TWI286457B - Print circuit board and method thereof - Google Patents
Print circuit board and method thereof Download PDFInfo
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- TWI286457B TWI286457B TW95110679A TW95110679A TWI286457B TW I286457 B TWI286457 B TW I286457B TW 95110679 A TW95110679 A TW 95110679A TW 95110679 A TW95110679 A TW 95110679A TW I286457 B TWI286457 B TW I286457B
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- circuit board
- printed circuit
- pcb
- metal layer
- base surface
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- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
1286457 九、發明說明: [發明所屬之技術領域] 本發明係有關於一種印刷 [先前技術] 電路板(PCB)及其製作方法 消費性電子產品在量產 . 座則’都需經過靜電防護(ESD) 的認證,由於靜電產生的I , /、吊毛壓對於印刷電路板(PCB)1286457 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a printing [prior art] circuit board (PCB) and a method of manufacturing the same, in which a consumer electronic product is mass-produced. ESD) certification, due to static electricity generated I, /, hair pressure for printed circuit boards (PCB)
上的電子零件會造成損壞,故I 玟對印刷電路板(^:別採取靜電The electronic parts on the board will cause damage, so I 玟 on the printed circuit board (^: Do not take static electricity
防言隻(ESD)措施,不但可延長 瓦包于屋口口的使用舞命,也同時 保障消費者在使用電子產品時的人身安全。 請參閱第卜2圖,第2圖為第1圖沿Π-Π所看到印 刷電路板Π)的切面,印刷電路板(PCB)1G係為複數板件U 堆疊形成,為達成靜電防護(ESD),通常使用貫孔(則及 接地(GND)的鋼舖在印刷電路板(pCB)i〇周圍,避免靜電的 浪湧電壓(SUrge)將印刷電路板(pcB)中的電子元件16擊 穿。 4头P刷包路板(pcb)i〇在製作時,除了電路設計需 要而在印刷電路板(PCB)中設置的貫孔15外,還會沿著印 刷電路板(PCB)l〇基面ι〇1上的周圍設置複數貫孔13,並 且以銅14舖在貝孔13周圍,再將銅14連到接地層,通常 貝孔13之覓度為5〇〇μη!(也就是20mil),以作為靜電防護 (ESD)來保護印刷電路板(pcB)1〇。由於在設置貫孔時必須 考慮到位置誤差,故印刷電路板(PCB)之外框會留下一淨空 0535-A211 18TWF(N2);A05153;SHERRy 5 1286457 區域12 ’其中銅14電鍍於該淨空區域12以及該等貫孔l3 上。通常淨空區域12的寬度為250μπι(10πή1),由上可知, 習知印刷電路板(PCB)l〇中的貫孔13以及淨空區域12皆 疋用以達成靜電防護(ESD)所必須占用的面積,若是可以不 在印刷電路板(PCB)10基面1〇1上的周圍設置貫孔13以及 鍍銅,而仍可達成靜電防護(ESD)之效果,則可節省貫孔The anti-thesis (ESD) measure not only extends the use of the tile in the mouth of the house, but also protects the personal safety of consumers when using electronic products. Please refer to Figure 2, Figure 2 is the cut surface of the printed circuit board (第) as seen in Figure 1 . The printed circuit board (PCB) 1G is formed by stacking a plurality of boards U to achieve electrostatic protection ( ESD), usually using a through hole (and grounded (GND) steel around the printed circuit board (pCB) i〇, to avoid static surge voltage (SUrge) will hit the electronic components 16 in the printed circuit board (pcB) Wearing 4 P-Plates (pcb) i〇, in addition to the hole design 15 provided in the printed circuit board (PCB) in addition to the circuit design, will also follow the printed circuit board (PCB) A plurality of through holes 13 are arranged around the base surface ι〇1, and copper 14 is placed around the hole 13 and the copper 14 is connected to the ground layer. Usually, the width of the hole 13 is 5 〇〇μη! 20 mil) to protect the printed circuit board (PCB) as electrostatic protection (ESD). Since the position error must be taken into consideration when setting the through hole, the outer frame of the printed circuit board (PCB) leaves a clearance 0535- A211 18TWF(N2); A05153; SHERRy 5 1286457 Area 12' in which copper 14 is electroplated on the clearance area 12 and the through holes l3. Typically, the clearance area 12 has a width of 25 0μπι(10πή1), as can be seen from the above, the through hole 13 and the clearance area 12 in the conventional printed circuit board (PCB) are used to achieve the area occupied by electrostatic discharge (ESD), if it is not in the printed circuit board The (PCB) 10 base surface 1〇1 is provided with a through hole 13 and copper plating, and the effect of electrostatic discharge (ESD) can still be achieved, thereby saving the through hole
