1288049 九、發明說明： 【發明所屬之技術領域】 μ 歸及—種化學賊研磨_之可細，該可撓膜 -製程； 圓的一細^ 【先前技術】 • u 電子產業中，晶_相_理製成是相當重要的， ^中曰曰圓相關製程中處裡該晶圓的表面平坦度係相當重要，因 =般需先以化學機械研磨機，對晶圓表面進行適當的研磨， 二，雜f以及獲得較佳的表面平整度，通常鮮化學機械研 少一承載頭，所述之承載頭可用以吸附待研磨之晶 磨ί上，且支持晶圓在研磨過程中不會脫離承載頭，此 曰 頭在研磨過程中尚需對晶圓均勻且適當的向下施壓，使 磨後可獲得鶴平雜高的面，如此有驗後續的晶圓 ❹化學賊研賴的承_可靖雜胁晶圓上主 於承翻上且與晶圓接觸—可撓膜，該可撓膜一 般採用鼠丁二烯（neo—prene)製成圓盤狀，由於氣丁 二二树油、耐化轉品的特性，且其接觸面具*良好的摩 f 2此適用於該承載頭上，有關化學機械研磨機之承載 J、、、田f業方式係屬習知技術可參閱公告第373811號「化學 ^ f 3研賴之晶K吸随之氣密度檢峨置」，所述之可撓膜 該，_，並且與承_本身⑽的構造區隔出數 ，軋袷，，各氣密室具有與其導通的至少一導管，藉此可利用 以二的方式控制可挽膜變形，例如抽氣時可撓膜收縮時會 Ξ成ί ί盤的方式吸附晶圓，而充氣時可撓膜會膨脹抵壓晶 囡，於研磨過程中施加適當且均勻的壓力。 5 1288049 採用烯所製成之可賊6在目前普遍被 磨過程；522 ?的問題存在，一般來說，晶圓在研 其中時^需要嚴格的齡’有位麵的物質參雜於 可於膜會影料磨的品f，但利用氯丁二婦所製成的 就ΐ說會ί用^過程中對研磨的内部環境產生較大的汗染，也 的矜^你^了―触紅可誠树磨雜巾因摩擦產生 fftί磨品財不好的卿，再者軸断顧的接觸 的摩擦阻力，但實際操作下仍會發現有產生滑片1288049 IX. Description of invention: [Technical field to which the invention belongs] μ is classified as a kind of chemical thief grinding _ which can be fine, the flexible film-process; round one fine ^ [prior art] • u in the electronics industry, crystal _ It is very important to make the phase. The surface flatness of the wafer in the process of the middle circle is very important. Because of the need to properly grind the surface of the wafer with a chemical mechanical grinder. Second, miscellaneous f and obtain better surface flatness, usually fresh chemical mechanical grinding less than a carrier head, the carrier head can be used to adsorb the crystal grinding to be polished, and support wafers during the grinding process will not Out of the carrier head, the hoe needs to apply a uniform and appropriate downward pressure on the wafer during the grinding process, so that the surface of the Heping can be obtained after the grinding, so that the subsequent wafer ❹ chemical thieves research The _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The characteristics of tree oil, resistant to conversion, and its contact mask * good friction f 2 suitable On the carrier head, the bearing technology of the chemical mechanical grinding machine J, and the field of the industry is known as the "Technology ^ f 3 Research Lai Zhi Jing K suction gas density inspection device" The flexible film is _, and is separated from the structural area of the bearing body (10), and the airtight chamber has at least one conduit connected thereto, thereby controlling the pullable by means of two The film is deformed. For example, when the flexible film shrinks during pumping, the wafer is adsorbed by the disk, and when inflated, the flexible film expands to resist the crystal, and an appropriate and uniform pressure is applied during the grinding process. 5 1288049 The thief 6 made of ene is currently in the process of being generally ground; the problem of 522 存在 exists. Generally speaking, when the wafer is being researched, it is necessary to have a strict age. The film will be used to grind the product f, but the use of the chloroprene woman will say that it will use the ^ process to produce a large amount of sweat on the internal environment of the grinding, also 矜 ^ you ^ - touch red Can the tree to grind the scarf due to friction, the fft ί 磨 品 磨 磨 , , , , , , , , , , , , , , , , , , , , , , , , , , ff ff
