I2846lftlwfdoc/g 九、發明說明： 【發明所屬之技術領域】 喷墨列印技術已經廣泛士處 的辦公n + 5乏地應用於具有0文列印功能 (P心喷墨 使得墨滴從噴墨印頭=生文::==水並 利用這些墨點在請表_成_或文字“並 4 Τ ί、，墨水至喷墨印頭，除了具有儲墨腔〇nk 絲料墨切外，墨水_具有縣流道（flow 來將儲墨腔之墨水導引至噴墨㈣。對於同時供 應夕種色彩墨水之單一墨水匣而言，每一種色彩墨水都有 個別的儲墨腔及墨水流道。 已知的墨水g製作方式有多種，其中一種製作方式是 將多個，墨腔及多個墨水流道，以—體成形的方式製作， 再以蓋板圍住這些墨水流道的一側。然而，這會增加墨 水£之模具設計難度，因啸高墨水_製作成本。曰例ς 美國專利編號 US5,497，178 和 US6,811，250。 因此’國内專利公開第200531840號之「墨水厘」揭 露一種將墨水匣之儲墨腔及流道分離製作後再組裝的技 術’這有助於降低墨水匣之製作成本。 圖1A為習知之墨水匣的一視角之立體爆炸圖。圖 12846胤—_ 為圖ία之墨水匣的另一視角之立體爆炸圖。請參考圖ία 及圖1Β ’墨水匣100包括一本體11〇及一流道模組12〇。 本體110具有三儲墨腔112a、112b、112c及三出墨口 U6a、 116b、116c’其中這些出墨口 U6a、116b、116c位於本體 之110底部，而這些儲墨腔112a、112b、112c分別連通於 這些出墨口 116a、116b、116c，以使得位於儲墨腔ii2a、 112b、112c内墨水供應至流道模組12〇。 流道权組120具有二墨水流道122a、122b、122c。這 些儲墨腔112a、112b、112c分別藉由其底部之出墨口 116a、116b、116c而連通於這些墨水流道〗22a、122b、 122c。這些墨水流道122a、122b、122c更分別具有三供墨 口 124a、124b、124c在晶片接合區R中，以使得墨水輸 出至晶片接合區R上的喷墨印頭（喷墨晶片）。 將流道模組120接合至本體11〇之底部的方式包括超 音波溶接、雷射焊接或塗膠等。無論接合的前後，為了將 流道模組120定位至本體ho之底部，可藉由本體之 兩卡塊118a及118b及流道模組120之兩卡槽128&及128b 的相對卡合，以將流道模組120定位至本體之底部。 然而，僅藉由卡塊ll8a及U8b和卡槽128&及128b 來定位本體110及流道模組120之位置，僅能確保流道模 組120之一側（如靠近圖1B的左側，或稱流道模組12〇 的前端）的定位，而流道模組12〇之另一側（如靠近圖1B 的右側’或稱流道模組120的後端）卻可能作擺動。因此 在組裝後是否有準確定位，必須以二次元等級以上的量測 I284^Q4Lf.d0C/g 工具來檢驗，將產生f測時間之成本。若擺動情況嚴重的 話，很有可能導致流道模組120與本體110之間的接合良 率不佳。因此，為了將防止流道模組120之擺動，其中一 種方法是卡塊ll8a及118b和卡槽128a及128b之間以干 涉方式相配合。 然而，當卡塊118a及118b和卡槽128a及128b之間 若以干涉方式相配合時，在卡塊118a及118b和卡槽i28a 及128b之交接處會造成應力集中。若以超音波熔接的方式 來將流道模組120接合至本體11〇的話，超音波能量將會 聚集在應力集中的地方，因而造成流道模組120與本體n〇 之間的接合良率降低。 【發明内容】 本發明之目的就是在提供一種墨水匣，用以提高製作 良率。I2846lftlwfdoc/g Nine, invention description: [Technical field of invention] Inkjet printing technology has been widely used in office n + 5 lack of application for printing with zero text (P-ink inkjet makes ink droplets from inkjet Print head = raw text:: == water and use these ink points in the form _ _ or text "and 4 Τ ί,, ink to the inkjet print head, in addition to the ink reservoir 〇 nk silk ink cut, Ink_ has a county flow channel (flow to guide the ink of the ink reservoir to the inkjet (4). For a single ink cartridge that simultaneously supplies the color ink, each color ink has an individual ink reservoir and ink flow. Known ink g can be produced in a variety of ways, one of which is to make a plurality of ink chambers and a plurality of ink flow paths, which are formed in a body-formed manner, and then cover one of the ink flow paths with a cover plate. However, this will increase the difficulty of the design of the ink mold, because of the high ink production cost. For example, US Patent Nos. US 5,497,178 and US 6,811,250. Therefore, 'Domestic Patent Publication No. 200531840' "Ink PCT" discloses an ink storage chamber and a flow path for ink The technique of reassembling after fabrication 'This helps to reduce the manufacturing cost of the ink cartridge. Fig. 1A is a perspective exploded view of a conventional ink cartridge. Fig. 12846胤-_ is another perspective of the ink cartridge of Fig. The three-dimensional explosion diagram. Please refer to the figure ία and FIG. 1 'The ink cartridge 100 includes a body 11 〇 and a first-class track module 12 〇. The body 110 has three ink storage chambers 112a, 112b, 112c and three ink outlets U6a, 116b, 116c. 'The ink outlets U6a, 116b, 116c are located at the bottom of the body 110, and the ink storage chambers 112a, 112b, 112c are respectively connected to the ink outlets 116a, 116b, 116c so as to be located in the ink storage chambers ii2a, 112b, The ink in 112c is supplied to the flow channel module 12A. The flow channel group 120 has two ink flow paths 122a, 122b, 122c. These ink storage chambers 112a, 112b, 112c are respectively provided by the ink outlets 116a, 116b at the bottom thereof. 116c is connected to the ink flow paths 22a, 122b, 122c. The ink flow paths 122a, 122b, 122c further have three ink supply ports 124a, 124b, 124c in the wafer bonding region R, respectively, so that the ink is output to the wafer bonding. Inkjet printhead on zone R (inkjet The manner in which the runner module 120 is joined to the bottom of the body 11 includes ultrasonic welding, laser welding or gluing, etc. In order to position the runner module 120 to the bottom of the body ho before and after the joining, The flow channel module 120 can be positioned to the bottom of the body by the relative engagement of the two card blocks 118a and 118b of the body and the two card slots 128 & and 128b of the flow channel module 120. However, only the positions of the body 110 and the flow path module 120 are located by the blocks ll8a and U8b and the card slots 128 & and 128b, only one side of the flow path module 120 can be secured (eg, near the left side of FIG. 1B, or The front end of the runner module 12 is positioned, and the other side of the runner module 12 (such as the right side of FIG. 1B or the rear end of the runner module 120) may swing. Therefore, if there is accurate positioning after