TWI275774B - Edge defect inspection apparatus - Google Patents

Edge defect inspection apparatus Download PDF

Info

Publication number
TWI275774B
TWI275774B TW94127086A TW94127086A TWI275774B TW I275774 B TWI275774 B TW I275774B TW 94127086 A TW94127086 A TW 94127086A TW 94127086 A TW94127086 A TW 94127086A TW I275774 B TWI275774 B TW I275774B
Authority
TW
Taiwan
Prior art keywords
light
thickness direction
focus position
mirror
irradiated
Prior art date
Application number
TW94127086A
Other languages
Chinese (zh)
Other versions
TW200706828A (en
Inventor
Naoyuki Nohara
Hideo Sakai
Original Assignee
Raytex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytex Corp filed Critical Raytex Corp
Priority to TW94127086A priority Critical patent/TWI275774B/en
Publication of TW200706828A publication Critical patent/TW200706828A/en
Application granted granted Critical
Publication of TWI275774B publication Critical patent/TWI275774B/en

Links

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

An edge defect inspection apparatus includes: an oval mirror which has a mirror surface provided on its inside and an opening to insert an object to be inspected at its apex portion; an irradiation portion which irradiates coherent light to an edge of the object located near a first focus position in the oval mirror; a light detection portion which is located at a second focus position in the oval mirror; and light shielding means which shields low-ordered diffracted light regularly reflected. The irradiation portion can be driven in the thickness direction of the object by movement means and can irradiate different irradiation areas at the edge of the object in the thickness direction.

Description

1275774 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種光學性檢查被檢查物的端部^ 山 部傷檢查裝置。 劳 $而 【先前技術】 關於用來檢查形成於矽晶圓的外周邊緣部之端部之狹 長端部破裂、缺陷或是研磨傷之端部傷之端部傷檢查裝 置,係有人提出利用橢圓鏡之檢查裝置。例如有人提出^ %於橢圓鏡的鏡㈣置光吸收構件,以光吸收構件來吸收正 向反射光之低階繞射光,並藉由設置於第2焦點位置之光 檢測部,來僅檢測因端部傷而產生漫反射之高階繞射光之 裝置(例如參照專利文獻丨)。此外亦有人提出,除了 μ置 .於第2焦點位置之第i光檢測部之外,亦於設置在第:焦 .點位置之被檢查物的周圍,設置第2光檢測部,藉由2個 可對應縱向損傷及橫向損傷之裳置(例心 •文獻2)。 π〜 ’這些端部傷檢查裝置’雖然藉由旋 端部全周圍,但是卻無法檢μ與關方μ交 置及大小。此外,雖然藉由感光部所 二:先的強度可推測某種程度之損傷的種類,但就以 著限制。 ^識“傷的詳細者,乃存在 =利文約]日本特開細3_287412號公報 [專利文獻2]日本特開平叫5咖號公報 317320 5 1275774 【發明内容】 (¾明所欲解決之課題) 本發明乃鑑於上述情形而創作出之 可檢測被檢查物的端部傷 Λ ;:月純出種 ^ ^ , . Β ^^ 丨甸在厚度方向的砰細位置,以及損 知的大小及種類之端部傷檢查裝置。 (解決課題之手段)1275774 IX. Description of the Invention: [Technical Field] The present invention relates to an end portion inspection device for optical inspection of an object to be inspected. [Previous technique] It is proposed to use an ellipse for an end injury inspection device for inspecting an end portion of a narrow end portion of a peripheral edge portion of a tantalum wafer which is broken, defective, or scratched. Mirror inspection device. For example, it has been proposed that the mirror (four) of the elliptical mirror is provided with a light absorbing member, and the light absorbing member absorbs the low-order diffracted light of the forward reflected light, and the light detecting portion provided at the second focus position detects only the cause. A device that produces a high-order diffracted light with a diffuse reflection at the end (for example, see Patent Document). Further, it has been proposed to provide a second light detecting unit around the object to be inspected at the second focus position, in addition to the ith light detecting unit at the second focus position. One can correspond to longitudinal damage and lateral damage (Chen Xin • Document 2). π 〜 'the end injury inspection devices' are not able to detect the intersection and size of the μ side by the entire circumference of the end portion. Further, although the type of damage of a certain degree can be estimated by the intensity of the first portion of the photosensitive portion, it is limited. 。 识 详细 详细 利 利 利 ] ] 3 3 3 3 3 3 3 3 3 3 3 _ _ _ _ _ _ _ _ _ _ _ 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 The present invention is designed to detect the end scar of the object to be inspected in view of the above situation;: purely out of the moon ^ ^ , . Β ^^ 砰 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在End injury inspection device. (Means for solving the problem)

本發明為—種端部傷檢查裝置,係具備··於内側具有 :、“之:圓鏡;朝向配置於該橢圓鏡的第1焦點位置附近 =檢查物的端部照射同調光(⑶herent之發光部;配 置於上述橢圓鏡的第2焦點位置’可檢測出由所照射之上 ί同調光於上述被檢查物的上述端部以及於上述橢圓鏡產 反射而到達上迷第2焦點位置之繞射光之光檢測部;及 將上迷、,&射光中產生正向反射之低階繞射光加以遮光之遮 光手段’其特徵4 :上述發光部係藉由移動手段,可在上 述被檢查物的上述厚度方向自由地設定上述發光部的位The present invention is an end injury inspection device, which has: on the inside: "the round mirror; the vicinity of the first focus position disposed in the elliptical mirror = the end of the inspection object is illuminated by the same dimming ((3) herent The light-emitting portion is disposed at the second focus position of the elliptical mirror to detect that the end portion of the object to be inspected is irradiated with the light, and that the elliptical mirror is reflected by the elliptical mirror to reach the second focus position. a light-detecting portion for diffracting light; and a light-shielding means for shielding low-order diffracted light that generates forward reflection in the upper, lower, and lighter features. The feature 4: the light-emitting portion is inspected by a moving means The thickness direction of the object is free to set the position of the light-emitting portion

