TWI281519B - Electrolyzing polishing process system and method thereof - Google Patents

Electrolyzing polishing process system and method thereof Download PDF

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TWI281519B
TWI281519B TW94103872A TW94103872A TWI281519B TW I281519 B TWI281519 B TW I281519B TW 94103872 A TW94103872 A TW 94103872A TW 94103872 A TW94103872 A TW 94103872A TW I281519 B TWI281519 B TW I281519B
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metal foil
electrode
acid
gap
electrolyte
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TW94103872A
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Chinese (zh)
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TW200628640A (en
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Jia-Lung Guo
Shuo-Ren Li
Jau-Jang Chen
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Jia-Lung Guo
Shuo-Ren Li
Jau-Jang Chen
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  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

This invention is about an electrolyzing polishing process system and a method thereof. The system comprises an electrolyte tank, a metallic sheet whose thickness is 0.5 mm to 0.005 mm, an electrode part, and a power supply. The method comprises a pre-process procedure, an electrolyzing polishing procedure, a post-process procedure, and an examination procedure. At the gap between the metallic sheet and the electrode part, the tips on the metallic sheet will preferentially form a reversed electroplating reaction because of bigger current density that makes the tips depart from the metallic sheet, so the surface roughness of the first surface of the metallic sheet can be improved. This invention is suitable for the surface treatment of a flexible metallic sheet with a big area. This invention is a continuous and non-contact process causing no residual stress, and can bilaterally process a workpiece at one time.

Description

.1281519 五、發明說明(1) 【發明所屬之技術領域】 本發明係有關一種電解拋光處理系統及方法,特別是 指一種利用逆電鍍反應之電解拋光處理系統及方法,其兼 具適合大面積可撓性金屬之表面處理、可連續式處理、無 接觸式處理之殘留應力與可同時雙面處理之優點及功效。 【先前技術】 ^ 軟性顯示器(flexible display)正是當今最先進且極 待開^之項域’若以金屬箔板(m e t a 1 - f 〇 i 1 )為軟性顯示器 之基材疋較好的選擇,當然,在其他領域中也有可能會應 >用到這種表面粗度佳、大面積且極薄之導電薄片。 然而,對一個大面積且極薄之導電薄片進行表面之處 理的方式彳艮多。以傳統之表面粗度之改善方式而言,主要 是直接接觸式之加工或處理,如研磨、接觸式之拋光。但 是對於厚度為〇.5mm以下之導電薄片而言,直接接觸式之 的主要問題在於:接觸力太大時會破壞導電薄片,且在接 觸加工的同時,雖然改善了表面粗度,但也造成殘留應 之問題。 ~ ^ 一一—·* 其次,次只能進行一面,無法 時,進行雙面處理,所以,無法同時雙面處理。 …、/ 9 另外丄傳統之接觸式處理多半是一片一片的逐片#理 ,無法進行連續式處理,故,處理速度較慢。 处 因此’有必要研發出新技術,以解決上述問。 【發明内容】 本發明之主要目的,在於提供一種電解拋光處理系統BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrolytic polishing processing system and method, and more particularly to an electrolytic polishing processing system and method using a reverse plating reaction, which is suitable for a large area. The surface treatment of flexible metal, continuous treatment, residual stress without contact treatment and the advantages and effects of simultaneous double-sided treatment. [Prior Art] ^ The flexible display is the most advanced and extremely popular item in the world. If the metal foil board (meta 1 - f 〇i 1 ) is the substrate of the soft display, it is a better choice. Of course, it is also possible in other fields to use such a conductive sheet having a good surface roughness, a large area, and an extremely thin surface. However, there are many ways to surface the surface of a large-area and extremely thin conductive sheet. In the conventional way of improving the surface roughness, it is mainly direct contact processing or processing, such as grinding, contact polishing. However, for a conductive sheet having a thickness of less than 55 mm, the main problem of the direct contact type is that the conductive sheet is destroyed when the contact force is too large, and the surface roughness is improved at the same time as the contact processing, but also Residue should be a problem. ~ ^ 一一—·* Secondly, the second time can only be performed on one side. If it is not possible, double-sided processing is performed, so it cannot be double-sided at the same time. ..., / 9 In addition, the traditional contact treatment is mostly one piece by piece, and it cannot be processed continuously, so the processing speed is slow. Therefore, it is necessary to develop new technologies to solve the above problems. SUMMARY OF THE INVENTION The main object of the present invention is to provide an electrolytic polishing processing system

第5頁 1281519 五、發明說明(2) 及方法,利用逆電鍍反應之原理,適合大而接m W 〇大面積可撓性金屬 之表面處理。Page 5 1281519 V. Inventive Note (2) and method, using the principle of reverse plating reaction, is suitable for the surface treatment of large-area flexible metal.

