TWI278974B - Having notch to reduce warpage of electronic device - Google Patents

Abstract

The present invention discloses the technology to effectively decrease the stress generated from the differences of thermal expansion coefficients between each part of the electronic component. For instance, the stress is generated from the differences of the thermal expansion coefficients among the protector (or so-called the molding compound/package material), the portion of circuits, or the other parts during the temperature change. The present invention is characterized that there exists a recess on the surface of the protector to cover an article to effectively absorb the stress generated from the differences of thermal expansion coefficients among the said article, the protector, or other devices during temperature change, so that the situation of warpage of electronic device during packaging process can be effectively reduced.

Description

1278974 —一·_ V. INSTRUCTIONS (1) Field of the Invention The present invention relates to a technique that effectively reduces, warm sound: inner body (for example, commonly known as a packaging material or packaging material "), electricity: Γ元5, he The stress generated by the difference in thermal expansion coefficient between the parts and the like 峥Invented background: (Fancy dress: the generation is the protective material Λ ' and the case is said to be u ^, and the field poetry (1) In the process of manufacturing the product: = curvature phenomenon. The amount of warpage of the electronic assembly is too large, and the wafer inside the wafer and the solder ball outside the structure are peeled off, so how to avoid the excessive curvature of the electronic assembly, One m: Gan 2 mechanical behavior is the most difficult to predict, causing research difficulties. The reason is that the structural material oblique gas ^m ^ Μ Ίτ ^ . is still a sub-material, in the heating process due to the v-degree close to its softening point It is difficult to predict the 暮丝德化. How to have it; the situation of the mechanical properties of the south molecular material becomes an important and key technical issue in the packaging process of the sub-assembly. The technology of the appearance, not only can use the 丨 丨 θ body ' and not Limited to the size of electronic components and electronic components, it is a kind of square temple, practical, and low-cost electronic structure. Page 4,127,794. V. Invention description (2) Curve improvement technology β Current technical overview: To solve the problem of the surface distortion caused by the electronic package in the packaging process, Robin A. Shaq and Jans W. Wilson have published a national patent (Announcement No.: 424285, Announcement Date 2001, the name is: A method and apparatus for balancing the difference in thermal expansion in an electronic package) utilizing a layer of thermoplastic between the underfill and the substrate to reduce the coefficient of thermal expansion of the wafer from the coefficient of thermal expansion of at least one other component of the package The difference is that this method is mainly applied to flip chip (Flip — Chip) packaging. Tang Weisen et al. in the national patent (publication number: 388976, announcement date 2000, patent name: semiconductor package with full exposed heat sink In the case of the full-expansion heat sink packaging method, there is also a function for the plastic ball grid array electronic package (PBGA) to reduce the warp, but The complexity of the technology reduces its practical value. Period 199^1(4) (Announcement No.: 368186 'Announcement of the Japanese Set) mentioned in the ΛΓ/called: reduced surface semiconductor sealant appearance and its manufacturing equipment ίί 'Using the change of packaging material appearance To reduce the shape of the package to strengthen its knots, the technology of wood reduction, the change of the coefficient of warp, the pure resistance (four) the material itself, the thermal expansion of the knee protrusion type 2" It is easy to use. ^ The description of the invention is not invented with other parts groups. Page 5 1218794

ϊ V. Inventive Note (4) Materials, PBGA (Plastic Ball Grid Array) As shown in Figure 1, PBGA (Plastic Ball Grid Array) 70 pieces as an example of the wafer! The circuit board 2, and the structure of the material are in the environment of high temperature and high temperature. One is the tin ball in the electricity:::: when the sub-assembly is placed on the upper plate of the sub-assembly product. In these two phases, when the time is one, the temperature is as high as 230. The environment of C, casting wedge irrigation f, the product must pass 193. C, therefore, the mold conversion vinegar is bound to be "who must change the temperature of the broken glass is U. This mold filling Sa will inevitably enter the nonlinear plastic deformation zone, and the tortoise product of the Leizi product will be born. The present invention: for example, mold irrigation The outer surface of the protective body such as an ester includes at least one recess such as a land type, a cross type, and a straight five hole. In addition, one of the representative examples of the specific technology of the present invention is an electronic element 'including At least one integrated circuit; a carrier for supporting the integrated circuit; and a protective body (for example, commonly referred to as a packaging material or packaging material) for covering the integrated circuit, and at least one of the carrier In part, the surface of the protective body includes at least one recess to reduce stress caused by temperature changes of the electronic component. In the above electronic component, the integrated circuit may be a wafer containing electrons formed by the semiconductor material. a circuit; the carrier may be a substrate, or a lead frame, or a tape (Tape); the carrier may also serve as a mechanical connection or electrical connection for the integrated circuit; and the recess of the protective body can In the central region of the surface of the protective body. In the above electronic component, the electronic component is subjected to temperature change, and 12897794. 5. The invention (5) stress is derived from the difference in thermal expansion coefficient of each part. For example, the integrated circuit The difference in thermal expansion coefficient of the protective body, the difference in thermal expansion coefficient between the carrier and the protective body, the difference in thermal expansion coefficient between the carrier and the integrated circuit, and the like may of course come from the integrated circuit. The thermal expansion coefficients of the protective body, the carrier, and the like are different from each other. In the above electronic component, the concave surface of the protective body may be two linear concaves and intersect each other in a cross shape, and the two linear depressions are respectively parallel. The two edges of the protective body are adjacent to each other. The surface of the protective body may be open at four corners and include two recesses respectively parallel to (or included in) two diagonal lines of the quadrilateral. The surface of the protective body may also be square and include two depressions that are respectively parallel to (or included in) the two diagonals of the square. The depression of the surface of the body may also be two: a hole 'one of the plurality of holes is located at the first place, and the other holes are located at: the position of the first position is symmetrically arranged with respect to the first position; ^ The concave surface of the protective body includes five concave holes, wherein: the second position: the second position, the other four are located around the first position, and are arranged in a cross shape with respect to the first position. In the electronic component, the device for forming the protection may also be a type of reduction, and the body of the scorpion is usually composed of a polymer (4). The encapsulation (encaqing 1ant). The surface of the protective body may be applied to the surface of the protective body: or may be formed by the structure of the mold used for the pound mold vinegar to form the electronic component. The carrier may include at least one connecting portion 1278794.丨·丨...... V. Description of the invention (6) The bit is used to mechanically or electrically connect the integrated circuit, and the protective body covers the integrated circuit and the connection portion to seal the integrated circuit And the connection site. As can be seen from the above description, the invention of the present invention is characterized in that the surface of the protective body covering an object (for example, a material commonly known as a packaging material or a packaging material) has a depression to effectively reduce the object, the protective body, and the temperature when the temperature changes. Or the stress generated by the difference in thermal expansion coefficient between his device and the like. 1. Since the features of the invention of the present invention are as described above, the surface of the protective body covering an object has a depression to effectively reduce the difference in thermal expansion coefficient between the object and the protective body when the temperature changes. The concrete representation of the invention may be another electronic component, an object, the object comprising at least one integrated circuit, and a protective body covering at least one of the objects == at least A recess to reduce the stress β that the electronic component is subjected to and to double the object itself may be an integrated circuit, or the carrier and the integrated circuit body, the carrier is used for: The product can also be used for mechanical connection or electrical connection. The integrated circuit protector can cover only the integrated circuit, or can simultaneously ===guarantee, and at least a part of the carrier. The lithographic diagram of the detailed description of the integrated circuit is shown in Fig. 1. The PBGA (plastic ball grid array) electronic component is basically the same. Page 9 1218794 ------ V. Description of invention (7) For the protection of the circuit • (4) (such as the shape of the curved mold to cover the shape of the cross-shaped groove; fresh mold and vinegar):: does not appear as the integrated circuit surface contains the cross-shaped groove. 埼The model of the mold-filled ester and the like is an integrated circuit (protective body (the external surface contains a five-hole straight hole; the mold vinegar and the like)::: the person is a protective body (for example) Commonly known as the structure of the material or map; when the child is in the depression, the simulated image is simulated after the simulated heating process and = the non-existing is the protective body (for example, when the structure is called the presence of the depression, the simulation is repeated after the reheating process) The fabrics are not shown as protective bodies (for example, commonly known as structural materials, when there are cruciform depressions, the test piece is in the simulation I package), the image and phase diagram; Experimental shadow protection Γ such as commonly known as packaging materials or packaging materials) Table curve ...: ... when the depression, the test piece is simulated (Iv) When the heating process is protected by Ξ = (e.g. commonly known configuration by packaging material or packaging material) table depression, a test strip Movies experiment and phase diagrams in the simulation process further heated;

= When the scholar is a protective body (for example, a member called a structural material or a packaging material), when the test piece is recessed, the test piece is simulated after the reheating process, and the charm is 3D.

Figure 11 shows the image of the straight surface of the protective surface, such as the commonly used structure or packaging material. Image and phase diagram; & the test piece after the simulated reheating process experiment & For the material or packaging material) The test piece is warped after the simulated reheating process. Figure 12 shows the rabbit only #Main & six + 士 is the lean body (the 3D surface map when there is a straight five-hole depression on the surface). BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 Integral circuit 2 carrier 3 protector 20 mold filling and ester forming device (protective body) 21 linear recess 22 straight recess 22 protective body (or its surface) an edge 24 protector (or An edge 30 of the surface of the mold is formed by a device for casting a resin (protective body) 31 a linear depression 32 a linear depression 40 a device for forming a mold filling (protective body) 41 position of one of five pits 42 Position of the second hole 4 3 position of three of the five holes 44 position of the four four holes

1278974

The position of the five five-holes of the present invention: The technical description of the invention: the machining method or the change of the mold design, the design of the organizer, especially the design of the _____.

The electron-constructing body of the present invention reduces the shape of the mold, such as mold-filling, such as cross-type, cross-type and straight-line two, showing the integrated circuit such as processing mode formation; FIG. The protective body of the integrated circuit, such as a mold-filled ester, contains a pit having a straight cross five holes (for example, formed by machining). In general, the current electronic components such as mold-filled esters have a flat surface, and in this case, the design of the groove of the external surface protects the warping behavior of the protective body of the electronic component at a high temperature. The stress generated by the thermal expansion is released from the groove, and the amount of warpage of the electronic component is reduced to achieve a more perfect electronic component product quality. The mechanical processing method can effectively reduce the stress remaining in the structure 后 after the structure is deformed by external force. The blind hole method is one of them. According to the concept and principle of the blind hole method, we can use a machining method such as cutting to machine a small groove outside the protective body such as mold filling, so that the amount of warpage generated when the protective body is heated and heated is effective. cut back. In order to measure and compare the situation and effect of stress release at high temperature after mechanical processing, according to the invention, using mechanical processing,

Page 12 1278974

V. INSTRUCTIONS Gl) Body, / Mountain + The stress caused by nonlinear expansion under temperature is released. The groove with a cross-shaped lock has the greatest effect. The detailed description of Mingji: Ref: Figure:::: Two U four, etc. Illustrate the explosion diagram of the case, in which the electronic component of the carrier f A (plastic ball grid array) is commonly known as the construction material m circuit 1; The protective body 3 (for example, the protective body 3 can be detached as shown in FIG. 2; = 21, 22 are linear and intersect each other as ΐ": Side: 23 ί type protection device: the protective body of the Γ 3 (The mold filling ester is formed into a shape of four ^ itiri, but the surface of the protective body 3 is not necessarily the protective body 3 or a shape such as a square shape. The protective device 30, the decoration; the total one of the mold irrigation The protective device 30' formed by vinegar has a quadrangular shape and includes 32, and the two linear recesses are considered to be 3 and the two diagonal corners of the depression 31 are parallel to or include the quadrilateral=3. The surface of the body that can be attached can also be shown as (4) the protective device formed by the mold vinegar = Jit: the depression is five concave, the five concave holes - 1, and the other concave holes are located at the first 42, 43 44, 45, etc., the surrounding column of the matching position 41. Although the protective body ', the first position 41 shown in Fig. 4 is a cross-shaped man-made body d ( Protection device for mold filling and esterification 1278974

V. Description of invention (12) 4 22 is (five: concave hole, but the essence of the invention according to the present invention is not necessarily as shown in Figure 4, and the arrangement of J:" is not necessarily limited 'but symmetrical Arrangement (Fact? 'The position of the concave mesh, the other located at the first Mj, χ, around the first place, relative to the first position: the stress generated by the temperature change The absorption effect is better. t = Ϊ Γ The absorption effect of the stress generated by the change of the brewing degree is also better. y The integrated circuit 1 can be a wafer containing a semiconductor material: the ΐ f Ϊ T circuit; The device 2 can be a substrate, or a wire object, which can serve as a domain for mechanical connection or electrical connection. The depression of the protection body can be located in the 70 pieces of the electrons of the protection. The stress that is subjected to temperature change; the difference in thermal expansion coefficient of each part. For example, the difference between the thermal expansion coefficient of the integrated circuit 1 and the protective body 3, the difference between the carrier 2 and the protective body 3 = thermal expansion coefficient, The difference between the carrier 2 and the thermal expansion system of the integrated circuit i, etc., may of course come from The thermal expansion coefficients of the integrated circuit 1, the protective body 3, the fixture 2, and the like are different from each other. ' ^ In the electronic component shown in Fig. 2, the protective body 3 does not have to be a mold-filled ester. The device can also be an encapsulation (encapsulaM).

Page 15 1278974 V Description of Invention (13) The body 3 usually contains a polymer material. Since the feature of the invention of the present invention is as described above, the surface of the protective body covering an object has a depression to effectively reduce the stress generated by the difference in thermal expansion coefficient between the object and the protective body when the temperature changes. It is obvious that the inventive technique of the present invention can also be applied to an electronic component that does not include a carrier or a carrier and an integrated circuit. For example, an electronic component includes: Although the drawing does not show a connecting portion for mechanically connecting or electrically connecting the integrated circuit, those skilled in the art know that the carrier can be used to form a connecting portion. The protective circuit is preferably provided by mechanically or electrically connecting the integrated circuit and the right protecting body covers the integrated circuit and the connecting portion to seal the two-body circuit and the connecting portion. Those skilled in the relevant art also know that the recesses of the protective bodies 20, 30, 40, etc. shown in Fig. 2, Fig. 3 and Fig. 4 may be mechanically processed on the surface of the protective body, or may be filled by a mold. The structure of the mold used for the ester is formed. An object comprising at least one integrated circuit, or the object itself is an integrated circuit, or the object itself is a carrier integrated with the integrated circuit; and a protective body covering the object At least a portion of the surface of the protective body includes at least one recess to reduce stress experienced by the electron element: temperature change. The above description is intended to provide a better or more practical embodiment of the invention. The spirit and scope of the present invention are not limited by the above-described embodiments, and may include various modifications or approximations. ^

Claims (1)

1278974 6. Patent application scope L An electronic component comprising: at least one integrated circuit; a carrier 'to support the integrated circuit; a protective body for covering the integrated circuit with frost 4 and ,, In a portion, the surface of the protective body comprises a crucible and a stress dish which is subjected to a temperature change of at least one component of the carrier to reduce the electron element 2, such as the patent system range system-wafer. The electronic component according to Item 1, wherein the integrated body 3 is as in the patent application scope 1st substrate, a roll #, and the wire 70 electronic, wherein the carrier is a soil pole lane lead frame and the like The cup in the go. 4. If the scope of the patent application section contains at least one electronic device of the side of the i#, the vehicle has a wide area for connecting the integrated circuit. Λ申一 Please select the electronic component of item (4) of the above range, wherein the carrier package ^ to "electrical connection device' is used to electrically connect the integrated circuit. The electronic component of claim 1, wherein the recess is located in a central region of the surface of the protective body. 7. The electronic component described in claim 1 of the patent scope is subjected to a change in temperature due to a difference in thermal expansion coefficient of each portion. 8. The electronic component according to claim 1, wherein the stress due to the temperature change is different from the thermal expansion coefficient of the integrated circuit and the protective body. 9. The electronic component according to claim 1, wherein the stress due to the temperature change is different from the thermal expansion coefficient of the carrier and the protective body. Page 17 1278754 VI. Patent Application Range For example, the electronic component described in item 1 of the patent scope, the stress due to temperature change is derived from the difference between the thermal expansion coefficient of the carrier and the integrated circuit & The electronic component of claim 1, wherein the protective body-surface comprises two linear depressions, and the two linear depressions are further in a ten-shaped shape and are respectively parallel to the protective body. Adjacent two edges. 12. The electronic component of claim 1, wherein the surface of the protective body has a quadrangular shape and includes two or four depressions, the two depressions being parallel to the two diagonals of the quadrilateral. The electronic component of claim 1, wherein the protective body has a square surface and includes two recesses which are respectively parallel to the two diagonals of the square. The electronic component of claim 1, wherein the surface of the protective body comprises a plurality of recesses, one of the plurality of recesses is located at a first position, and the other recesses are located at a circumference of the first position The garden is arranged symmetrically with respect to the first position. The electronic component of claim 1, wherein the surface of the protective body comprises five recesses, one of the five recesses is located at a first position, and the other four are located at the first position Zhou Yuan is arranged in a zigzag shape relative to the first position. The electronic component of claim 1, wherein the protective body is a device formed by casting a resin. 17. The electronic component of claim i, wherein the protective body is an encapurant. Page 18 1278974 6. Patent application scope _ 'where the recess is in the recess where the protector wherein the carrier includes the protector cover circuit and the carrier is wrapped, the protector encapsulates the integrated circuit 18. If the scope of the application for patents is the first item, the +, μ is applied to the surface of the protective body, and the electronic component a is the i-th of the patent application scope. It is a 'coming' T-piece of a mold used for casting vinegar, 2〇·If the scope of patent application is 】, it contains polymer materials.疋Electronic component, such as the electronic component described in the scope of the patent application, at least one connecting portion for connecting the integrated circuit, Ϊ = way and the connecting portion 'to seal the product 22. If the patent is applied for The electronic component of the above aspect, comprising at least one electrical connection device for electrically connecting the integrated body to cover the integrated circuit and the electrical connecting device for densely connecting the electrical connecting device. An electronic component comprising: an object comprising: at least one integrated circuit; and a protective body covering at least a portion of the object, the surface of the protective body comprising at least one recess, To reduce the stress on the electronic component due to temperature changes. The electronic component of claim 23, wherein the object further comprises at least one carrier for supporting the integrated circuit. The electronic component of claim 23, wherein the protector covers the integrated circuit. 26. The electronic component of claim 24, wherein the protection Page 19 1278974 VI. Scope of Application The body covers the integrated circuit and at least part of the carrier. Page 20