>置,並將上述同調光照射於上述被檢查物的上述端部之上 述厚度方向的不同之照射範圍。 根據本發明之端部傷檢查裝置,由於可藉由移動手 段,將同調光照射於被檢查物的端部之厚度方向的不同之 照射範圍,因此可藉由光檢測部來檢測出對應各個照射範 圍之繞射光的強度,而檢測出損傷在厚度方向上的詳細位 置,以及損傷的大小。 此外,本發明為一種端部傷檢查裝置,係具備:於内 側具有鏡面之橢圓鏡;朝向配置於該橢圓鏡的第丨焦點位 317320 6 -1275774 置附近之被檢查物的端部照射同調光之發光部;配置於上 述橢圓鏡的第2焦點位置,可檢測出由所照射之上述同調 光於上述被檢查物的上述端部以及於上述橢圓鏡產生反射 而到達上述弟2焦點位置之繞射光之光檢測部丨及將上述 繞射光中產生正向反射之低階繞射光加以遮光之遮光手 段,其特徵為:於上述被檢查物的上述厚度方向之不同位 置設置複數個上述發光部,上述各個發光部係從不同方 ^向將上述同凋光照射於上述被檢查物的上述端部之上述 、厚度方向的不同之照射範圍。 根據本發明之端部傷檢查裝置,由於可藉由複數的發 光部,將同調光照射於被檢查物的端部之厚度方向的不同 =照射範圍,因此可藉由光檢測部來檢測出對應各個發光 部之繞射光的強度,藉此可檢測出在厚度方向上之損傷的 位置,以及損傷的大小。 一此外,上述發明之端部傷檢查裝置可構成為,上述發 _春光部係具備:發出上述同調光之光源;及對該光源所照射 出的同調光產生光學作用,而將上述照射範圍在上述被檢 —物的上述^部之厚度方向縮小來照射之聚光手段。 根據本發明之端部傷檢查裝置’由於可將照射於被檢 查2的端部之同調光的照射範圍,往厚度方向縮小,因此 在從不$的位置由發光部照射於厚度方向_,可精確的檢 測出,因厚度方向之損傷的位置以及損傷的大小所造成之 在光檢測部所檢測出之繞射光的強度差。 此外,於上述發明之端部傷檢查裝置中,上述發光部 317320 7 !275774 可照射不同波長之上述同調光。 根據本發明之端部傷檢查裝置,係藉由光檢測部透過 不同波長之各種同調光來檢測出折射光的強度,而可檢測 出細微的損傷,以及在波長較長的同調光中因吸收較大而 無法檢測出之損傷,以及僅在特定波長的同調光下產生漫 反射之損傷。 (發明之效果) 根據本發明,由於可於被檢查物的厚度方向改變發光 邛所照射出之同調光的照射範圍,因此可特定出被檢查物 的厚度方向之損傷的詳細位置以及損傷的大小。此外,藉 由不同波長之同調光,可檢測出細微的損傷,以及在波長 車^長的同調光因吸收較大而無法檢測出之損傷,或者僅在 特定波長的同調光下產生漫反射之損傷,因而可實現精細 的端部傷檢查。 【實施方式】 .(第1實施型態) /弟1圖至第10圖係顯示本發明的第工實施型態。第^ ,係顯示以垂直面來剖切端部傷檢查裝置之縱向剖面圖, 第2圖係顯示以水平面來剖切端部傷檢查裝置之縱向剖面 圖。第3圖係顯示以發光部3來照射被檢查物的端部之說 =圖。此外’ f 4圖及第6圖係顯示由發光部所照射之被 :查物的端部之放大正面圖’第5圖及第7圖係顯示放大 °面圖。f 8圖係顯示在厚度方向改變照射範圍時,由 檢測部所檢測出的結果的—例之圖式,第9圖係顯示在改 317320 8 -1275774 變所照射的同調光的波長時,由光檢測部所檢測出的結果 的例之圖式,第10圖係頰示在藉由複數個波長的同調 光,在厚度方向改變照射範圍時,由光檢測部所檢測出的 結果的一例之圖式。 如第1圖、第2圖所示,端部傷檢查裝置丨係具備: 於内側2a具有鏡面2b,且形成有可將被檢查物3插入於 f點部2c之缺口 2d之橢圓鏡2;及對配置於橢圓鏡2的 第1焦點位置A附近之被檢查物3的端部3a,照射同調光 〜之發光部4;及配置於橢圓鏡2的第”、點位置b之光 檢測部5。此外,端部傷檢查裝置!亦具備:可旋動被檢 查物3而加以保持之保持部6;能夠以橢圓鏡2的第i焦 點位置A為中心而朝被檢查物3的厚度方向旋動發光 之移動手段7;及設置於橢圓鏡2之遮光手段8。被檢查物 3例如為板狀的矽晶圓或是半導體晶圓。 如第3圖所示,發光部4係具備:發出同調光c之光 〜原9;及對所照射出的同調光c產生光學作用之聚光手段 ^光源9例如為雷射光,可自由調整波長。更詳細而言, 可私用He-Ne雷射及半導體雷射,並切換各種波長之複數 2田射’因此可自由調整波長。或者是亦可使用可變波長 田射。此外,聚光手段10為,在對被檢查物3的端部% ::射從光源9所發出的同調光〇時,可在被檢查物3:端 a的厚度方向將照射範圍11縮小之透鏡。如此.,發光>, and the above-mentioned same dimming light is applied to the end portion of the object to be inspected to have a different irradiation range in the thickness direction. According to the end injury inspection device of the present invention, since the same dimming light can be irradiated to the irradiation range of the thickness direction of the end portion of the inspection object by the moving means, the corresponding detection can be detected by the light detecting portion. The intensity of the range of diffracted light is detected, and the detailed position of the damage in the thickness direction and the size of the damage are detected. Further, the present invention provides an end injury inspection apparatus comprising: an elliptical mirror having a mirror surface on the inner side; and an end portion of the inspection object disposed adjacent to the first focus position 317320 6 -1275774 disposed in the elliptical mirror The light-emitting portion is disposed at the second focus position of the elliptical mirror, and is configured to detect the end portion of the object to be inspected by the illumination and the reflection at the elliptical mirror to reach the focus position of the brother 2 The light-emitting light detecting unit 丨 and the light-shielding means for shielding the low-order diffracted light that causes forward reflection in the diffracted light, wherein a plurality of the light-emitting portions are provided at different positions in the thickness direction of the object to be inspected, Each of the light-emitting portions is irradiated to the end portion of the object to be inspected in a different irradiation range in the thickness direction from the different directions. According to the end damage inspection device of the present invention, since the light emission portion can be irradiated to the end portion of the inspection object in the thickness direction by the plurality of light-emitting portions, the irradiation range can be detected by the light detecting portion. The intensity of the diffracted light of each of the light-emitting portions can thereby detect the position of the damage in the thickness direction and the size of the damage. Further, in the end injury inspection device according to the above aspect of the invention, the hair-spring portion may include: a light source that emits the same dimming light; and an optical effect of the same dimming light that is emitted from the light source, and the irradiation range is The light collecting means for reducing the thickness direction of the above-mentioned portion of the object to be inspected is irradiated. According to the end injury inspection device of the present invention, since the irradiation range of the same dimming light that is irradiated to the end portion of the inspection 2 can be reduced in the thickness direction, the light-emitting portion is irradiated in the thickness direction at a position that is not $. The difference in intensity of the diffracted light detected by the photodetecting portion due to the position of the damage in the thickness direction and the size of the damage is accurately detected. Further, in the end injury inspection device according to the above aspect of the invention, the light-emitting portion 317320 7 ! 