1279666 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種散熱裝置，且特別是有關於一種 適用於電子儀器設備之具有冷熱交換功能之散熱裝置。 【先前技術】 隨著資訊科技的高度發展，例如積體電路之製程的改 進’以及對積體電路功能規格的要求日益升高，現今積體 電路的設計已是十分的精緻與複雜。肇因於複雜的電路設 汁所引發之龐大電能的消耗，而這些消耗的電能將會造成 晶片溫度的上升。 以積體電路為基礎的相關元件在電腦的應用上相當重 要，現今電腦機殼設計為了成本及空間節省考量，内部難 以預留足夠之自然對流之空間，因此使得電腦上元件，例 如中央處理器及週邊裝置控制晶片之溫度上升更形嚴重， ，成整個系統内部產生溫度過高的問題。當熱量聚集在機 殼内部而無法即時散掉時，將造成電子元件無法正常工 作，甚至使整個電腦系統當機。 傳統之電腦散熱器，在處理高功率之中央處理器時， 一般而&，可採用直接安裝於中央處理器上之散熱器，其 風扇直接口人向中央處理器上方的散熱鰭片，將熱量排出電 腦内部° #了有效的將中央處理ϋ所產生的熱量排出電腦 =部，^前多採用以熱管與散熱鰭片的方式引導中央處理 器之熱量，再由風扇的氣流將熱量移除。隨著中央處理器 的運作速度提高，其所產生的熱量越來越高，散熱器所需 1279666 的體積也就越來越大’以提高移除熱量的能力。 而在將t央處理器上之熱移除後，敎交 * 在機殼内部’因此必須再進行系統内部I散敎，通=仍 於機殼上，例如利用電源供應器上之= 溫度最多鱼室=關，亦即其所能獲致平衡之 往往不： 時由氣體對流之散熱方式效率 為主二孰因此需要一種散熱裝置，解決習知之散熱風扇 馮主的政熱糸統所遭遇散熱效率有限之問題。 【發明内容】 Α因此本發明之—目的，就是在提供-種具有冷熱交換 功此之散熱裝置，用以有效達成電子設備或儀器之散熱。 j本的另一目的，是在提供一種具有冷熱交換功能 之政…、裝置，用以改善傳統之風扇散熱系統之散熱效果， 使散熱效果不受限於環境溫度。 ^本發明的再一目的，是提供一種具有冷熱交換功能之 散熱裝置，不單利用傳統氣體對流方式來散熱，使得散熱 效率更好。 根據本發明之上述目的，提出一種具有冷熱交換功能 之散熱裝置。散熱裝置主要包含一殼體、一第一導流裝置、 一致冷晶片與一第二導流裝置。殼體包含一第一空間，具 有一第一進氣口與一冷氣出口，以及一第二空間，具有一 弟一進氣口與一熱氣出口。 第導流裝置位於第一進氣口旁，用以導引一熱源流 1279666 體自第一進氣口進入殼體。致冷晶片位於該殼體内，具有 一冷側與一熱側，冷側與第一空間耦合，用以冷卻熱源流 體’熱側與第二空間耦合。第二導流裝置位於第二進氣口 旁’用以導引外部環境流體自第二進氣口進入殼體，進行 一熱父換’熱源流體經冷卻後自冷氣出口流出殼體，外部 環境流體經熱交換後自熱氣出口流出殼體。 致冷晶片之冷側與熱側更可分別連接第一散熱片與第 二散熱片’以加強流體之熱交換效果。 於一較佳實施例中，更包含一溫度及/或溼度感測裝 置’連接於一調整器，調整器則連接一直流電壓轉換器。 藉由感測器偵測系統内部之溫度及/或溼度，並將訊號傳回 调整器，進而控制直流電壓轉換器調整致冷晶片之供給電 壓’如此進行一回饋控制，彈性調整致冷晶片之功率與效 能，防止露點效應之產生。 由上述可知’應用本發明之具有冷熱交換功能之散熱 衣置，因為導流裝置將流體強制性地送往致冷晶片冷側與 熱側，分別促進了熱源流體與外部環境流體的熱交換，不 僅充刀發揮致冷效果，也兼顧致冷晶片之熱側，即放熱一 側之熱排除，構成一相對於習知以風扇為主之散熱系統， 有較佳散熱效果之冷熱交換系統。 配合溫/溼度感測裝置對於致冷晶片之回饋控制，更解 決了致冷晶片的應甩上，難以避免的露點問題。 ^本發明不僅對各式電子儀器設備、裝置提供一良好之 政熱方式，尤其在技術進步快速的電腦產業中，更解決了 散熱此一影響技術發展之重要問題。 、 7 ^79666 【實施方式】 參照第1A至1C圖。第1A、1B圖係分別繪示依照本 月之具有冷熱父換功能之散熱裝置一較佳實施例的前視 圖與後視圖。第1C圖係繪示第1Λ圖之側剖面圖。具有冷 熱交換功能之散熱裝置主要包含一殼體100、一第一導流裝 置110a、一致冷晶片12〇與一第二導流裝置ii〇b。 殼體100包含一第一空間1〇〇a，具有一第一進氣口 102a與一冷氣出口 1〇4，以及一第二空間1〇叽，具有一第 =進氣口 102b與一熱氣出口 106。第一導流裝置u〇a位於 第一進氣口 102&旁，用以導引一熱源流體自第一進氣口 102a進入殼體1〇〇，熱源流體經冷卻後自冷氣出口流出殼 體，外部環境流體經熱交換後自熱氣出口流出殼體。 致冷晶片120位於該殼體1〇〇内，具有一冷側12如與 —熱側120b，冷側120a與第一空間100a耦合，用以冷卻 熱源流體，熱側12〇b與第二空間i00b耦合。第二導流裝1279666 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device having a cold heat exchange function suitable for an electronic instrument device. [Prior Art] With the rapid development of information technology, such as the improvement of the process of integrated circuits and the increasing requirements for the functional specifications of integrated circuits, the design of integrated circuits today is very delicate and complicated.肇 Due to the huge electrical energy consumption caused by complex circuit design, these consumed energy will cause the temperature of the wafer to rise. Related components based on integrated circuits are very important in the application of computers. Today's computer casing design is difficult to reserve enough space for natural convection in order to save cost and space. Therefore, components on the computer, such as the central processing unit. And the peripheral device controls the temperature rise of the wafer to be more serious, causing a problem of excessive temperature inside the entire system. When heat is collected inside the casing and cannot be dissipated immediately, the electronic components will not work properly and even the entire computer system will be down. The traditional computer heat sink, when dealing with a high-power central processing unit, generally adopts a heat sink directly mounted on the central processing unit, and the fan directly directs the cooling fins to the upper side of the central processing unit. The heat is discharged inside the computer. # Effectively discharges the heat generated by the central processing unit to the computer. The front part uses the heat pipe and the heat sink fin to guide the heat of the central processor, and then