所占之面積,並且,因為不設置貫孔13,故也不必留下 r二區域12 ’所節省的面積則可用來作其他的電路設計。 [發明内容] 為了改善上述缺點,本發明係提供一種印刷電路板 (PCB)及其製作方法。 本每月之印刷電路板(PCB)包括有複數板件、一侧邊以 及至屬層,该等複數板件互相層疊,而該側邊環繞複數 板件,並且該金屬層設於該侧邊上。 本發明之實施例中,該金屬層係電鍍於該侧邊上,並 且5亥金屬層係為銅層。、 本發明之印刷電路板(PCB)之製作方法係先提供複數 層疊板件,該等層疊之板件包括有一侧邊,再於該等板件 上設複數貫孔,最後同時電鍍該等貫孔及該側邊。 將金屬層%繞設於印刷電路板(pcB)之側邊,可提供完 整的靜電H以保護設於印刷電路板(pCB)中各式電子元The area occupied, and since the through hole 13 is not provided, the area saved by the r two area 12' does not have to be left for other circuit designs. SUMMARY OF THE INVENTION In order to improve the above disadvantages, the present invention provides a printed circuit board (PCB) and a method of fabricating the same. The monthly printed circuit board (PCB) includes a plurality of boards, one side and a tributary layer, the plurality of boards are stacked on each other, and the side surrounds the plurality of boards, and the metal layer is disposed on the side on. In an embodiment of the invention, the metal layer is plated on the side and the 5 ohm metal layer is a copper layer. The manufacturing method of the printed circuit board (PCB) of the present invention firstly provides a plurality of laminated plates, wherein the stacked plates comprise one side, and then a plurality of through holes are formed on the plates, and finally the plating is simultaneously performed. Hole and the side. The metal layer % is wound around the side of the printed circuit board (pcB) to provide complete static electricity H to protect various electronic components provided in the printed circuit board (pCB).
0535-A21118TWF(N2);A05153;SHERRY °广省P刷電路板(PCB)之空間。 顯易懂=明,上述和其他目的、特徵和優點能更明 詳細說明如下4舉出較佳實施例,並配合所附圖示,作 [只施方式] 複數板件^壓3^ ’本發明之印刷電路板(PCB)20係由 金屬声23 # 仅^孟屬23,且於本實施例中, 平面。 θ ^中側邊22係垂直並鄰接於基面201的 請比對輦1 K d π 明 圖之習知印刷電路板(PCB)IO與本發 板⑽)10為、去财由弟1圖中可以有出,印刷電路 (刪。闲 電防護(ESD)之效,在印刷電路板 (_周圍設置貫孔13,並且考慮誤差而在印刷電路: (PCB)10基謂上外側留下淨现渺由第4祖^ 看出本毛明之印刷電路板(pcB)2〇的基面2〇1上的周圍 ’又有叹1防止靜電(Esd)的貫孔以及淨空區域,也無 將金屬層電倾基面2G1上的翻。本發明的印刷電路被 (PCB)2G係將金屬層23電辦印刷電路板2㈣側邊^,0535-A21118TWF (N2); A05153; SHERRY ° wide P brush circuit board (PCB) space. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages will be more clearly described in the following. FIG. 4 exemplifies the preferred embodiment and, in conjunction with the accompanying drawings, The printed circuit board (PCB) 20 of the invention is composed of a metal sound 23 #only, and in this embodiment, a plane. θ ^ The side 22 is perpendicular and adjacent to the base 201. Please compare the conventional printed circuit board (PCB) IO and the hair plate (10) with the 辇1 K d π There can be a printed circuit (deleted. ESD) effect, a through hole 13 is placed around the printed circuit board (and around the printed circuit: (PCB) 10 base is left outside the net Now, from the 4th ancestor, it can be seen that the periphery of the base surface 2〇1 of the printed circuit board (pcB) of the Maoming is also sighed by the anti-static (Esd) through hole and the clearance area, and there is no metal. Turning on the layered electric tilting surface 2G1. The printed circuit of the present invention is electrically connected to the side of the printed circuit board 2 (4) by the (PCB) 2G system.