275774 can illuminate the same dimming light of a different wavelength. According to the end injury inspection device of the present invention, the intensity of the refracted light is detected by the light detecting portion transmitting various kinds of coherent light of different wavelengths, and fine damage can be detected, and absorption can be performed in the same wavelength of the same wavelength. Damage that is large and undetectable, and that produces diffuse reflection only at the same wavelength of the same dimming. (Effects of the Invention) According to the present invention, since the irradiation range of the same dimming light emitted by the illuminating illuminator can be changed in the thickness direction of the object to be inspected, the detailed position of the damage in the thickness direction of the object to be inspected and the size of the damage can be specified. . In addition, by the same dimming of different wavelengths, it is possible to detect subtle damage, as well as damage that cannot be detected due to large absorption of the same dimming in the wavelength, or to generate diffuse reflection only under the same wavelength of the same dimming. Damage, thus enabling a fine end injury check. [Embodiment] (1st Embodiment) / 1 to 10 shows the first embodiment of the present invention. The second section shows a longitudinal sectional view of the end injury inspection device in a vertical plane, and the second figure shows a longitudinal sectional view of the end injury inspection device cut in a horizontal plane. Fig. 3 is a view showing the end portion of the inspection object illuminated by the light-emitting portion 3. Further, the 'f 4 diagram and the sixth diagram show an enlarged front view of the end portion of the object to be illuminated by the light-emitting portion. Figs. 5 and 7 are enlarged views. The f 8 figure shows a result of the result detected by the detecting unit when the irradiation range is changed in the thickness direction, and the figure 9 shows the wavelength of the same dimming light irradiated by the change of 317320 8 -1275774 by An example of the result of the detection by the light detecting unit, and FIG. 10 is an example of a result detected by the light detecting unit when the irradiation range is changed in the thickness direction by the same dimming of a plurality of wavelengths. figure. As shown in Fig. 1 and Fig. 2, the end injury inspection device includes: a mirror surface 2b on the inner side 2a, and an elliptical mirror 2 in which the inspection object 3 can be inserted into the notch 2d of the f point portion 2c; And the end portion 3a of the inspection object 3 disposed near the first focus position A of the elliptical mirror 2, the light-emitting portion 4 that emits the same light, and the light detecting portion that is disposed at the "th" and the position b of the elliptical mirror 2 5. The end injury inspection device further includes a holding portion 6 that can hold the inspection object 3 and hold it, and can be oriented in the thickness direction of the inspection object 3 around the i-th focus position A of the elliptical mirror 2 a moving means 7 for rotating the light; and a light blocking means 8 provided in the elliptical mirror 2. The object 3 to be inspected is, for example, a plate-shaped germanium wafer or a semiconductor wafer. As shown in Fig. 3, the light-emitting portion 4 is provided with: The light source of the same dimming light, the original 9; and the light collecting means for optically illuminating the same dimming light c, the light source 9 is, for example, laser light, and the wavelength can be freely adjusted. More specifically, He-Ne can be used privately. Laser and semiconductor lasers, and switch multiple wavelengths of various wavelengths 'so you can freely adjust the wavelength. Or also In addition, the concentrating means 10 is a thickness at the end 3 of the object to be inspected 3 when the same portion of the object to be inspected 3 is injected with the same dimming ray from the light source 9. The direction will illuminate the lens with a narrowing range of 11. Thus, the light

