1275801 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種已安裝在測試卡上之探針表面處 理方法，特別係指一種將探針表面施予鍍膜處理，於表面形 成覆膜，該覆膜材質依需求不同可為金屬或合金或非金屬材 質，以達到可修補、減少異物附著、增加導電性或絕緣性， 防止電磁干擾者。 【先前技術】 按，一般受測物(如晶圓、1C、DRAM…等）須經由測試機 台之測試，以測試受測物是否符合設計上所要求之功能特性 ，將不良σσ淘汰以保障產品品質，而其測試機台上之測試卡 1，請參閱第一、二圖所示，主要係設有一電路板丨丨，該電 路板11上設有定位座12,該定位座12上係排列固定有數支探 針13，該等探針13係接設有導線14連接於電路板11上，而一 般之探針13係由具導電性之金屬或其他導電材質所製成，如 第三Α圖所示，探針13之一端為固定端131係固定於定位座12 上，另一端為接觸端132係呈垂直彎折懸空於電路板11上， 藉由探針13之接觸端132與受測物19之訊號接點形成接觸， 以便直接對受測物19輸入信號及偵測輸出值，進行電性參數 量測訊號之傳送，來測試受測物19之良率，然，習知探針13 係以導電體製成，探針13係採緊密間隔排列，故探針13與探 針13之間會有電磁干擾產生，或因異物掉落於探針13與探針 13間之縫隙而產生短路之現象，使探針13無法正常運作，一 般而言，探針13會有接觸性的磨耗，磨耗之嚴重程度會影響 測試卡1測試之可靠度及使用壽命，而探針13之接觸端132 表面133長期使用易磨損，接觸端132受磨損之表面133會呈 凹凸不平狀，如第三B圖所示，易附著有殘渣及污垢18，不 易清除，而使受測物19測試之良率大幅降低，重測率增加， 故須先將表面之殘渣及污垢18清除，再以砂紙將接觸端132 之表面133予以研磨修整，方可再為使用，但探針以經多次 修整磨耗後其長度會縮短，磨至—定長度後，便不能使用， 必須丟棄，使用壽命短，而測式卡丨之成本極高，如此之使 用極不符經濟效益。 緣此’本發明人有鑑於習知測試卡之探針存在有如上述 之缺失，乃潛心研究、改良，遂得財創出本發明。 【發明内容】 本發明之主要目的，係在提供一種極具耐磨性，可增加 導電性及減少摩擦，以減少探針表_著之魅及污垢，並 可方便修整、重複使用，減少磨損探針，使用壽命長，並使 檢測良率大符提升之已安裝麵試卡上之探針表面處理方 法。 本發明之主要特徵，其實施方法： a.將測試奸撕福賴之部份予吨覆额，僅露出 欲處理之探針表面； 1275801 b. 將遮蔽後之測試卡贿針置於㈣裝置中. c. 於未遮蔽之探針表面鍍上具導電性之覆膜。’ 本發明之另—主料徵，其實施方法： a. 將測試卡及探針不須鑛膜 欲處理之探針表面； 之部份^包覆遮蔽 僅露出1275801 IX. Description of the Invention: [Technical Field] The present invention relates to a surface treatment method of a probe that has been mounted on a test card, and particularly to a method of applying a coating surface to a surface of a probe to form a film on the surface. The material of the coating may be metal or alloy or non-metal according to requirements, so as to achieve repair, reduce foreign matter adhesion, increase conductivity or insulation, and prevent electromagnetic interference. [Prior Art] According to the general test object (such as wafer, 1C, DRAM, etc.), it must be tested by the test machine to test whether the tested object meets the functional characteristics required by the design, and the bad σσ is eliminated to protect Product quality, and the test card 1 on the test machine, please refer to the first and second figures, mainly provided with a circuit board 丨丨, the circuit board 11 is provided with a positioning seat 12, the positioning seat 12 is attached A plurality of probes 13 are arranged and fixed, and the probes 13 are connected with a wire 14 connected to the circuit board 11. The general probe 13 is made of a conductive metal or other conductive material, such as the third. As shown in the figure, one end of the probe 13 has a fixed end 131 fixed to the positioning base 12, and the other end of the contact end 132 is vertically bent and suspended on the circuit board 11, by the contact end 132 of the probe 13 and The signal contact of the test object 19 forms a contact, so that the signal is directly input to the test object 19 and the output value is detected, and the electrical parameter measurement signal is transmitted to test the yield of the test object 19. However, conventionally, The probe 13 is made of an electric conductor, and the probes 13 are arranged at close intervals, so There is electromagnetic interference between the needle 13 and the probe 13, or a short circuit occurs due to the foreign matter falling on the gap between the probe 13 and the probe 13, so that the probe 13 cannot operate normally. Generally, the probe 13 There will be contact wear. The severity of the wear will affect the reliability and service life of the test card 1. The surface 133 of the contact end 132 of the probe 13 is easy to wear for a long time, and the surface 133 of the contact end 132 is worn. Rugged and uneven, as shown in Figure B, it is easy to adhere to residue and dirt 18, which is difficult to remove, and the yield of the test object 19 is greatly reduced, and the retest rate is increased. Therefore, the surface residue and dirt must be removed first. 18 is removed, and the surface 133 of the contact end 132 is ground and trimmed with sandpaper before being used again, but the length of the probe is shortened after being subjected to multiple dressing abrasions, and after grinding to a certain length, it cannot be used, and must be used. Discarding, short service life, and the cost of measuring cassettes is extremely high, so the use is extremely inconsistent with economic benefits. Accordingly, the present inventors have deliberately studied and improved the present invention in view of the absence of the probe of the conventional test card, and the present invention has been developed. SUMMARY OF THE INVENTION The main object of the present invention is to provide a wear resistance, which can increase conductivity and reduce friction, thereby reducing the charm and dirt of the probe, and can be easily trimmed, reused, and reduced in wear. The probe has a long service life and allows the detection surface to be improved by the probe surface treatment method on the installed interview card. The main features of the present invention are as follows: a. The part of the test will be torn to the surface of the probe to be treated; 1275801 b. Place the masked test card on the (4) device Medium. c. Apply a conductive coating to the unshielded probe surface. The other main method of the present invention is carried out by: a. placing the test card and the probe without the ore film to be treated on the surface of the probe;
b·將遮蔽後之測試卡與探針置於獅裝置中； c.於未遮蔽之探針表面鐘上具絕緣性之覆膜。’ 【實施方式】 ' 述如下 有關本發明為達上述之使用目的與功效，所採用之技 術手段，跡出較佳可行之實施例，並配合圖式所示，詳 本發明主要係於測試卡上之探針2表面料鍛膜處 理’該挺針2可設為由鶴金屬或鶴合金等具剛性、具導電之 材質所製成’如第五A圖所示，其實施方法如下，請參閱第 四圖所示： a.將測試卡及探針2之針身22部份予以包覆遮蔽，僅露 出針頭21部位； b·將遮蔽後之測試卡與探針2置於鑛膜裝置中：其鐘膜 裝置可設為真空電鍍爐； c·於未遮蔽之探針2針頭21表面鍵上具導電性之覆膜 3 ’形成保護，如第五b圖所示； d·測試卡上之探針2使用磨損後，將探針2之表面修整·· 7 先清除覆膜3表面所殘留之殘渣及污垢31，再予以研磨修 整，如第五C、五D圖所示； e·再將測試卡及探針2之針身22部份予以包覆遮蔽，僅 露出針頭21部位； f·再於未遮蔽之探針2針頭21表面鍍上具導電性之覆 膜32 ’形成保護’如第五E圖所不’可再重複使用。 本發明之另一實施例，主要係測試卡上之探針2表面之 覆膜3經使用後會產生磨損，如第五C圖所示，主要係針對 測試卡上之探針2表面施予修整鍍膜處理，其實施方法如下 ，請參閱第六圖所示： a·將探針2之表面修整：先清除覆膜3表面所殘留之殘渣 及污垢31，再予以研磨修整，如第五D圖所示； b·將測试卡及楝針2不須鑛膜之部份予以包覆遮蔽，僅 露出欲處理之探針2表面； c·將遮蔽後之測試卡與探針2置於鍵膜裝置中：其鍍膜 裝置可設為真空電鍍爐； d·再於未遮蔽之探針2表面錢上具導電性之覆膜32，形 成保護，如第五E圖所示。 而覆膜3、32之材質可依檢測不同之物品或使用條件之 不同，於探針2之表面鍍上不同材質，覆膜3、32之材質可為 金屬、合金、氧化物、硼化物、碳化物、氟化物、氮化物、 石夕化物、硫化物’碲化物等’而鍍膜方式可採用有電電錄法 (有電解反應之電链）或無電電鑛法（無電解反應之電鑛）， 例如屬於有電電料之—般紐、複合钱、合金電链等， 而屬於無電紐法之物理氣相沉積法，如真空濺链法、真空 条鍍法或離子束鍍膜法等，或屬於化學氣她積法之大氣壓 化學氣相沉積法、健化學氣相沉積法、電漿辅助化學氣相 沉積法等。 ” 依上所述，於探針2之表面施予鍍臈處理，其探針2不會 受磨損，被雜部位僅係其表面之賊3，而覆經磨碰 可予以修整，重複魏再使用，當探針2再次使用後，其表 面之覆膜32再次磨損，即可重複修整、賴，如此重複修整、 鏡膜可使探針級職卡之使財命增長，可大符降低成 本；而一般的探針會有接觸性的磨耗，磨耗之嚴重程度會影 響測試卡之可靠度及使用壽命，本發明藉由適當的鑛膜方 式’可延長探針2於測試卡上之使用壽命，且探針在使用上， 會因與文測试物的接觸性測試造成受測試物的接觸面部分 材料附著於探針之表面上，而本發明之探針2經過鍍膜處 理，於探針2之表面鍍上一層具導電性及耐磨性之覆膜3、 32，使其表面較為光滑，可減少受測試物材料附著之現象， 且比較容易清除’可提升測試的良率，且本發明之探針2可 在不需從測試卡上取下的情況下進行鍍膜處理，將不需鍍膜 處理的所有表面予以包覆起來，僅將需鍍膜之表面直接暴露 於錄膜裝置内進行鑛膜即可，重複鏡膜極為方便。 1275801 本發明之又-實施例，若測試卡上之探針2係為緊密間 隔排列，為防止探針2與探針2之間會產生電磁干擾，且會有 因異物掉落而產生短路之現象，於其表面施讀膜處理之實 施方法如下，如第七、八圖所示： a.將探針2之針身22部份予吨魏蔽，僅露出針頭21 部位； b·將遮蔽後之探針2置於鍍膜裝置中：其链膜裝置可設 為真空電鍍爐； C·於未遮蔽之探針2針頭21表面鍍上具導電性之覆膜3; d.再將探針2之針頭21部份予以包覆遮㉟，僅露出針身 22部位； e·將遮蔽後之探針2置於鍍膜裝置中； f.於未遮蔽之探針2針身22表面鍍上一層非導電性之絕 緣膜4 ,形成隔絕保護。 如此，於探針2之針頭21表面鍍上一層具導電性佳之覆 膜3 ’再於棟針2之針身22表面鍍上一層非導電性且具絕緣材 質之絕緣臈4，如第八圖所示，探針2與探針2之間受絕緣膜4 之絕’減> 電磁谓之情況產生，且若錢雜掉落於探 針2與探針2間之縫隙，不會有短路之情況發S，使探針2得 以穩定正作，而測試之良率更佳，重測率大為降低。 由以上說明可知，本發明具有以下之優點： 、本發明於探針之表面鍍上—層舰，形成保護 ，使探針 1275801 更具耐磨性，可降低磨耗。 —、本發明之探針經表面處理可增加導電性，可減少探針表 面附著之殘渣及污垢，且容易清除。 三、 本發明探針表面之覆膜可方便修整，並重複錢膜再使用 ，可減少探針之磨耗，使用壽命較長。 四、 本發明之探針可在不需從測試卡上取下的情況下進行 鑛膜處理’將不需麵處_所有表舒以包覆起來， 僅將需鍍膜之表面直接暴露於鑛膜裝置内進行鑛膜即 可’重複鑛膜極為方便。 五、 本發明可於探針之針頭表面錢上一層具導電性之覆膜 ，再於探針之針身表面上鑛上—層絕緣膜，可防止探針 間異物料發生短路之情況，舰針得以狱正常運作 ，測試之良率更佳，重測率降低。 綜上所述，本發明之實施例確實已能達到所預期之使 用目的及功效，且未見有_結構特徵公知、公_者 ，故本發明當能符合發明專利之巾請要件，爰依法提出申 請’懇請早日審結’並核賜專利，實深任感荷。 【圖式簡單說明】 第一圖所示係為測試卡之立體圖。 第二圖所示係為測試卡之使用示意圖。 第三八圖所示係為習知探針之放大示意圖。 第三B圖所示係、為習知探針磨損之示意圖。 1275801 第四圖所示係為本發明之流程圖。b. Place the shielded test card and probe in the lion device; c. Apply an insulating film to the unmasked probe surface clock. 'Embodiment' The following is a description of the preferred embodiment of the present invention in order to achieve the above-mentioned purpose and effect of use, and the present invention is mainly shown in the test card. The probe 2 surface material forging film treatment 'The needle 2 can be made of a rigid, electrically conductive material such as crane metal or crane alloy' as shown in Figure 5A. The implementation method is as follows, please Refer to the fourth figure: a. Cover the test card and the needle body 22 of the probe 2 to cover only the needle 21; b. Place the shielded test card and probe 2 on the membrane device. Medium: the bell membrane device can be set as a vacuum plating furnace; c. The protective film 3' on the surface of the unshielded probe 2 needle 21 is protected, as shown in the fifth b diagram; d·test card After the probe 2 is worn, the surface of the probe 2 is trimmed. 7. The residue and dirt 31 remaining on the surface of the film 3 are removed first, and then ground and trimmed, as shown in the fifth C and fifth D drawings; · The test card and the needle body 22 of the probe 2 are covered and covered, only the needle 21 is exposed; f· again 2 probe needles 21 of the plated surface with the unmasked coating of the conductive film 32 'to form a protective' as in the fifth to FIG no E 'can be reused. In another embodiment of the present invention, the film 3 on the surface of the probe 2 on the test card is mainly worn after being used, as shown in FIG. 5C, mainly for the surface of the probe 2 on the test card. Trimming coating treatment, the implementation method is as follows, please refer to the sixth figure: a·Repair the surface of the probe 2: first remove the residue and dirt 31 remaining on the surface of the coating 3, and then grind and trim, such as the fifth D Figure b; The test card and the needle 2 are not covered by the part of the film, only the surface of the probe 2 to be treated is exposed; c. The masked test card and probe 2 are placed In the key film device: the coating device can be set as a vacuum plating furnace; d. The conductive film 32 is formed on the surface of the unshielded probe 2 to form a protection, as shown in FIG. The materials of the coatings 3 and 32 can be plated with different materials on the surface of the probe 2 according to different items or conditions of use. The materials of the coatings 3 and 32 can be metals, alloys, oxides, borides, Carbide, fluoride, nitride, asahi compound, sulfide 'telluride, etc.' can be coated by electro-electric recording (electrical chain with electrolytic reaction) or electroless ore method (electroless ore without electrolysis) For example, it belongs to electric-electric materials, such as alloys, composite money, alloy electric chains, etc., and belongs to the physical vapor deposition method of non-electrical method, such as vacuum sputtering method, vacuum strip plating method or ion beam coating method, etc. Atmospheric pressure chemical vapor deposition, chemical vapor deposition, plasma-assisted chemical vapor deposition, etc. According to the above, the ruthenium treatment is applied to the surface of the probe 2, and the probe 2 is not subject to wear, and the nicked portion is only the thief 3 on the surface thereof, and the rubbing can be trimmed by the rubbing, repeating Wei Zai When used, when the probe 2 is used again, the surface film 32 of the surface is worn again, and the dressing and lamination can be repeated, and the dressing is repeated, and the mirror film can increase the life of the probe level card, thereby reducing the cost. However, the general probe has contact wear, and the severity of the wear affects the reliability and service life of the test card. The present invention can extend the service life of the probe 2 on the test card by a proper film-forming method. And the probe is in use, the contact surface portion of the test object is attached to the surface of the probe due to the contact test with the test object, and the probe 2 of the present invention is subjected to coating treatment on the probe. The surface of 2 is coated with a layer of conductive and wear-resistant coatings 3, 32 to make the surface smoother, which can reduce the adhesion of the material to be tested, and it is easier to remove the 'good test yield, and this The probe 2 of the invention can be used without a test card In the case of the next coating process, all the surfaces that do not need to be coated are coated, and only the surface to be coated is directly exposed to the film recording device to perform the mineral film, and the mirror film is extremely convenient. 1275801 In another embodiment, if the probes 2 on the test card are closely spaced, electromagnetic interference between the probe 2 and the probe 2 is prevented, and a short circuit occurs due to falling of foreign matter. The method for performing the surface treatment film processing is as follows, as shown in the seventh and eighth figures: a. The portion of the needle body 22 of the probe 2 is pre-twined to expose only the needle 21; b. 2 placed in the coating device: the chain device can be set as a vacuum plating furnace; C. on the surface of the unshielded probe 2 needle 21 is coated with a conductive film 3; d. then the needle 2 of the probe 2 Part of the cover 35, only the body 22 is exposed; e. The shielded probe 2 is placed in the coating device; f. The surface of the unshielded probe 2 is coated with a layer of non-conductive The insulating film 4 forms an isolation protection. Thus, the surface of the needle 21 of the probe 2 is plated with a conductive layer. The film 3' is further coated with a non-conductive insulating material 4 on the surface of the pin 22 of the pin 2, as shown in the eighth figure, the insulating film 4 between the probe 2 and the probe 2 The absolute 'minus> electromagnetic generation is the case, and if the money falls on the gap between the probe 2 and the probe 2, there will be no short-circuit condition S, so that the probe 2 can be stabilized, and the test The yield is better, and the retest rate is greatly reduced. It can be seen from the above description that the present invention has the following advantages: The present invention is coated on the surface of the probe to form a layer of ship to form a protection, so that the probe 1275801 is more wear-resistant. The friction of the probe of the present invention can increase the conductivity by surface treatment, reduce the residue and dirt adhering to the surface of the probe, and is easy to remove. 3. The film on the surface of the probe of the invention can be easily trimmed. Repeat the use of the money film to reduce the wear of the probe and have a long service life. 4. The probe of the present invention can perform the mineral film treatment without removing it from the test card, 'will not need to be covered _ all the sheets are coated, and only the surface to be coated is directly exposed to the mineral film. It is very convenient to repeat the mineral film by carrying out the mineral film inside the device. 5. The invention can apply a layer of conductive film on the surface of the needle of the probe, and then deposit a layer of insulating film on the surface of the needle body of the probe to prevent short circuit of the material between the probes. The needle is in normal operation, the test yield is better, and the retest rate is reduced. In summary, the embodiments of the present invention have indeed achieved the intended use and efficacy, and there is no known structural feature, and the present invention can meet the requirements of the invention patent towel. I filed an application, 'Please ask for an early conclusion,' and approved the patent. [Simple description of the diagram] The first figure shows a perspective view of the test card. The second figure shows the use of the test card. Figure 38 is an enlarged schematic view of a conventional probe. The figure shown in the third B is a schematic diagram of the conventional probe wear. 1275801 The fourth figure shows a flow chart of the present invention.
第五A圖所示係為本發·針之剖視圖。 第五β圖所稀為本剌騎表 尽復膜之不意 第圖所示係為本發·針上之__之示意圖。 々五D圖所示係為本發贿針上覆膜修整之示意圖。 第^圖所示係為本發明探針上再讀上伽之示意圖 第/、圖所示係為本發明另一實施例之流程圖。 圖所示係為本發明又一實施例之流程圖。Figure 5 is a cross-sectional view of the hair pin. The fifth β-graph is rare as the 剌 表 尽 尽 尽 尽 尽 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第The figure shown in Figure 5 is the schematic diagram of the film repair on the bribe needle. The figure is a schematic diagram of re-reading the gamma on the probe of the present invention. The figure is a flow chart of another embodiment of the present invention. The figure shows a flow chart of still another embodiment of the present invention.
第八圖所示係為本發明 又一實施例探針之針頭表面鍍上覆 膜’針身表面鍍上絕緣膜之示意圖。Fig. 8 is a schematic view showing the surface of the needle surface of the probe of the still further embodiment of the present invention. The surface of the needle body is plated with an insulating film.
【主要元件符號說明】 1 測試卡 11 電路板 12 定位座 13探針 131 固定端 132接觸端 133表面 14 導線 18 殘渣及污垢 19受測物 2 探針 21 針頭 22 針身 3 覆膜 31殘渣及污垢 32 覆膜 4 絕緣膜 12[Main component symbol description] 1 Test card 11 Circuit board 12 Positioning seat 13 Probe 131 Fixed end 132 Contact end 133 Surface 14 Conductor 18 Residue and dirt 19 Test object 2 Probe 21 Needle 22 Needle body 3 Film 31 residue and Dirt 32 coating 4 insulating film 12