ΐίί= 均會影響#者在生產過程中驗率，因此改 ；；ϊ=ϊ對崎顧境產生紐影響，以及改善則機率等 問4疋值侍研究探討的。 【發明内容】 本發明人主要目的即在於改善已知可撓膜對於研磨環境 汙染以及改善滑片的問題。 為達成上述目的，本發明人提供一種新的化學機械研磨 機用之可顧，該可賊細高潔淨度之卵L (sileQne)製 成圓盤狀，其包括接觸或抵壓晶圓的一平面部、由平面部向上 延伸的一套接部所構成，其中平面部的外側利用真空微米塗裝 方式（或稱高分子封裝）塗佈一層聚對二甲苯 (Poly+-para-xylylene)形成與晶圓接觸的一接觸面。 藉由上述結構，本發明之可撓膜具有對研磨晶圓環境較 低污染的特色，且可提供良好的摩擦阻力防止滑片，且接觸面 塗裝聚對二甲苯有助於可撓膜耐腐蝕性，提高該可撓膜之耐用 性0 【實施方式】 以下遂結合附圖近一步說明本發明主要的技術特徵。 請參閲第一圖所示，圖中所示係為一種化學機械研磨機 之承載頭簡圖，而本發明之可撓膜3係裝配於承載頭1上，承 載頭1利用可撓膜3驅使晶圓進行研磨製程的必需動作。 1288049 該承載頭1具有一本體1 1，本體1 1藉由一快速接頭 1 3與一轉轴1 2組合為一體，且快速接頭1 3的一接頭部1 31與本體1 1間藉由一彈性元件13 2形成一第三氣密室 1 1 4，該本體11内部設置有一彈性元件i11，本發明之 可挽膜3套设於該彈性元件1 1 1處，藉以區隔出一第二氣後 室1 1 3，該承載頭1進行研磨晶圓4時，會將本體11抵接 於一研磨台2的一研磨墊2 1上，且本體1 1與研磨墊2 1間 的空間形成一第一氣密室112，該第一、第二、第三氣密室 112、113、114分別與一第一管115、一第二管1 16、一第三管117導通。 在進行晶圓的研磨製程時，該第三管1 17係對第三氣 密室1 1 4抽氣，使得承載頭1的本體1 1受壓力而上升，此 時就可將待處理晶囡置入本體内且正對可撓膜3下方’之後第 ^一管116抽氣會驅使可挽膜3產生向上凹陷形成有如吸盤 的型態吸附晶圓4，承載頭1就可移動至研磨墊21上，實際 進行研磨製程時，該第一管1 1 5會充氣入第二氣密室1 1 3 内，使可撓膜3均勻且適當的抵壓晶圓4，當承載頭1或研磨 台2其中之一轉動時，就會對晶圓4進行研磨作業。 本發明主要特徵在於可撓膜3的改良，請配合參閱第二 圖與第三圖所示，本發明之可撓膜3係由高潔淨度的矽膠 (sileone)製成圓盤狀’該可挽膜包括一平面部3 1，由平 面部31向上延伸的一套接部3 2，其中須特別說明的是，該 化學機械研磨機的種類繁多，而承載頭1的形式也有所不同， 因此在本創作圖中所顯示的可撓膜3之套接部3 2係以簡圖 表示，該套接部3 2需配合不同的裝置而會有適當的外型調 整’本創作之可撓膜3在平面部31的下端面係利用真空微米 〒裝之方式塗佈至少一層聚對一甲本（p〇ly—一xylylene) (或稱派瑞林Parylenen)所構成的塗佈層]q，蕤由螻涂佑 層3 3形成的一接觸面3 Η抵接於晶圓4的3一側佈 7 1288049 3主要_高潔_膠 Uiicone)表面具有強大的摩擦阻力，使之接觸 磨製財滑片的_，又構成塗佈層3 3㈣對二甲笨 vtt^Ua〇rtX^ylene)具有耐腐謝生的特性，因此可有效降 ^可，膜3受舰的問題，提高可撓膜3的咖性，再者，該 南潔淨度之石夕膠材質構成之可撓膜3對於晶圓4的研磨^ 汙染較小，可提高製程的良率。兄 制麵上所述’本發明可有效改善傳統可撓膜對於晶圓研磨 製程上的問題，實為一種優良的發明，誠符合發明專利 件，羑依法具文提出申請。 1288049 【圖式簡單說明】 第一圖係本發明可撓膜設置於化學機械研磨機之承載頭上之 剖面簡圖。 第二圖係本發明之可撓膜的立體外觀圖。 第三圖係本發明之可撓膜的剖視圖。 【主要元件符號說明】 1承載頭 111彈性元件 113第二氣密室 1 1 5第一管 1 17第三管 13快速接頭 13 2彈性元件 2 1研磨墊 3 1平面部 3 2套接部 4晶圓 1 1本體 112第一氣密室 114第三氣密室 116第二管 1 2轉軸 1 3 1接頭部 2研磨台 3可撓膜 311接觸面 3 3塗佈層Ϊ́ίί= will affect the rate of the # in the production process, so change;; ϊ = ϊ ϊ 顾 顾 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 。 。 。 。 。 。 。 。 SUMMARY OF THE INVENTION The main object of the present inventors is to improve the problem that the known flexible film contaminates the grinding environment and improves the sliding sheet. In order to achieve the above object, the present inventors have provided a new chemical mechanical polishing machine, which can be made into a disk shape, which includes a contact or compression wafer. The flat portion is composed of a set of joints extending upward from the flat portion, wherein the outer side of the flat portion is coated with a layer of poly-p-xylylene (Poly+-para-xylylene) by a vacuum micro coating method (or a polymer package). A contact surface for wafer contact. With the above structure, the flexible film of the present invention has the characteristics of low pollution to the environment of the polished wafer, and can provide good frictional resistance to prevent the sliding sheet, and the contact surface coated with parylene contributes to the resistance of the flexible film. Corrosiveness, improving the durability of the flexible film. [Embodiment] Hereinafter, the main technical features of the present invention will be described in further detail with reference to the accompanying drawings. Referring to the first figure, the figure shows a schematic diagram of a carrier head of a chemical mechanical grinder, and the flexible film 3 of the present invention is mounted on the carrier head 1, and the carrier head 1 utilizes the flexible film 3 The necessary action to drive the wafer to the polishing process. 1288049 The carrier head 1 has a body 1 1. The body 1 1 is integrated with a rotating shaft 1 2 by a quick connector 13 , and a joint portion 1 31 of the quick connector 13 and the body 11 are separated by a The elastic member 13 2 forms a third airtight chamber 1 14 . The body 11 is internally provided with an elastic member i11. The liftable film 3 of the present invention is sleeved on the elastic member 11 1 to thereby partition a second gas. The back chamber 1 1 3, when the carrier head 1 is used to polish the wafer 4, the body 11 is abutted on a polishing