Dr由移動手段7,而可在被檢查物3的厚度方向自由 土 °又疋位置’而能將同調光C照射於被檢查物3的端部3a 317320 9 1275774 之厚度方向的不同照射範圍。此外,如第1圖、第2圖所 Λ彳文么光邛4照射出的光,在被檢查物3的端部3a產生 反射而形成%射光D,此繞射光D於擴圓鏡2產生反射而 聚光於第2隹Α $ Τι …、”、、£位置B ’而由光檢測部5檢測出此繞射光 D,光檢測部5例如為光電二極體。The Dr is moved by the moving means 7, and the same dimming light C can be irradiated to the different irradiation ranges in the thickness direction of the end portions 3a 317320 9 1275774 of the test object 3 in the thickness direction of the object 3 to be inspected. Further, as shown in FIGS. 1 and 2, the light emitted from the aperture 4 is reflected at the end portion 3a of the inspection object 3 to form a % incident light D which is generated in the expansion mirror 2. The diffracted light D is detected by the light detecting unit 5 by reflection and condensing on the second 隹Α $ Τ ... ..., ", and £ position B ', and the photodetecting portion 5 is, for example, a photodiode.

如第1圖、第2圖所示,保持部6係將被檢查物3的 端部定位於橢圓鏡2的第1焦點位置A附近,並藉由 轉動轴&的轉動’可在第1焦點位置A上,使被檢查物3 =端部3a往圓周方向移動。此外,遮光手段8為,在包含 f 1焦點位置A及第2焦點位置B且平行於被檢查物3的 厚度方向的面,與橢圓鏡2相交之交又線上,具有特定寬 度之貼附的遮蔽帶。到達至此遮光手段8之繞射光D,並 不產生反射而到達光檢測部5,而是被遮光手段8所吸收。 j外於光;f欢測部5的帛j焦點位i A侧,設置遮光板H k疋口 A攸叙光部4照射出的同調光c雖於被檢查物3 ^的端部3a產生反射而形成繞射光〇,但是須防止繞射光d 未於橢圓鏡2產生反射而直接到達光檢測部$之故。 〜接著說明此端部傷檢查裝置i的作用。如第!圖所示, 係說明對於被檢查物3的端部3 a之圓田士人 ^ ^ 而| Ja之®周方向的任意位置檢 查有否損傷的情況。首先,發弁邮4多 I光邛4係位於中央位置0而 照射被檢查物3的端部3a。篦4同# # 弟4圖係顯示於中央位置〇昭 射時之被檢查物3的端部3a之放大 、 又穴正面圖,第5圖係顯示 放大剖面圖。如第4圖、第5圖所示 U 丁 在相彳每3 b位於被檢 查物3的端部3a之上方的位置時 直日守,攸中央位置〇照射時 317320 10 1275774 的照射範圍11 〇中,並未包含損傷3b。因此,所照射之同 調光C產生正向反射而成為低階繞射光d 1。如第2圖所 示’低P自繞射光D1係以從平面觀看時之橢圓鏡2的軸線l 附近為路徑,朝向第2焦點位置b,並如第!圖、第5圖 所示’依循著從侧面觀看時之被檢查物3的端部3a之形 狀,而在厚度方向上具備某種程度的擴散。因此,低階繞 射光D1被遮光手段8或是遮光板12所吸收,大部分的低 階折射光D1並未到達光檢測部5。 、b上述在位於巾央位置〇以同調光c照射被檢查物3 的端部3a時,同調光c係通過橢圓鏡2的軸線l上而照 射,相對於此,亦可使光源9及第2焦點位置6互不重疊 的方式,將光源9的光軸從橢圓鏡2的軸線l偏移些許 (4。左右)而配置,來取代上述方式。藉此,所照射的同調 光C於被檢查物3的端部3a產生正向反射之低階繞射光 D1亦從橢圓鏡2的軸線L偏移’因此可省略遮光板12。As shown in FIG. 1 and FIG. 2, the holding portion 6 positions the end portion of the inspection object 3 near the first focus position A of the elliptical mirror 2, and can be rotated by the rotation of the rotation shaft & At the focus position A, the object to be inspected 3 = the end portion 3a is moved in the circumferential direction. Further, the light shielding means 8 is attached to the elliptical mirror 2 at a line intersecting the elliptical mirror 2 on the surface including the f 1 focus position A and the second focus position B and parallel to the thickness direction of the inspection object 3 Masking tape. The diffracted light D reaching the shading means 8 reaches the photodetecting portion 5 without being reflected, but is absorbed by the shading means 8. j outside the light; f 欢j focus position i A side of the welcoming unit 5, the visor H k 疋 攸 A 攸 攸 攸 攸 攸 攸 攸 攸 攸 攸 虽 虽 虽 虽 虽 虽 虽 虽 虽 同 同 同 同 同 同 同 同 同 同 同 同The diffracted pupil is formed by reflection, but it is necessary to prevent the diffracted light d from directly reaching the photodetecting portion $ without being reflected by the elliptical mirror 2. ~ Next, the action of the end injury inspection device i will be described. As the first! As shown in the figure, it is explained that there is any damage to the position of the rounded area of the end portion 3a of the test object 3, which is in the direction of the | First, the hairpin 4 is placed at the center position 0 to illuminate the end portion 3a of the inspection object 3. The 篦4 and ## 弟4 drawings are shown in the enlarged position of the end portion 3a of the object 3 to be inspected at the center position, and the front view of the hole is shown in Fig. 5, and the enlarged cross-sectional view is shown in Fig. 5. As shown in Fig. 4 and Fig. 5, the U is in a position where the position is above the end 3a of the test object 3, and the illumination range of the 317320 10 1275774 is 11 when the central position is 〇. In the absence of damage 3b. Therefore, the same dimming C that is irradiated produces a forward reflection and becomes a low-order diffracted light d 1 . As shown in Fig. 2, the low-P self-diffracted light D1 is a path near the axis l of the elliptical mirror 2 when viewed from the plane, and faces the second focus position b, as in the first! In the figure, Fig. 5 shows the shape of the end portion 3a of the test object 3 when viewed from the side, and has a certain degree of diffusion in the thickness direction. Therefore, the low-order diffracted light D1 is absorbed by the light-shielding means 8 or the light-shielding plate 12, and most of the low-order refracted light D1 does not reach the light detecting portion 5. When the end portion 3a of the inspection object 3 is irradiated with the dimming light c at the position of the center of the towel, the dimming light c is irradiated onto the axis l of the elliptical mirror 2, and the light source 9 and the light source 9 may be irradiated. 2, the focus position 6 does not overlap each other, and the optical axis of the light source 9 is shifted from the axis l of the elliptical mirror 2 by a little (about four degrees) instead of the above. Thereby, the low-order diffracted light D1 which is irradiated with the same dimming light C at the end portion 3a of the test object 3 is also shifted from the axis L of the elliptical mirror 2, so that the light shielding plate 12 can be omitted.