assembly, it must be tested by the I284^Q4Lf.d0C/g tool above the secondary element level, which will generate the cost of f measurement time. If the swing condition is severe, there is a high possibility that the joint yield between the runner module 120 and the body 110 is poor. Therefore, in order to prevent the swing of the flow path module 120, one of the methods is to cooperate the interference between the blocks ll8a and 118b and the card slots 128a and 128b. However, when the blocks 118a and 118b and the card slots 128a and 128b are mated in an interference manner, stress concentration is caused at the intersection of the blocks 118a and 118b and the card slots i28a and 128b. If the flow channel module 120 is joined to the body 11 by ultrasonic welding, the ultrasonic energy will be concentrated in the place where the stress is concentrated, thereby causing the bonding yield between the flow channel module 120 and the body n〇. reduce. SUMMARY OF THE INVENTION An object of the present invention is to provide an ink cartridge for improving the yield.
本發明之另一目的是提供一種墨水匣，用以提高儲墨 腔之配置的彈性。 昆之之另—目的是提供種墨水11 ’用以方便墨水 匿之机道/歧定位於墨水Ε之本體。 ㈣彳ί 點™林發明所揭露的技 提出iitc份或全部目的或其它目的’本發明 卡合部及；個第一本體、一流道模組、多個第一 一卞合部。本體具有多個儲墨腔。流道模 7 1284舰 twf.doc/g 、、且接口至本體。這些第一卡合部設置於本體及流道模組兩 這些弟—卡合部分別對應這些第---^合部而設置 於，體及流道模組兩者之另一，其中這些第一卡合部及這 ~第=卡合部之間的相互卡合實質上固定本體及流道模組 在一二維平面上之相對位置。 e為達上述之一或部份或全部目的或其它目的，本發明 更提出一種墨水匣，其包括一本體及一流道模組。本體具 有夕個儲墨腔及多個出墨口，其中這些出墨口位於本體之 一底壁’而這些儲墨腔分別連通於這些出墨口。流道模組 具^接合至本體之底壁的基礎部及一突出於基礎部之抬 升部，並具有一位於抬升部之晶片接合區、多個位於晶片 接合區之供墨口及多個分別將這些出墨口分別連通至這些 供墨口的墨水流道，其巾基礎部具有—基礎面，錄升部 具有-連接基礎面及晶#接合區賴面，而側面與基礎面 所構成之夾角為90度至135度之間。 本發關制卡合的方絲—二維平面±定位本㉝ 及流道模組之_相對位置，以確保流道模組接合 ^ 的同時及之後的相對定位。此外，本發㈣將某些墨_ 道之水平的區段自晶 >；接合區延伸至晶片接合區以外，2 而提升這些儲墨腔之配置的彈性。 為讓本發明之上述和其他目的、特徵和優點 易懂，下文特舉較佳實施例，並配合所附圖式 月j 明如下。 f叶、、、田呪 8 I2846lQlwf.doc/g 【實施方式】 下列各實施例的說明是參考附加的圖式，用以例示本 电明可用以貝施之特定實施例。本發明所提到的方向用 語，例如「上」、「下」、「前」、「後」、「左」、「右」 4 ’僅疋參考附加圖式的方向。因此，使用的方向用語是 用來說明，而非用來限制本發明。 圖2A為本發明第一實施例之墨水匣的一視角之立體 爆炸圖。圖2B為圖2A之墨水匣的另一視角之立體爆炸 • 圖。請同時參考圖2A及圖2B，墨水匣200包括一本體 210、一導流模組220、多個卡合部230a〜230d及卡合部 240a〜240d。在一實施例中，本體21〇是由一底壁250和 . 與底壁250貫質上垂直的四側壁所構成之中空容器。 本體210具有三儲墨腔212a〜212c及三出墨口 216a 〜216c，其中這些出墨口 216a〜216c分別位於本體21〇之 一底壁250，而這些儲墨腔212a〜212c分別連通於這些出 墨口 216a〜216c。 • 流道模組220具有一晶片接合區R、三墨水流道222a 〜222c及三供墨口 224a〜224c，其中供墨口 224a〜224c 位於晶片接合區R之内，而墨水流道222a〜222c將出墨 口 216a〜216c分別連通至供墨口 224a〜224c。 卡合部230a〜230d以例如是如圖2A所示的四個卡塊 或突出體（卡塊或突出體於本發明統稱為卡塊）形式設置 於本體210上，卡合部240a〜240d以例如是如圖2A所示 的四個卡槽或凹槽形式設置於流道模組220上。卡合部 12846瓜_。吻 230a 230d及卡合部2術〜240d之間的相互卡合實質上 固定本體210及導流模組22〇在底壁25〇之表面上的二維 平面上之相對位置，此二維平面為在圖2A及圖2b上:抽 及y軸所展開之平面。 相車乂於圖1B之習知墨水g 1〇〇的這些卡塊Η如及 和對應之料切伽及懸僅能夠 =之械於本體110沿著正乂軸、負χ軸及負γ軸的移 動’苐-貫施例之這些卡合部23Ga〜23Gd及這些卡合部 a〜24〇d則能夠限制流道模組22〇之相對於本體21〇沿 ，正X轴貞X軸、正Y軸及負γ軸的移動，並可限制 ^模組220之相對於本體21()繞著z軸（與X軸及y轴 正交）方向旋轉。換言之，透過卡合部230a〜230d和卡合 4 240a〜240d的配合’可防止流道模組22〇裝配於本體 210時產生X軸及y轴方向的偏移及繞著z轴（與X轴及^ 軸正交）方向所產生的旋轉偏量。 由於採用卡合部230a〜23〇d及卡合部240a〜24〇d定 位之方式’故可提升定位的準確度。目此，當流道模組⑽ 1例如是超音波溶接的方式接合至本體21()時，溶接之品 ^及良率得以提高。但本實施例之流道模組220固定於本 =々接&方式不以d皮⑫接為限，其他例如是雷射焊 接或以黏_合方式亦可_將錢模組22㈣定於本體 =土’並可透過本發明的卡合部設置方式幫助流道模組 疋位於本體21G。此外，藉由分別量取卡合部23〇a〜 之間的彼關距和卡合部·a〜24()d之間的彼此間 1284祖·/g m捉雌财或製造者在將流道模組22〇固定 3 2Λ〇 if ^即可容易檢查出流道模組22G或本體2H)之 ^疋否超出容許公差，以確保流道模組现能 合並定位於本體210上。 己 這些卡合部23〇a〜230d可為卡塊， 〜則可為卡槽，但在其他未繪示的實_—中，這:二Another object of the present invention is to provide an ink cartridge for enhancing the elasticity of the configuration of the ink reservoir. The other is to provide a kind of ink 11 ’ to facilitate the hiding of the ink path/dislocation to the body of the ink cartridge. (4) Techniques disclosed in the invention of the present invention, iitc or all of the objects or other objects are proposed. The engaging portion of the present invention and the first body, the first-class track module, and the plurality of first ones are combined. The body has a plurality of ink storage chambers. The runner module 7 1284 ships twf.doc/g, and interfaces to the body. The first engaging portions are disposed on the body and the flow channel module. The two engaging portions are respectively disposed corresponding to the first and second matching portions, and the other one of the body and the flow channel module. The mutual engagement between the one engaging portion and the ~==the engaging portion substantially fixes the relative positions of the body and the flow channel module on a two-dimensional plane. e is one or a part or all of the above or other purposes, and the present invention further provides an ink cartridge comprising a body and a first-class track module. The body has an ink storage chamber and a plurality of ink outlets, wherein the ink outlets are located at a bottom wall of the body and the ink reservoirs are respectively connected to the ink outlets. The flow channel module has a base portion joined to the bottom wall of the body and a raised portion protruding from the base portion, and has a wafer bonding region at the lifting portion, a plurality