本發明之次一=的,在於提供一種電解拋光處理 及方法,其町進行連續式處理。 μ A 供種電解拋光處理系統 本發明之又一目的,在於 及方法,其無接觸式處理之殘留應力 本發明之再一目的,在於提供一種電解拋光處理系 及方法,其可同時雙面處理。 /、、、' /本發明係提供一種電解拋光處理系統,其包括: 一電解液槽,其内容納有一電解液; ^ · 一金屬薄片’其具有一待處理之第一表面及一第二 面,該金屬薄片係具有可撓性且具有一介於〇 5mm至一 0· 005mm間之厚度,該金屬薄片係概成捲狀且 動裝置所帶動而可移動; ° 一電極部,該電極部與該金屬薄片之第一表面間具有 一預定之電解間隙,其内充滿該電解液; 一電源供應部’其具有一正電極及一負電極,該金屬 薄片係連接至該正電極,該電極部係連接到該負電極; _ 藉此,該尚未經過該電解間隙之第一表面上具有複數 個凸出部,每一凸出部分別具有一尖端部及一根部,在該 電解間隙處,複數個尖端部因電流密度較大而優先產生^ 電鍍反應並脫離該金屬薄片,進而達到改善該金屬薄片之 第一表面之表面粗度。 本發明之方法包括下列步驟:The second aspect of the present invention is to provide an electrolytic polishing treatment and a method in which a continuous treatment is carried out in a town. A further object of the present invention is a method and method for the residual stress of the contactless treatment. A further object of the present invention is to provide an electrolytic polishing treatment system and method which can simultaneously treat both sides . /,,, ' / The present invention provides an electrolytic polishing processing system, comprising: an electrolyte bath containing an electrolyte therein; ^ · a metal foil having a first surface to be treated and a second The metal foil is flexible and has a thickness of between 〇5 mm and 0.001 mm, and the metal foil is rolled and moved by the moving device; ° an electrode portion, the electrode portion Forming a predetermined electrolytic gap between the first surface of the metal foil and filling the electrolyte; a power supply portion having a positive electrode and a negative electrode, the metal foil being connected to the positive electrode, the electrode Connected to the negative electrode; _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ A plurality of tip portions preferentially generate a plating reaction due to a large current density and are separated from the metal foil, thereby improving the surface roughness of the first surface of the metal foil. The method of the invention comprises the following steps:

.1281519 五、發明說明(3) .電解拋光步驟、三.後處理步 一 ·前處理步驟、二 禪及四、檢測步驟。 本發明之上述目的與優點,不難 .之詳細說明與附®中,獲得深人瞭解。4所選用實施例 【實列實施例並配合圖式詳細說明本發明於後·· 本發明係為一種電解拋光虛王里& 部份,杜m m Γ 統及方法。關於系統 參圖’其主要包括電解液槽10、-金屬溥片20、一電極部30及一電源供應部4〇。 關於該電解液槽1〇,其内容納有一電解液η。實務 上,該電解液11係選自硫酸、磷酸、甘油、硝酸、鹽酸、 乳酸、檸檬酸、鉻酸、亞磷酸、有機酸之水溶液其中之一 項。 而該金屬薄片20,係具有一待處理之第一表面21及 一第二表面22,該金屬薄片20係具有可撓性且具有一介 於0· 5mm至〇· 〇〇5mm間之厚度Τ,該金屬薄片20係概成捲狀 且被一第一驅動裝置2 3所帶動而可移動。當然,此金屬薄 片20亦可與另一非金屬基材25複合成一體而成為一複合薄 _片,如第十圖所示。 ,有關此電極部3 0部份,該電極部3 0與金屬薄片2 0之第 一表面21間具有一預定之電解間隙G(如第二圖所示),其 内充滿該電解液1丨;此電解間隙G最好呈垂直狀,或是傾 斜狀’以利反應產生之氣體或氣泡向上飄離。 該電源供應部40,其具有一正電極41及一負電極42,.1281519 V. Description of invention (3). Electrolytic polishing step, 3. Post-treatment step 1 · Pre-processing step, 2 zen and 4, detection steps. The above objects and advantages of the present invention are not difficult. The detailed description and the attached ® are well understood. 4 Selected Embodiments [The present invention will be described in detail with reference to the drawings. The present invention is an electropolishing virtual king & part, dum m system and method. Regarding the system, the reference numeral 'is mainly includes an electrolytic solution tank 10, a metal crucible 20, an electrode portion 30, and a power supply portion 4A. The electrolyte tank 1 is filled with an electrolyte η. In practice, the electrolyte 11 is selected from the group consisting of sulfuric acid, phosphoric acid, glycerin, nitric acid, hydrochloric acid, lactic acid, citric acid, chromic acid, phosphorous acid, and an aqueous solution of an organic acid. The metal foil 20 has a first surface 21 to be treated and a second surface 22, and the metal foil 20 has flexibility and has a thickness 0 between 0·5 mm and 〇〇·〇〇5 mm. The metal foil 20 is wound in a roll shape and is movable by a first driving device 23. Of course, the metal foil 20 can also be integrated with another non-metal substrate 25 to form a composite thin sheet, as shown in the tenth figure. With respect to the portion of the electrode portion 30, the electrode portion 30 and the first surface 21 of the metal foil 20 have a predetermined electrolytic gap G (as shown in the second figure) filled with the electrolyte 1丨. The electrolysis gap G is preferably vertical or inclined to facilitate the gas or bubbles generated by the reaction to drift upward. The power supply unit 40 has a positive electrode 41 and a negative electrode 42.

第7頁 .1281519 五、發明說明(4) 該金屬薄片2 0係 該負電極42。 藉此,該尚 複數個凸出部21 有一尖端部2 11A 尖端部211A因電 該金屬薄片2 0, 之表面粗度。 前述之電源 一供電。由於反應 電,則有更多之 連接至該正電極4 1,該電極部3 〇係連接到 未經過該電解間隙G之第一表面21上具有 1(請參閱第三圖),每一凸出部211分別具 及根部211B,在該電解間隙g處,複數個 流密度較大並優先產生逆電鍍反應而脫離 進而達到改善該金屬薄片2〇之第一表面21 供應部4 0,其係可連續供電,或是間歇性 時會有氣體(或氣泡)產生,若採間歇性供 氣體(或氣泡)排出時間,較不易累積氣體 待處理之第一表面 一介於0. 5mm至 成捲狀,且被一第 經過一電解間隙G 每一凸出部2 11分 電極部3 0,該電極 有該預定之電解間 以上為本發明之電解拋 其次,關於本發明之方 括下列步驟: 一、前處理步驟61 :準 一電解液11 ; 一金屬薄片20 21及一第二表面22,該金屬 _0· 0 05mm間之厚度τ,該金屬 一驅動裝置23所帶動而可移 之,第一表面21上具有複數個 別具有一尖端部211 a及一根 部30與該金屬薄片2〇之第一 隙G ’該電解間隙G内充滿該 光處理系統。 法部份,請參閱第九圖,其包 備一電解液槽1 0,其内容納有 ,其具有 薄片20具有 薄片2 0係概 動,該尚未 凸出部2 11 部211B ; — 表面2 1間具 電解液11 ; 一電源供應部40Page 7 .1281519 V. DESCRIPTION OF THE INVENTION (4) The metal foil 20 is the negative electrode 42. Thereby, the plurality of projections 21 have a tip portion 2 11A, and the tip end portion 211A is made to have a surface roughness of the metal foil 20. The aforementioned power supply is powered. Due to the reaction electricity, there is more connection to the positive electrode 4 1, and the electrode portion 3 is connected to the first surface 21 not passing through the electrolytic gap G to have 1 (see the third figure), each convex The outlet portion 211 has a root portion 211B, and a plurality of flow densities are large at the electrolysis gap g, and a reverse plating reaction is preferentially generated to be detached to improve the first surface 21 supply portion 40 of the metal foil 2, 5毫米至卷状状。 The first surface of the first surface of the first surface is 0. 5mm to the roll And passing through an electrolysis gap G, each of the protrusions 2 11 is divided into electrode portions 30, and the electrode has the predetermined electrolysis chamber and is the electrolysis of the present invention. The following steps are involved in the present invention: The pre-processing step 61: a quasi-electrolyte 11; a metal foil 20 21 and a second surface 22, the thickness τ between the metal 0. 0 05 mm, the metal driving device 23 is driven and movable, a surface 21 having a plurality of individual ones The tip portion 211a and the one portion 30 and the first gap G' of the metal foil 2' are filled with the optical processing system. For the part of the method, please refer to the ninth figure, which is provided with an electrolyte tank 10, which is contained therein, and has a sheet 20 having a sheet 20 system, the unexposed portion 2 11 portion 211B; 1 with electrolyte 11; a power supply unit 40

1281519 五、發明說明(5) "" " 其具有一正電極41及一負電極42,該金屬薄片20係連接至 該正電極41,該電極部30係連接到該負電極42 ; 二、 電解拋光步驟62 :使該金屬薄片20移動,在該電 解間隙G處,複數個尖端部211A因電流密度較大而優先產 生逆電鍍反應並脫離該金屬薄片2〇,進而達到改善該金屬 薄片20之第一表面21之表面粗度; 三、 後處理步驟63 :清洗該處理後之金屬薄片20,之 後並乾燥; 四、 檢測步驟64 :對已處理之金屬薄片20進行表面粗 度之量測、化學成份分析及抗腐蝕測試。然而,此第四步 驟屬於非必要步驟,實務上也可省略。 關於本發明之動作原理,請參閱第三圖至第八圖所示 〇 首先,請參閱第三及第四圖,該金屬薄片20之第一表 面21上具有複數個凸出部2Π ,每一凸出部211具有一尖 端部2 11A及一根部2 11 B。當該金屬薄片2 0經過該電解間隙 G時,為方便說明,在第四圖中分別於該尖端部2 11 A之最 外端、中間處及較内處設定一第一點P1、一第二點P2、一 .第三點P3。而在該根部211B旁,則設一第四點P4。 其次,該第一點P1至該電極部3 0之距離為一第一距離 L1,該第四點P4至該電極部30之距離為第二距離L2。此時 ’第一距離L1比第二距離l 2小,所以尖端部2 11 A之第一點 p 1處之電流密度較大(意指相對於第四點P4處較大),發生 逆電鍍之反應也較快。1281519 V. The invention has a positive electrode 41 and a negative electrode 42 connected to the positive electrode 41, and the electrode portion 30 is connected to the negative electrode 42; 2. Electrolytic polishing step 62: moving the metal foil 20, at the electrolytic gap G, the plurality of tip portions 211A preferentially generate a reverse plating reaction and get detached from the metal foil 2 因 due to a large current density, thereby improving the metal The surface roughness of the first surface 21 of the sheet 20; 3. Post-processing step 63: cleaning the treated metal foil 20, followed by drying; 4. Detection step 64: surface roughness of the treated metal foil 20 Measurement, chemical composition analysis and corrosion resistance testing. However, this fourth step is a non-essential step and can be omitted in practice. For the principle of operation of the present invention, please refer to the third to eighth figures. First, referring to the third and fourth figures, the first surface 21 of the metal foil 20 has a plurality of protrusions 2Π, each of which has a plurality of protrusions 2 The projection 211 has a tip end portion 21A and a portion 211B. When the metal foil 20 passes through the electrolytic gap G, for convenience of explanation, in the fourth figure, a first point P1 and a first point are respectively set at the outermost end, the middle portion and the inner portion of the tip end portion 2 11 A. Two points P2, one. Third point P3. Next to the root 211B, a fourth point P4 is provided. Next, the distance from the first point P1 to the electrode portion 30 is a first distance L1, and the distance from the fourth point P4 to the electrode portion 30 is a second distance L2. At this time, the first distance L1 is smaller than the second distance l 2 , so the current density at the first point p 1 of the tip end portion 2 11 A is large (meaning larger at the fourth point P4), and reverse plating occurs. The reaction is also faster.

