1288477 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種電 製造方法，特別是電子電路之保護元件及其 向基板上形成從基板兩端 二 及介於其間之介電声，再藉由切 剎製程形成橫向間隙，構 电層冉精由切 且有橫構成上、下電極層之重疊部份 ，、有検向間隙，以及上、 隔之刑能品批兩& Γ增电極層以介電層相互間 隔之型悲，而放電電極對向 之私々，、，m成； 又尾為上' 下層電極放電 之形式，以因應電容、雷 阻或龟感等特性使用者。 【先前技術】 在％路中’電容、電阻万带曰 ^ Mr ^ - Μ 及兒感疋目前電子產品中 不了或缺的二大被動元件，帝六 台匕甘接# is 私谷的原始功能為儲存電 月b其構成原理係在兩導電物皙 -^ ^ ^ ^ 物間以介電質隔離，並 將靜電何儲存於其間，Μ錢 調諧及震盪等作用。依不鬥八币# 了方硌應波、 料间介電質區分固定電容、可 父电谷及晶片電容等三大類。 *電阻器的功能則是為調整電路中的電壓及電 〜，電感器的主要功能則是 止電磁波干擾，三者互相的雜訊’以防 ,|f . 甘_ m 相4配作用而達成電子迴路控 制“’其應用範圍涵蓋資訊、通 他工業產品領域，是各 、私子及，、 分貝屋口口不可或缺的零組件。 八次，在電子通訊設備之線路中， 土”兩戍疋口為#電放電（Electro_Static 12884771288477 IX. Description of the Invention: [Technical Field] The present invention relates to an electrical manufacturing method, and more particularly to a protective element of an electronic circuit and a dielectric sound formed on the substrate from both ends of the substrate and between Then, the lateral gap is formed by the cutting process, and the electrical layer is cut and has a horizontal portion to form an overlapping portion of the upper and lower electrode layers, and there is a gap between the upper and lower electrodes, and the upper and lower compartments can be approved by the two & The collector layer is separated by a dielectric layer, and the discharge electrode is opposite to the private layer, and m is formed; and the tail is in the form of the upper 'lower layer discharge to meet the characteristics of capacitance, lightning resistance or turtle sensation. user. [Prior Art] In the % road, 'capacitance, resistance million belt 曰 ^ Mr ^ - Μ and children's sense of the current two electronic components are missing or lack of two passive components, the emperor six Taiwan 匕 Ganlian # is the original function of the private valley In order to store the electricity month b, the principle of its structure is to isolate the dielectric between the two conductive materials, and store the static electricity in between, and to adjust the vibration and oscillation. According to Fang Yiying, the dielectric between the materials, the fixed capacitance, the parent electric valley and the chip capacitor. * The function of the resistor is to adjust the voltage and electricity in the circuit~, the main function of the inductor is to stop the electromagnetic wave interference, the mutual noise of the three 'in case, prevent the |f. Electronic circuit control "'The scope of application covers information, through the field of industrial products, it is the indispensable components of the private and private, and the mouth of the decibel house. Eight times, in the line of electronic communication equipment, soil" two戍疋口为#电放电(Electro_Static 1288477