of ink supply ports at the wafer bonding region, and a plurality of respectively The ink outlets are respectively connected to the ink flow paths of the ink supply ports, and the towel base portion has a base surface, and the recording portion has a connection base surface and a crystal joint surface, and the side surface and the base surface are formed. The angle is between 90 degrees and 135 degrees. The hairline of the hair switch system - the two-dimensional plane ± position the relative position of the 33 and the runner module to ensure the relative positioning of the runner module at the same time and after. In addition, the present invention (4) extends the level of the ink level from the crystal >; the bonding region beyond the wafer bonding region, 2 to enhance the flexibility of the arrangement of the ink reservoirs. The above and other objects, features, and advantages of the invention will be apparent from the description of the appended claims. f YE, 、, 呪 呪 8 I2846lQlwf.doc/g [Embodiment] The following description of the embodiments is made with reference to the accompanying drawings to illustrate the specific embodiments of the invention. The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", and "right" 4', refer only to the direction of the additional drawing. Therefore, the directional terminology used is for the purpose of illustration and not limitation. Fig. 2A is a perspective exploded view of a view of the ink cartridge of the first embodiment of the present invention. Fig. 2B is a perspective exploded view of another view of the ink cartridge of Fig. 2A. 2A and 2B, the ink cartridge 200 includes a body 210, a flow guiding module 220, a plurality of engaging portions 230a to 230d, and engaging portions 240a to 240d. In one embodiment, the body 21 is a hollow container formed by a bottom wall 250 and four side walls that are perpendicular to the bottom wall 250. The body 210 has three ink storage chambers 212a to 212c and three ink outlets 216a to 216c, wherein the ink outlets 216a to 216c are respectively located at one bottom wall 250 of the body 21, and the ink storage chambers 212a to 212c are respectively connected to these. Ink outlets 216a to 216c. The flow path module 220 has a wafer bonding area R, three ink flow paths 222a to 222c, and three ink supply ports 224a to 224c, wherein the ink supply ports 224a to 224c are located within the wafer bonding region R, and the ink flow path 222a~ 222c connects the ink outlets 216a to 216c to the ink supply ports 224a to 224c, respectively. The engaging portions 230a to 230d are disposed on the body 210 in the form of, for example, four blocks or protrusions (the blocks or protrusions are collectively referred to as the blocks in the present invention) as shown in FIG. 2A, and the engaging portions 240a to 240d are For example, it is disposed on the flow channel module 220 in the form of four card slots or grooves as shown in FIG. 2A. The engagement part 12846 melon _. The mutual engagement between the kiss 230a 230d and the engaging portion 2 to 240d substantially fixes the relative position of the body 210 and the flow guiding module 22 on a two-dimensional plane on the surface of the bottom wall 25A, the two-dimensional plane In Fig. 2A and Fig. 2b: the plane from which the y-axis is developed is drawn. The clips of the conventional ink g 1〇〇 of FIG. 1B, for example, and the corresponding material tangles and suspensions can only be mechanically coupled to the body 110 along the positive, negative and negative gamma axes. The movements of the engaging portions 23Ga to 23Gd and the engaging portions a to 24〇d of the embodiment can limit the flow path module 22 to the front side of the body 21, the positive X axis and the X axis, The movement of the positive Y-axis and the negative γ-axis can limit the rotation of the module 220 relative to the body 21 () about the z-axis (orthogonal to the X-axis and the y-axis). In other words, the engagement of the engaging portions 230a to 230d and the engaging portions 4 240a to 240d prevents the flow path module 22 from being displaced from the x-axis and the y-axis when the flow path module 22 is mounted on the body 210 and around the z-axis (with X The amount of rotation caused by the direction of the axis and the axis is orthogonal. Since the engagement portions 230a to 23〇d and the engagement portions 240a to 24〇d are positioned, the accuracy of the positioning can be improved. Therefore, when the flow path module (10) 1 is joined to the body 21 (e.g., by means of ultrasonic welding, the melted product and the yield are improved. However, the flow channel module 220 of the present embodiment is fixed to the present invention, and the method is not limited to the connection of the skin 12, and other methods such as laser welding or bonding can also be used to set the money module 22 (four). The body = soil 'and can help the runner module to be located on the body 21G through the engagement portion of the present invention. In addition, by separately measuring the distance between the engaging portion 23〇a~ and the engaging portion·a~24()d between each other, 1284 祖·/gm catches the female wealth or the manufacturer is going to flow. It is easy to check whether the flow channel module 22G or the body 2H) exceeds the tolerance to ensure that the flow channel module can be merged and positioned on the body 210. These engaging portions 23〇a~230d may be card blocks, and ~ may be card slots, but in other unillustrated real_-, this: two
