓之方式成 請參閱第一圖,為20 02 告第5 1 4766號所揭示 $ 月21日Α。之台灣專利公 之種導光板模仁製造方法,其步驟In recent years, with the liquid 曰#-E field more extensive, such as the colorization and large-scale of the pen, its application 1.0,%-w/DI electric shame, various desktop computers, LCD TV temple liquid is not showing day by day. To use a light source system as a liquid helium '/, not to emit light' (Backught M〇duler K, the light source of the device, such as a backlight module), to guide the light source疒出: In the first-plate backlight module, the important element or point source is converted into a surface light source, ς. The direction of the first-line transmission wheel, the general light guide plate of the line source includes at least one smooth surface, in order to improve the light emission 5 and a /, the bottom surface of the opposite surface micro-structure, such as V-type two sentence courtesy, generally set the uniformity of the bottom surface of the light guide plate, and then enhance the ^ Zheng shot to enhance the light guide plate exit beam a _, The overall performance of the board of the first month of the month. 目刚' ¥ 微 微 微 微 系 系 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : And photoresist lithography mold light, developed on a substrate to form a micro-structured plate, light After molding, the mold core is formed by exposure, and then the model light guide plate is electroformed. (4) Refer to the first figure for the injection or hot pressing of the plastic. For the 20 02, report No. 5 1 4766 Revealing the method of manufacturing the light guide plate mold core of Taiwan Patent Publication No. 21

第6頁 1289241 -----— —^― —. — 五、發明說明〖(2) 包括:於一平面基板上冷受 & 阻劑曝光顯影',以構成光阻劑(S801);將前述光 板與若干光阻圖案表ί =光=案(S8°2”於該平面基 式於該平面基板表面4 ;;層;晶種⑽…以電鑄方 該基板表面脫離= ;(S804 );將該模仁與 (S8 0 6 )。 將该权仁表面之銅晶種蝕刻去除 然,此種製造方法所得之導-*或熱壓之方式成型導光板時,仁,再經由塑膠射 槽結構較小,一般為50〜1〇 射7制之導光板之v型 溫、壓力及排氣等因素二;=。射出或熱壓時由於模 型’無法準確得到所需之V型卜反之:型槽結構不易成 板之出光效率。而之VW籌’從而影響整個導光 之導m此制提供一種能得到出光效率高之v型"槿 之V先板杈仁製造方法實為必要。 價、、、Ό構 【發明内容】 本發明之目的在於提供一種能得到精度 構之導光板模仁製造方法。 Ό t槽結 ^發明提供之導光板模仁製造方法包括 供-具V型槽結構之基板;於該基板 :::.提 均句光阻層;利用一具預定圖案之光罩對心2塗佈― 光,然後顯影,使得該基板之V型槽結構上形層★進行曝 =結構;於該基板及該突起結構上鑛—金屬成犬起狀 及金屬層與基板剥離,得到一具排氣結構Page 6 1289241 -----———————————— V. Description of the invention 〖(2) includes: cold exposure & resist exposure development on a flat substrate to form a photoresist (S801); The light plate and the plurality of photoresist patterns are λ = light = case (S8 ° 2) on the plane of the planar substrate surface 4; layer; seed crystal (10) ... by electroforming the substrate surface is detached = (S804 The mold core is combined with (S8 0 6 ). The copper seed crystal on the surface of the weight is etched and removed, and the light guide plate is formed by the method of the manufacturing method or the hot pressing method, and the kernel is passed through the plastic. The structure of the slotting is small, generally the v-type temperature, pressure and exhaust of the light guide plate made of 50~1 〇7, and the second factor; =. The model can't accurately obtain the required V-type when shooting or hot pressing. On the contrary: the groove structure is not easy to be the light-emitting efficiency of the plate, and the VW is used to affect the whole light guide. This system provides a v-type manufacturing method that can obtain a high light-emitting efficiency. The present invention aims to provide a method for manufacturing a light guide plate mold having a precision structure. Ό t 槽 结 ^ The invention provides a light guide plate mold manufacturing method comprising: a substrate having a V-groove structure; on the substrate::: a uniform sentence photoresist layer; using a predetermined pattern of the mask to the center 2 Coating-lighting, and then developing, so that the V-shaped groove structure of the substrate is exposed to the structure; on the substrate and the protruding structure, the mineral-metal is formed into a dog shape and the metal layer is peeled off from the substrate to obtain a Exhaust structure