Discharge, ESD )對於電子設備構成基板等元件的破 壞而造成產品的損失，電子設備中通常會裝設可防止 因異常電壓而造成損壞之電子保護元件，而且，通常 是利用電容、電阻及電感等被動元件來作為控制。 有關靜電放電保護元件，例如，暫態電壓抑制二 極體（Transient Voltage Suppress Diode, TVSD) 元件、積層式壓敏電阻（Multi-Layer Varistor, ML V ) ^ 元件等，提供來作為線路保護設計之用；而在線路設 | 計上，業者也已應用如屏蔽（Shielding)保護、間 隙放電（Gap Discharge)、電容（Capacitor)之充 放電等各種不同方式’來解決靜電放電保護的設計問 題。 於諸多對靜電放電保護設計的解決對策之中，於 印刷電路基板佈局（PCBLay〇ut)時，直接於靜電 放電保護設置點設計如第1 a圖所示之間隙放電電極 結構，並於印刷電路基板製作之同時包含靜電放電保 ® 護設計者，乃是成本較低的方式’也已被廣泛的應用 在許多設計之中。 第1A圖係顯示在一印刷電路基板10上，於欲 設置靜電放電保護機構的線路11上製作出一尖形放 電電極12a，同時藉由一個間隙13的形成，再將另 一個尖形電極12b接地（Ground )者； 合併參考第1B圖所示，當因受到電擊15等而導 1288477 致可能之異常電壓、能量如靜電放電表示曲線16出 現在線路11中時，於兩個主要放電電極12a、12b之 間的間隙13產生擊穿、崩潰現象，故必需將此 電壓的幅度限制在如曲線17所示之可以接受的程 度，以對線路11產生保護作用。 =㈣電放電保護設計方式，經過分析後，發 現/、具有以下之缺點·· (1)二=知技藝中的間隙13之製作，係以機械切巧 ::::而受限於靜電放電製程能力的限制： 法達成的問題。 ㈢有热 ⑺度尺寸無法做到报小， 糸見度尺寸的崩潰電壓就會偏古， 、 保護作用就會被限制；對於需：更低！！：路的 護的電路將不適用。 -朋，貝包壓保 【發明内容】 有鐘於上述先前技藝所指出之缺 被動元件或保護需各別製作；:二及鑑於各 製造成本等諸多問題，本發明即旨成在 =費及增加 於多種電子電路之保護元件。杈么、—種可適用 本發明之電子電路之保護元件及… 於基板上形成積層式構造，並方法，係 層，且利用切割製程形成間？製程形成介電 电層利用不同特性 1288477 之材料，故可形成能夠因應電容、電阻及電感等特性 . 需要之保護元件，而間隙中利用空氣放電或填入壓電 敏感材料或不同氣體，可形成具有防護靜電放電功能 之元件者。 ，本發明之電子電路之保護元件及其製造方法，係 ;=瓷基板上形成多數層於基板周緣内侧部份重疊 w電層及电極層，整體組合後，經由切割製程使形 成〃有適田深度之橫向間隙，構成兩電極層重疊的部 : 分依橫向間隙而為前後相對，並依介電層而成為上下 對’如此’藉由間隙寬度或填人間隙内之材料特 ΐ路=電層的厚度等，可使之用以作為多種電子 逼路之保護元件者。 ^明之電子電路之保護元件及其製造方法，並 二多數Ξ!:ΐ後’沿著同一方向形成多數相互間隔 構成因楛：肢电極’再配合切割製程形成橫向間隙， :成，間隙而成為多數前後與上下相對電極 二;:上因下::同之;方向有多㈣ 態，可作為排:層，故其形成矩陣排列型 那丨且排谷等的保護元件。 上層:::::::路之保護元件及其製造方法，其 度來決間隙，係依其間的介電層的厚 電極與下層電極之；：=刷技術形成，如此’上層 ]的问度可以控制得極小，可克服 1288477 因為間隙寬度尺寸所導致之崩潰電壓。 本發明之電子電路之保護元件及其製造方法，发 結構簡單，且具有多種適用功能，對於電器產品而言 更具有降低成本之作用。 本發明之詳細構成、製造方法步驟，以及复 用、功能，參照下列依附圖所作之說明即可得到進— 步的了解： 【實施方式】 本發明之電子電路之保護㈣，其製造方法，如 弟A 2F圖所示，其製作步驟如下·· ΐίΓΓ基板21上端表面製作-基層玻璃22, 二曰 22的大小控制在位於陶瓷基板21的中 :::基層破璃22的側邊與陶究基板的邊緣不接 觸，（如第2Α圖） 恢 2. 於基層麵22上被覆第—冑 層23的一端蛊陶。 弟 屯極 電極声23^ 的第一端相連接’第― 上另一端則局部地被覆到基層玻璃22的 上知表面，·（如第2B圖） 旳 3. 於第一電極層 Μ具有約盍其M 士被後層"電層24,介電層 百、力與基層玻璃22相同的 玻璃心正上方，介電層24的另」; 層玻◎的-端；（如第2〇圖）而貝；連接至基 4.於介電層24上再被覆第二電極層25,第二電極層 1288477 25的一端與陶:光基板21的第二端相連 極声25 66η ^ 而子a運接’第二電 、一鳊則局部地被覆到介電^ % & 表面；（如第2D圖） I电層24的上端 5. 被覆一保護玻璃層26 保護玻璃；26的^ 電極層25的上端，該 迮圖）6的其他端與介電層24相接；（如第 6. 最後，以鑽石刀片切判锣 結構體中，對…t 雷射切割製程，於 一再甲對上述弟一電極層23、介電層 —電極層25的重疊部份，p 弟 :保4玻璃層26、第二電極層25、介電層以、、 電極層23及基層玻璃22的橫向間隙 破璃層26、第二電極層乃、介電層24 層23及基層玻璃^ ' … 為橫向間隙3的關係而成；Discharge, ESD) The loss of the product caused by the destruction of components such as the substrate of the electronic device. Electronic devices are usually installed in the electronic device to prevent damage due to abnormal voltage. Moreover, capacitors, resistors, inductors, etc. are usually used. Passive components come as controls. Electrostatic discharge protection components, such as Transient Voltage Suppress Diode (TVSD) components, Multi-Layer Varistor (ML V) components, etc., are provided as line protection designs. In the circuit design, the operator has also applied various methods such as Shielding protection, Gap Discharge, Capacitor charging and discharging to solve the design problem of electrostatic discharge protection. In many solutions to the electrostatic discharge protection design, in the printed circuit board layout (PCBLay〇ut), the gap discharge electrode structure as shown in Fig. 1a is designed directly at the electrostatic discharge protection set point, and in the printed circuit The production of substrates, including the ESD protection designer, is a lower cost method' has also been widely used in many designs. Fig. 1A shows a tip-shaped discharge electrode 12a formed on a printed circuit board 10 on a line 11 on which an electrostatic discharge protection mechanism is to be provided, and another tip-shaped electrode 12b is formed by the formation of a gap 13. Grounding (Ground); As shown in FIG. 1B, when a voltage abnormality, energy such as an electrostatic discharge indicating curve 16 appears in the line 11 due to an electric shock 15 or the like, the two main discharge electrodes 12a are shown. The gap 13 between 12b causes breakdown and collapse, so it is necessary to limit the magnitude of this voltage to an acceptable level as shown by curve 17, to protect the line 11. = (4) Electro-discharge protection design method, after analysis, found /, has the following shortcomings · (1) two = knowledge of the gap 13 in the production of technology, is mechanically cautious :::: and limited by electrostatic discharge Limitation of process capability: The problem reached by law. (3) There is a heat (7) degree size can not be reported small, the breakdown voltage of the visibility size will be old, and the protection will be limited; for the need: lower! ! : The circuit of the road will not be applicable. -Pen,Baibao pressure protection [Summary of the Invention] There are no passive components or protections that have been identified in the above prior art. It is necessary to make separate productions: 2 and in view of various manufacturing costs and the like, the present invention is intended to be Added to the protection components of a variety of electronic circuits. What is the type of the protective circuit of the electronic circuit of the present invention and the formation of a laminated structure on the substrate, and the method, the layer, and the forming process using the cutting process? The process forms the dielectric layer using materials of different characteristics 1288477, so it can form protective components that can meet the characteristics of capacitance, resistance and inductance. The gap can be formed by using air discharge or filling piezoelectric sensitive materials or different gases. It has components that protect against electrostatic discharge. The protective element of the electronic circuit of the present invention and the manufacturing method thereof are as follows: = a plurality of layers are formed on the ceramic substrate, and the electric layer and the electrode layer are partially overlapped on the inner side of the periphery of the substrate, and after the whole combination, the formation is made through a cutting process. The lateral gap of the depth of the field constitutes the portion where the two electrode layers overlap: the front and back are opposite to each other according to the lateral gap, and the upper and lower pairs are made by the dielectric layer, such as by the gap width or the material in the filling gap. The thickness of the electrical layer, etc., can be used as a protective element for a variety of electronic forcings. ^Mingzhi electronic circuit protection components and their manufacturing methods, and the majority of the Ξ!: After the ' 'the majority of the mutual spacing along the same direction constitutes the cause: the limb electrode' and the cutting process to form a lateral gap, into, gap It becomes the front and rear and the upper and lower opposite electrodes 2; the upper and lower sides: the same; the direction has many (four) states, which can be used as the row: layer, so it forms a protective element such as a matrix arrangement type and a valley. The upper layer::::::: the protection element of the road and the manufacturing method thereof, the degree of the gap is determined by the thick electrode and the lower electrode of the dielectric layer in between; :==brush technology, so the 'upper layer' The degree can be controlled to a minimum, which overcomes the breakdown voltage caused by the gap width dimension of 1288477. The protection element of the electronic circuit of the invention and the manufacturing method thereof have the advantages of simple structure and various applicable functions, and have the effect of reducing the cost for the electrical product. The detailed configuration of the present invention, the manufacturing method steps, and the multiplexing and functions can be further understood by referring to the following descriptions made with reference to the accompanying drawings: [Embodiment] The protection of the electronic circuit of the present invention (4), the manufacturing method thereof, such as As shown in the figure A 2F, the manufacturing steps are as follows: ΐ ΓΓ ΓΓ 上 上 21 21 ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ The edge of the substrate is not in contact, (as shown in Fig. 2). 2. The end of the first layer 23 is covered on the base layer 22. The first end of the second electrode electrode 23^ is connected to the 'top' and the other end is partially covered to the upper surface of the base glass 22, (as shown in Fig. 2B). 3. The first electrode layer has about盍 M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M And attached to the base 4. The second electrode layer 25 is further coated on the dielectric layer 24. One end of the second electrode layer 1288477 25 is connected to the second end of the ceramic substrate 21 to be extremely audible 25 66 η ^ a transported 'secondary electricity, one turn is partially covered to the dielectric ^ % &surface; (as shown in Figure 2D) I upper end of the electrical layer 24 5. coated with a protective glass layer 26 protective glass; 26 ^ electrode The other end of the layer 25 is connected to the dielectric layer 24; (eg, the sixth. Finally, the diamond blade is used to cut the structure of the structure, and the ...t laser cutting process is repeated. The overlapping portion of the electrode layer 23 and the dielectric layer-electrode layer 25, the glass layer 26, the second electrode layer 25, the dielectric layer, the electrode layer 23, and the base glass The lateral gap of the glass 22 is formed by the relationship between the glass layer 26, the second electrode layer, the dielectric layer 24 layer 23 and the base glass layer ...