Si:或=可^ ’而這些卡合部之-或全部可對應 =塊。此外’在-貫施例中，當卡合部2施和23Si: or = can be ' and - or all of these engaging portions can correspond to = block. In addition, in the embodiment, when the engaging portion 2 is applied and 23
戶^ 底壁250之表面上的一側二角落時（如圖2A 定:2。〜、可提供作為墨水S綱安裝於印表機上時之 雖以具有二個儲墨腔的墨水匣為例做說明，但並並 明之墨水匿的儲墨腔數量，熟習此技藝者可 墨腔或四個以上的儲墨腔。 例女一個儲 爆炸二3:tB本=:=:之_的-視角之立體 圖。，同時Ι—Υλ 墨水匣的另"'視角之立體爆炸 及」流道模H圖3Β，墨水請包括一本體310 〜具有三儲墨腔312a〜312e及三出墨口 316a C /、延些出墨口 316a〜316c位於本體31〇之一底 =這些儲墨腔仙〜312e分別連通於這此出墨口 31ba〜316c 〇 一 流道模組320接合至本體3H)之底壁350。流道模組 11 1284狐wfdoc/g 320具有一晶片接合區R、三墨水流道322a〜322c及三供 墨口 324a〜324c，其中這些供墨口 324a〜324c位於晶片 接合區R之内，而這些墨水流道322a〜322c將這些出墨 口 316a〜316c分別連通至這些供墨口 M4a〜324c。 流道模組320更可具有一接合至本體31〇之基礎部 320a、一突出於基礎部320a之抬升部320b，其中晶片接 合區R位於抬升部320b上，而基礎部32〇a具有一基礎面 B，且抬升部320a具有一連接基礎面B及晶片接合區R的 側面S，而側面S與基礎面B所構成之夾角a為9〇度至 135度之間。 墨水流道322a實質上平行於此二維平面的區段自晶 片接合區R延伸至晶片接合區R以外。此外，這些供墨口 324a〜324c依序排列。在一實施例中，墨水流道322a之 區段的延伸方向實質上平行於供墨口 324a〜324c之排列 方向，於圖3A及圖3B上為y軸方向。在另一實施例中， 墨水流道322a之區段的延伸方向與供墨口 324a〜324c之 > 排列方向之夾角角度大於零度（即墨水流道322a之區段的 延伸方向實質上不平行於供墨口 324a〜324c之排列方 向），如墨水流道322b實質上平行於此二維平面的區段的 設計方式。 在一實施例中’儲墨腔312a〜312c依序排列，而墨 • 水流道322a之區段的延伸方向實質上平行於儲墨腔312a 〜312c之排列方向（y軸方向）；在其他實施例中，墨水 流道322a之區段的延伸方向實質上不須平行於儲墨腔 12 12846似^_ 312a〜312c之排列方向，如墨水流道322b實質上平行於 此二維平面的區段的設計方式。此外，儲墨腔312a〜312c 依序排列，而供墨口 324a〜324c依序排列，且儲墨腔312a 〜312c之排列方向實質上平行於供墨口之排列方向（乂軸 方向）。 由於水平延伸這些墨水流道之一、某些或全部的方 式，可使得儲墨腔312a〜312c沿著不同方向來排列。因 此’與圖2A及圖2B之儲墨腔212a〜212c相較來說，圖 3A及圖3B之儲墨腔312a〜312c可容納的海綿寬度（y軸 方向）較大，這使得墨水的供應較為正常，熟習此技藝之 人士當知不限於延伸一個墨水流道，可視需求來設計延伸 一個或一個以上之墨水流道。 圖4A為本發明第三實施例之墨水{£的一視角之立體 爆炸圖。圖4B為圖4A本發明之墨水匣的另一視角之立體 爆炸圖。第三實施例為第一及第二實施例之結合，墨水匣 400包括一本體410、一導流模組420、多個卡合部430a 〜430d及多個卡合部440a〜440d。 本體410具有三儲墨腔412a〜412c及三個出墨口 416a〜416c，其中這些出墨口 416a〜416c位在本體410之 底壁450，且這些儲墨腔412a〜412c分別連通於這些出墨 口 416a〜416c 。 流道模組420具有一晶片接合區R、三墨水流道422a 〜422c及三供墨口 424a〜424c，其中這些供墨口 424a〜 424c位於晶片接合區R之内，而這些墨水流道422a〜422c 13 ltwf.doc/g 將這些出墨口 416a〜416c分別連通至這些供墨口 42乜〜 424c 〇 流道模組420更可具有一接合至本體41〇之基礎部 420a、一突出於基礎部420a之抬升部42〇b，其中晶片接 合區R位於抬升部420b上，而基礎部42〇a具有一基礎面 B，且抬升部420a具有一連接基礎面B及晶片接合區尺的 側面S，而側面S與基礎面b所構成之夾角a為卯度至 135度之間。 卡合部430a〜430d以例如是如圖4A所示的四個卡塊 形式設置於本體410上，卡合部440a〜440d以例如是如圖 4A所示的四個卡槽形式設置於流道模組420上。卡合部 430a〜430d及卡合部440a〜440d之間的相互卡合實質上 固定本體410及導流模組420在二維平面上之相對位置， 此二維平面為在圖2A及圖2B上X軸及y軸所展開之平 面。透過卡合部430a〜430d及卡合部440a〜440d的配合， 能夠限制流道模組420之相對於本體410沿著正X轴、負 X軸正γ轴及負γ轴的移動’並可限制流道模組Co之 相對於本體410繞著z軸（與X軸及y軸正交）方向旋轉。 換言之，透過卡合部430a〜430d和卡合部440a〜440d的 配合’可防止流道模組420裝配於本體410時產生X軸及 y軸方向的偏移及繞著Z軸（與X軸及y軸正交）方向所 產生的旋轉偏量。 在一實施例中，卡合部430a〜430d分別設置於底壁 450之表面上的四個角落，如圖4A所示。當卡合部430c 14 twf.doc/g 〜430ds史置於底壁450上二個角落，可以對固定於底壁45〇 的流道模組420提供保護，以防止墨水匣4〇〇掉落地上時 對流道模組420的撞擊而造成流道模組42〇損害或導致流 道模組420脫落。 由於採用卡合部430a〜430d及卡合部440a〜44〇d定 位之方式’故可提升定位的準確度。因此，當流道模組42〇 以例如是超音波熔接的方式接合至本體41〇時，熔接之品 質及良率得以提高。但本實_之流道模組固定於本 體410接合方式不以超音波轉為限，其他例如是雷射焊 接或以黏膠黏合方式亦可用以將流道馳蚊於本體 410 ^ ’並可透過本發明的卡合部設置方式幫助流道模组 420定位於本體41〇。 這些卡合部43〇a〜430d可為卡塊，而這些卡合部4術 44〇d可為卡槽’但在其他未繪示的實施例中，這些卡合 =-或全部可為卡槽，而這些卡合部之—或全料對^ 二塊:此外，在一實施例中，當卡合部43〇a和4地: 斛塊於底壁450之表面上的-側二角落時(如圖4八 ^ '、可作為定位凸塊，以提供作為墨水E 400安穿 於印表機上時之定位用途。 文衣 曰片;422a實質上平行於上述二維平面的區段自 曰曰片接5區R延伸至晶片接合區R以外。 口 424a〜424c 佑皮 μ τ； ί ^ ® 向實質上平行於這此二^4=道4=之區段的延伸方 4Α及圖4Β上為之娜^ 15 I2846Qiltwfd0C/g 儲墨腔412a〜412c依序排列，而墨水流道422a之區 段的延伸方向貫質上平行於儲墨腔412a〜412c之排列方 向（y軸方向）。此外，這些供墨口 424a〜424c依序排列， 且儲墨腔412a〜412c之排列方向實質上平行於供墨口 424a〜424c之排列方向（y軸方向）。在其他實施例中， 墨水流道422a之區段的延伸方向實質上不須平行於儲墨 腔412a〜412c之排列方向，如墨水流道422b實質上平行 於此二維平面的區段的設計方式。 由於水平延伸墨水流道之一、某些或全部的方式，可 使得儲墨腔412a〜412c沿著不同方向來排列。因此，與圖 2A及圖2B之儲墨腔212a〜212c相較來說，儲墨腔412a 〜412c可容納的海綿寬度（y軸方向）較大，這使得供墨 水供應較為正常，熟習此技藝之人士當知不限於延伸一個 墨水流道，可視需求來設計延伸一個或一個以上之墨水流 道。 圖5A為圖4A之流道模組的輪廓示意圖，流道模组 420具有兩相對第一側邊421a及兩相對第二侧邊421卜這 四個卡合部440a〜440d分別位於兩第—側之個別 ㈣末端。當這些卡合部4偷〜4為卡槽時，分 =些^合部44〇a〜44〇d之多個卡合部（未緣 ; 塊。反之亦然。 ^ 罔，心心 I明第"鮮g <’錢模組的輪廓示意 圖二，520具有兩相對侧邊521a及兩相對第二側邊 通’兩卡合部篇及遍分別位於兩側邊⑵ 16 ltwf.doc/g 的一末端，而另外兩個卡合部540c及540d則分別位於兩 側邊521a之個別的中央。當這些卡合部54〇a〜54〇d為卡 槽時，分別對應這些卡合部540a〜540d之多個卡合部（未 繪示）則為卡塊。反之亦然。須說明的是，卡合部54〇c 及540d不一定須分別位於兩側邊52la之個別的中央，亦 可位於兩側邊521a之個別的中央與末端之間的位置。