TWI284403B - Package structure and stiffener ring - Google Patents

Abstract

A package structure and a stiffener are provided. The package structure includes a carrier, a chip, a stiffener ring and a heat sink. The chip is disposed on the carrier and is electrically connected with the carrier. The stiffener ring is disposed on the carrier around the chip. The stiffener ring has a first surface and a second surface. The second surface is opposite to the first surface. An area of the first surface is greater than an area of the second surface. As the second surface is stuck on the carrier, the stiffener ring and the carrier form a receiving space. The heat sink is disposed on the chip and the stiffener ring.

Description

1284403 .

TRIA TW2488PA IX. Description of the Invention: [Technical Field] The present invention relates to a package structure and particularly relates to a package structure having a stiffener ring. [Prior Art] The semiconductor packaging technology is developing rapidly. Various types of wafers are used to protect the wafer and protect the wafer from moisture by the packaging technology. The package structure is used to guide the electrical connection between the internal conductive lines of the wafer and the printed circuit board. . Please refer to FIG. 1A to FIG. 1B at the same time, and FIG. 1A is a schematic exploded view of a conventional package structure. Figure 1B shows the combination of the structure of the seal of Figure 1A, the intention. The package structure 100 includes a heat sink 11 , a reinforcement ring 12 , a wafer 130 , a substrate 140 , and a plurality of solder balls 170 . The heat sink 11 is disposed on the upper surface 121 of the reinforcing ring 120, and the reinforcing ring 120 and the substrate 140 are bonded by the glue 145. The wafer 130 is disposed on the substrate 140, and the wafer 130 includes a plurality of bumps 160 as shown in FIG. 1B. A solder ball 170 is formed under the substrate 140. The package structure 100 further includes a primer 147, and the primer 147 is filled with a primer 147 between the wafer 130 and the 'substrate 140 by a one-step adhesive process to protect the bumps, as shown in FIG. 1B. Show. The reinforcing ring 120 is used to prevent warpage of the substrate 140. However, the reinforcing ring 120 of the conventional package structure 100 has a certain degree of width to avoid warping deformation of the substrate 140. Therefore, the underfill overflow range 149 between the reinforcing ring 120 and the wafer 130 is narrow, resulting in a bottom 6 1284403

‘Sanda number TW2488PA glue 147 easily flows to the reinforcement ring 120 during the dispensing process. The primer 147 is not allowed to completely flow into the gap 151 between the wafer 130 and the substrate 140, resulting in a void 152 (void) in the underfill gap 151. Not only does the bump 160 be completely protected, but the structural strength of the package structure 100 is further reduced. Therefore, how to avoid the gap 151 having the hole 152 is an important problem to be solved. SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide a package structure which is improved in structural design of a reinforcing ring so that the reinforcing ring can maintain the original function of preventing warpage of the wafer carrier, and The package structure can effectively fill the gap between the wafer and the wafer carrier during the in-line dispensing process. Not only the warpage deformation of the wafer carrier is prevented, but also the contact area between the reinforcing ring and the heat sink is maintained, and the bump can be completely protected by the primer. The structural strength of the package structure is greatly increased. > In accordance with the purpose of the present invention, a package structure is proposed. The package structure includes a wafer carrier, a wafer, a reinforcement ring, and a heat sink. The wafer is placed on the wafer carrier and electrically connected to the wafer carrier. The reinforcing ring is placed on the wafer carrier and surrounds the wafer. The reinforcing ring has a first surface and a second surface. The second surface is opposite the first surface, the area of the first surface being greater than the area of the second surface. When the second surface is attached to the wafer carrier, an accommodating space is formed between the reinforcing ring and the wafer carrier. The heat sink is disposed on the wafer and the reinforcing ring. According to another object of the present invention, a reinforcement ring is proposed for use in a 7 1284403