丽後相對。（如第2F圖） I 如此’構成第-電極層23和第二電極層乃， :::其：的介電層24厚度作為放電間隙，使整 組/、備踭笔放電保護元件的特性；另一部份，第一 23和第二電極層25並因為橫向間隙3而成 :: 电極層231和後第一電極層232相對，前 弟二電極層251和後第二電極層252相對，如此可 :為填入橫向間隙3内的壓電材料或不同氣體(He 孔材料特性不同，使前第一電極層231和後第一 電極層232及前第二電極層251和後第二電極層 1288477 252之間形成不同Trigger Voltage(觸發電壓）的 ESD保護元件。 請再參照第3、4、5圖，係本發明之電子電路之 保濩7G件的製造方法之另一實施例，其製作步驟如 下·· 1 ·首先製備一陶瓷基板4 ;Li relative is relative. (As shown in Fig. 2F) I such that the thickness of the dielectric layer 24 constituting the first electrode layer 23 and the second electrode layer is :::: the thickness of the dielectric layer 24 serves as a discharge gap, so that the characteristics of the entire group/discharge protection element are The other part, the first 23 and the second electrode layer 25 are formed by the lateral gap 3: the electrode layer 231 and the rear first electrode layer 232 are opposed to each other, the front electrode layer 251 and the rear second electrode layer 252 In contrast, it is possible to fill the piezoelectric material or different gases in the lateral gap 3 (the characteristics of the He hole material are different, and the front first electrode layer 231 and the rear first electrode layer 232 and the front second electrode layer 251 and the second An ESD protection element having different Trigger Voltages is formed between the two electrode layers 1288477 and 252. Referring to Figures 3, 4 and 5, another embodiment of the manufacturing method of the protective 7G device of the electronic circuit of the present invention is shown. , the production steps are as follows: 1 · First prepare a ceramic substrate 4;
2·在陶瓷基板4上製作一緩衝底層41，該緩衝底層 41具有與陶瓷基板4沿著相同方向延伸之長形 體’其位於陶兗基板4的中央；2. A buffer underlayer 41 is formed on the ceramic substrate 4, and the buffer underlayer 41 has an elongated body extending in the same direction as the ceramic substrate 4, which is located at the center of the ceramic substrate 4;
3.在緩衝底層41上端被覆一電極材料層42，該電極 材料層42為门形狀，其具有與陶竞基板4相同的 長度，其兩端為塊狀體421、422，具有較高的高度， 而可分別地位於前述緩衝底層41的左右兩側，該 塊狀體421、422並分別連接至陶基板4的上端 側邊，其上端為平板表面423，平板表面4乃側邊 向外伸出，形成平板表面423的上端略呈十字狀； 4·於電極材料層42上端被覆一介電層43 ; 5.復於介電層43上方被覆一電極導體層44，該電極 導體層44 ’係以含有鈀（pd)或鉑（pt)的導體 二料製作，其覆蓋到電極材料層42的局部，係沿 者陶瓷基板4的長方向上’數置數個相互 體電極441、442、443、444，該等單趙電極441早 442、443、444的上下兩端具有較高的高度，而可 11 1288477 分別地位於介電声 層41的上下兩： 電極材料層42及緩衝底 的上下兩側，使體電極441、442、443 兩端I緣分別與陶莞基板 下側邊4B相接； 7工W違4A及 6·然後，於電極遂雜 7.最1 "上端再被覆一層保護層； 構體中央背〜 或疋雷射切割製程於結 門隙5·^ —道橫向㈣5,該橫向 =二貝穿電極導體層44、介電層43、電極材料 曰，亚局部深入緩衝底層41;使電極導體層料、 :¾層43、電極材料層42 ’因橫向間隙5而成為 月J後相對的型式，尤其是電極導體層，更因為橫 向間隙5而分成别後間隔相互對稱之單體電極 441、442、443、444 及下單體電極 44a、44b、44c、 44d。 如此，電極導體層44和電極材料層42之間， 因為介電層43、得以經由厚膜印刷製程形成，介電 層43的厚度可以控制到最小，而經由介電層43可 使用不同性質的介電材料，則構成具備電容、電阻 或電感特性需求之功能元件；並且，藉由在橫向間 隙5内利用空氣放電原理或填入壓電敏感材料即可 提供ESD保護。 上述以多數單體電極相對成矩陣排列所構成之 保護元件，其使用至電路板上時，可同時提供給多組 12 由此可知，本發明之電子電路之保護元件，經由 上述製造步驟’根據對微間隙材料層或橫向間隙填入 材料的選擇使用，即可使整體達到不同作用。3. An electrode material layer 42 is coated on the upper end of the buffer bottom layer 41. The electrode material layer 42 has a gate shape and has the same length as the Tao competition substrate 4, and the two ends thereof are block bodies 421 and 422 having a high height. The block bodies 421 and 422 are respectively connected to the upper end sides of the ceramic substrate 4, and the upper end thereof is a flat surface 423, and the flat surface 4 is outwardly extended. The upper end of the flat surface 423 is slightly cross-shaped; 4. The upper end of the electrode material layer 42 is covered with a dielectric layer 43; 5. The upper surface of the dielectric layer 43 is covered with an electrode conductor layer 44, and the electrode conductor layer 44' It is made of a conductor material containing palladium (pd) or platinum (pt), which covers a portion of the electrode material layer 42 and is provided with a plurality of mutual body electrodes 441 and 442 along the longitudinal direction of the ceramic substrate 4. 443, 444, the upper and lower ends of the single-electrode 441 early 442, 443, 444 have a higher height, and 11 1288477 are respectively located on the upper and lower sides of the dielectric acoustic layer 41: the electrode material layer 42 and the buffer bottom On the upper and lower sides, the I edges of the body electrodes 441, 442, and 443 are respectively 4B of the lower side of the base plate is connected; 7 W is in violation of 4A and 6 · Then, the electrode is noisy 7. The upper end of the 1 " is covered with a protective layer; the center of the structure is back ~ or the laser cutting process is at the gate The gap is 5·^—the transverse direction (4) 5, the lateral direction=the second electrode-through electrode conductor layer 44, the dielectric layer 43, the electrode material 曰, the sub-portion deeply buffers the bottom layer 41; the electrode conductor layer material, the layer 3:43, the electrode material layer 42' is a type which is opposite to the month J due to the lateral gap 5, in particular, the electrode conductor layer, and further, the lateral electrodes 5 are divided into the individual electrodes 441, 442, 443, 444 and the lower single electrode 44a which are symmetrical to each other. , 44b, 44c, 44d. Thus, between the electrode conductor layer 44 and the electrode material layer 42, since the dielectric layer 43 can be formed through a thick film printing process, the thickness of the dielectric layer 43 can be controlled to a minimum, and different properties can be used via the dielectric layer 43. The dielectric material constitutes a functional component having capacitive, resistive or inductive characteristics; and ESD protection can be provided by utilizing the principle of air discharge or filling the piezoelectric sensitive material in the lateral gap 5. The protection element formed by arranging a plurality of single-electrode electrodes in a matrix may be simultaneously provided to a plurality of groups 12 when used on a circuit board. Thus, the protection element of the electronic circuit of the present invention is The choice of the micro-gap material layer or the lateral gap-filling material allows the whole to achieve different effects.
1288477 電路之連接接腳使用，形成於兩側之電極材料層42 的塊狀體421、422可作為接地使用；如此，不僅可 避免傳統上需分別連接不同的保護元件所造成的困 擾，更因為影響電容、電阻特性之介電層可以得到良 2的控制，以及透過間隙内填入的材料使其具備降低 朋/貝電壓之靜電保濩功能，使得與之連接的電路品質 更為穩定。 請芬照f 6圖所示，係本發明電子電路之保護元 件的製造方法之另-實施例’如圖所示，本發明之電 子電路之保護元件，又得以在基板上方形成緩衝層 61、弟-電極層62,介電層63、第二 護f65、第—絕緣材料％及第二絕緣材料67，^ 割製程形成-道將上述材料分成前後相對之樺向孔 壓T黃向孔隙68内利用空氣放電原理將不 同“或堡電敏感材料填入，達到在基 電放電保護元件（ESD}之特性；並且，在 二備评 也可以利用厚膜印刷製程形成第 ^ 面’ 電;層:= 及弟一緣材料76等，同樣形成保 ？ 後，經電鍍製程於基體外部形成外部電極8匕2然 1288477 後，經電鍍製程於基體外部形成外部電極81、82, 再將上下層電路相連，構成有雙面效應之電子 護元件。 而第6圖所示之實施例，則可使基板上端為靜電 放電保護元件電路，基板的下端則可為RC電路或 EMI電路，構成兼具靜電放電保護元件（esd)盥 電路之複合式功能元件，或者為，靜電放電保護元件 (ESD)與EMI電路結合成—體的複合式功能元件。 —若再如前所述地配合矩陣排列形成排阻或排 容’則整體而言’功能更具備多樣化，將之使用於電 子產品，除了可減少線路的架設成本外，並可適用於 高頻，具備更精細要求的電子元件特十生，符合要求 卓i ’專、短、小的電子元件之需要。 如此，經由多層介電層及電極導體單元，配合一 間隙材料層的設計，整體形成多電容或多電阻之型 態，只要改變微間隙材料層的材料，即可使其作不同 用途，實施上相當方便。 根據以上兩個實施例，本發明具有以下之優點： 1. 雙向對位電極結構，可以藉由鑽石刀片切割或者是 雷射切割方式，很輕易的將間隙放電電極間的尺寸 控制到10〜3 〇 m。 2. 垂直式相互疊合的電極結構，可以藉由印刷厚度來 控制，很輕易的將間隙放電電極間的尺寸控制到5 1288477 〜25 // m 〇 3·因為間隙放電電極的尺寸極度微小化，可以將崩潰 電壓達成有效降低之效果，以最簡單結構裝置提供 符合ESD低壓保護設計需求的目的。 需陳月者以上所返者乃是本發明較佳具體的實 施例，若依本發明之構相觫从> % w 乂 再〜所作之改變，其產生之功能 作用，仍未超出說明書與圖 + .