When the bottom surface of the bottom wall 250 is on one side and two corners (as shown in Fig. 2A: 2.), it can be provided as an ink S. When mounted on a printer, the ink cartridge having two ink storage chambers is For example, but the number of ink reservoirs hidden by the ink is clear, and the skilled person can use the ink chamber or more than four ink storage chambers. A female reservoir explosion 2: tB this = -=: A perspective view of the viewing angle. At the same time, the 立体 Υ Υ 匣 另 & ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' C /, the ink outlets 316a to 316c are located at the bottom of the body 31 = = these ink storage chambers sm ~ 312e are respectively connected to the ink outlets 31ba ~ 316c 〇 the first-channel module 320 is joined to the bottom of the body 3H) Wall 350. The flow channel module 11 1284 fox wfdoc/g 320 has a wafer bonding area R, three ink flow paths 322a to 322c, and three ink supply ports 324a to 324c, wherein the ink supply ports 324a to 324c are located within the wafer bonding region R. The ink flow paths 322a to 322c communicate the ink discharge ports 316a to 316c to the ink supply ports M4a to 324c, respectively. The flow channel module 320 further has a base portion 320a joined to the body 31A, and a raised portion 320b protruding from the base portion 320a, wherein the wafer bonding region R is located on the lifting portion 320b, and the base portion 32a has a foundation. The surface B and the lifting portion 320a have a side surface S connecting the base surface B and the wafer bonding region R, and the angle a formed by the side surface S and the base surface B is between 9 ft and 135 degrees. The ink flow path 322a extends substantially parallel to the two-dimensional plane from the wafer bonding region R to the outside of the wafer bonding region R. Further, these ink supply ports 324a to 324c are sequentially arranged. In one embodiment, the direction in which the sections of the ink flow path 322a extend is substantially parallel to the arrangement direction of the ink supply ports 324a to 324c, which is the y-axis direction in Figs. 3A and 3B. In another embodiment, the angle between the extending direction of the section of the ink flow path 322a and the direction of the arrangement of the ink supply ports 324a to 324c is greater than zero degrees (i.e., the extending direction of the section of the ink flow path 322a is substantially non-parallel to The arrangement direction of the ink supply ports 324a to 324c, such as the design of the ink flow path 322b substantially parallel to the two-dimensional plane. In one embodiment, the ink storage chambers 312a to 312c are sequentially arranged, and the direction in which the sections of the ink/water flow path 322a extend is substantially parallel to the arrangement direction of the ink storage chambers 312a to 312c (y-axis direction); For example, the extending direction of the section of the ink flow path 322a does not substantially have to be parallel to the arrangement direction of the ink storage chamber 12 12846 like _ 312a 312 312c, for example, the ink flow path 322b is substantially parallel to the section of the two-dimensional plane. The way of design. Further, the ink storage chambers 312a to 312c are sequentially arranged, and the ink supply ports 324a to 324c are sequentially arranged, and the arrangement direction of the ink storage chambers 312a to 312c is substantially parallel to the arrangement direction of the ink supply ports (the x-axis direction). Since one, some or all of these ink flow paths are horizontally extended, the ink storage chambers 312a to 312c can be arranged in different directions. Therefore, compared with the ink storage chambers 212a to 212c of FIGS. 2A and 2B, the ink reservoirs 312a to 312c of FIGS. 3A and 3B can accommodate a larger sponge width (y-axis direction), which enables supply of ink. More generally, those skilled in the art are not limited to extending an ink flow path, and are designed to extend one or more ink flow paths as desired. Fig. 4A is a perspective exploded view of a view of the ink of the third embodiment of the present invention. Fig. 4B is a perspective exploded view of another view of the ink cartridge of the present invention of Fig. 4A. The third embodiment is a combination of the first embodiment and the second embodiment. The ink cartridge 400 includes a body 410, a flow guiding module 420, a plurality of engaging portions 430a to 430d, and a plurality of engaging portions 440a to 440d. The body 410 has three ink storage chambers 412a to 412c and three ink outlets 416a to 416c, wherein the ink outlets 416a to 416c are located at the bottom wall 450 of the body 410, and the ink storage chambers 412a to 412c are respectively connected to the outlets. Ink ports 416a to 416c. The flow path module 420 has a wafer bonding area R, three ink flow paths 422a to 422c, and three ink supply ports 424a to 424c, wherein the ink supply ports 424a to 424c are located within the wafer bonding region R, and the ink flow paths 422a ～ 422c 13 ltwf.doc/g The ink outlets 416a to 416c are respectively connected to the ink supply ports 42乜 to 424c. The flow channel module 420 may further have a base portion 