The Santa Claus number is on the TW2488PA package structure. The package structure includes a wafer and a substrate ' and the wafer is electrically connected to the substrate. The reinforcing ring includes a first surface and a second surface. The second surface is opposite the first surface, the area of the first surface being greater than the area of the second surface. When the second surface is attached to the substrate, an accommodating space is formed between the reinforcing ring and the substrate. The above described objects, features, and advantages of the present invention will become more apparent from the aspects of the preferred embodiments of the invention. Figure is an exploded perspective view of a package structure in accordance with a first embodiment of the present invention. The package structure 200 includes a wafer carrier 240, a wafer 230, a reinforcement ring 220, and a heat sink 210. The heat sink 210 is disposed on the wafer 230 and the reinforcement ring 220 to help the heat dissipation of the wafer 230. The wafer 230 is disposed on the wafer carrier 240 and electrically connected to the wafer carrier 240. The reinforcing ring 220 is disposed on the wafer carrier 240 and surrounds the wafer 230. The reinforcing ring 220 has a first surface 221 and a second surface 222. The second surface 222 is opposite to the first surface 221, and the area of the first surface 221 is larger than the area of the second surface 222. Referring to Figure 2B, a side view of a combination of package structures in accordance with a first embodiment of the present invention is shown. When the second surface 222 of the reinforcing ring 220 is attached to the wafer carrier 240 by a glue 245, an accommodating space 250 is formed between the reinforcing ring 220 and the wafer carrier 240. Housing space 250 series 8 1284403

The TW2488PA is disposed along the inner edge of the inward slanting of the reinforcing ring 240. Since the area of the first surface 221 of the reinforcing ring is larger than the area of the second surface 222, the accommodating space 250 forms an oblique groove with an upper narrow width. To increase the overflow range 249 of the primer 247 in the dispensing process. As for the detailed steps of dispensing, the drawings are described in detail below. Referring to Figures 3A to 3C, a flow chart of the dispensing process of the package structure of the first embodiment of the present invention is shown. First, as shown in FIG. 3A, the wafer 230 is placed on the wafer carrier 240. And coating a colloid 245 B at the edge of the surface of the wafer carrier 240, and then bonding the reinforcing ring 220 to the wafer carrier 240. At this time, the inner edge of the reinforcing ring 220 forms a space with the wafer carrying body 240. The space 250 is such that the area of the first surface 221 - of the reinforcing ring is larger than the area of the second surface 222 , so that the accommodating space 250 is an oblique groove having an upper narrow width. Next, as shown in Fig. 3B, a primer 247 is dropped between the wafer 230 and the reinforcing ring 220. The primer 247 is diffused by the capillary phenomenon in the gap 251 between the wafer 230 and the wafer carrier 240. Since the bottom of the accommodating space 250 has a large overflow range 249, the primer 247 does not flow during the diffusion process; as for the gap between the reinforcing ring 220 and the wafer carrier 240, the primer 247 can completely fill the wafer 230. There is a gap 251 with the wafer carrier 240 without any holes. Then, as shown in Fig. 3C, the primer 247 is then thermally cured so that the primer 247 is solid to protect the bumps 260 in the gap 251. The heat sink 210 is disposed on the first surface 221 of the reinforcing ring 220 and the wafer 230 to help dissipate heat from the wafer. Due to the first surface of the reinforcement ring 220 221 9 1284403

Sanda number TW2488PA is within the scope of the invention. In addition, the reinforcing ring can be an integrally formed structure, and the material of the reinforcing ring can be made of a material having high thermal conductivity and hardness, such as metal, ceramic or polymer material, which can more effectively prevent the substrate from warping and help the heat dissipation of the wafer. The other 5 wafer carrier can be a lead frame or a substrate. The wafer can be placed on the wafer carrier by flip chip or surface mounting technology (SMT). The package structure disclosed in the above embodiments of the present invention improves the B structure design of the reinforcing ring, so that the reinforcing ring maintains the function of preventing the warpage deformation of the wafer carrier, and the package structure can be effectively used in the dispensing process. The underfill is filled with the gap between the wafer and the wafer carrier. It not only prevents the wafer carrier from warping and maintaining the contact area between the reinforcing ring and the heat sink, but also completely protects the bump with the primer, greatly increasing the structural strength of the package structure. In the above, although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make various kinds without departing from the spirit and scope of the invention. Modifications and refinements, therefore, the scope of protection of this invention is subject to the definition of the scope of the patent application. 11 1284403