the airflow of the fan removes the heat. . As the speed of the central processing unit increases, the amount of heat generated is getting higher and higher, and the volume of the heat sink required for 1279666 is getting larger and larger to improve the ability to remove heat. After the heat on the t-processor is removed, the 敎* is inside the casing. Therefore, the internal I of the system must be dissipated. The pass=still on the casing, for example, using the power supply. Fish room = off, that is, it can not be balanced. The efficiency of the heat dissipation by gas convection is the second. Therefore, a heat sink is needed to solve the heat dissipation efficiency of the conventional heat-dissipating fan. Limited problem. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a heat sink having a cold heat exchange function for efficiently achieving heat dissipation from an electronic device or instrument. Another purpose of the present invention is to provide a heat exchange function and device for improving the heat dissipation effect of the conventional fan heat dissipation system, so that the heat dissipation effect is not limited to the ambient temperature. Another object of the present invention is to provide a heat sink having a cold heat exchange function, which not only utilizes conventional gas convection to dissipate heat, but also provides better heat dissipation efficiency. According to the above object of the present invention, a heat sink having a cold heat exchange function is proposed. The heat sink mainly comprises a casing, a first flow guiding device, a uniform cold chip and a second flow guiding device. The housing includes a first space having a first air inlet and a cold air outlet, and a second space having a first air inlet and a hot air outlet. The first flow guiding device is located beside the first air inlet to guide a heat source flow 1279666 from the first air inlet into the housing. The chilled wafer is located within the housing having a cold side and a hot side coupled to the first space for cooling the heat source fluid' heat side coupled to the second space. The second flow guiding device is located beside the second air inlet port to guide the external environment fluid from the second air inlet into the casing, and perform a hot parent exchange. The heat source fluid is cooled and then flows out of the casing from the cold air outlet, and the external environment The fluid exits the housing from the hot gas outlet after heat exchange. The cold side and the hot side of the cooled wafer may be connected to the first heat sink and the second heat sink respectively to enhance the heat exchange effect of the fluid. In a preferred embodiment, a temperature and/or humidity sensing device is further coupled to a regulator, and the regulator is coupled to the DC voltage converter. Detecting the temperature and/or humidity inside the system by the sensor and transmitting the signal back to the regulator, thereby controlling the DC voltage converter to adjust the supply voltage of the cooled wafer. Thus performing a feedback control, elastically adjusting the cooling chip Power and efficiency to prevent the occurrence of dew point effects. It can be seen from the above that 'the heat-dissipating device having the cold heat exchange function of the present invention is applied, because the flow guiding device forcibly sends the fluid to the cold side and the hot side of the cooling chip, respectively, promoting heat exchange between the heat source fluid and the external environmental fluid, Not only does the filling knife exert the cooling effect, but also the hot side of the cooling chip, that is, the heat removal on the heat releasing side, forming a cooling and heat exchange system having a better heat dissipation effect than the conventional fan-based heat dissipation system. In conjunction with the temperature/humidity sensing device, the feedback control of the cooled wafer further solves the problem of dew point which is difficult to avoid on the surface of the cooled wafer. The invention not only provides a good political heat method for various electronic equipments and devices, but also solves the important problem of heat dissipation, which affects the development of technology, especially in the computer industry with rapid technological advancement. 