1281519 五、發明說明(6) ----- 請參閱第五圖及第六圖’開始逆電鍍反應後,金 片20之金屬與電解液11中之酸根化學反應而形成了含金 屬的酸根聚合物之黏稠層5 0。更嚴格的說,此愈 & 辦調滑5 0形 成了較接近金屬溥片2 0之内黏稠層5 1 (黏度較言、 呵^及外黏稠 層52(黏度較低),同時,會有氣體或氣泡產生,在接 •極之金屬薄片2 0部份是產生氫氣,而接近該電極部3 〇部{八 則是產生氧氣,剛好是與電解反應相反。 77 在第六圖中,可以看出部份之尖端部2Ua已經不見, 第一距離L1變成由第二點P2至該電極部3〇之距離,作仍 •於該第二距離L2。 — /、 請參閱第七圖及第八圖,逆電鍍反應繼續進行,更多 的尖端部211A被移除(因電流密度較大),第一距離以再^ 成由苐二點P 3至該電極部3 0之距離,但仍小於該第二距2 最後,該凸出部2 11會變的較平滑,所以,有效的改 善了整個金屬薄片20的第一表面21之表面粗度。 綜上所述,本發明之優點及功效可歸納為: [1 ]適合大面積可撓性金屬之表面處理。由於本發明 鲁採連續對金屬薄片進行處理,當金屬薄片之寬度加大時, 理論上只要電極部也加大仍可以進行處理,故,可大面積 [2 ]可連續式處理。本發明可對連續且極薄之金屬薄 20連續的反應處理(此為逆電鍍反應),特別是適合加工 大尺寸之可撓式顯示器(flexible display)之金屬箱板1281519 V. INSTRUCTIONS (6) ----- Please refer to the fifth and sixth figures. After the reverse plating reaction is started, the metal of the gold plate 20 reacts with the acid radical in the electrolyte 11 to form a metal-containing acid radical. The viscous layer of the polymer is 50. More strictly speaking, this more & adjust the slip 50 to form a sticky layer 5 1 which is closer to the metal enamel film (the viscosity is better than the words, oh ^ and the outer viscous layer 52 (low viscosity), at the same time, There is a gas or a bubble, and in the portion of the metal foil 20, hydrogen gas is generated, and close to the electrode portion 3, the gas is generated, which is exactly the opposite of the electrolytic reaction. 77 In the sixth figure, It can be seen that part of the tip end portion 2Ua is no longer visible, and the first distance L1 becomes the distance from the second point P2 to the electrode portion 3〇, and is still at the second distance L2. — /, Please refer to the seventh figure and In the eighth figure, the reverse plating reaction continues, and more of the tip portion 211A is removed (due to the higher current density), and the first distance is further reduced by the distance from the second point P 3 to the electrode portion 30, but Still smaller than the second distance 2 Finally, the protrusion 2 11 becomes smoother, so that the surface roughness of the first surface 21 of the entire metal foil 20 is effectively improved. In summary, the advantages of the present invention And the efficacy can be summarized as: [1] suitable for the surface treatment of large-area flexible metals. Due to the invention Lu Cailian When the width of the metal foil is increased, the metal foil can be processed in theory as long as the electrode portion is enlarged, so that the large area [2] can be continuously processed. The present invention can be continuous and extremely thin. Metal thin 20 continuous reaction treatment (this is a reverse plating reaction), especially a metal box plate suitable for processing a large-sized flexible display

第10頁 1281519Page 10 1281519

(metal-foil)或類似之可撓式可暮 [3 ]無接觸式處理之殘留應力。的金屬薄片。 的切削或研磨工具直接接觸待加工由於本發明並非傳統 .應力,同時,亦無表面傷害。 表面,所以並無殘留 _ [4]可同時雙面處理。只要在往^ :均設有電極部,即可同時雙面加工:力薄片兩面 不易雙面加工之缺點。 凡全克服習知技術中 Μ 由以上詳細說明 確可達成前述目的, 專利申請。 ,可使熟知本項技藝者明瞭本發明的 貫已符合專利法之規定,爰提出發明(metal-foil) or similar flexible 暮 [3] residual stress without contact treatment. Metal foil. The cutting or grinding tool is in direct contact with the workpiece to be processed because the invention is not conventional. Stress, and at the same time, no surface damage. Surface, so there is no residue _ [4] can be double-sided at the same time. As long as the electrodes are provided in the ^:, the double-sided processing can be performed at the same time: the two sides of the force sheet are not easy to be processed on both sides. In the case of fully overcoming the prior art, the above-mentioned purpose, patent application, can be achieved by the above detailed description. It will be apparent to those skilled in the art that the invention has been in compliance with the provisions of the patent law and

