1286360 九、發明說明： 【發明所屬之技術領域】 本發明為可擦财程式唯讀記㈣之縣技藝。本 亦適用於包含有可擦拭可程式唯讀記憶體之單次可程式^統 (one time programming system)中使變成為多次可程式系統 (multi-time programming system)。 , 【先前技術】 先前技藝如圖1所示，唯讀記憶體晶片1〇安置於第一 金屬基材12上方，晶片10表面各接點，以打線方式14 : 搞合於第二金屬基材η及第三金屬基材13.。保護里膠17 係可為陶i材料或是黑色織膠體，封裝保護位於第^ 三金屬基材11.12.13.上方之元件，晶片1Q上方開 15不被保護黑膠17封住，賴玻璃152安置在透光窗w 面’保護玻璃152上面覆蓋-層可以重複㈣之遮 =便遮光溥片16打開時，紫外光可以照射晶片 除曰曰片10的記憶體内容，等待重新寫入。 於保護玻璃152外部’避免外部雜散紫外光不;昭: 而>月除了晶片10中的記憶程式。 射 【發明内容】 習知技藝的缺點是結構複雜，保鑊 ⑴透光窗15巾無雜存在，㈣安要開透光窗 愛腴π 罝保瘦破璃152與保言雈 '=膠17之間的燒結黏合等，製作過程複雜。本發明 = 種全透光膠27封裝，不必開窗，也 : 乂文置保護玻璃，在透 1286360 光膠27外部覆蓋一層可以重複黏貼之遮光單元26，完成本 發明之封裝。需要清除晶片10中的記憶内容時，將遮光單元 26掀起來，紫外光照射透光膠27至晶片10，達到清除記憶 體内容的效果，再將遮光單元26黏貼回去，等待新的程式之 寫入至晶片10。 【實施方式】 圖2.本發明實施例一 將可擦拭可程式唯讀記憶體晶片10可安置於第一金屬基材 (lead frame) 12上，晶片10的表面接點分別以打線14耦|合於 第二基材11及/或第三金屬基材13，以全透光膠27封裝，不 必開窗，也不必安置保護玻璃，在透光膠27外部罩蓋一層可 以重複黏貼之遮光單元26，該遮光單元26係可為可以重複 黏貼之薄片。需要清除晶片中的記憶内容時，將遮光單元26 掀起來，紫外光照射透光膠27至晶片，達到清除晶片10中 的記憶體内容的效果，再將遮光單元26黏貼回去，等待新的 程式之寫入。 圖3.本發明實施例二 與前一圖示不同的是，前一設計的第二金屬基材11及/或第 三金屬基材13係彎腳向下，本設計顯示第二金屬基材11及/ 或第三金屬基材13也可以是水平腳之設計。惟，這些金屬基 材的外部變化，並非本發明之重點，其形狀可以依據所需加 1286360 以變化設計。 圖4.本發明實施例三 與前一圖示不同的是，前一設計的第二金屬基材11及/或第 三金屬基材13係水平腳，本設計顯示第二金屬基材11及/ 或第三金屬基材13也可以是Z字腳之設計。惟，這些金屬 基材的外部變化，並非本發明之重點，其形狀可以依據所需 加以變化設計。 圖5.本發明實施例四 與前一圖示不同的是，前一設計係以第一金屬基材（lead frame) 12承載晶片10，本設計使用電路板基材29承載晶片 1〇，其餘原理相同。 電路板基材29具有金屬的弟·一電路21、弟一電路22、弟 三電路23，晶片10可安置於第一電路22上，晶片10的表 面接點分別以打線14耦合於第二電路21及/或第三電路23, 以全透光膠27封裝，不必開窗，也不必安置保護玻璃，在透 光膠27外部覆蓋一層可以重複黏貼之遮光單元26，該遮光 單元26係可為可以重複黏貼之薄片。需要清除晶片中的記憶 内容時，將遮光單元26掀起來，紫外光照射透光膠27至晶 片，達到清除晶片10中的記憶體内容的效果，再將遮光單元 26黏貼回去，等待新的程式之寫入。 1286360 圖6.本發明實施例五 與前一圖示不同的是，前一設計的遮光單元26，覆蓋在晶片 10上表面，本設計是當晶片之封裝很薄時，可以使用較大片 之遮光薄片36直接覆蓋在晶片10上面周圍，意即，所述之 遮光薄片36之面積大於所述之晶片10上表面之面積，其餘 原理相同。 電路板基材29具有第二電路21及第三電路23，晶片10以 覆晶發明耦合其接點於第二電路21及/或第三電路23，以全 透光膠27封裝，不必開窗，也不必安置保護玻璃，在透光膠 27外部覆蓋一層可以重複黏貼之薄片遮光薄片36。需要清除 晶片中的記憶内容時，將遮光薄片36掀起來，紫外光照射透 光膠27至晶片10,達到清除晶片10中的記憶體内容的效 果，再將遮光薄片36黏貼回去，等待新的程式之寫入。 圖7.本發明實施例六 與前一圖示不同的是，前一設計係以晶片10安置於電路板基 材29上，本設計顯示該第二電路及該第三電路沿伸繞至電路 板基材29下方，以製作為延伸電極，成為表面黏著式封裝， 以便後續安置於母板39上，該母板39係可為一電路板，意 即，該母板39，其設置於該電路板基材29之下方，其中該 第二電路21及該第三電路23電性連接至該母板39其餘原理 相同。 1286360 電路板基材29具有第二電路21及/或 命 ί置於基材29上，，隨第片第 "? 23；r^f# 27 ^ Γ™ i 蓋―層心麵獅之遮光g 而要α除日日片中的纪憶内容時，將座 紫外光照射透光膠27至晶片】。/達^；^,6掀起來， 體内容的效果，再將遮光^ 36==除t片1G中的記憶 寫入。 寻月允4貼回去，等待新的程式之 5·多次可程式系統之應用 ^(one time programming system) ^ #, ^ 3控制電路、以及可擦拭可程式唯讀記紐，在奴存入系 、、先以後’便以不透光的黑膠封裝。目為紫外光無法冑透黑膠， 因此^法藉由紫外光刪除資料重複寫人程式。本發明將習 头^單—人可私式系統外部的黑膠改為以透明膠封裝，在封裝 ，口°之方安置—張可以重複撕開、黏貼之遮光材料。如此， 白知的單次可程式系統，便可以變成為多次可程式系統 (multi-time programming system) 〇 描述揭不了本發明之較佳實施例以及設計圖式，惟，較 佳貫施及設計圖式錢舉例說明，並非用於限制本發明 ^權利範圍於此’凡是以均等之發明手段實施本發明者、或 疋以下述之「申請專利範圍」所涵蓋之權利範圍而實施者， 均不脫離本發明L為申請人之權利範圍。 1286360 【圖式簡早說明】 圖1.先前技藝 圖2.本發明實施例一 圖3.本發明實施例二 圖4.本發明實施例三 圖5.本發明實施例四 圖6.本發明貫施例五 圖7.