420a joined to the body 41A, and a protrusion The lifting portion 42〇b of the base portion 420a, wherein the wafer bonding region R is located on the lifting portion 420b, and the base portion 42A has a base surface B, and the lifting portion 420a has a side connecting the base surface B and the wafer bonding surface S, and the angle a formed by the side S and the base surface b is between 卯 and 135 degrees. The engaging portions 430a to 430d are disposed on the body 410 in the form of, for example, four blocks as shown in FIG. 4A, and the engaging portions 440a to 440d are disposed in the flow path in the form of, for example, four card slots as shown in FIG. 4A. Module 420. The mutual engagement between the engaging portions 430a to 430d and the engaging portions 440a to 440d substantially fixes the relative positions of the main body 410 and the flow guiding module 420 on a two-dimensional plane. The two-dimensional plane is in FIGS. 2A and 2B. The plane on which the X and y axes are expanded. By the engagement of the engaging portions 430a to 430d and the engaging portions 440a to 440d, the movement of the flow path module 420 with respect to the body 410 along the positive X-axis, the negative X-axis positive γ-axis, and the negative γ-axis can be restricted. The flow path module Co is restricted from rotating relative to the body 410 about the z-axis (orthogonal to the X-axis and the y-axis). In other words, the engagement of the engaging portions 430a to 430d and the engaging portions 440a to 440d prevents the displacement of the flow path module 420 in the X-axis and the y-axis direction and the Z-axis (with the X-axis) when the flow path module 420 is mounted on the body 410. The rotational offset produced by the direction of the y-axis is orthogonal. In one embodiment, the engaging portions 430a to 430d are respectively disposed at four corners on the surface of the bottom wall 450 as shown in Fig. 4A. When the engaging portions 430c 14 twf.doc/g ~ 430ds are placed on the two corners of the bottom wall 450, the flow channel module 420 fixed to the bottom wall 45A can be protected to prevent the ink cartridges from falling. The impact of the runner module 420 on the ground causes damage to the runner module 42 or causes the runner module 420 to fall off. Since the engagement portions 430a to 430d and the engagement portions 440a to 44〇d are positioned, the accuracy of the positioning can be improved. Therefore, when the flow path module 42 is joined to the body 41 by, for example, ultrasonic welding, the quality and yield of the fusion are improved. However, the way in which the flow channel module is fixed to the body 410 is not limited to the ultrasonic wave. Others such as laser welding or adhesive bonding can also be used to loosen the flow channel to the body 410 ^ ' The flow channel module 420 is assisted to be positioned on the body 41 by the engagement portion arrangement of the present invention. The engaging portions 43〇a to 430d may be the card blocks, and the engaging portions 4 may be the card slots. However, in other embodiments not shown, these engaging== or all may be cards. a groove, and the two or all of the engaging portions: in addition, in one embodiment, when the engaging portions 43A and 4 are: the two sides of the bottom surface of the bottom wall 450 When (as shown in Fig. 4 VIII', it can be used as a positioning bump to provide positioning for the ink E 400 when it is worn on the printer. The woven piece is 422a substantially parallel to the above two-dimensional plane. The self-clamping 5 region R extends beyond the wafer bonding region R. The ports 424a to 424c are 皮 τ; ί ^ ® to the extension of the segment substantially parallel to the two ^ 4 = dao 4 = 4, I2846Qiltwfd0C/g ink storage chambers 412a to 412c are sequentially arranged, and the extending direction of the section of the ink flow path 422a is substantially parallel to the arrangement direction of the ink storage chambers 412a to 412c (y-axis direction). Further, the ink supply ports 424a to 424c are sequentially arranged, and the arrangement direction of the ink storage chambers 412a to 412c is substantially parallel to the arrangement direction of the ink supply ports 424a to 424c (y-axis direction). In other embodiments, the extending direction of the section of the ink flow path 422a does not substantially have to be parallel to the arrangement direction of the ink storage chambers 412a to 412c, such as the ink flow path 422b substantially parallel to the section of the two-dimensional plane. The ink storage chambers 412a to 412c are arranged in different directions due to one, some or all of the horizontally extending ink flow paths. Therefore, the ink storage chambers 212a to 212c of FIGS. 2A and 2B are arranged. In comparison, the ink storage chambers 412a to 412c can accommodate a larger