^ 、_不所涵盍之精神時，均應1288477 The connecting pins of the circuit are used, and the block bodies 421 and 422 formed on the electrode material layers 42 on both sides can be used as the grounding; thus, not only the troubles caused by the traditional connection of different protective components are avoided, but also because The dielectric layer that affects the capacitance and resistance characteristics can be controlled by the good 2, and the material filled through the gap enables the electrostatic protection function of reducing the voltage of the pen/bei, so that the quality of the circuit connected thereto is more stable. According to another embodiment of the manufacturing method of the protective element of the electronic circuit of the present invention, as shown in the figure, the protective element of the electronic circuit of the present invention can form a buffer layer 61 above the substrate. The electrode layer 62, the dielectric layer 63, the second guard f65, the first insulating material % and the second insulating material 67, the cutting process forming channel divides the material into front and rear opposite bifurcation pressure T yellow to the aperture 68 Internally, the principle of air discharge is used to fill different "or electric sensitive materials" to achieve the characteristics of the ESD protection component (ESD}; and, in the second review, the thick film printing process can also be used to form the surface" After the formation of the external electrode 8匕2 is formed by the electroplating process on the outside of the substrate, the external electrodes 81 and 82 are formed on the outside of the substrate, and the upper and lower layers are formed. Connected to form an electronic protection component having a double-sided effect. In the embodiment shown in Fig. 6, the upper end of the substrate can be an electrostatic discharge protection component circuit, and the lower end of the substrate can be an RC circuit or an EMI circuit, which constitutes both static electricity. put A composite functional component of a protective component (esd) or a circuit, or a composite functional component in which an electrostatic discharge protection component (ESD) and an EMI circuit are combined into a body - if the matrix is arranged as described above to form an exclusion resistor Or the capacity of 'integrated' is more diversified, and it is used in electronic products. In addition to reducing the cost of wiring, it can be applied to high-frequency, electronic components with finer requirements. Requires the need for special, short, and small electronic components. Thus, through the design of a multilayer dielectric layer and electrode conductor unit with a gap material layer, a multi-capacitor or multi-resistance type is formed as a whole, as long as the micro-gap is changed. The material of the material layer can be used for different purposes, which is quite convenient to implement. According to the above two embodiments, the invention has the following advantages: 1. The bidirectional alignment electrode structure can be cut by a diamond blade or laser The cutting method makes it easy to control the size between the gap discharge electrodes to 10~3 〇m. 2. Vertically overlapping electrode structures can be printed by Degree control, it is easy to control the size between the gap discharge electrodes to 5 1288477 ~ 25 / / m 〇 3 · Because the size of the gap discharge electrode is extremely small, the breakdown voltage can be effectively reduced, with the simplest structure The device is provided for the purpose of complying with the ESD low-voltage protection design requirements. Those who need to return the above are preferred embodiments of the present invention, and if the configuration according to the present invention is changed from > % w 〜 The function of the function is still beyond the spirit of the specification and the figure + .^ and _ not covered.