本發明實施例六 【主要元件符號說明】 晶片10 第一金屬基材12 第二金屬基材Π 第三金屬基材13 打線14 透光窗15 保護玻璃152 遮光薄片16 保護黑膠17 第一電路22 第二電路21 第三電路23 遮光單元26 遮光薄片3 6 1286360 透光膠27 電路板基材29 母板391286360 IX. Description of the invention: [Technical field to which the invention pertains] The present invention is a county skill in which the erasable program can only be read (4). This also applies to a multi-time programming system in a one-time programming system that includes wipeable programmable read-only memory. [Prior Art] As shown in FIG. 1 , the read-only memory wafer 1 is disposed above the first metal substrate 12, and the surface of the wafer 10 is connected to each other by a wire bonding method 14 : engaging with the second metal substrate η and the third metal substrate 13. The protective rubber 17 can be a ceramic i material or a black woven colloid, and the package protects the component above the metal substrate 11.12.13. The upper 15 of the wafer 1Q is not sealed by the protective black rubber 17, and the glass 152 is sealed. Placed on the light-transmissive window w-covering the cover glass 152 - the layer can be repeated (4). If the light-shielding film 16 is opened, the ultraviolet light can illuminate the memory contents of the wafer except the wafer 10, waiting for rewriting. Outside the protective glass 152 'avoiding external stray ultraviolet light; not: * except for the memory program in the wafer 10. Shooting [Summary of the Invention] The shortcoming of the conventional technique is that the structure is complicated, and the protective sputum (1) light-transmissive window 15 has no impurities, (4) An wants to open the light-transparent window 腴 罝 罝 罝 瘦 瘦 破 152 保 保 = = = = = = The sintering process is complicated, and the manufacturing process is complicated. The invention is a full-transparent adhesive 27 package, which does not need to open the window, and also: the cover glass is covered with a light-shielding unit 26 which can be repeatedly pasted on the outside of the 1286360 optical adhesive 27 to complete the package of the invention. When it is necessary to clear the memory content in the wafer 10, the light shielding unit 26 is picked up, and the ultraviolet light is irradiated to the transparent adhesive 27 to the wafer 10 to achieve the effect of clearing the memory contents, and then the light shielding unit 26 is pasted back, waiting for the new program to be written. Into the wafer 10. [Embodiment] FIG. 2. In the first embodiment of the present invention, the wipeable programmable read only memory chip 10 can be disposed on a first lead frame 12, and the surface contacts of the wafer 10 are respectively coupled by a wire 14 | Cooperating with the second substrate 11 and/or the third metal substrate 13 and encapsulating the entire transparent adhesive 27, without opening the window, and without installing the protective glass, the cover of the transparent adhesive 27 can be repeatedly covered with a light-shielding unit. 26, the shading unit 26 can be a sheet that can be repeatedly pasted. When it is necessary to clear the memory content in the wafer, the light shielding unit 26 is picked up, the ultraviolet light is irradiated to the transparent adhesive 27 to the wafer, the effect of clearing the memory contents in the wafer 10 is achieved, and the light shielding unit 26 is pasted back, waiting for the new program. Write. 