7 ^79666 [Embodiment] Referring to Figures 1A to 1C. 1A and 1B are respectively a front view and a rear view showing a preferred embodiment of a heat sink having a hot and cold father changing function according to this month. Fig. 1C is a side cross-sectional view showing the first drawing. The heat sink having the cold heat exchange function mainly comprises a casing 100, a first flow guiding device 110a, a uniform cold wafer 12A and a second flow guiding device ii〇b. The housing 100 includes a first space 1〇〇a having a first air inlet 102a and a cold air outlet 1〇4, and a second space 1〇叽 having a first air inlet 102b and a hot air outlet. 106. The first flow guiding device u〇a is located beside the first air inlet 102&; for guiding a heat source fluid from the first air inlet 102a into the casing 1〇〇, and the heat source fluid is cooled and then flows out of the casing from the cold air outlet. The external ambient fluid flows out of the casing from the hot gas outlet after heat exchange. The cooling fin 120 is located in the casing 1 , has a cold side 12 such as a heat side 120b, and a cold side 120a is coupled to the first space 100a for cooling the heat source fluid, the hot side 12 〇 b and the second space I00b coupling. Second diversion
置/l〇b位於第二進氣口 102b旁，用以導引外部環境流體 自第二進氣口 l〇2b進入殼體1〇〇，進行一熱交換。本發明 斤稱之冷側係指致冷晶片上吸熱之一側，熱側係指放熱之 —偵卜 ”、 於一較佳實施例中，致冷晶 …M ^ i 丄 、 =位於一殼體100内。殼體100分隔出第一空間1〇〇a ㈣二空严曰1 100b，第一空間l00a具有一第—進氣口膨 與—冷氣出口 1〇4,第二空間具有一第二進氣口 1〇孔盥一 熱氣出:1〇6,其中第一進氣口 102a位於冷氣出口 1〇4之 上方，弟二進氣口 l〇2b位於熱氣出口 1〇6上方。 1279666 致冷晶片120之冷侧220a_合連接-第-散熱片 122’例如為一金屬散熱片’或較佳為—鋁質散熱片，第一 散熱片122冑冷側220a冷卻，並與熱源流體進行執交換。 第一導流裝置11Ga設置於第-進氣〇 lG2a^，包含一第 :風扇U2a，係連接於一馬達114，第—風扇仙係吹向 设體100内。The /1〇b is located beside the second air inlet 102b for guiding the external environmental fluid from the second air inlet port 1〇2b into the casing 1 to perform a heat exchange. The cold side of the present invention refers to one side of the heat absorption on the cooled wafer, and the hot side refers to the heat release. In a preferred embodiment, the cooling crystal...M ^ i 丄, = is located in a shell In the body 100, the housing 100 separates the first space 1〇〇a (4) and the second air 曰1 100b, the first space l00a has a first air inlet and a cold air outlet 1〇4, and the second space has a first space The two air inlets 1 〇 盥 热 热 热 热 热 : : : , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , 1 1 1 1 1 The cold side 220a of the cold wafer 120 is connected to the first heat sink 122', for example, a metal heat sink or preferably an aluminum heat sink, and the first heat sink 122 is cooled by the cold side 220a and is in contact with the heat source fluid. The first flow guiding device 11Ga is disposed in the first air inlet 〇1G2a, and includes a first fan: a fan U2a connected to a motor 114, and the first fan is blown into the installation body 100.
熱傳導至該第二散熱片126,其中第二散熱片126位於熱氣 出口 106旁。較佳地，第二側124b面積大於第一側， 一導熱體m具有-第-側124#_第二側i24b，第 側124a耦合於致冷晶片12〇之熱側12〇b，第二側12仆 與-第二散熱片m麵合，導熱體124用以把熱侧麗之 以加快傳熱速度。導熱冑124例如為_金屬導熱體，或較 佳為一鋁質導熱體。 第二導流裝置110b使用一第二風扇U2b，在馬達114 與第一風扇112a相接之另一側，馬達114同時連接第二風 羽112b ’共用馬達114節省了額外的驅動裳置需求。第二 風扇112b係設置於第二進氣口 102b旁，並吹向殼體1〇〇 内，用以導引外部環境之流體進入殼體1〇〇，與第二散熱片 126進行熱交換。 當本發明之具有冷熱交換功能之散熱裝置使用於一電 腦系統時，第一進氣口 1〇2&係朝向電腦系統之機殼内部， 而第一進氣口 1 〇2b係朝向外部環境。首先，馬達114同時 驅動第一風扇U2a與第二風扇U2b，來自機殼内之一熱流 體文第一風扇112a之吸取，經由第一進氣口 i〇2a進入殼 體100内。 9 1279666 提供一電壓使致冷晶η 日日片I20運作。冷側120a因為是一 吸熱端，因此第一散埶H m， 尺 … 2受到冷卻，溫度下降。而熱 源々IL體流經第一散熱片丨22卑 … ^ 2時將進仃熱交換，因此當此埶 源 體自冷氣出口 104流出Μ妒】ηη … 、 机出设體10〇至機殼内時，為一低 溫之流體，此低溫之流_ ώ - -體-入機设内部再進一步進行熱交 換，達到冷部電腦系統内部之效果。 而致冷晶片120之熱側職因為是一放熱端，經由導 24快速地把熱量傳導至第二散熱片126,同時，藉由 第二風扇mb抽取外部環境流體，自第二進氣口曰Heat is conducted to the second fin 126, wherein the second fin 126 is located beside the hot gas outlet 106. Preferably, the second side 124b has a larger area than the first side, a heat conductor m has a -first side 124#_second side i24b, and the first side 124a is coupled to the hot side 12〇b of the chilled wafer 12, second The side 12 servant and the second heat sink m face each other, and the heat conductor 124 is used to heat the hot side to accelerate the heat transfer speed. The thermal conductive crucible 124 is, for example, a metal thermal conductor or, preferably, an aluminum thermal conductor. The second flow guiding device 110b uses a second fan U2b. On the other side of the motor 114 that is in contact with the first fan 112a, the motor 114 is simultaneously coupled to the second wind feather 112b. The common motor 114 saves additional drive slack requirements. The second fan 112b is disposed beside the second air inlet 102b and blows into the casing 1b to guide the fluid of the external environment into the casing 1 to exchange heat with the second fins 126. When the heat sink having the cold heat exchange function of the present invention is used in a computer system, the first air inlet 1 〇 2 & is oriented toward the inside of the casing of the computer system, and the first air inlet 1 〇 2b is oriented toward the external environment. First, the motor 114 simultaneously drives the first fan U2a and the second fan U2b, and the heat from the first heat fan 112a in the casing is sucked into the casing 100 via the first air inlet i2a. 9 1279666 provides a voltage to make the cold crystal η day film I20 operate. Since the cold side 120a is a heat absorbing end, the first divergence H m , the scale 2 is cooled, and the temperature is lowered. When the heat source 々IL body flows through the first heat sink 丨22 ^... ^ 2 will heat exchange, so when the 埶 source body flows out from the cold air outlet 104 η ηη ... , the machine outlet body 10 〇 to the casing Inside, it is a low-temperature fluid, and the low-temperature flow _ ώ - - body - into the machine to further heat exchange, to achieve the effect of the internal part of the computer system. The hot side of the cooled wafer 120 is a heat release end, and the heat is quickly conducted to the second heat sink 126 via the guide 24, while the external air fluid is extracted by the second fan mb from the second air inlet.
入殼體100内，流經箆-埤舳μ ;,L 工弟一政熱片126進行熱交換，將第二 散熱片126上之熱量帶去，姑 者從…、氣出口 106排出殼體 100 外。 藉由上述之冷側120a負責電腦系統内部流體之冷卻， 而熱側隱亦藉由第二導流裝置_以及第二散W126 之散熱機制，將熱量適時排放至外部環境，如此構成一且 有冷熱交換功能及致冷效果之冷熱交換系統。 - 於本貫施例中，較佳地，在第一空間與第二空 放置隔熱物質140’例如填充隔熱泡絲於其間，提：二隔‘ 功能於第一空間盥第-*門夕„ ^ 4. . m^ 、弟一工間之間’保持較佳的裝置運作環 境。 具有冷熱交換功能之散熱裝置更包含—電路控制板 170,具有不同功能之輸出指示燈17〇3至i7〇c。第一浐示 燈二術為一預備指示燈，表示散熱裝置處於運作前之^ 狀態（stand by)，第二指示燈17〇b表示裝置處於運作狀態， 第三指示燈17〇c為一過熱警示燈’當裝置排熱端異常厂無 1279666 法正常散熱或散熱不及時，第三指示燈170c發出訊號。開 關160用以控制散熱裝置之啟動。 參考第4圖，其繪示依照本發明之具有冷熱交換功能 之散熱裝置一較佳實施例的溫度控制系統之示意圖。於本 實施例中，更可於電腦系統内裝設一溫度感測器4〇2，例如 致冷晶片410之冷侧附近，且電性連接一調整器4〇4，用以 監控系統内部之環境溫度，將溫度監控訊號傳送至調整器 404。調整器404電性連接於直流電壓轉換器4〇6，其中直 流電壓轉換器406係與致冷晶片41〇電性連接，用Z控制 致冷晶片41G之-輸人電壓，例如將12v直流輸人電壓轉 換成3V至12V，並將轉換後之電壓輸送至致冷晶片41〇, 可調整致冷晶片410之功率效能。 藉由加入溫度感測器、調整器’構成一s度控制系統。 調整器根據溫度感測器傳回之監控訊號，傳送—調整訊號 至直流電壓轉換器，進行致冷晶片電壓之調控，進而達至; 控制冷卻溫度之恆溫目的，例如將系統内外溫差控制於約5 至8度内’如此也避免當系統内部溫度驟然降低，使系統 内外溫差過高可能遭遇露點產生之問題，造成元件損害。 :考第3A與第3B圖’其分別繪示依照本發明之具有 冷熱交換魏之散鮮、置—較㈣施财的導料上視圖 與側視圖。於上述較佳實施例中，更包含-導流罩300,主 要包含一伸縮部302與一固定邱η〜 ^ ^ 疋邛304。固定部304耦合固定 於散熱裝置之第一進氣口之外 卞义u m H 例如以螺絲鎖附或黏貼 方式。利用此導流罩300之可從从从μ -h 41.^ I伸特性’將伸縮部302拉 到所欲加強排熱之位置，集中 次取熟源流體。導流罩3〇〇 1279666 亦可裝設於冷氣出口之外側，用以導引經冷卻之流體較為 集中地流至欲冷卻之位置。 參考第2A至2D圖。第2A至2C圖係繪示依照本發明 之具有冷熱交換功能之散熱裝置另一較佳實施例的前視 圖、上視圖與側視圖。第2D圖係繪示第2 A圖之剖面圖。 在本發明之另一實施例中，第一風扇與第二風扇使用軸流 式風扇。 一致冷晶片220與導流裝置210a、210b裝設於一殼體 200内。殼體200包含第一空間200a與第二空間200b。第 一空間200a具有一第一進氣口 202a與一冷氣出口 204，第 二空間200b具有一第二進氣口 202b與一熱氣出口 206。第 一進氣口 202a位置係在相對於冷氣出口 204之下方，第二 進氣口 202b位置係在相對於熱氣出口 206之下方。 致冷晶片220之冷側220a與一第一散熱片222耦合， 熱側220b與一導熱體224之第一側224a耦合，導熱體224 之第二側224b則耦合於一第二散熱片226。第一導流裝置 210a包含一第一軸流風扇212a與一馬達214，第二導流裝 置210b包含一第二轴流風扇212b與馬達214。 當軸流風扇212a、212b同時受馬達214驅動運轉時， 由第一進氣口 202a進入之熱流體往上流動，途中經過第一 散熱片222而進行熱交換，接著從冷氣出口 204排出。同 樣地，外部環境之流體則由第二進氣口 202b進入向上流 動，途中經過第二散熱片226而進行熱交換，再從熱氣出 口 206排出，構成一冷熱交換交換系統。 本實施例中包含一電路控制板270，具有第一指示燈 12 l279666 27〇a，係為一預備指示燈、第二指示燈270b，表示裝置處 於運作狀態，以及第三指示燈270c，為一過熱警示燈。 因為在第1A圖之實施例中，散熱裝置之厚度包含第一 散熱片、第二散熱片及導熱體之總厚度，而本實施例之散 熱裳置在厚度上只相關於其中一元件之厚度，因此本實施 例之散熱裝置具有較小的厚度。 參考第5圖’其繪示依照本發明之具有冷熱交換功能 之散熱裝置另一較佳實施例的溼度控制系統之示意圖。本 發明之散熱裝置更包含一溼度感測裝置502,例如為一相對 濕度感測晶片，設置於系統中溫度較低位置，例如貼附於 致冷晶片510冷測表面。一調節單元52〇與溼度感測裝置 502以及致冷晶片510電性連結，用以控制與調節致冷晶片 510之輸出功率。 當環境的相對溼度達100%時即有露點效應產生，且環 境溫度越低，露點溫度也相對較低。因此利用溼度感測裝 置502偵測整個系統中較冷位置，會獲得較合理的系統資 訊。 ' 調節單it 520包含-調整器504與一直流電壓轉換器 506,直流電壓轉換器506電性連接致冷晶片51〇，傳輸一 供給電壓於致冷晶片510,調整器504電性連接直流電壓轉 換器506以及溼度感測裝置5〇2。溼度感測裝置5〇2在獲得 較冷位置之溼度資訊後，以訊號方式將此資訊傳送至 器504,調整器504依據傳回之溼度監控訊號，傳送一溼度 調整訊號給直流電壓轉換器5〇6，以控制致冷晶片51〇的輸 出功率。預設一溼度臨界值，例如相對溼度9〇%至， 13 1279666 當偵測到之m度超過此臨界值，調整^ 5G4便運作調降供 給致：晶片510之電壓’以減少致冷晶片51〇的輪出功率 以及溫降效能，以免溫度過低到達露點溫度。 由上述本發明較佳實施例可知，應用本發明具有下列 優點：本發明之具有冷熱交換功能之散歸置利用致冷晶 片之效應，以致冷晶片吸熱端提供致冷效果，並輔以導流 裝置之•又叶，加強流體之強制流動，達到較佳致冷效果。 而放熱端藉由另一導流裝置加強排熱之效果。本發明之裝 置屏除傳統散熱風扇以環境溫度來進行散熱的方式，而是 以低於環境溫度的適當溫度（為避免露點的產生）來進行= 熱’亦即利用溫m度感測裝置監控並調整致冷晶片輸出功 率，以防止露點效應產生以及控制系統所欲之恆定溫度， 並將熱端完全隔絕在系統的外部，而制快速且均句的 熱目的。 同時，本發明應用於各式電子設備上，例如桌上型電 腦系統機殼、筆記型電腦、投影機、音響或其他有散熱需 求之電器或電子儀器設備等機殼上’具有極佳的散熱效 果，最大散熱平衡溫度不再受限於外部環境溫度，解決了 傳統之風扇散熱裝置所遭遇的困難。利 -選擇性’可加強特定熱源流體之吸取， 特疋位置之冷卻，以配合不同使用環境之需求。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作各種之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 1279666 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第1A、1B圖係分別繪示依照本發明之具有冷熱交換 功能之散熱裝置一較佳實施例的前視圖與後視圖。 第1C圖係繪示第ία圖之側剖面圖。 第2A至2C圖係分別繪示依照本發明之具有冷熱交換 功能之散熱裝置另一較佳實施例的前視圖、上視圖與側視 圖。 第2D圖係繪示第2A圖之剖面圖。 第3 A與第3B圖係分別繪示依照本發明之具有冷熱交 換功能之散熱裝置一較佳實施例中的導流罩上視與側視 圖。 第4圖係繪示依照本發明之具有冷熱交換功能之散熱 裝置一較佳實施例的溫度控制系統之示意圖。 第5圖係繪示依照本發明之具有冷熱交換功能之散熱 裝置一較佳實施例的溼度控制系統之示意圖。 【主要元件符號說明】 100a、200a :第一空間 l〇2a、202a:第—進氣口 104、204 :冷氣出口 ll〇a、2i〇a:第—導流裝置 100、200 :殼體 100b、200b ··第二空間 102b、202b :第二進氣口 106、206 :熱氣出口 1279666 110b、210b :第二導流裝置112a、212a :第一風扇 112b、212b :第二風扇 120、220 :致冷晶片 120b、220b :熱側 124、224 :導熱體 124b、224b ··第二側 140、240 :隔熱物質 170、270 :電路控制板 170b、270b :第二指示燈 402 ··溫度感測器 406 :直流電壓轉換器 502 :溼度感測裝置 5 0 6 :直流電壓轉換器 520 :調節單元 114、214 :馬達 120a、220a :冷側 122、222 :第一散熱片 124a、224a :第一側 126、226 :第二散熱片 160 、 260 :開關 170a、270a :第一指示燈 170c、270c :第三指示燈 404 :調整器 410 :致冷晶片 504 :調整器 510 :致冷晶片 16Into the housing 100, flowing through the 箆-埤舳μ;, L, the brother-and-political heat sheet 126 for heat exchange, the heat on the second heat sink 126 is taken away, the former is discharged from the air outlet 106 100 outside. The cold side 120a is responsible for the cooling of the internal fluid of the computer system, and the thermal side also discharges the heat to the external environment in a timely manner by the heat dissipation mechanism of the second flow guiding device _ and the second diffusion W 126, thus forming one and Cold and heat exchange system with cold heat exchange function and cooling effect. In the present embodiment, preferably, the insulating material 140' is placed in the first space and the second space, for example, filled with a heat insulating bubble, and the second space is provided in the first space.夕 „ ^ 4. . m ^ , between the brothers to 'maintain a better device operating environment. The heat sink with hot and cold exchange function further includes - circuit control board 170, with different function of the output indicator 17 〇 3 to I7〇c. The first indicator light is a preliminary indicator light indicating that the heat sink is in front of the operation (stand by), the second indicator light 17〇b indicates that the device is in operation, and the third indicator light is 17〇 c is an overheat warning light. 'When the device exhaust heat is abnormal, the factory does not have the 1279666 method for normal heat dissipation or heat dissipation. The third indicator light 170c sends a signal. The switch 160 is used to control the start of the heat dissipation device. Referring to Fig. 4, it is shown A schematic diagram of a temperature control system of a preferred embodiment of a heat sink having a cold heat exchange function according to the present invention. In this embodiment, a temperature sensor 4〇2, such as a cooled wafer, is further disposed in the computer system. Near the cold side of 410, and electrical A regulator 4〇4 is connected to monitor the ambient temperature inside the system, and the temperature monitoring signal is transmitted to the regulator 404. The regulator 404 is electrically connected to the DC voltage converter 4〇6, wherein the DC voltage converter 406 is coupled to The cooling chip 41 is electrically connected, and the input voltage of the cooled wafer 41G is controlled by Z, for example, the 12V DC input voltage is converted into 3V to 12V, and the converted voltage is supplied to the cooling chip 41〇. Adjusting the power performance of the cooling chip 410. By adding a temperature sensor and a regulator, a s degree control system is formed. The regulator transmits and adjusts the signal to the DC voltage converter according to the monitoring signal returned by the temperature sensor. The regulation of the temperature of the cooled wafer is carried out; the purpose of controlling the temperature of the cooling temperature is, for example, controlling the temperature difference between the inside and the outside of the system to be within about 5 to 8 degrees. This also avoids a sudden drop in the internal temperature of the system, so that the temperature difference between the inside and the outside of the system may be too high. Suffering from the problem of dew point, causing component damage. : Tests 3A and 3B's respectively show the guides with the hot and cold exchange of the heat and cold exchange, the set-by-four (four) wealth management according to the present invention. The view and the side view. In the above preferred embodiment, the flow guide cover 300 further includes a telescopic portion 302 and a fixing portion η 〜 〜 ^ 304. The fixing portion 304 is coupled and fixed to the first heat dissipating device. Outside the air inlet, 卞H, for example, is screwed or glued. With this shroud 300, the telescopic portion 302 can be pulled from the μ-h 41. In the position, the source fluid is collected in a concentrated manner. The shroud 3〇〇1279666 can also be installed on the outer side of the cold air outlet to guide the cooled fluid to flow more concentratedly to the position to be cooled. References 2A to 2D 2A to 2C are front, top and side views showing another preferred embodiment of a heat sink having a cold heat exchange function in accordance with the present invention. Figure 2D is a cross-sectional view of Figure 2A. In another embodiment of the invention, the first fan and the second fan use an axial fan. The uniform cold wafer 220 and the flow guiding devices 210a, 210b are mounted in a housing 200. The housing 200 includes a first space 200a and a second space 200b. The first space 200a has a first air inlet 202a and a cold air outlet 204, and the second space 200b has a second air inlet 202b and a hot air