J281519 圖式簡單說明 【圖式簡單說明】 第一圖係本發明之系統部份之示意圖 第二圖係本發明之系統部份之剖視示意圖 第三圖係本發明之處理過程一之示意圖 第四圖係本發明之處理過程一之剖視示意圖 第五圖係本發明之處理過程二之示意圖 第六圖係本發明之處理過程二之剖視示意圖 第七圖係本發明之處理過程三之示意圖 第八圖係本發明之處理過程三之剖視示意圖 I 第九圖係本發明之方法部份之流程圖 第十圖係本發明之金屬薄片為複合薄片狀之示意圖 【主要元件符號說明】 1 0電解液槽 11電解液 20金屬薄片 2 1第一表面 211凸出部 2 11 A尖端部 2 11 B根部 2 2第二表面 23第一驅動裝置 25非金屬基材 3 0〔電#部— 4 0電源供應部 >41正電極 4 2負電極 5 0黏稠層 5 1内黏稠層 5 2外黏稠層 6 1前處理步驟 62電解拋光步驟 6 3後處理步驟 6 4檢測步驟 P1第一點 P2第二點 P3第三點BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a portion of a system of the present invention. FIG. 2 is a schematic cross-sectional view of a portion of the system of the present invention. 4 is a schematic cross-sectional view of a process of the present invention. FIG. 5 is a schematic view of a process 2 of the present invention. FIG. 6 is a cross-sectional view showing a process 2 of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 8 is a cross-sectional view of a process 3 of the present invention. FIG. 9 is a flow chart showing a part of the method of the present invention. FIG. 10 is a schematic view showing a metal foil of the present invention in a composite sheet shape. 10 electrolyte tank 11 electrolyte 20 foil 2 1 first surface 211 projection 2 11 A tip portion 11 11 B root 2 2 second surface 23 first drive device 25 non-metal substrate 3 0 — 4 0 power supply unit > 41 positive electrode 4 2 negative electrode 5 0 viscous layer 5 1 inner viscous layer 5 2 outer viscous layer 6 1 pre-treatment step 62 electropolishing step 6 3 post-processing step 6 4 detection step P1 first Point P 2 second point P3 third point

第12頁 1281519 L1第一距離 T厚度 圖式簡單說明 P4第四點 L 2第二距離 G電解間隙 Φ ΙΪΙΒί 第13頁Page 12 1281519 L1 first distance T thickness Graphical description P4 fourth point L 2 second distance G electrolytic gap Φ ΙΪΙΒί Page 13

Claims (1)

1281519 六、申請專利範圍 1 · 一種電解拋光處理系統,其包括: 一電解液槽,其内容納有一電解液; 一金屬薄片,其具有一待處理之第一表面及一第二 表面,該金屬薄片係具有可撓性且具有一介於0. 5mm 至0. 0 0 5mm間之厚度,該金屬薄片係概成捲狀且被一 第一驅動裝置所帶動而可移動; 一電極部,該電極部與該金屬薄片之第一表面間具 有一預定之電解間隙,其内充滿該電解液; 一電源供應部,其具有一正電極及一負.電極,該金 > 屬薄片係連接至該正電極,該電極部係連接到該負電 極; 藉此,該尚未經過該電解間隙之第一表面上具有複 數個凸出部,每一凸出部分別具有一尖端部及一根部 ,在該電解間隙處,複數個尖端部因電流密度較大而 優先產生逆電鍍反應並脫離該金屬薄片,進而達到改 善該金屬薄片之第一表面之表面粗度。 2 ,·如申請專利範圍第1項所述之電解拋光處理系統,其 中,該電解液係選自硫酸、填酸、甘油、踢酸、鹽酸 I 、乳酸、檸檬酸、鉻酸、亞構酸、有機酸之水溶液其 中之一項。 3 ·如申請專利範圍第1項所述之電解拋光處理系統,其 中,該電源供應部係連續供電。 4 ·如申請專利範圍第1項所述之電解拋光處理系統,其 中,該電源供應部係間歇性供電。1281519 VI. Patent Application No. 1 · An electrolytic polishing processing system comprising: an electrolyte bath containing an electrolyte therein; a metal foil having a first surface to be treated and a second surface, the metal The sheet is flexible and has a thickness of between 0.5 mm and 0.05 mm. The foil is rolled and moved by a first driving device; an electrode portion, the electrode And a predetermined electrolytic gap between the first surface and the first surface of the metal foil filled with the electrolyte; a power supply portion having a positive electrode and a negative electrode, the gold > a positive electrode, the electrode portion is connected to the negative electrode; thereby, the first surface that has not passed through the electrolytic gap has a plurality of protrusions, and each of the protrusions has a tip end portion and a portion, respectively At the electrolysis gap, a plurality of tip portions preferentially generate a reverse plating reaction due to a large current density and are separated from the metal foil, thereby improving the surface roughness of the first surface of the metal foil. 2. The electropolishing treatment system according to claim 1, wherein the electrolyte is selected from the group consisting of sulfuric acid, acid filling, glycerin, kappa acid, hydrochloric acid I, lactic acid, citric acid, chromic acid, phthalic acid. One of the aqueous solutions of organic acids. 3. The electrolytic polishing processing system of claim 1, wherein the power supply unit is continuously powered. 4. The electrolytic polishing processing system of claim 1, wherein the power supply unit is intermittently powered. 第14頁 1281519Page 14 1281519 六、申請專利範圍 步驟: 其内容 ί里之一 可撓性 該金屬 動而可 上具有 端部及一根部; 一表面間具有該 解液;一電源供 極,該金屬薄片 連接到該負電極 納有一電 第一表面 且具有一 薄片係概 移動’該 複數個凸 5v二種電解拋光處理方法,其包括下列 —·省處理步驟:準備一電解液槽, 解液y —金屬薄片,其具有待處 及一第二表面,該金屬薄片具有 介於0· 5mm至〇· 〇〇5mm間之厚度, r 成捲狀且被一第一驅動裝置所帶 尚未經過一電解間隙之第一表面 出部,每一凸出部分別具有一尖 φ 一電極部,係與該金屬薄片之第 預定之電解間隙,其内充滿該雷 應部,其具有-正電極及一負1 係連接至該正電極,該電極部係 -·電解拋光步驟:使該金屬薄片移動,在該電解間 隙處,複數個尖端部因電流密度較大而優先產生 逆電鍍反應並脫離該金屬薄片,進而達到改善該 金屬薄片之第一表面之表面粗度; 三.後處理步驟:清洗該處理後之^屬薄片,之後並 乾燥。 如申請專利範圍第5項所述之電解拋光處理方法,其 中’又包括下列步驟: 四、檢測步驟:對已處理之金屬薄片進行表面粗度 之置測、化學成份分析及抗腐飾測試。Sixth, the scope of the patent application steps: one of the contents of the flexible one of the metal can have an end and a part; a surface between the solution; a power supply pole, the metal foil is connected to the negative electrode Having an electric first surface and having a sheet-like movement 'the plurality of convex 5v two kinds of electropolishing treatment methods, including the following - - provincial processing steps: preparing an electrolyte tank, dissolving y - metal foil, having And a second surface, the metal foil having a thickness of between 0.5 mm and 〇〇·〇〇5 mm, r being rolled and being carried by a first driving device without passing through a first surface of an electrolytic gap Each of the protrusions has a tip φ-electrode portion, and a predetermined electrolytic gap of the metal foil, which is filled with the lightning portion, and has a positive electrode and a negative 1 system connected to the positive portion Electrode, the electrode part--electrolytic polishing step: moving the metal foil, at the electrolysis gap, a plurality of tip portions preferentially generate a reverse plating reaction due to a large current density and are separated from the metal foil The surface roughness of the first surface of the metal foil is improved; 3. Post-processing step: the treated thin film is washed, and then dried. The electropolishing treatment method according to claim 5, wherein the method further comprises the following steps: 4. Testing step: measuring the surface roughness of the treated metal foil, chemical composition analysis and anti-corrosion testing. 第15頁Page 15
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