在本發明之範圍内，合予陳明。 J心 15 1288477 【圖式簡單說明】 第1A圓為習知間隙放電技藝之結構圖示。 第囷為省知間隙放電技蟄之電壓抑制說明圖 示0 第2A-2F圖為本發明之製作流程平面及側面表 示圖。 第3圖為本發明第二實施例之製作流程立體示 圖。 ’、 第4圖為本發明第二實施例之組合立體表示圖。 第5圖為本發明第二實施例之組合剖面示圖。 第6圖為本發明第三實施例之組合剖面示圖。 16 1288477Within the scope of the present invention, Chen Ming is incorporated. J heart 15 1288477 [Simple description of the diagram] The 1A circle is a structural diagram of the conventional gap discharge technique. The third section is a voltage suppression description of the known gap discharge technique. FIG. 2A-2F is a plan view and a side view of the manufacturing process of the present invention. Fig. 3 is a perspective view showing the manufacturing flow of the second embodiment of the present invention. 4 is a combined perspective view of a second embodiment of the present invention. Figure 5 is a cross-sectional view showing a combination of a second embodiment of the present invention. Figure 6 is a sectional view showing a combination of a third embodiment of the present invention. 16 1288477
【主要元件符號說明】 10 :印刷電路基板 11 :線路 12a、12b :尖形放電電極13 :間隙 15 :電擊 16 :靜電放電表示曲線 17 :曲線 21 :陶瓷基板 22 :基層玻璃 23 :第一電極層 24 :間隙材料層 25 :第二電極層 26 :保護玻璃層 3 :橫向間隙 4 :陶瓷基板 41 :缓衝底層 42 :電極材料層 421、422 :塊狀體 423 :平板表面 43 :介電層 44 :電極導體層 441、442、443、444 : 單體電極 4A :上側邊 4B ··下側邊 44a、44b、44c、44d : 下單體電極 5 :橫向間隙 61 :缓衝層 62 :第一電極層 63 :介電層 64 :第二電極層 65 :保護層 66 :第一絕緣材料 67 :第二絕緣材料 68 :橫向孔隙 71 :第一電極層 72 :第二電極層 73 :介電層 74 :保護層 75 :第一絕緣材料 76 :第二絕緣材料 81、82 :外部電極 17[Description of main component symbols] 10: Printed circuit substrate 11: Lines 12a, 12b: Tip discharge electrode 13: Gap 15: Electric shock 16: Electrostatic discharge shows curve 17: Curve 21: Ceramic substrate 22: Base glass 23: First electrode Layer 24: gap material layer 25: second electrode layer 26: protective glass layer 3: lateral gap 4: ceramic substrate 41: buffer underlayer 42: electrode material layer 421, 422: block body 423: flat surface 43: dielectric Layer 44: electrode conductor layers 441, 442, 443, 444: single electrode 4A: upper side 4B · lower side 44a, 44b, 44c, 44d: lower single electrode 5: lateral gap 61: buffer layer 62 : First electrode layer 63 : Dielectric layer 64 : Second electrode layer 65 : Protective layer 66 : First insulating material 67 : Second insulating material 68 : Transverse aperture 71 : First electrode layer 72 : Second electrode layer 73 : Dielectric layer 74: protective layer 75: first insulating material 76: second insulating material 81, 82: external electrode 17