0535-A21118TWF(N2);A05153;SHERRY 1286457 側邊29 # & 2〇1白、1為環繞於該印刷電路板(PCB)20且垂直於該基面 、平面並且提供該金屬層23連接印刷電路板(PCB)20 内之接地層。太I日3#斗丁y 效田二 本卷月之5又口十不但可以達到相同的靜電防護 2 ’並且由第4圖可看出本發明之印刷電路板(pcB训 =知印刷電路板(PC聊多出了環繞μ知印刷電路板 區於⑺周圍之貫孔13面積以及為防Α誤差而設置的淨空 7 不㈣去鑽孔之成本,更有乡餘的面積來作其他 的電路設計。 方土明參閱第3、5圖’本發明之印刷電路板(pCB)之製作 21勹、V帮如下.首先’ a.提供複數板件2卜該等板件 广:括有—側邊22,其中’該側邊22垂直於基面2〇ι並 印刷電路板c接著,b.於該等板件21上設 ^貝孔24 ’該貫孔24係用以作為印刷電路板(PCB)20上 之電路設計並連接印刷電路板(PCB)2()上之電子元件25之 用’ c·再將-金屬層23電鍵於該等貫孔^及該側邊^, 取後,d.層疊固定該等板件2】,即完成印刷電路板(pc學 之製作。應注意的是,本發明之印刷f路板(pcB)之製作方 法另外還須使金屬層23接地,以提供靜電防護之效。 雖然本發明已以較佳實施例揭露如上,然其並非用以 限定本發明,任何熟習此技藝者,在不㈣本發明之精神 和範圍内,當可作些許之更動與潤飾,因此本發明之保護0535-A21118TWF(N2); A05153; SHERRY 1286457 Side 29 # & 2〇1 white, 1 is wrapped around the printed circuit board (PCB) 20 and perpendicular to the base surface, plane and provides the metal layer 23 connection printing Ground plane within the board (PCB) 20. Too I day 3 #斗丁y 效田二本卷月5又口10 not only can achieve the same static protection 2 ' and can be seen from Figure 4 of the printed circuit board of the present invention (pcB training = know the printed circuit board (The PC talks about the area of the through hole 13 around the (7) printed circuit board area and the clearance provided for the anti-tamper error. 7 (4) The cost of drilling, and the more common area for other circuits. Design: Refer to Figures 3 and 5 for the manufacture of the printed circuit board (pCB) of the present invention. 21 V, V gang is as follows. First, 'a. Provide a plurality of plates 2 pp. These plates are wide: include - side 22 , wherein the side 22 is perpendicular to the base surface 2 并 and the printed circuit board c is followed by b. the plate member 21 is provided with a hole 24 ' for the printed circuit board (PCB) The circuit on the 20 is designed and connected to the electronic component 25 on the printed circuit board (PCB) 2 (), and then the metal layer 23 is electrically connected to the through hole ^ and the side ^, after taking, d. Stacking and fixing the boards 2], that is, completing the printed circuit board (the production of pc technology. It should be noted that the manufacturing method of the printed circuit board (pcB) of the present invention additionally requires metal 23 is grounded to provide an electrostatic protection effect. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and any person skilled in the art, without the spirit and scope of the invention, Make some changes and retouch, so the protection of the present invention
0535-A21118TWF(N2);A05153;SHERRY 12864570535-A21118TWF(N2);A05153;SHERRY 1286457
範圍當視後附之申請專利範圍所界定者為準DThe scope is subject to the definition of the scope of the patent application attached to the application.
0535-A21118TWF(N2);A051 53;SHERRY 9 1286457 【圖式簡單說明】 第1圖係為習知印刷電路板不意圖, 第2圖係為第1圖沿Π - Π剖面線之剖面圖; 第3圖係為本發明之印刷電路板示意圖; 第4圖係為第1圖沿IV-IV剖面線之剖面圖; 第5圖係為本發明印刷電路板之製作方法流程圖。 【主要元件符號說明】 習知技術 10印刷電路板(PCB) 11板件 12淨空區域 13、15貫孔 14銅 16電子元件 本發明 20印刷電路板(PCB) 21板件 22側邊 23金屬層 24貫孔 25電子元件 0535-A21118TWF(N2);A05153;SHERRY 10 1286457 a、b、c、d 步驟0535-A21118TWF(N2); A051 53; SHERRY 9 1286457 [Simplified description of the drawings] Fig. 1 is a schematic view of a conventional printed circuit board, and Fig. 2 is a sectional view taken along line Π-Π of Fig. 1; 3 is a schematic view of a printed circuit board of the present invention; FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 1; and FIG. 5 is a flow chart of a method for manufacturing a printed circuit board of the present invention. [Major component symbol description] Conventional technology 10 printed circuit board (PCB) 11 panel 12 clearance area 13, 15 through hole 14 copper 16 electronic component 20 invention printed circuit board (PCB) 21 panel 22 side 23 metal layer 24 through hole 25 electronic components 0535-A21118TWF (N2); A05153; SHERRY 10 1286457 a, b, c, d steps
0535-A21118TWF(N2);A051 53;SHERRY0535-A21118TWF(N2); A051 53; SHERRY
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TW95110679A TWI286457B (en) | 2006-03-28 | 2006-03-28 | Print circuit board and method thereof |
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TW95110679A TWI286457B (en) | 2006-03-28 | 2006-03-28 | Print circuit board and method thereof |
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TW200738093A TW200738093A (en) | 2007-10-01 |
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