此外,於此情況下 。 ;力、11文尤源…《ν〜刊仰蚵於憜 圓鏡2的軸線L而往水平方向傾斜’但較理想是往垂直方 向傾斜。亦即,若在被支撐為水平之被檢查物3的端部% 上,從相對於橢圓鏡2的軸線L往水平方向傾斜之方向照 射同調光C的話,則包含較多的損傷檢測所需資訊之乂右 =向的散漫反射光會往左右偏移,而可能導致有效資二受 損之問題。另-方面’在往垂直方向傾斜時,由於上下= 向的散漫反射光並未含有什麼的損傷檢測所需資訊,因此 上述問題不太會發生。此外,即使在往水平方向傾斜的情 317320 11 1275774 況下,亦可藉由形成橢圓鏡2的形狀為左右非對稱等,而 將左右方向的散漫反射光,聚光於光檢測器中。Also, in this case. ; force, 11 Wen Yuyuan... "v~~ 刊 蚵 憜 憜 轴线 轴线 的 的 的 的 的 圆 圆 圆 圆 圆 圆 圆 圆 圆 圆 圆 圆 圆 圆 圆 圆 圆 圆 圆 圆 圆 圆In other words, if the same dimming light C is irradiated from the end portion of the object 3 to be supported horizontally in the horizontal direction with respect to the axis L of the elliptical mirror 2, it is necessary to detect a large amount of damage. After the information, the right diffuse reflected light will shift to the left and right, which may cause the damage of the effective capital. On the other hand, when tilting in the vertical direction, since the scattered reflection light of the up and down direction does not contain any information required for damage detection, the above problem does not occur. Further, even in the case of the inclination of the horizontal direction 317320 11 1275774, the shape of the elliptical mirror 2 can be left-right asymmetric or the like, and the diffused reflected light in the left-right direction can be collected in the photodetector.

接下來,如第1圖所示,一邊將發光部4往上方移動 -邊依序照射’而到達上方位置p。第6圖係顯示,於上 方位置f照射被檢查物3的端部3a時的放大正面圖,第7 圖係顯不放大剖面圖。如第6圖、第7圖所示,由於昭射 範圍Up與損傷3b重疊,因此同調光C因損傷3b而產、生 漫反:’而成為高階繞射A D2。因此,如第1圖、第2 >圖、第^圖所示,繞射光D2並不被遮光手段8所吸收, ’、夕數係於橢圓鏡2產生反射,而由第2焦點位置b的光 檢測部5所檢測出。第8圖係顯示,以中央位置〇之照射 角0為0度,照射角0與光檢測部5所檢測出之光的強度 R之間的關係。如第8圖所示,以位於中央位置。或是較 中央位置0還下方的照射角0為負值的情況下,成為正向 反射之低階繞射光D1,由於其絕大部分都未到達 知部5’因此光的強度㈣持在低位準。—旦往中央位置〇 的上方移動而使照射角0顯示為正值,則由於在照射範圍 ^内含有損« 3b,因此產生漫反射而發生高階繞射光 2’光的強度R逐漸提高,於上方位置p達到最大值。 如此,於被檢查物3的任意端部3a中,藉由在被檢查物3 的厚度方向改變照射範圍來照射時’可獲得顯示出厚度方 向的損傷位置或是損傷的狀態(大小、形狀等)之資訊。 之後,若轉動保持部6的轉動軸6a使端部%亦往圓周方 向移動的話,即可詳細檢查出在被檢查物3的端部%之圓 317320 12 1275774 · 周方向及厚度方向之有無損傷、及其位置、大小。 类:者/弟3圖所不’若藉由切換做為聚光手段1〇 = :::設定照射於厚度方向全體的照射範圍& 可更有效率的進行圓周方向的端部傷之檢查。亦即j 射範圍11a中於圓周方向確 … 圍η縮小至確認出存在有損將照射範 , LU ^ ^ ^ 貝%之邛刀而進行厚度方向的 仏查’如此可更有效率的進行詳細的檢查 變照射範圍u之聚光年ρ 1Λ y q於改Next, as shown in Fig. 1, while the light-emitting portion 4 is moved upward, the light is sequentially irradiated to reach the upper position p. Fig. 6 is an enlarged front view showing the end portion 3a of the inspection object 3 at the upper position f, and Fig. 7 is an enlarged cross-sectional view. As shown in Fig. 6 and Fig. 7, since the illuminating range Up overlaps with the damage 3b, the same dimming C is produced by the damage 3b, and becomes a high-order diffraction A D2. Therefore, as shown in Fig. 1, the second diagram, and the second diagram, the diffracted light D2 is not absorbed by the shading means 8, and the number of eves is reflected by the elliptical mirror 2, and is reflected by the second focus position b. The light detecting unit 5 detects the light. Fig. 8 is a view showing the relationship between the irradiation angle 0 and the intensity R of the light detected by the light detecting portion 5 at an irradiation angle 0 of the central position 为 of 0 degrees. As shown in Figure 8, it is located at the center. Or when the illumination angle 0 below the center position 0 is a negative value, the low-order diffracted light D1 that becomes the forward reflection does not reach the known part 5', so the intensity of the light (4) is held at the low level. quasi. Once the upper position is moved to the upper position and the illumination angle 0 is displayed as a positive value, the damage « 3b is included in the irradiation range ^, so that the diffused reflection occurs and the intensity R of the high-order diffracted light 2' is gradually increased. The upper position p reaches the maximum value. In the end portion 3a of the test object 3, when the irradiation range is changed in the thickness direction of the test object 3, the damage position or the damage state (size, shape, etc.) in the thickness direction can be obtained. ) information. After that, when the rotation axis 6a of the rotation holding portion 6 moves the end portion % in the circumferential direction, the presence or absence of damage in the circumferential direction and the thickness direction of the end portion of the object 3 to be inspected is 317320 12 1275774. , its location, size. Class: 者/弟三图不不" If switching is used as a concentrating means 1 〇 = ::: Sets the irradiation range of the entire thickness in the thickness direction & The inspection of the end injury in the circumferential direction can be performed more efficiently . That is, in the j-range 11a, it is determined in the circumferential direction... The circumference η is reduced until it is confirmed that there is a loss of the irradiation range, and the LU ^ ^ ^%% of the knives are examined in the thickness direction. Thus, the efficiency can be more detailed. Checking the range of illumination, the concentration of light, ρ 1Λ yq