12892411289241

、胃"相較於先前技術,本發明之模仁製造方法所得之金屬 ‘光板杈仁具一排氣結構,再經由塑膠射出或熱壓之方式 成型導光板時,可以順利將模仁與導光板間之氣體順利排 出,使得模仁表面與導光板表面完全貼合,且通過控制適 當之模溫及壓力,使得導光板型槽結構易於成型,即 侍到精確度咼之V型槽結構,從而保證整個導光板之出光 效率。 【實施方式】 凊芩閱第二圖,係本發明導光板模仁製造方法之製造 流程,其包括以下步驟··提供一具V型槽結構之基板 (S901);於該基板之v型槽結構上塗佈一均勻光阻層 (S9 0 2 );利用一具預定圖案之光罩對該光阻層進行θ曝光, 然後顯影,使得該基板之V型槽結構上形成一突起狀光阻 結構(S90 3 );於該基板及該突起結構上鍍一金屬薄膜層 (S904),經電鎢於該金屬薄膜層表面形成一金屬層 (S9 0 5 ) ·’將該金屬薄膜層及金屬層與基板剝離,彳^到一具 排氣結構之金屬導光板模仁(S 9 〇 6 )。 請一併參閱第三圖,提供一具ν型槽結構丨〗之基板 10,其中,該基板10係聚甲基丙烯黢甲酯(p〇iy MetCompared with the prior art, the metal 'light plate barn obtained by the mold manufacturing method of the invention has an exhaust structure, and when the light guide plate is formed by plastic injection or hot pressing, the mold core can be smoothly The gas between the light guide plates is smoothly discharged, so that the surface of the mold core is completely adhered to the surface of the light guide plate, and the light guide plate groove structure is easily formed by controlling the appropriate mold temperature and pressure, that is, the V-shaped groove structure with precise precision is provided. In order to ensure the light extraction efficiency of the entire light guide plate. [Embodiment] The second drawing is a manufacturing process of a method for manufacturing a light guide plate mold of the present invention, which comprises the following steps: providing a substrate having a V-groove structure (S901); and a v-groove on the substrate Structurally coating a uniform photoresist layer (S9 0 2 ); θ exposure of the photoresist layer by using a mask with a predetermined pattern, and then developing, so that a protruding photoresist is formed on the V-groove structure of the substrate a structure (S90 3 ); plating a metal thin film layer on the substrate and the protruding structure (S904), forming a metal layer on the surface of the metal thin film layer by electro-tungsten (S9 0 5 ) · 'the metal thin film layer and metal The layer is peeled off from the substrate, and the metal light guide plate mold (S 9 〇 6 ) of an exhaust structure is used. Please refer to the third figure to provide a substrate 10 having a ν-type groove structure, wherein the substrate 10 is polymethyl methacrylate (p〇iy Met).

Meth Acrylate,PMMA),亦可採用玻璃等其他材 板10己具V型槽結構11,該V型槽社槿]]总山你 ^ 〜、、°構11係由傳統之網板印 刷式、賀砂與蝕刻式、機械加工式.或氺 ^ ^ ^ 叭戎九阻先刻鑄模式等方 1289241Meth Acrylate, PMMA), can also use other materials such as glass 10 has a V-groove structure 11, the V-shaped groove community]] total mountain you ^ ~, ° ° structure 11 by the traditional screen printing, Hesha and etching type, mechanical processing type. Or 氺^ ^ ^ 戎 戎 nine resistance first casting mode etc. 1288241