outlet 206. The first air inlet 202a is positioned below the cold air outlet 204 and the second air inlet 202b is positioned below the hot air outlet 206. The cold side 220a of the cooled wafer 220 is coupled to a first heat sink 222, the hot side 220b is coupled to the first side 224a of the heat conductor 224, and the second side 224b of the heat conductor 224 is coupled to a second heat sink 226. The first flow guiding device 210a includes a first axial flow fan 212a and a motor 214, and the second flow guiding device 210b includes a second axial flow fan 212b and a motor 214. When the axial fans 212a, 212b are simultaneously driven by the motor 214, the hot fluid entering from the first intake port 202a flows upward, passes through the first fins 222 to exchange heat, and is then discharged from the cold air outlet 204. Similarly, the fluid of the external environment enters the upward flow from the second air inlet 202b, passes through the second heat sink 226 for heat exchange, and is discharged from the hot gas outlet 206 to form a cold heat exchange system. The embodiment includes a circuit control board 270 having a first indicator light 12 l279666 27〇a, which is a preliminary indicator light, a second indicator light 270b, indicating that the device is in operation, and a third indicator light 270c. Overheat warning light. In the embodiment of FIG. 1A, the thickness of the heat dissipating device includes the total thickness of the first fin, the second fin, and the heat conductor, and the heat sink of the embodiment is only related to the thickness of one of the components. Therefore, the heat sink of the embodiment has a small thickness. Referring to Figure 5, there is shown a schematic diagram of a humidity control system in accordance with another preferred embodiment of a heat sink having a cold heat exchange function in accordance with the present invention. The heat sink of the present invention further includes a humidity sensing device 502, such as a relative humidity sensing wafer, disposed at a lower temperature in the system, such as attached to the cold sensing surface of the cooled wafer 510. An adjustment unit 52 is electrically coupled to the humidity sensing device 502 and the cooling wafer 510 for controlling and regulating the output power of the cooled wafer 510. When the relative humidity of the environment reaches 100%, the dew point effect occurs, and the lower the ambient temperature, the lower the dew point temperature. Therefore, the humidity sensing device 502 is used to detect a colder position in the entire system, and a more reasonable system information is obtained. The adjustment unit 520 includes a regulator 504 and a DC voltage converter 506. The DC voltage converter 506 is electrically connected to the cooling chip 51A, and a supply voltage is transmitted to the cooling wafer 510. The regulator 504 is electrically connected to the DC voltage. Converter 506 and humidity sensing device 5〇2. The humidity sensing device 5〇2 transmits the information to the device 504 after receiving the humidity information in the cold position, and the adjuster 504 transmits a humidity adjustment signal to the DC voltage converter 5 according to the returned humidity monitoring signal. 〇6 to control the output power of the cooled wafer 51〇. Presetting a humidity threshold, such as a relative humidity of 9〇%, 13 1279666. When the detected m degree exceeds the threshold, the adjustment ^ 5G4 operates to decrease the supply voltage of the wafer 510 to reduce the cooling wafer 51. The turn-off power and temperature drop performance of the crucible to prevent the temperature from reaching the dew point temperature too low. It can be seen from the above preferred embodiments of the present invention that the application of the present invention has the following advantages: the hollow placement of the cold heat exchange function of the present invention utilizes the effect of the cooled wafer, so that the cold end of the cold wafer provides a cooling effect and is supplemented by a diversion flow. The device and the leaf further enhance the forced flow of the fluid to achieve a better cooling effect. The heat release end enhances the effect of heat removal by another flow guiding device. The device screen of the present invention performs the heat dissipation method at the ambient temperature in addition to the conventional heat dissipation fan, but performs the temperature at a suitable temperature lower than the ambient temperature (to avoid the occurrence of the dew point) = heat, that is, is monitored by the temperature m-degree sensing device. Adjust the output power of the cooled wafer to prevent the dew point effect from occurring and to control the constant temperature desired by the system, and to completely isolate the hot end from the outside of the system for a fast and uniform heating purpose. At the same time, the present invention is applied to various electronic devices, such as a desktop computer system case, a notebook computer, a projector, an audio or other electrical device or electronic equipment having heat dissipation requirements, and has excellent heat dissipation. The result is that the maximum heat balance temperature is no longer limited by the external ambient temperature, which solves the difficulties encountered by conventional fan heat sinks. The selectivity-selectivity enhances the extraction of specific heat source fluids and the cooling of specific locations to suit the needs of different environments. While the present invention has been described above by way of a preferred embodiment, it is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; A front view and a rear view of a preferred embodiment of a heat sink having a cold heat exchange function. Figure 1C is a side cross-sectional view showing the ία diagram. 2A to 2C are respectively a front view, a top view and a side view showing another preferred embodiment of the heat sink having the cold heat exchange function according to the present invention. Fig. 2D is a cross-sectional view showing Fig. 2A. 3A and 3B are respectively a top and side views of a shroud in a preferred embodiment of a heat sink having a cold and heat exchange function in accordance with the present invention. Figure 4 is a schematic illustration of a temperature control system in accordance with a preferred embodiment of a heat sink having a cold heat exchange function in accordance with the present invention. Figure 5 is a schematic view showing a humidity control system of a preferred embodiment of a heat sink having a cold heat exchange function in accordance with the present invention. [Main component symbol description] 100a, 200a: first space l〇2a, 202a: first air inlet 104, 204: cold air outlet ll〇a, 2i〇a: first-flow guiding device 100, 200: housing 100b 200b · second space 102b, 202b: second air inlets 106, 206: hot gas outlets 1279666 110b, 210b: second flow guiding devices 112a, 212a: first fans 112b, 212b: second fans 120, 220: Cooling wafers 120b, 220b: hot side 124, 224: heat conductors 124b, 224b · second side 140, 240: heat insulating material 170, 270: circuit control board 170b, 270b: second indicator light 402 · · temperature sense 406: DC voltage converter 502: humidity sensing device 5 0 6 : DC voltage converter 520: regulating unit 114, 214: motor 120a, 220a: cold side 122, 222: first heat sink 124a, 224a: One side 126, 226: second heat sink 160, 260: switch 170a, 270a: first indicator light 170c, 270c: third indicator light 404: adjuster 410: cooling chip 504: adjuster 510: cooling chip 16