,λ/ί . κ先手奴10,例如有依據凹凸透鏡 =及夫瑞奈透鏡(⑹一 系列等聚光及擴散透鏡系列之切換的方 法寻。此外,亦可讓發光部4具備如此的功能。 此外’發光部4可昭射;^ 、、士 ι Ί 在波長“交長之同調光C中,可藉:縮:C。因此, 因吸收較大而無法辨識之損傷。二圖二示:,識: 查物3的端部3a的任意位 又 ^被檢 ,,„ , Ιχ 皮長λ而照射時,浊 弋=檢測部5所檢測出之光的強度R之間的關係。如 9圖所不’猎由改變波長又’可藉由波長λ2,來 長Η中無法檢測出之損傷。第1〇圖係顯示,改變波 長又並且改變發光部4的照射角0的情況之圖形 顯示波長為λ3、λ4、λ5、Α6時的關係,各 個波長Α的大小為又3<λ4<λ5<λ6。如第i :=,於照射角幻附近,可由較小的波長又而” 、斤:起因於損傷之高階繞射★ D2,於照射角Ο附 i ’可由較大的波長又而明顯的檢測出起因於損傷之高階 317320 13 1275774 知射光D2。 物3的!山/(端^傷檢查裝置1不僅可詳細檢查被檢查 可配入h之圓周方向,亦可詳細檢查厚度方向,並且 貝傷的特性,改變所照射的同調光0的波長λ來進 因此’可檢查出損傷的位置、大小、範圍及種類。 (弟2實施型態) Η ? 11圖係顯示本發明的第2實施型態,乃以垂 剖切端部傷檢杳梦&, λ / ί . κ first hand slave 10, for example, according to the lenticular lens = and Freyn lens (6) a series of concentrating and diffusing lens series switching methods. In addition, the light-emitting portion 4 can also have such a function In addition, the 'light-emitting part 4 can be shot; ^, 士, ι Ί in the wavelength of the same length of the dimming C, can be borrowed: shrink: C. Therefore, because of the absorption is too large to identify the damage. Figure 2 shows : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : 9 is not 'hunting by changing the wavelength and 'can be detected by the wavelength λ2, the damage can not be detected in the long 。. The first diagram shows the pattern of changing the wavelength and changing the illumination angle 0 of the light-emitting portion 4 When the wavelengths are λ3, λ4, λ5, and Α6, the magnitude of each wavelength Α is 3 < λ4 < λ5 < λ6. If i = :=, near the illumination angle, the smaller wavelength can be Jin: High-order diffraction caused by damage ★ D2, detected at the illumination angle i i ' can be detected by a larger wavelength Because of the damage, the high-order 317320 13 1275774 knows the light D2. The object 3! Mountain / (end wound inspection device 1 can not only check the circumferential direction of the inspection can be assigned to h, but also the thickness direction, and the shell injury The characteristic is to change the wavelength λ of the illuminating coherent light 0 so that the position, size, range and type of the damage can be checked. (Different 2 implementation) 11 11 shows the second embodiment of the present invention. Is to cut the end of the injury and test the nightmare &

於與上述實施二斤採=3。於此實施型態中,對 號並省略=用的構件為共通者,賦予相同的符 部:'=態r傷檢查裝置13’係具 18。發光部 14、15、16、17、丨 8 # 於被檢查物3的厚度方向呈略為相等的角係 :==源9及聚光手段…可照射第1焦點I: A之被檢查物3的端部3a。In the implementation of the above two pounds = 3. In this embodiment, the components that are referenced and omitted = are common, and the same components are assigned: '= state r injury inspection device 13'. The light-emitting portions 14, 15, 16, 17, and 丨8 # are slightly equal in the thickness direction of the test object 3: == source 9 and condensing means...the first focus I: A can be irradiated with the object 3 End 3a.

如此’即使發光部無法藉由移動手段來移動至奸杳 勿3的厚度方向,也可藉由配置複數 欢一 方向詳細檢查被檢查物3的端部2们’而同樣地於厚度 以上係參照圖式來詳細說明本發明的 具體的構成並不限定於此實施型態,亦人 4 ’、旦疋 發明的主旨之範圍的設計變更等。 3 不脫離本 上述係顯示出,藉由發光部的聚光 圍11於被檢查物3的端部3a的厚户方2 :妝射乾 子,但是並孫定於此。即使,料^度小之例 1早父大,也可藉由 317320 14 •1275774 在厚度方向改變照射範圍而使光的強度R相對的改變,因 此可辨識出損傷。此外,藉由從不同的角度照射同調光於 相同的照射範圍,可使反射光的強度,因位於照射範圍之 才貝知的狀態之不同而產生差距。利用此差距,可間接的檢 、J出損&的狀怨(大小及角度等)。此外,關於遮光手段$, 久开/成為將遮敝帶貼附於橢圓鏡2而成者,但並不限定於 此。只要為至少遮蔽住正向反射之低階繞射光D1即可, 例如,亦可於被檢查物3的端部3a及光源9之間,在與被 ,J物3的面直交之垂直方向,將做為空間濾光器而由特 定寬度的板材所構成之遮光板,與橢圓鏡2的内面抵接而 配置。藉此,低階繞射光D1可由遮光板來遮蔽,並且高 U光D2可從遮光板之外射出,並藉由橢圓鏡2來聚 光0 (產業上之可利用性)In this way, even if the light-emitting portion cannot be moved to the thickness direction of the adultery by the moving means, the end portions 2 of the inspection object 3 can be inspected in detail by arranging a plurality of directions, and the thickness is referred to in the same manner. The specific configuration of the present invention is not limited to the embodiment, and the design changes of the scope of the gist of the invention are also described in detail. 3, the present invention is shown in Fig. 2, the condensed area 11 of the light-emitting portion is formed on the thick portion 2 of the end portion 3a of the test object 3, but the sun is fixed here. Even in the case of the case where the material is small, the early father is large, and the intensity R of the light can be relatively changed by changing the irradiation range in the thickness direction by 317320 14 • 1275774, so that the damage can be recognized. In addition, by illuminating the same illumination range from different angles, the intensity of the reflected light can be made different due to the difference in the state of the illumination range. By using this gap, you can indirectly check, J damages and grievances (size and angle, etc.). Further, the light-shielding means $ is a long-opening/attachment of the concealer tape to the elliptical mirror 2, but is not limited thereto. For example, the low-order diffracted light D1 that shields at least the forward reflection may be disposed, for example, between the end portion 3a of the test object 3 and the light source 9, in a direction orthogonal to the surface of the object 3, A light shielding plate made of a plate having a specific width as a spatial filter is placed in contact with the inner surface of the elliptical mirror 2. Thereby, the low-order diffracted light D1 can be shielded by the visor, and the high U-light D2 can be emitted from outside the visor and condensed by the elliptical mirror 2 (industrial availability)