Sanda number TW2488PA [Simple description of the diagram] Figure 1A shows an exploded view of the conventional package structure. FIG. 1B is a schematic diagram showing the combination of the package structure of FIG. 1A. 2A is a schematic exploded perspective view of a package structure in accordance with a first embodiment of the present invention. FIG. 2B is a combined side view of a package structure in accordance with a first embodiment of the present invention. 3A to 3C are views showing the package structure of the first embodiment of the present invention. 4A to 4B are views showing a dispensing flow chart of a package structure in accordance with a second embodiment of the present invention. [Main component symbol description] 100, 200, 400: package structure 110, 210: heat sink I 120, 220, 420: reinforcement ring 121: upper surface 130, 230: wafer 140, 240: wafer carrier 145, 245: colloid 147, 247: primer 149, 249, 449: overflow range 151, 251: gap 152: hole 12 1284403

Sanda number TW2488PA 221: first surface 222: second surface 250, 450: accommodation space • 160, 260: bumps 170, 270: solder balls

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Claims (1)

Positive replacement page I2M403 Sanda number TW2488 (061227) CRF X. Patent application scope: 1. A package structure comprising: a wafer carrier; a wafer disposed on the wafer carrier and electrically connected to the wafer carrier a reinforcing ring disposed on the wafer carrier and surrounding the wafer, the reinforcing ring having a first surface and a second surface, the second surface being opposite to the first surface, the first surface The area is larger than the surface of the second surface, and when the second surface is attached to the wafer carrier, an accommodating space is formed between the inner edge of the reinforcing ring and the wafer carrier; and a heat sink And disposed on the wafer and the reinforcing ring. 2. The package structure according to claim 1, wherein the reinforcement ring is an integrally formed structure. 3. The package structure according to claim 1, wherein the reinforcement ring material is a material having a high thermal conductivity. 4. For the package structure described in claim 3, the reinforced ® ring material is a metal, ceramic or polymeric material. 5. The package structure of claim 1, wherein the accommodating space is a space that is narrower and wider. 6. The package structure of claim 5, wherein the accommodating space is a slant groove. 7. The package structure of claim 5, wherein the accommodating space is a T-shaped groove. 8. The package structure as claimed in claim 1, wherein the 1284403 Sanda number TW2488 (061227) The CRF wafer carrier system is a package substrate. 9. The package structure of claim 1, wherein the wafer carrier system is a lead frame. 10. The package structure of claim 1, wherein the wafer is disposed on the wafer carrier by a flip chip bonding technique (Flip Chip). 11. The package structure of claim 1, wherein the wafer is disposed on the wafer carrier by Surface Mounting Technology (SMT). 12. A reinforcing ring is applied to a package structure, the package structure includes a chip and a substrate, and the chip is electrically connected to the substrate, the reinforcement ring is disposed on the substrate, and surrounds the wafer, The reinforcing ring has a first surface opposite to the first surface, the first surface has an area larger than an area of the second surface, and the second surface is attached to the substrate In the upper case, an accommodating space is formed between the inner edge of the reinforcing ring and the substrate. The reinforcing ring of claim 12, wherein the package further comprises a heat sink disposed on the reinforcing ring and the wafer to dissipate heat from the wafer. 14. The reinforcing ring of claim 12, wherein the reinforcing ring is an integrally formed structure. 15. The reinforcing ring of claim 12, wherein the reinforcing ring material is a material having a high thermal conductivity. 16. The reinforcement ring according to claim 15 of the patent application, wherein the 15 1284403 Sanda number TW2488 (061227) CRF reinforcement ring material is metal, ceramic or polymeric material. 17. The reinforcing ring of claim 12, wherein the accommodating space is a space that is narrower and wider. 18. The reinforcing ring of claim 17, wherein the accommodating space is a slant groove. 19. The reinforcing ring of claim 17, wherein the receiving space is a T-shaped groove. 16 .1284403 Patent Application No. 094146558 Revision 1T^ 449 ·' 247 2ψ 260 ^Ύ7 Figure 4 449 450 247 2f 260 251^ 450 "X υυυυυυυυυυυυυυυ 210 420 245 240 270 400