sponge width (y-axis direction), which makes the ink supply more normal, and those skilled in the art are not limited to extending an ink flow path, which can be visually required. The design extends one or more ink flow paths. Figure 5A is a schematic view of the flow path module of Figure 4A. The flow channel module 420 has two opposite first side edges 421a and two opposite second side edges 421. The engaging portions 440a to 440d are respectively located at the respective (four) ends of the two first sides. When the engaging portions 4 are stolen to 4 as the card slots, the plurality of engaging portions 44a to 44d are engaged. (not a margin; block. vice versa. ^ 罔, heart I Ming &Quot;Fresh g < 'The outline of the outline of the money module 2, 520 has two opposite sides 521a and two opposite side sides of the 'two engaging parts and the two sides are respectively located on both sides (2) 16 ltwf.doc / g One end of the other, and the other two engaging portions 540c and 540d are respectively located at the respective centers of the two side edges 521a. When the engaging portions 54〇a to 54〇d are the card slots, respectively, the engaging portions 540a are respectively corresponding to the engaging portions 540a. A plurality of engaging portions (not shown) of ～540d are blocks. vice versa. It should be noted that the engaging portions 54〇c and 540d do not have to be located at the respective centers of the side edges 52la, respectively, or at the positions between the respective centers and ends of the side edges 521a.
圖5C為本發明第五實施例之流道模組的輪庵示音 圖，流道模組620具有兩相對側邊621a及兩相對第二側邊 621b’兩卡合部640a及640b分別位於兩侧邊621a之個別 的一末端，而另外一卡合部640c則位於較遠離前述末端之 第二側邊621b的中央。當這些卡合部64〇a〜64〇c為卡槽 時，分別對應這些卡合部640a〜640c之多個卡合部（未检 示）則為卡塊。反之亦然。 9FIG. 5C is a view showing the rim of the flow channel module according to the fifth embodiment of the present invention. The flow channel module 620 has two opposite side edges 621a and two opposite second side edges 621b'. The two engaging portions 640a and 640b are respectively located. The other end of the side edges 621a, and the other engaging portion 640c are located at the center of the second side 621b farther from the aforementioned end. When the engaging portions 64A1 to 64〇c are the card slots, the plurality of engaging portions (not shown) corresponding to the engaging portions 640a to 640c are the blocks. vice versa. 9
一 士由圖5A〜圖5C所示之這些實施例可知，於本發明之 範疇中，上述這些卡合部視其需求來決定其數量，並分別 位於本體及導賴_職位4，以岐本體及導流模组 在二維平面上之相對位置。此外，流道模組上的卡合部設 置之位置不限於流道模組之任—侧邊，亦可設置於 合於本體之底壁的流道模組其下表面處。 圖6為本發明第六實施例之墨水e的立體爆炸圖。請 乡考圖6’第六實施例之墨水E 7〇〇之本體710之底壁75〇 的^表面的四個角落設有卡合部730a〜73〇d，其分別卡合 ^〇又在机道拉組72〇之四個角落的卡合部％此〜 父於圖4A之第三實施例的墨水E 400,第六實施例之墨水 17 twf.doc/g 匿700的卡合部730c及730d改為卡槽，而卡合部740c 及740d改為卡塊。 圖7為本發明第七實施例之墨水匣的立體爆炸圖。請 參考圖7,相較於圖6之第六實施例的墨水匣7〇〇，第七實 施例之墨水匣800之本體81〇的底壁85〇的外表面設有一 卡合部830，其局部地圍繞於流道模組82〇之側緣，使得 卡合部8 3 0及流道模組8 2 〇之間的相互卡合實質上將本體 810及流道模組820定位在一二維平面（χγ平面）上之相 對位置。 圖8為本發明第八實施例之墨水匣的立體爆炸圖。請 參考圖8,相較於圖6之第七實施例的墨水匣8〇〇，第八實 施例之墨水匣900之本體910的底壁950的外表面設有一 卡合部930，其完全地圍繞於流道模組92()之側緣，使得 卡合部930及流道模組920之間的相互卡合實質上將本體 910及流道模組920定位在一二維平面（χγ平面）上之相 對位置。 综上所述，在本發明之墨水匣因採用卡合的方式來確 保本體及流道模組之間定位的準確性及可靠度。此外，當 本體及流道模組以例如是超音波熔接時，以預防因干涉所 造成之局部應力集中而導致超音波能量的不均，故可提升 熔接之品質及良率。另一方面，本發明因將某些墨水流道 之水平的區段自晶片接合區延伸至晶片接合區以外，因而 提升這些儲墨腔之配置的彈性。 雖然本發明已以多個實施例揭露如上，然其並非用以 18 I2846〇L,〇c/g 明’任何熟習此技藝者’在不脫離本發明之精神 t犯圍内’當可作些許之更動與濶飾，因此本發明 二利範圍所界定者為準，而本發明的 專利文件摘要部分和標題僅是用來輔助 用’並非用來限制本發明之權利範圍。 【圖式簡單說明】 圖1Α為习习+ 圖ιβ ^白知之墨水匣的一視角之立體爆炸圖。 圖2Α為之墨水匣的另一視角之立體爆炸圖。 爆炸圖。、發明第—實施例之墨水匡的—視角之立體 圖2Β為]ο 圖3A為°八之墨水匣的另一視角之立體爆炸圖。 爆炸圖。，、、、本發明第二實施例之墨水_—視角之立體 圖4a!^3A之墨水11的另—視角之立體爆炸圖。 爆炸圖。 發明第三實關之墨水_—視角之立體As can be seen from the embodiments shown in FIG. 5A to FIG. 5C, in the scope of the present invention, the above-mentioned engaging parts determine the number according to their needs, and are respectively located on the main body and the guide_position 4, to the body. And the relative position of the flow guiding module on a two-dimensional plane. In addition, the position of the engaging portion on the flow channel module is not limited to the side of the flow channel module, and may be disposed at the lower surface of the flow channel module of the bottom wall of the body. Figure 6 is a perspective exploded view of an ink e according to a sixth embodiment of the present invention. In the four corners of the bottom surface 75 of the body 710 of the ink E 7 第六 of the sixth embodiment of the sixth embodiment, there are provided engaging portions 730a to 73〇d, which are respectively engaged and The engaging portion of the four corners of the tunnel pull group 72〇 is the ink E 400 of the third embodiment of the parent FIG. 4A, and the engaging portion 730c of the ink 17 twf.doc/g of the sixth embodiment 700 And 730d is changed to the card slot, and the engaging portions 740c and 740d are changed to the card block. Figure 7 is a perspective exploded view of an ink cartridge according to a seventh embodiment of the