、由於可將發光部所照射出之同調光的照射範圍,改變 • 至被檢查物的厚度方向’因此可特定出被檢查物的厚度方 向之損傷的詳細位置以及損傷的大小。 又 【圖式簡單說明】 广圖係顯示以垂直面來剖切本發明的第工實施型態 之&部傷檢查裝置之縱向剖面圖。 、 第2圖係顯示以水平面來剖切本發明的第Since the irradiation range of the same dimming light irradiated by the light-emitting portion can be changed to the thickness direction of the object to be inspected, the detailed position of the damage in the thickness direction of the object to be inspected and the size of the damage can be specified. Further, the drawings show a longitudinal sectional view of a & section injury inspection apparatus of a first embodiment of the present invention in a vertical plane. Figure 2 shows the section of the invention cut in a horizontal plane

之端部傷檢查裝置之縱向剖面圖。 貝她H 昭 第3圖係顯示以本發明的第1實 、也i怨之發光部炎日彳 射被檢查物的端部之說明圖。 木〃 317320 15 1275774 實施型態之發光部所照 〇 實施型態之發光部所照 第4圖係顯示由本發明的第1 射之被檢查物的端部之放大正面圖 第5圖係顯示由本發明的第1 射之被檢查物的端部之放大剖面圖 第6圖係顯示由本發明的第i實施型態之 射之被檢查物的端部之放大正面圖。 斤如A longitudinal sectional view of the end injury inspection device. Fig. 3 shows an explanatory view of the end portion of the object to be inspected by the first embodiment of the present invention. 〃 317320 15 1275774 The light-emitting unit of the embodiment of the light-emitting unit according to the fourth embodiment shows the enlarged front view of the end of the first object to be inspected according to the fourth embodiment of the present invention. Fig. 6 is an enlarged front elevational view showing the end portion of the test object to be inspected by the i-th embodiment of the present invention, in an enlarged cross-sectional view of the end portion of the first object to be inspected. Jin

第7圖係顯示由本發明的第1實施型態之發光部❹ 射之被檢查物的端部之放大剖面圖。 斤^ ▲第8圖係顯示在將照射範圍改變至本發明的第卜 型態之厚度方向時’由光檢測部所檢 “ 圖式。 』®日J、、口禾的一例之 第9圖係顯示在改變本發明的 的同調光(c〇h_Llght)的波=之所照射 出的結果的-例之圖式 長^由光檢測部所檢測Fig. 7 is an enlarged cross-sectional view showing an end portion of the test object which is irradiated by the light-emitting portion of the first embodiment of the present invention.斤^ ▲ Fig. 8 shows the pattern of 'detected by the light detecting unit' when the irradiation range is changed to the thickness direction of the type of the present invention. 』®J, and the ninth example of the mouth The pattern length of the example in which the result of the wave of the same dimming (c〇h_Llght) of the present invention is changed is detected by the light detecting portion.

第10圖係顯示在藉由本發明的第i實施型態之複數個 同調光’將照射範圍改變至厚度方向時,由光檢測 斤檢測出的結果的一例之圖式。 山第11圖係顯示以垂直面來剖切本發明的第2實施型態 <端部傷檢查裝置之縱向剖面圖。 【主要元件符號說明】 1、13 端部傷檢查裝置 2 2a 内侧 2b 2c 頂點部 2d 4 、 14 、 15 、 16 、 17 、 18 橢圓鏡 鏡面 缺口 發光部 317320 16 1275774 · 3 a 端部 5 光檢測部 6a 轉動軸 8 遮光手段 10 聚光手段 12 遮光板 B 第2焦點位置 D、Dl、D2 折射光 中心點 0、0p照射角 3b 損傷 6 保持部 7 移動手段 9 光源 1卜 1 la、11〇、1 lp A 第1焦點位置 C 同調光 L 軸線 P 上方位置 照射範圍 λ、λΐ至λ6 波長Fig. 10 is a view showing an example of a result detected by the photodetector when the irradiation range is changed to the thickness direction by the plurality of coherent lights in the i-th embodiment of the present invention. Fig. 11 is a longitudinal cross-sectional view showing the second embodiment of the present invention, in which the end injury inspection device is cut, in a vertical plane. [Description of main component symbols] 1, 13 End injury inspection device 2 2a Inside 2b 2c Vertex 2d 4, 14 , 15 , 16 , 17 , 18 Elliptical mirror notch light emitting part 317320 16 1275774 · 3 a End 5 Light detection Part 6a Rotating shaft 8 Shading means 10 Concentrating means 12 Light blocking plate B Second focus position D, Dl, D2 Refraction light center point 0, 0p Irradiation angle 3b Damage 6 Holding portion 7 Moving means 9 Light source 1 Bu 1 la, 11 〇 , 1 lp A 1st focus position C Same as dimming L axis P above position λ, λ ΐ to λ6 wavelength

17 31732017 317320

Claims (1)