五、發明說明 於 如第四 採用正 法採用 請 阻層進 形成一 準,進 影式曝 光線經 基板10 劑進行 狀光阻 米,亦 他值。 液’且 可將光 έ玄基板1 0之V型έ 士媒1 1 V— 图所干。h 佈一均勻光阻層2〇, "^ ^ 2 :该光阻層2 0為有機光阻劑材料,可 二去’、:採用負光阻劑。該光阻層20之塗佈方 方疋塗方法,亦可採用喷塗方法等其他方法。V. Description of the invention In the fourth method, use the normal method to form a layer of resistive layer, and to expose the light through the substrate to form a photoresist, which is also a value. The liquid can be dried by the V-type scorpion medium 1 1 V of the optical substrate. h cloth-uniform photoresist layer 2〇, "^ ^ 2 : The photoresist layer 20 is an organic photoresist material, which can be used to remove the photoresist. The coating method of the photoresist layer 20 may be carried out by other methods such as a spraying method.

二併參閱第五圖,利用一具預定圖案之光罩對該光 订曝光,然後顯影,使得該基板之v型槽結構11上 突起狀光阻結構20a。將光罩(圖未示)與基板㈣ 打曝光步驟。其中,曝光之光源為紫外線,採用投 光技術曝光,即該光罩平行於基板丨〇。光源發出之 光學系統(圖未示)透過光罩照射至塗佈光阻芦 上,受到光線照射之光阻發生光敏反應,經;顯影 顯影,發生光敏反應之光阻未被溶解,形成一突= 結構20a。該突起狀光阻結構2〇a厚度為i微米〜1〇微 可根據導光板成型時模溫及壓力等因素之要求為其 該顯影劑為曱基異丁基酮,於基板丨〇上噴灑顯影" 基板處於靜止狀態30秒〜6〇秒,使之充分反應,% 罩之圖案轉移於基板1Q。Referring to the fifth figure, the light is contracted by a reticle of a predetermined pattern and then developed so that the v-shaped groove structure 11 of the substrate has a projecting photoresist structure 20a. Expose the mask (not shown) to the substrate (4). Wherein, the light source for exposure is ultraviolet light, and is exposed by a light-emitting technique, that is, the mask is parallel to the substrate 丨〇. The optical system (not shown) emitted by the light source is irradiated onto the coated photoresist reed by the reticle, and the photo-resistance of the light-irradiated photoresist is photosensitive. After development and development, the photo-resistance of the photosensitive reaction is not dissolved, forming a sudden process. = Structure 20a. The protrusion-shaped photoresist structure 2〇a has a thickness of i micrometers to 1 〇. The developer can be sulfhydryl isobutyl ketone according to the requirements of mold temperature and pressure during molding of the light guide plate, and sprayed on the substrate rafter. The development " substrate is in a static state for 30 seconds to 6 seconds, so that it is fully reacted, and the pattern of the % mask is transferred to the substrate 1Q.

如第六圖所示’於該基板丨〇及該光阻突起結構2〇a上 鍍一金屬薄膜層30。將顯影後之基板1〇放入濺鍍機(圖未 示)腔體内,設定工作壓力〇 〇5 t〇rr,將基板10加熱到 1 5 0 C,通入電漿反應氣體,控制反應時間,於基板丨〇及 該光阻突起結構20a之表面沈積一層厚度為2〇〇〜500A之金 屬薄膜層3 0 ’此金屬薄膜層3 〇亦可由蒸鍍等其他沈積方法 獲得,該金屬薄膜為銅或其他金屬。 〆As shown in Fig. 6, a metal thin film layer 30 is plated on the substrate and the photoresist protrusion structure 2A. The developed substrate 1 is placed in a cavity of a sputtering machine (not shown), the working pressure is set to 〇5 t〇rr, the substrate 10 is heated to 150 C, and the plasma reaction gas is introduced to control the reaction time. Depositing a metal thin film layer 3 0 ' on the surface of the substrate 丨〇 and the photoresist protrusion structure 20a to a thickness of 2 〇〇 500 500 Å. The metal thin film layer 3 〇 may also be obtained by other deposition methods such as evaporation, and the metal thin film is Copper or other metal. 〆

1289241 五、發明說明(5) "一"— ------ 如第七圖所示,經電鑄於該金屬薄膜層3〇表 金屬層40。將基板10置入電鑄液中,進行無極電=成一 形成金屬層40。其中,該電鑄液係提供金屬離子:二驟以 次磷酸鹽與促進劑等之混合物。提供金屬離子之=洛液 '中 化鎳溶液,亦可以為硫酸鎳或氣化鎳等其他溶液’奋液為磷 為鹼金屬鹵化物。此外,該電鑄液還可包括PH碉節=進劑 濕劑、光澤劑等來加強電鑄效果。該電鑄液為酸性=潤 亦可以為鹼性溶液。該基板1 〇置於電鑄液之時間依ς =, 金屬層40厚度而設置。本實施方式之金屬層4〇厚度可=之 0.4 mm〜2 mm,通過無極電鑄,該金屬層形成於哕八“ 膜層3 0上。 、〜I屬薄 如第八圖所示,將該金屬薄膜層30及金屬層4〇鱼 板10剝離,得到一具排氣結構5〇之金屬導光板模仁了二 該金屬薄膜層3〇及金屬層40與基板10及該光阻突起 : 2 0 a剝離,得到由金屬薄膜層3 〇及金屬層4 〇整合之金屬 體結構模型,此模型即為模仁6〇,該模仁6〇具有一排5姓 構50,該排氣結構50之深度為該突起狀光阻結構2〇a之*严、Ό 度,亦可根據導光板成型時模溫及壓力等因素之要求而子嶽 化。 ’欠 本發明之模仁製造方法所得之金屬導光板模仁具一 氣結構,經由塑膠射出或熱壓之方式成型導光板時, 順利將模仁與導光板間之氣體順利排出,使得模仁表面與 導光板表面完全貼合,且通過控制適當之模溫及壓力,佶 得導光板之V型槽結構易於成型,即得到精確度高之ν = 1289241_ 五、發明說明(6) 結構,從而保證整個導光板之出光效率。 綜上所述,本發明符合發明專利要件,爰依法提出專 利申請。惟,以上所述者僅為本發明之較佳實施方式,舉 •凡熟悉本案技藝之人士,在援依本案發明精神所作之等效 修飾或變化,皆應包含於以下之申請專利範圍内。1289241 V. Invention Description (5) "One"------- As shown in the seventh figure, the metal layer 40 is electroformed on the metal thin film layer 3. The substrate 10 is placed in an electroforming liquid to perform electrodeless electricity formation to form a metal layer 40. Wherein, the electroforming solution provides a metal ion: a mixture of a hypophosphite and an accelerator. Providing metal ions = Luo liquid 'neutralized nickel solution, may also be other solutions such as nickel sulfate or nickel vaporization'. Phosphorus is an alkali metal halide. In addition, the electroforming solution may further include a PH = section = a wetting agent, a glossing agent, etc. to enhance the electroforming effect. The electroforming solution is acidic or moist and can also be an alkaline solution. The substrate 1 is placed in the electroforming solution at a time dependent on the thickness of the metal layer 40. The thickness of the metal layer 4 of the present embodiment can be 0.4 mm to 2 mm, and the metal layer is formed on the film layer 30 by the electroless casting. The light is thin as shown in the eighth figure. The metal thin film layer 30 and the metal layer 4 are separated from each other, and a metal light guide plate mold having a venting structure is obtained. The metal thin film layer 3 and the metal layer 40 and the substrate 10 and the photoresist protrusion are: 20 a stripping, a metal structure model obtained by integrating the metal thin film layer 3 〇 and the metal layer 4 ,, the model is the mold core 6 〇, the mold core 6 〇 has a row of 5 surname 50, the exhaust structure The depth of 50 is the strictness and the degree of the protrusion-like photoresist structure 2〇a, and may be decomposed according to the requirements of the mold temperature and the pressure during the molding of the light guide plate. The metal light guide plate mold has a gas structure, and when the light guide plate is formed by plastic injection or hot pressing, the gas between the mold core and the light guide plate is smoothly discharged, so that the surface of the mold core completely conforms to the surface of the light guide plate, and passes through Control the proper mold temperature and pressure, and the V-groove structure of the light guide plate is easy to form. The type, that is, the high precision ν = 1289241_ five, the invention description (6) structure, thereby ensuring the light-emitting efficiency of the entire light guide plate. In summary, the invention meets the requirements of the invention patent, and patent application is filed according to law. The present invention is only a preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

第11頁 1289241 圖式簡單說明 第一圖係一種先前技術導光板模仁製造方法流程圖。 第二圖係本發明之導光板模仁製造方法流程圖。 第三圖係本發明之具v型槽結構之基板示意圖。 第四圖係本發明之導光板模仁製造方法之光阻塗佈示意 圖。 第五圖係本發明之導光板模仁製造方法經曝光、顯影得到 之基板示意圖。 第六圖係本發明之導光板模仁製造方法之沈積金屬薄模層 示意圖。 第七圖係本發明之導光板模仁製造方法之電鑄示意圖。 第八圖係本發明之導光板模仁製造方法所得之導光板模仁 示意圖。 【主要元件符號說明】 基板 10 V型槽結構 11 光阻層 20 突起狀光阻結構 20a 金屬膜薄層 30 金屬層 40 排氣結構 50 模仁 60Page 11 1289241 BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a flow chart of a prior art method of manufacturing a light guide plate mold. The second figure is a flow chart of a method for manufacturing a light guide plate mold of the present invention. The third figure is a schematic view of a substrate having a v-groove structure of the present invention. The fourth figure is a schematic diagram of photoresist coating of the method for producing a light guide plate mold of the present invention. The fifth drawing is a schematic view of a substrate obtained by exposing and developing the method for manufacturing a light guide plate mold of the present invention. Fig. 6 is a schematic view showing a deposited metal thin mold layer of the method for producing a light guide plate mold of the present invention. The seventh drawing is a schematic view of electroforming of the method for manufacturing a light guide plate mold of the present invention. The eighth drawing is a schematic view of a light guide plate mold obtained by the method for manufacturing a light guide plate mold of the present invention. [Main component symbol description] Substrate 10 V-groove structure 11 Photoresist layer 20 Projected photoresist structure 20a Metal film thin layer 30 Metal layer 40 Exhaust structure 50 Mould 60

第12頁Page 12

Claims (1)

1289241 ------_ 六 申清專利範圍 提3 $板拉仁製造方法,其包括以下步驟: μ型槽結構之基板; 下乂驟 利用二ί 型槽結構上塗佈一均勻光阻層; 顯,圖案之光罩對該光阻層進行曝光,然後 F且^構 該基板之V型槽結構上形成一突起狀光 突起結構上鑛-金屬薄膜層’· 聘該金屬Ϊ膜ί缚膜層表面形成一金屬層,· 2,構之金屬寧基板剝離,得到一氣 3之導光板模仁製造’法, 其中圍第1項所述之導光板模仁製造方法’ “二:專二結構係採用機械加工製成。 申中::型槽結構係採用光阻 :睛專利範圍第1ΙΜ == 法, ,其中該光阻層之爸德士;^之ν先板杈仁製邊万 L如申請專利範圍第Γ項方所法:採,旋W '如申請專利二以/法係採用喷塗方法。玄, 如申請專利範圍第〗IS 材料。 含, 其中塗佈之先限俜負先所广之導光板模仁製造方/ 係負先阻材料。 $ 13頁 1289241 六、申請專利範圍 9.如申請 其中該 1 0.如申請 其中該 1 1.如申請 其中該 1 2.如申請 其中該 1 3.如申請 其中該 1 4.如申請 其中該 1 5 ·如申請 其中該 1 6.如申請 其中該 液。 1 7.如申請 其中該1289241 ------_ Liu Shenqing patent scope provides 3 $ laren manufacturing method, which includes the following steps: a substrate with a μ-shaped groove structure; a lower photoresist is coated with a uniform photoresist a photosensitive mask of the pattern is exposed, and then a V-shaped groove structure of the substrate is formed to form a protrusion-like light protrusion structure on the metal-metal film layer. A metal layer is formed on the surface of the binder layer, and the metallized substrate of the structure is peeled off, and a method for manufacturing a light guide plate mold of a gas 3 is obtained, wherein the method for manufacturing the light guide plate mold of the first item is described. The two structural systems are made by machining. Shenzhong:: The groove structure is made of photoresist: the patent scope is the first ΙΜ == method, where the photoresist layer is the daddy; Wan L is as claimed in the third paragraph of the patent application: mining, spinning W 'if applying for patent 2 / method using spraying method. Xuan, such as the scope of patent application 〗 IS material. Contains, where the first limit of coating Negatively the first light guide plate mold manufacturer / negative resistance material. $ 13 page 128 9241 VI. Application for patents 9. If the application is for the case of 10. If the application is for that 1 1. If the application is for that 1 2. If the application is for that 1 3. If the application is for that 1 4. If the application is for the 1 5 If you apply for it, 1 6. If you apply for this liquid. 1 7. If you apply for it 專利範圍第1項所述之導光板模仁製造方法, 突起狀光阻結構厚度為1微米至1 0微米。 專利範圍第1項所述之導光板模仁製造方法, 金屬薄膜層之沈積方法係採用蒸鍍方法。 專利範圍第1項所述之導光板模仁製造方法, 金屬薄膜層之沈積方法係採用濺鍍方法。 專利範圍第1項所述之導光板模仁製造方法, 金屬薄膜層材料為銅。 專利範圍第1項所述之導光板模仁製造方法, 電鑄步驟使用之電鍍液為酸性溶液。 專利範圍第1項所述之導光板模仁製造方法, 電鑄步驟使用之電鍍液為鹼性溶液。 專利範圍第1項所述之導光板模仁製造方法, 電鑄步驟使用之電鑛液為填化鎳溶液。 專利範圍第1項所述之導光板模仁製造方法, 電鑄步驟使用之電鍍液為硫酸鎳或氣化鎳溶 專利範圍第1項所述之導光板模仁製造方法, 金屬層之厚度為0.4mm至2mm。The method for manufacturing a light guide plate mold according to the first aspect of the invention, wherein the protruding photoresist structure has a thickness of 1 micrometer to 10 micrometers. The method for manufacturing a light guide plate mold according to the first aspect of the patent, the method for depositing a metal thin film layer is an evaporation method. The method for manufacturing a light guide plate mold according to the first aspect of the patent, the method for depositing a metal thin film layer is a sputtering method. The method for manufacturing a light guide plate mold according to the first aspect of the invention, wherein the metal film layer material is copper. The method for manufacturing a light guide plate mold according to the first aspect of the invention, wherein the electroplating solution used in the electroforming step is an acidic solution. The method for manufacturing a light guide plate mold according to the first aspect of the invention, wherein the electroplating solution used in the electroforming step is an alkaline solution. The method for manufacturing a light guide plate mold according to the first aspect of the invention, wherein the electro-mineral solution used in the electroforming step is a nickel-filled solution. The method for manufacturing a light guide plate mold according to the first aspect of the invention, wherein the electroplating solution is a method for manufacturing a light guide plate mold according to the first aspect of the patent of the nickel sulfate or the vaporized nickel solution, wherein the thickness of the metal layer is 0.4mm to 2mm. 第14頁Page 14
TW92137540A 2003-12-31 2003-12-31 Manufacturing method of a cavity of a light guide plate TWI289241B (en)

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