pad 2 1 of a polishing table 2, and a space between the body 11 and the polishing pad 2 1 is formed. The first airtight chamber 112, the first, second, and third airtight chambers 112, 113, and 114 are respectively electrically connected to a first tube 115, a second tube 166, and a third tube 117. During the polishing process of the wafer, the third tube 1 17 evacuates the third airtight chamber 1 14 , so that the body 11 of the carrier head 1 is pressurized and rises, and the wafer to be processed can be placed at this time. After the body is in the vicinity of the flexible film 3, the pumping of the first tube 116 drives the liftable film 3 to form a shape-adsorbing wafer 4 which is recessed to form a suction cup, and the carrier head 1 can be moved to the polishing pad 21 When the polishing process is actually performed, the first tube 115 is inflated into the second airtight chamber 1 1 3, so that the flexible film 3 uniformly and appropriately presses the wafer 4, when the carrier 1 or the polishing table 2 When one of them is rotated, the wafer 4 is polished. The main feature of the present invention is the improvement of the flexible film 3. Referring to the second and third figures, the flexible film 3 of the present invention is made of a high-purity sileone. The film includes a flat portion 31, and a set of joints 3 2 extending upward from the flat portion 31. It should be particularly noted that the chemical mechanical grinder has a wide variety and the form of the carrier head 1 is different. The sleeve portion 3 2 of the flexible film 3 shown in the present drawing is shown in a simplified diagram, and the socket portion 3 2 needs to be matched with different devices to have an appropriate shape adjustment. 3 coating, at the lower end surface of the flat portion 31, a coating layer formed of at least one layer of p〇ly-xylylene (or parylene) by vacuum micron armoring,一 A contact surface 3 formed by the 蝼 佑 layer 3 3 Η abuts the 3 side of the wafer 4 on the side of the cloth 7 1288049 3 main _ Gao Jie _ plastic Uiicone surface has a strong frictional resistance, making it contact with the grinding The _ of the sheet, which constitutes the coating layer 3 3 (four), has the characteristics of corrosion resistance and eclipse, so Effectively lowering the film, the film 3 is subject to the problem of the ship, and the coffee film of the flexible film 3 is improved. Furthermore, the flexible film 3 composed of the material of the south cleanliness is less polluting to the wafer 4, Can improve the yield of the process. The invention described above can effectively improve the problem of the conventional flexible film on the wafer grinding process, and is an excellent invention. It is in line with the invention patent and is submitted in accordance with the law. 1288049 [Simple description of the drawings] The first figure is a schematic cross-sectional view of a flexible film of the present invention disposed on a carrier head of a chemical mechanical grinder. The second drawing is a perspective view of the flexible film of the present invention. The third figure is a cross-sectional view of the flexible film of the present invention. [Main component symbol description] 1 carrier head 111 elastic member 113 second airtight chamber 1 1 5 first tube 1 17 third tube 13 quick joint 13 2 elastic member 2 1 polishing pad 3 1 flat portion 3 2 socket portion 4 crystal Circle 1 1 body 112 first airtight chamber 114 third airtight chamber 116 second tube 1 2 shaft 1 3 1 joint portion 2 polishing table 3 flexible film 311 contact surface 3 3 coating layer