present invention. Referring to FIG. 7, compared with the ink cartridge 7 of the sixth embodiment of FIG. 6, the outer surface of the bottom wall 85A of the body 81 of the ink cartridge 800 of the seventh embodiment is provided with an engaging portion 830. Partially surrounding the side edge of the runner module 82〇, such that the mutual engagement between the engaging portion 830 and the runner module 8 2 实质上 substantially positions the body 810 and the runner module 820 in one or two The relative position on the dimension plane (χγ plane). Figure 8 is a perspective exploded view of an ink cartridge according to an eighth embodiment of the present invention. Referring to FIG. 8, compared with the ink cartridge 8 of the seventh embodiment of FIG. 6, the outer surface of the bottom wall 950 of the body 910 of the ink cartridge 900 of the eighth embodiment is provided with an engaging portion 930, which is completely Around the side edges of the runner module 92 (), the mutual engagement between the engaging portion 930 and the runner module 920 substantially positions the body 910 and the runner module 920 in a two-dimensional plane (χγ plane) ) relative position. In summary, the ink cartridge of the present invention ensures the accuracy and reliability of positioning between the body and the runner module by using a snap fit. Further, when the body and the flow path module are welded by, for example, ultrasonic waves, the unevenness of the ultrasonic energy is prevented by the local stress concentration caused by the interference, so that the quality and yield of the welding can be improved. In another aspect, the present invention enhances the flexibility of the configuration of the ink reservoirs by extending the horizontal sections of certain ink flow paths from the wafer bond area beyond the wafer bond area. Although the present invention has been disclosed above in various embodiments, it is not intended to be used in the context of the invention, and may be used in a manner that does not deviate from the spirit of the present invention. The invention is not limited to the scope of the invention, which is defined by the scope of the invention. [Simple description of the diagram] Figure 1 is a perspective exploded view of a perspective of the + ιβ^白知之墨匣. Figure 2 is a perspective exploded view of another perspective of the ink cartridge. Explosion map. Fig. 3A is a perspective exploded view of another angle of view of the ink cartridge of Fig. 3A. Explosion map. The ink of the second embodiment of the present invention is a three-dimensional exploded view of the ink of FIG. 4a!^3A. Explosion map. Invention of the third real ink _ - perspective of the three-dimensional
圖 4B 圖5A Λ闻々A之墨水匣的另—視角之立體爆炸圖。 圖 圖5B、為^=之流道柄組的輪廓系意圖。 ,承發明第四實施例之流道模組的輪廓示意 圖 圖 C為本發明第五實施例之流道模組的輪廓示意 19 I284^9Q4}twfdoc/g 圖6為本發明第六實施例之墨水匣的立體爆炸圖。 圖7為本發明第七實施例之墨水匣的立體爆炸圖。 圖8為本發明第八實施例之墨水匣的立體爆炸圖。 【主要元件符號說明】 100、200、300、400、700、800、900 :墨水£ 110、210、310、410、710、810、910 :本體 112a〜112c、212a〜212c、312a〜312c、412a〜412c : 儲墨腔 116a〜116c、216a〜216c、316a〜316c、416a〜416c : 出墨口 120、220、320、420、520、620、720、820、920 : 流道模組 320a :基礎部 320b :抬升部 124a〜124c、224a〜224c、324a〜324c、424a〜424c : 供墨口 118a、118b :卡塊 128a、128b ··卡槽 230a〜230d、240a〜240d、430a〜430d、440a〜440d、 540a〜540d、640a〜640c、730a〜730d、740a〜740d、830、 930 :卡合部 250、350、450、750、850、950 :底壁 421a、421b、521a、521b、621a、621b :侧邊 20 :wf.doc/g A ·· 夾角 B : 基礎面 R : 晶片接合區 S ·· 側面Figure 4B Figure 5A is a three-dimensional exploded view of the other perspective of the ink cartridge of the scent. Figure 5B shows the outline of the flow path handle set of ^=. FIG. 6 is a schematic outline of a flow channel module according to a fifth embodiment of the present invention. FIG. 6 is a sixth embodiment of the present invention. FIG. 6 is a sixth embodiment of the present invention. A three-dimensional explosion of the ink cartridge. Figure 7 is a perspective exploded view of an ink cartridge according to a seventh embodiment of the present invention. Figure 8 is a perspective exploded view of an ink cartridge according to an eighth embodiment of the present invention. [Description of main component symbols] 100, 200, 300, 400, 700, 800, 900: inks £110, 210, 310, 410, 710, 810, 910: bodies 112a to 112c, 212a to 212c, 312a to 312c, 412a ～412c: ink storage chambers 116a to 116c, 216a to 216c, 316a to 316c, 416a to 416c: ink outlets 120, 220, 320, 420, 520, 620, 720, 820, 920: flow path module 320a: basic Portion 320b: lifting portions 124a to 124c, 224a to 224c, 324a to 324c, 424a to 424c: ink supply ports 118a, 118b: card blocks 128a, 128b, card slots 230a to 230d, 240a to 240d, 430a to 430d, 440a ~440d, 540a~540d, 640a~640c, 730a~730d, 740a~740d, 830, 930: engaging portions 250, 350, 450, 750, 850, 950: bottom walls 421a, 421b, 521a, 521b, 621a, 621b : side 20 : wf.doc / g A · · angle B : base surface R : wafer joint S · · side