3. The second embodiment of the present invention differs from the previous embodiment in that the second metal substrate 11 and/or the third metal substrate 13 of the previous design are bent downward, and the design shows the second metal substrate. The 11 and/or third metal substrate 13 may also be of a horizontal foot design. However, the external variation of these metal substrates is not the focus of the present invention, and the shape can be varied depending on the need to add 1286360. Figure 4 is different from the previous embodiment in the third embodiment of the present invention. The second metal substrate 11 and/or the third metal substrate 13 of the previous design are horizontal legs. The design shows the second metal substrate 11 and / or the third metal substrate 13 may also be a Z-foot design. However, the external variation of these metal substrates is not the focus of the present invention, and the shape can be designed as desired. Figure 5 is different from the previous embodiment in the fourth embodiment of the present invention. The former design carries the wafer 10 with a first lead frame 12, and the design uses the circuit board substrate 29 to carry the wafer 1 and the rest. The principle is the same. The circuit board substrate 29 has a metal circuit 21, a circuit 22, and a third circuit 23. The wafer 10 can be disposed on the first circuit 22, and the surface contacts of the wafer 10 are coupled to the second circuit by wires 14 respectively. 21 and/or the third circuit 23 is encapsulated by the full light-transmissive glue 27, and it is not necessary to open the window, and the protective glass is not disposed. The light-transmissive glue 27 is covered with a light-shielding unit 26 which can be repeatedly pasted, and the light-shielding unit 26 can be The sheet that can be pasted can be repeated. When it is necessary to clear the memory content in the wafer, the light shielding unit 26 is picked up, the ultraviolet light is irradiated to the transparent adhesive 27 to the wafer, and the effect of clearing the memory contents in the wafer 10 is achieved, and then the light shielding unit 26 is pasted back, waiting for the new program. Write. 1286360 FIG. 6. The fifth embodiment of the present invention is different from the previous embodiment in that the shading unit 26 of the previous design covers the upper surface of the wafer 10. The design is that when the package of the wafer is thin, a larger sheet can be used. The sheet 36 is directly covered around the wafer 10, that is, the area of the light-shielding sheet 36 is larger than the area of the upper surface of the wafer 10, and the other principles are the same. The circuit board substrate 29 has a second circuit 21 and a third circuit 23, and the wafer 10 is coupled to the second circuit 21 and/or the third circuit 23 by a flip chip invention, and is packaged with a full transparent glue 27 without opening the window. It is also unnecessary to dispose the protective glass, and the outer layer of the light-transmitting adhesive 27 is covered with a sheet of light-shielding sheet 36 which can be repeatedly pasted. When it is necessary to remove the memory content in the wafer, the light-shielding sheet 36 is picked up, and the ultraviolet light is irradiated to the light-transmissive glue 27 to the wafer 10 to achieve the effect of removing the memory contents in the wafer 10, and then the light-shielding sheet 36 is pasted back, waiting for a new one. Write the program. 7. The sixth embodiment of the present invention differs from the previous embodiment in that the former design is placed on the circuit board substrate 29 with the wafer 10, and the design shows that the second circuit and the third circuit extend to the circuit. The board substrate 29 is formed as an extension electrode to form a surface-adhesive package for subsequent placement on the motherboard 39. The motherboard 39 can be a circuit board, that is, the motherboard 39 is disposed on the board Below the circuit board substrate 29, the second circuit 21 and the third circuit 23 are electrically connected to the motherboard 39. 1286360 The circuit board substrate 29 has a second circuit 21 and/or placed on the substrate 29, with the first piece "? 23; r^f# 27 ^ Γ TM i cover - layered face lion blackout g In addition to the content of the memory in the Japanese film, the ultraviolet light is irradiated to the transparent adhesive 27 to the wafer. /Da ^; ^,6 掀, the effect of the body content, then shading ^ 36 == save the memory in the t chip 1G.寻月允4 posted back, waiting for the new program 5 · multiple programmable system application ^ (one time programming system) ^ #, ^ 3 control circuit, and wipeable programmable read-only notes, in the slave deposit It will be packaged with opaque vinyl in the future. The purpose is that the ultraviolet light cannot penetrate the black glue, so the method of repeating the writing by the ultraviolet light deletion data is repeated. The invention replaces the black rubber outside the singular-personal-private system into a transparent plastic package, and the opaque material can be repeatedly rip-opened and pasted on the side of the package and the mouth. In this way, Bai Zhi's single-programmable system can be turned into a multi-time programming system. The description does not reveal the preferred embodiment and design of the present invention. The design of the drawings is exemplified and is not intended to limit the scope of the invention. The scope of the invention is to be implemented by the means of equal invention, or by the scope of the claims covered by the following claims. Without departing from the invention L is the scope of the applicant's rights. 1286360 [Description of the drawings] Fig. 1. Prior art Fig. 2. Embodiment 1 of the invention Fig. 3. Embodiment 2 of the invention Fig. 4. Embodiment 3 of the invention Fig. 5. Embodiment 4 of the invention Fig. 6. The invention Example 5 Figure 7. Embodiment 6 of the present invention [Description of main component symbols] Wafer 10 First metal substrate 12 Second metal substrate Π Third metal substrate 13 Wire 14 Light transmission window 15 Protective glass 152 Light-shielding sheet 16 Protection black rubber 17 First circuit 22 Second circuit 21 Third circuit 23 Light shielding unit 26 Light-shielding sheet 3 6 1286360 Light-transmissive glue 27 Circuit board substrate 29 Mother board 39