1275774 日修(t)止脊姻 第 94127086 申清專利範圍修正本 (95年12月1日) 1· 一種端部傷檢查裝置,係具備:於内側具有鏡面之橢圓 鏡;朝向配置於該橢圓鏡的第〗焦點位置附近之被檢查 物的端部照射同調光之發光部;配置於上述橢圓鏡的第 2焦點位置,可檢測出由所照射之上述同調光於上述被 檢查物的上述端部以及於上述橢圓鏡產生反射而到達 上述第2焦點位置之繞射光之光檢測部;以及,將上述 射光中產生正向反射之低階繞射光加以遮光之遮光 手段,其特徵為: 、上述發光部係藉由移動手段,可在上述被檢查物的 上述厚度方向自由地設定上述發光部的位置,並將上述 同調光照射於上述被檢查物的上述端部之上述厚度方 向的不同之照射範圍。 肇2.-種端部傷檢查裝置,係具備:於内侧具有鏡面之擴圓 鏡;朝向配置於該橢圓鏡的第〗焦點位置附近之被檢查 物的端部照射同調光之發光部;配置於上述橢圓鏡的第 2八焦點位置,可檢測出由所照射之上述同調光於上述被 檢查,的上述端部以及於上述橢圓鏡產生反射而到達 j述第2焦點位置之繞射光之光檢測部;以及’將上述 繞射光中產生正向反射之低階繞射光加以遮光之遮光 手段,其特徵為: 於上述被檢查物的上述厚度方向之不同位置設置 317320修正本 1 1275774 Γ ^; 複數個上述發光部^ 上述同調光照射於上述被檢查物的上述端部之上述厚 度方向的不同之照射範圍。 3·如申請專利範圍第1項戋笫2馆 ^ 貝飞罘2項之端部傷檢查裝置,其 中,上述發光部係具備··發出上述 ^ 叔3=1上述同调先之光源;以及, 對该光源所照射出的同調光產 η 士 、 门尤屋生先孥作用,而將上述照 ί冰π u κ 述鳊部之厚度方向予以縮 小來照射之聚光手段。 Π 4·如申請專利範圍第1 ★ t , ,貝飞罘2項之端部傷檢查裝置,其 〒上述發先部可照射不同浊 5·如申社直制…U/皮長之上述同調光。 甲明專利範圍第3項之端部作 發光部可昭射不πμ w查裝置’其中,上述 "、、射不冋波長之上述同調光。 # 317320修正本 21275774 日修(t)止脊婚941287086 Shen Qing Patent Range Revision (December 1, 1995) 1 · An end injury inspection device with an elliptical mirror with a mirror on the inside; the orientation is placed on the ellipse An end portion of the inspection object in the vicinity of the first focus position of the mirror is irradiated with the light-emitting portion of the dimming light, and is disposed at the second focus position of the elliptical mirror, and is capable of detecting the same light that is irradiated to the end of the inspection object And a light detecting unit that reflects the diffracted light reaching the second focus position and a light blocking unit that shields the low-order diffracted light that generates forward reflection in the light, and is characterized in that: In the light-emitting portion, the position of the light-emitting portion can be freely set in the thickness direction of the test object by the moving means, and the uniform light can be irradiated onto the end portion of the test object in the thickness direction. range. The 端2.-type end injury inspection device includes: a flared mirror having a mirror surface on the inner side; and a light-emitting portion that emits the same dimming light toward an end portion of the inspection object disposed near the first focus position of the elliptical mirror; At the second eight-focus position of the elliptical mirror, the end light that is irradiated by the illumination and the light that is reflected by the elliptical mirror and reaches the second focus position can be detected. a detecting unit; and a light shielding means for shielding the low-order diffracted light that causes forward reflection in the diffracted light, wherein: 317320 is modified at a different position in the thickness direction of the object to be inspected; The plurality of light-emitting portions are irradiated to the different irradiation ranges of the end portions of the inspection object in the thickness direction. 3. The end-inspection inspection device of the second item of the patent application, item 2, 2, and 2, the above-mentioned light-emitting unit is provided with the above-mentioned light source; The concentrating means for illuminating the thickness direction of the 鳊 冰 u 屋 屋 照射 对该 对该 对该 对该 对该 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Π 4·If the patent application scope is 1st ★ t , , the end injury inspection device of the 2 items of Beifei ,, the 发 〒 〒 可 可 可 · · · · · · · · · · · · · 申 申 申 申 申 U U U U U Light. The end portion of the third item of the patent scope of the patent can be used to illuminate the device without the πμw inspection device, wherein the above-mentioned ", and the wavelength of the same wavelength are the same. # 317320修正本本2
TW94127086A 2005-08-10 2005-08-10 Edge defect inspection apparatus TWI275774B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94127086A TWI275774B (en) 2005-08-10 2005-08-10 Edge defect inspection apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94127086A TWI275774B (en) 2005-08-10 2005-08-10 Edge defect inspection apparatus

Publications (2)

Publication Number Publication Date
TW200706828A TW200706828A (en) 2007-02-16
TWI275774B true TWI275774B (en) 2007-03-11

Family

ID=38646048

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94127086A TWI275774B (en) 2005-08-10 2005-08-10 Edge defect inspection apparatus

Country Status (1)

Country Link
TW (1) TWI275774B (en)

Also Published As

Publication number Publication date
TW200706828A (en) 2007-02-16

Similar Documents

Publication Publication Date Title
JP4457100B2 (en) Lighting device
JP2006268878A5 (en)
US10495804B2 (en) Optical plate, light irradiation device, light measurement device, light irradiation method, and light measurement method
CN101443654A (en) Surface inspection apparatus
JP4663725B2 (en) Edge inspection equipment
CN103105403A (en) Method and device for detecting surface defect of transparent optical component
TW201807400A (en) Dark field wafer nano-defect inspection system with a singular beam
JP6487617B2 (en) Defect inspection method and defect inspection apparatus for microlens array
CN106415247A (en) Illuminating device for inspection, and inspection system
TWI756287B (en) Method and apparatus for inspecting defects on transparent substrate and method of emitting incident light
TWI275774B (en) Edge defect inspection apparatus
EP2137518B1 (en) Through-substrate optical imaging device and method
KR20100053038A (en) Apparatus for detecting wafer crack and method for detecting wafer defect
JP2021106208A (en) Silicon wafer defect inspection method and silicon wafer defect inspection system
JP2008096187A (en) Edge-part flaw inspecting device
TWI282853B (en) Edge defect inspection apparatus
JP5938981B2 (en) Projection system
JPH063625A (en) Inspection device
JP2010098328A5 (en)
KR101157081B1 (en) Illumination device and substrate inspection apparatus including the same
JP2010091428A (en) Scanning optical system
JP4663724B2 (en) Edge inspection equipment
JP3142494U (en) Dark field illumination detector
JPH0783845A (en) Inspection device
KR20080023183A (en) Apparatus for the optical detection of a surface defect of a substrate

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees