TWI275107B - Electrical devices and process for making such devices - Google Patents

Abstract

A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7, 8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1) in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, and making a plurality of electrical connections (31, 51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.

Description

A7 B7 Ministry of Economic Affairs Intellectual Property Office Employees Consumption Cooperative Printed 1275107 V. INSTRUCTIONS (1) 1. [Technical Field of the Invention] The present invention relates to an electrical device and an assembly, and a method of manufacturing such a device and assembly. 2. [Prior Art] 5 A circuit protection device comprising a conductive polymer composition having a positive temperature coefficient (PTC) is well known. Such devices are intended for use in the surface mounting of substrates such as printed circuit boards, as disclosed in U.S. Patent Nos. 5,831,510 (Zhang et al.), 5,852,397 (Chan et al.), and 5,864,281 (Zhang et al.), and International Publication No. No. 94/01876 (Raychem, Division 10) and 95/08176 (Reiken), the disclosures of which are hereby incorporated by reference. The circuit protection device generally comprises first and second layered electrodes; a layered PTC resistance element is sandwiched between the two electrodes; and a third (remaining) layered conductive member is firmly fixed to the second of the PTC element. The same surface of the electrode but spaced apart from the second electrode; and a crossover conductor that passes through the aperture of the PTC 15 element and joins the third conductive member to the first electrode. This allows the same side of the device to be connected to the two electrodes so that the device can be flatly attached to a printed circuit board with the first electrode attached to the top without any leads. The resistive element preferably comprises a layered element composed of a PTC conductive polymer. The preferred device includes an additional conductive member and an additional cross-conductor so that the device is symmetrical and can be placed on the circuit board in either manner. A composite device can be formed when two of the devices are physically joined together in a stacked configuration. Such a composite device has the same small "footprint" of a single device on a printed circuit board, i.e., occupies a small area, but has a lower resistance than can be easily produced using a single device.

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^75107 Furthermore, the power dissipation of such a composite device is substantially independent of the power dissipation of one of the individual devices. As a result, the composite device has a lower resistance to a specified holding current, where "maintaining current" is the maximum current that can pass through the device without causing a device error. 5 III. [Inventive content] The Ministry of Economic Affairs' Intellectual Property Office employee consumption cooperative is printed as described in International Patent Publication No. WO99/53505 (Reken Company, Announcement, October 21, 1999), and its disclosure is described in For reference, the composite device can be prepared by sorting individual devices and then assembling the sorted devices into a composite device. This process is lengthy because it requires reading 1 to take the resistance of the individual devices. The inventors have found today that a layer assembly can be prepared in accordance with the present invention whereby the assembly can be divided into individual composite devices. Such an assembly allows for the simultaneous preparation of a large number of composite devices. Moreover, the method described herein thus allows the layers of the assembly to be patterned before or after fabrication into the assembly, so that the same starting layer can be prepared into a variety of different devices. In addition, the combination of layers is easily changed, allowing 15 to simply enhance the device having the combined function. Multiple interconnect architectures between layers can be easily implemented, and devices with a variety of external electrical contacts can be fabricated without changing the basic process. All of the herein described further increase the broad range of different devices that can be mass produced in an inexpensive manner by the methods disclosed herein. The present invention provides a method and a sequence of steps for performing a plurality of operational steps in an assembly, which are obtained by re-dividing into a composite device in the x and y directions (where X and y are corresponding to the planar direction of the layered pTC element) Device. The preparation of the apparatus in this manner is a significant improvement over other methods, such as that described in International Publication No. WO99/53505, because for the purposes of the present invention, individual devices need not be individually assembled, increasing efficiency and thereby reducing the manufacturing process.

This paper scale applies to China National Standard (CNS) A4 specification (210x297 mm) A7 1275107 B7 V. Invention description (3). Finally, the method of combining the various layers of materials to form the composite device disclosed herein allows for an extremely simple and suitable method for forming a variety of devices without changing the basic manufacturing process. In a first feature aspect, the present invention provides a method of fabricating a composite polymer 5 circuit protection device, the method comprising: (1) providing a polymer assembly comprising (a) providing first and second laminates, each laminate comprising a The layered polymer element has at least one conductive surface, (b) providing a conductive material pattern on at least one side of a laminated conductive surface; (C) firmly fixing the layer in a stack in a predetermined configuration, at least one layer of at least one layer a conductive surface forming an outer conductive surface of the stack, and (d) fabricating a plurality of electrical connections between the conductive surface of the first buildup and the conductive surface of the second buildup; and (2) subdividing the stack into individual devices, Each of the devices includes at least one electrical connection. In a second feature aspect, the present invention provides a polymer assembly, packaged by the Ministry of Economic Affairs, Intellectual Property Office, and a consumer cooperative cooperative. 20 (a) - the first laminate comprises a layered polymer element having at least one conductive surface (b) - the second laminate comprises a layered polymer element having at least one conductive surface patterned, the second laminate being firmly fixed to the first laminate of the stack, such that the laminate has first and second outer conductive surfaces Apply the Chinese National Standard (CNS) A4 specification (210x297 mm) on the paper scale. 5. Inventive Note (4) and (C) The plurality of transverse conductive members are between the first and second external conductive surfaces. The second laminate is in the form of a conductive surface formed by using the method of the present invention or the total electrode precursor on the resistive element, wherein the resistive component is larger than the predetermined final shape, and the formed surface is formed by the formation of the surface. Also greater than the predetermined final shape: the stack of resistive elements is divided into individual skirts. An electrode having a suitable shape is used to subdivide the stack by any one of 10 15 20 or any undesired portion of the combination i! Take: the conductive surface is ground, or etched, for example. Injury, ° can be removed by chemical vapor, Wei, and spatter. == The drive can be patterned via any of the PTC resistive elements or any of the electrical materials. Adhesives or systems can also be used. The expansion of the family and the formation of the mouth. Conductive material The surface of the mi PTC resistive element. The electrical interconnection between the eight sets of conductive surface combinations can be achieved before the stack is re-set. Alternatively, some or all of the predetermined electrodes or contacts = electrical connections may be made after the stack is subdivided into composite devices. The electrical interconnects can be designed to be joined, but not all, between the conductive surfaces of the stack or portions of the electrodes of the device. In a second feature aspect, the present invention provides a composite device which can be fabricated, for example, using the method of the first aspect of the invention or the assembly of the second aspect. The device comprises (1) first and second outer layered electrodes, (2) Third and fourth internal layered electrodes, (3) First and second layered pTC resistor elements, individually (1) with -6- This paper scale applies to China National Standard (CNS) A4 specification (210x297 mm) A7 1275107 B7 5. Invention Description (5) The PTC surface, and (ii) comprises a layered element composed of a PTC conductive polymer, the first resistive element having a first surface to which the first external electrode is firmly fixed, and The third internal electrode is fixedly fixed to the opposite second 5th surface, and the second resistive element has a second surface fixedly fixed by the second external electrode and a second opposite surface fixedly fixed by the fourth internal electrode, (4) a fifth outer layered conductive member, wherein (1) is firmly fixed to the first surface of the first PTC resistance element, and (ii) is separated from the first external electrode by 10, (5) - a sixth outer layered conductive member, (1) is firmly Fixed to the second PTC resistor element The first side, and (ii) is separated from the second outer electrode,

(6) - a seventh internal layered conductive member, (1) firmly fixed to the second side of the first PTC 15 resistive element, and (ii) separated from the third internal electrode, printed by the Ministry of Economic Affairs Intellectual Property Office employee consumption cooperative (7) - an eighth inner layered conductive member, (i) firmly fixed to the first surface of the second PTC resistance element, and (ii) spaced apart from the fourth inner electrode, 20 (8) - the first aperture passes Between the first external electrode of the first layered PTC element and the second external electrode of the second layered PTC element, (9) a second aperture which is interposed between the fifth outer layer of the first layered PTC element Between the sixth outer layered conductive member of the second layered PTC element, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). l275l〇7

V. Description of the invention (Printed by the Consumers' Cooperative of the Intellectual Property Office of the Ministry of Economic Affairs, do)—The first lateral conductive member (a) is located inside the first aperture, and the first external layer of the first layered PTC element is a layered PTC element. Between the second external electrodes. Brother - (4) firmly defined in the first PTC element, the second third layered element, and 70 pieces and = physical square material to the first - outer · seventh inner layered conductive member, the eighth inner layered conductive member And a first outer layered electrode 'but not connected to the third or inner electrode, and (11) a second lateral conductive member (a) located inside the second aperture, (b) 2 fifth outer layered conductive member and a sixth outer layered guide (4) firmly secured to the first PTC element, the second PTC element, and the second layered polymer layer, and (4) physically and electrically coupled to the fifth outer layered conductive member, the third inner electrode The fourth internal electrode and the sixth outer 20 layered conductive member, but not connected to the fourth or second external electrical system 2, the fourth feature aspect, the present invention provides a money according to the present invention, The method, the manufacturing of the composite device, the electrical component attached; the device. These components may be attached to the assembly before the assembly is subdivided into individual devices, or attached to the device after subdivision. 5 10 15 This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm). Four electric 1275107 A7 B7 V. Invention description (〇10 15 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 20 in the fifth In a feature aspect, the invention provides a composite device in accordance with the method of the features of the present invention, the device comprising an additional conductive layer on at least a portion of at least a face of the outer conductive surface.形成形成-Electrical connection pad 妓 - can be connected to the lining to attach the lining for attachment of the electrical component. The invention comprises a device made by the method of the fourth and fifth aspects of the invention.方式] 'A person as described later and patent application and as illustrated in the accompanying drawings, the present invention is more than a feature. Here, the feature is disclosed or disclosed in a certain context. The invention may also be used in other contexts and other combinations including any combination of features. The composition and apparatus of the present invention generally comprise at least a layered polymer element or a resistive element comprising a PTC composition having Positive temperature coefficient (PTc) performance 'is also in a relatively small temperature range, the resistivity can be significantly increased with temperature, "PTC" - then here the group = or the device has a rm value of at least 2.5 and / or The value of Ri(9) is at least 1〇, and the preferred compound or device has a value of 113() of at least 6, where Ri4 is the resistivity ratio of the end point and the starting point of the ^c range, and Ri(9) is in the range of 1〇〇. The ratio of the resistivity of the end point and the starting point is the ratio of the resistivity of the end point and the starting point of the range of 3 (the PTC composition used in the present invention is preferably a conductive polymer comprising a crystalline polymer component, Dispersing a granular filler component in the polymer component contains a conductive filler such as carbon black or metal. The filler component also contains -9- This paper scale applies to the Chinese National Standard (CNS) A4 specification (210 x 297 mm ^ —-- -

1275107 A7 B7 V. INSTRUCTIONS (8) Non-conductive fillers that not only alter the electrical properties of the conductive polymer but also change the physical properties. The composition also contains one or more other ingredients such as an antioxidant, a crosslinking agent, a coupling agent, a flame retardant, or an elastomer. The PTC composition preferably has a resistivity of less than 50 ohm-cm 5 m at 23 ° C, particularly less than 10 ohm-cm, especially less than 5 ohm-cm. Suitable conductive polymers for use in the present invention are disclosed, for example, in U.S. Patent Nos. 4,237,441 (van Konynenburg et al.), 4,304,987 (van Konynenburg et al.), 4,514,620 (Cheng et al.), 4,534,889 (van Konynenburg et al.), 4,545,926 ( Fouts et al., 10 4,724,417 (Au et al.), 4,774,024 (Deep et al.), 4,935,156 (van Konynenburg et al.), 5,049,850 (Evans et al.), 15 5,378,407 (Chandler et al.), 5,451,919 ( Chu et al., 5, 582, 770 (Chu et al.), 5, 747, 147 (Wartenberg et al.) and 5, 801, 612 (Chandler et al.), and U.S. Patent Application Serial No. 09/364,504 (Isozaki et al., filed 1999) July 3〇曰). The disclosures of these patents and applications are hereby incorporated by reference. Additionally the PTC composition can be a ceramic material. Layered Element #Ministry of Economics Intellectual Property Office Staff Consumer Cooperative Printed 20 The device of the present invention preferably comprises a PTC button element which is a layered element and which may be comprised of one or more conductive polymer members, at least - the guide member is made of a PTC material composition. When there is more than one type of conductive polymer ,, the current preferably flows sequentially through the different compositions, e.g., as the various forms extend across the entire device. t has a single-PTC composite 曰 element of the predetermined thickness is greater than the single-step can be easily prepared thickness, with -10- A7 B7 1275107 five 'invention description (9) PTC element with a predetermined thickness can be conveniently passed through the second or Multilayers such as melt extruded layer PTC compositions are prepared by combining heat and pressure laminates. When there is more than one PTC composition, the PTC elements are typically joined together by, for example, laminating different composition elements using heat and pressure. The assembly of the present invention comprises first and second laminates and includes additional laminates. The first and first laminates each comprise a layered polymer element having at least one electrically conductive surface, for example in the form of a metal foil electrode as described below, in this specification,

Each layer refers to a layer. The layered elements of the first and second laminates comprise the same composition of the PTC 10 composition, or the layers comprise different PTC compositions. For example, PTC compositions having different resistivities can be used, with the interconnect structure revised to a layer as a heater and the second layer as an overcurrent protection device. Each layer also contains a PTC composition having different exchange temperatures (i.e., the device is switched from a low resistance state to a high resistance state). For example, such a device can be used to form a 15-layer PTC temperature sensor, one layer being most sensitive to the lower temperature range and the second layer being most sensitive to the higher temperature range. In addition, one or more of the layers includes a zero temperature coefficient of resistance (ZTC) composition or a negative temperature coefficient of resistance (NTCS) composition. 0 The layers do not need to include a conductive layer. For example, other compositions useful for laminating elements of composite 20 comprise a dielectric material such as a polyester or a filled dielectric material such as FR4 epoxy. It can be used as an insulating layer to provide additional rigidity to the unit, or the material can be selected to aid in erection and packaging. In addition, the layered 7L member comprises a combination of a surface erection device which has a relatively high thermal conductivity and which can assist in the heat transfer between the layers of the complex sigma or the substrate and the composite.

Ministry of Economic Affairs, Intellectual Property Bureau, X Consumer Cooperatives, Printing -11- 1275107

10 15 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 20 layers of heat transfer. Conversely, the layered element comprises a composition-residue having a relatively low thermal conductivity as a thermal barrier between the layers. When it is desired that the device can respond to an overvoltage, the layer is normally insulated but becomes conductive when a certain voltage threshold level is reached. Such a composition comprises varistor particles dispersed within the polymerization. Other compositions useful in various embodiments of the present invention include flame retardants, expansion agents, and microwave absorbing materials that allow the device to use radiant heating at a particular frequency range. The thickness of the layered components used to form the composite device can vary. For example, an extremely thin layered element can be used as a single layer to provide very low resistance, while a thicker layered element can be used as a second layer to provide mechanical strength. Electrodes and Thunderbolts A particularly useful apparatus made by the method of the present invention comprises at least two metal foil electrodes with a polymeric element sandwiched therebetween. A particularly useful apparatus comprises a stack comprising η kinds of polymer ΡΤ (: elements each having two metal foil electrodes ' and (n-1) an adhesive layer interposed between pTC elements in a staggered pattern to form a composite device PTC element comprises Stacked top and bottom assemblies. Such devices have electrical connections to the electrodes, so that the PTC elements will be connected in parallel, resulting in a composite device having low resistance, typically less than 10 ohms, preferably less than 5 ohms at 20 ° C. Preferably less than 1 ohm, especially less than 〇5 ohm, and lower resistance is also possible, for example, below 〇·〇5 ohm. A particularly suitable foil electrode is a micro-rough metal foil electrode, particularly disclosed in U.S. Patent No. 4,689,475 ( Matthiesen) and 4,800,253 (Kleiner et al.) and International Patent Publication No. WO95/34081 (Reken Company, Announcement 曰 December 1995 • 12- This paper scale applies the Chinese National Standard (CNS) A4 specification (210x297 mm) )

A7 B7 1275107 V. Description of the Invention (n) M-day), which is hereby incorporated by reference. The electrodes can be modified to produce a pre-heating effect, thereby providing electrical contact points to the various interconnection points between the various layers of the composite device to achieve a predetermined function, and providing electrical contacts for mounting the device on a printed circuit board, receptacle, wafer or other Proper use. A composite device incorporating multiple inner and outer contact points, such as the one shown in Figures 16 through 20, 22 and 23, can be used to form a conductive surface of the polymer assembly. Alternatively, the conductive surface can be formed from a conductive ink, a metal layer that is sputtered or otherwise applied, a metal mesh, or other suitable layer. Particularly preferred conductive surfaces are etchable surfaces such as for patterning and/or easy soldering of the surface. The laminated conductive surface has a resistivity at 25 C that is at least 1 times lower than the resistivity of the attached polymer component at 25 °C. " , the pattern on the two sides of a specified layer can be the same or can be different. The additional pattern may be formed at any point of the process, for example, forming a stack (four) obliquely formed on the second conductive outer surface, or as an attachment to the inner conductive surface prior to completion of the stack assembly. The term "pore" printed by the Intellectual Property Office of the Ministry of Economic Affairs of the Fork Conductor Ministry of Economics is used to denote an opening here, when viewed at right angles to the plane of the device, 20 (a) has a closed section such as a circle. , _ or a rough polygon, or (b) a section of ''concave man''''''''''''''' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' Times, especially good at least 12 times, such as quarter circle or semicircle or open slot, and / or at least -13 - this paper size applies to China 6 standard (CNS) A4 specifications (21〇X 297 public Chu ) Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 1275107 A7 B7 V. Invention Description (I2) The two opposite edges of the section here are parallel to each other. Since the present invention relates to an assembly that can be divided into a plurality of electrical devices, the apertures typically have a closed cross-section, but if - or more of the dividing lines pass through the apertures of the closed cross-section, the apertures of the resulting device will have an open cross-section. Although for some of the 5 specific embodiments, it is desirable that the open cross section is a recessed section as previously defined, but to ensure that the crossover conductor through the aperture will not be damaged or loosened during installation or use of the device 'for other specific embodiments Preferably, the cross-conducting system is on the laterally flat surface of the device. In order to manufacture such a device, it is preferred (to be divided into a plurality of devices) having a plurality of elongated rectangular apertures such as slots and each of which has its own metal clock applied thereto. The assembly is then divided into ore-filled transverse conductive members on a plurality of devices. The pores of the thousand assemblies may have different sizes and/or shapes, configurations of the mating device, and current carrying capacity. The pores may be round holes. The round holes are satisfactory for many cases, but if the assembly 15 includes pores, the pores are traversed by at least one dividing line, the elongated pores are preferred because of the dividing line. The accuracy requirement is lower. > When the pores are not traversed by the age line, it is as small as possible for the parent fork conductor having the desired current carrying capacity. Usually a single cross and a conductor are all required to electrically connect the first electrode to the opposite side of the device. However, two or more cross conductors 20 can be used to make the same link. The number of conductors and their heat capacity have an impact on the failure rate of the circuit protection device. Usually the pores and the cross-conductors extend across all layers of the assembly. In addition, the apertures and the conductors may extend only over certain layers of the assembly to form devices having different functions. The gap can be formed before the placement of the conductor and the positioning of the conductor or the formation of the pores _- -14- The paper scale depends on the Zhongguan family standard -----

1275107 One - five, H呑 brother Ming U3; the placement of the cross conductor can be carried out simultaneously. The preferred procedure is to form apertures, such as by drilling, dicing, routing, or any other suitable technique, and then plating or otherwise coating or filling the inner surface of the aperture. Plating can be carried out by electroless plating or electrolytic plating or a combination of the two. The plating may be a single layer or a plurality of layers and may be composed of a single metal or a mixture of metals, particularly a solder. Plating is often formed on other exposed conductive surfaces of the assembly. If such plating is not desired, the other exposed conductive surfaces may be masked or otherwise desensitized, or may be selectively removed unless desired. The present invention includes the possibility that the mineral deposit not only produces a cross conductor but also produces at least a portion of the layered conductive member of the device. 10 Plating techniques for fabricating conductive vias through an insulated circuit board can be used in the present invention. Another technique for providing a cross-conductor is to place a moldable or liquid conductive composition in a preformed void, if desired or if the desired conductive composition is used to treat the composition within the pore, thereby producing a crossover having predetermined properties. 15 conductors. The composition can be selectively supplied to the pores, e.g., using a screen, or if desired, to pre-treat at least a portion of the assembly so that the composition does not stick to the entire assembly. For example, if desired, the molten conductive composition and solder can be used in this manner using wave soldering techniques. The parent fork V body can also be provided by a preform, such as a metal rod or tube 20 such as a rivet. When such a preform is used, the aperture can be formed when it is positioned within the device. The cross conductor can partially or completely fill the pores. When the pores are partially filled, they are further filled (including full filling) when the device is joined to other electrical components, especially by the soldering process. Additional solder can be supplied to the pores -15- This paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X297 mm)

Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 1275107 Α7 Β7 V. Invention Description (μ or surrounding assistance, _ including solder plating on holes _ and off. Usually at least part of the cross conductor is connected before the device is connected to other electrical components Positioning. However, the present invention includes a cross-linking system formed by a capillary action of a soldering process such as a soldering process. 5 "The cross-conductor can be designed to selectively connect a partial layer, that is, a partial layer but not all, such a cross. The conductor is shown in Fig. 15. The method of manufacturing the cross conductor includes forming a void which is larger than a predetermined size of the conductor and the conductor, filling the pore with an insulating material, forming an inner pore inside the insulating material, and causing the inner hole to become Conductivity. This method insulates the inner electrode from the cross conductor but still allows the outer electrode to be electrically connected. The electrical connection between the connector electrode of the non-crossing conductor and any remaining parts on each side of the PTC resistor element is preferably Conducted via the aforementioned cross-conductor, but may be any type of conductor such as a type of conductor that remains positioned even if not bonded to other parts of the device, Example 15 such as U The glyph member is stretched around one or more layers of the combined end of the device. The remaining layer of the conductive member of the Ministry of Economic Affairs, the Intellectual Property Office, the employee consortium, and the preferred embodiment of the device include an additional (remaining) conductive member On the same side of the PTC element as the second electrode but separated from the second electrode. This remaining layered conductive member with a cross conductor or other 20 connectors can be presented to provide an electrical path to the other electrodes, the electrical path is via the removal portion The layered conductive member is formed, and the remaining portion of the layered conductive member serves as an electrode. The remaining layered conductive member may exist on the inner surface and the outer surface of the layered member. The shape of the remaining layered conductive member and the remaining member and the electrode are intermediate The shape of the gap can be changed to match the desired characteristics of the device and to facilitate manufacturing. Remaining Conductor-16- 1275107

V. Description of invention (l5 5 10 15 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 20 cattle conveniently in a rectangular device - the end is a small rectangle, separated by __ rectangle _. The remaining pieces can be borrowed - closed by the island The cross-section gap and the electrical opening. The device can also be designed to be free of residual layered conductive members, as shown in Figure 12. The other layered element # device of the H-layer PTC resistance element or the second layer of the assembly can be physically Firmly @定ed into a stack, using a third piece to form a stack between them. The third layered element contains a non-conductive material such as a hot-melt adhesive or a hardenable adhesive material, wherein the addition of the filler can be a special heat or a miscellaneous f 1 three-layered component Also included can be a monomer or inorganic system such as epoxy resin, acrylic acid, propylene, amine = formic acid vinegar, material, class, bribe, Lai Lai, etc. If required: layer as an electrical insulator 'The preferred resistivity is at least 1 () 6 ohms per meter, especially at least H) 9 ohms per centimeter, and certain embodiments contemplate that the third layered component comprises a conductive material. For this embodiment of the material, the third layered element is used to electrically and physically join the layers together. A composite device configuration incorporating a conductive third layered component is shown in FIG. For other specific examples, it is desirable that the third component comprises a conductive material that is electrically conductive only in one direction (refer to Figure 14). The third layered element also provides its thermal layer to aid in heat transfer between the various layers of the composite device. The additional device can be designed to be free of separate layers and securely hold the components of the device together. For example, a device can be fabricated which is similar to that shown in Figure 8 but with the layered element 26 removed. The cross conductors 32 and 52 can be connected in parallel by the electrical connection and the physical layers of the layers. Item 21 shows another -17- This paper scale applies to China National Standard (CNS) A4 regulations (2ΐ〇χ297 public)

Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 1275107 A7 B7 V. Invention Description (16) As an example, the composite device does not need to separate layered components between the layers. The device is shown in a simple device, as shown in Figure 5, having two external electrodes, two internal electrodes, two crossed conductors or other conductors, and four remaining conductive members. This configuration 5 is useful because the device is top-to-bottom symmetrical, allowing for easy installation by automated equipment or by other means. The circuit protection device of the present invention has a power group of 23 ° C which is less than 1 ohm, preferably less than 0.5 ohm, particularly preferably less than 0.3 ohm, especially less than 0.1 ohm, and includes first and second layered PTC resistor elements, Each of 10 (a) consists of a conductive polymer having a resistivity of less than 50 ohm-cm at 23 ° C, preferably less than 10 ohm-cm, particularly preferably less than 5 ohm cm and having PTC performance: and b) has a first side and a second side. The first outer metal foil electrode contacts the first side of the first PTC element and the second outer metal foil electrode contacts the first side of the second PTC element. The fifteenth and fourth inner metal foil electrodes contact the second faces of the first and second PTC elements, respectively. Preferably, the device has fifth and sixth remaining outer metal foil conductive members, the fifth contact first face of the first PTC component and spaced apart from the first outer electrode, and the sixth contact first face of the second PTC component and The two external electrodes are separated. There are generally seventh and eighth remaining inner metal foil conductive members, the seventh 20 contacts the second side of the first PTC element and is spaced apart from the third inner electrode, and the eighth contacts the second side of the second PTC element and The four internal electrodes are separated. The device also includes one or more additional layered polymeric elements which may be electrically conductive or insulative. One of the preferred additional components is a third layered polymer component that is insulated between the first and second PTC components and is firmly attached to the -18- paper scale for the Chinese National Standard (CNS) A4 specification (210). X297 mm)

[275107 A7 B7 V. INSTRUCTIONS INSTRUCTIONS (Γ 10 15 The Intellectual Property Intelligence Bureau Employees Consumer Cooperatives prints the exposed inner surface of a 20 ptc component, which may include the inner surface of the PTC component or its internal electrodes or internal conductive members. PTC components, electrodes And the remaining conductive members define two apertures, wherein the first aperture is between the first external electrode, the seventh and eighth inner remaining conductive members and the second outer electrode; and the second aperture is between the fifth remaining outer conductive member, Between the third and fourth inner electrodes and the sixth remaining outer conductive member, and passing through the first and second PTC elements and the third layered polymer layer (if present). Further, the device includes first and second lateral conductive members The first lateral conductive member is located inside the first aperture and is physically and electrically connected to the first and second external electrodes and the seventh and eighth internal remaining conductive members. The second lateral conductive member is located The second aperture is internally and physically and electrically connected to the fifth and sixth outer remaining conductive members and the third and fourth inner electrodes. Other device embodiments do not contain the remaining (also called Additional) Conductive members. The device of the present invention can be of any suitable size. However, one of the great advantages of the application is to minimize the size of the I. The preferred device has a maximum dimension of 12 mm, preferably at most 7 mm and/or a surface area of at most 6 G. Square millimeters, preferably up to 40 square millimeters, especially up to 3 square millimeters. The surface area can be as small as, for example, up to 15 square millimeters. Methods The method disclosed herein can be used to manufacture all or most of the methods on a stack of layers very economically. Step, and then divide the two stacks along the pass through any, part or main conductive surface or through any, part or all of the dividing line to pick up the age (four) of the financial output has read special 19 - the paper size is suitable Treasury Standard χ 2-97 公计计线1275107

5 10 15 Printed by the Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperative 20 The shape of the fixed device is straight, curved or curved. The same line, such as the electrode and the remaining part __, can also have any suitable (9) shape = before the division, the step of the family, Chang Xian Ren Cai ^, =: r part guide (four) sample; = the exterior of the electric surface pattern. However, the internal and patterning may be based on the intended function of the final device prior to assembly; the same or different from the electrical surface. For example, Figures 5, 6, 8, 9 ^ Internal Electrode' This internal electrode is a mirror image of the external electrode. Figures 1A and 18 to 2A show that the device has a built-in and a pattern that can be patterned by removing or etching the conductive material. Alternatively, the pattern can be fabricated by, for example, screen printing, seaming or depositing. It is used for some purposes: two alternating by a pair of two opposite faces taken by staggered strips to remove the physical stress of the conductive material strip. The resulting _ contains a gap or recess, the gap or (d) 卩 is suitable for the second electrode of the device and the inspection piece, separating a device from the other device to provide an assembly and subdividing into individual device demarcation lines, allowing individual lamination or assembly Stack orientations or provide markers. The cross-conductor, i.e., the electrical connection, can be formed before or after the laminate is formed into a stack. If it is desired to form a cross-conductor that does not traverse all of the stacked layers, it is convenient to form only the cross-conductors of the predetermined stack and then assemble the stack. In addition, the blind via method can be used to make a connection after stack assembly. The stacked group vibrations can be completed, for example, in multiple stages, such as preparing certain laminates and firmly fixing them together, performing a number of steps in the stacking process (for example, forming and plating a cross-conductor), and then stacking other layers. Can be firmly fixed to this section -20_ This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 public Chu) 1275107 B7 V. Invention description (l9 10 15 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 20 groups The stacking of the structure completes the assembly. The stack 4 is subdivided into composite I, which can be completed by various techniques such as sawing, shearing, cutting, day 7, weighing and de-tightening, for example, using mines, t, blades, wires, Water jet robbing, unstraining devices, lasers or complex combinations are achieved. A number of preferred methods for fabricating a single 4-layer device are disclosed in U.S. Patent No. 5,864,281. These methods are adapted to subdivide stacks, for example as herein. In addition, the method does not have a right-drying step, such as firmly fixing the stack on the stack, and using the cross-conductor to make a plurality of electric laps can be simultaneously completed. To reduce the shrinkage caused by the shrinkage during subsequent processing steps Preferably, the pattern is applied to surround at least the periphery of the laminate. The preferred pattern is produced by a method comprising 'surrounding the periphery of the laminate with a cross-sectional design such as a "W" sub-shape or a "Z"-shaped selectivity from each laminate. The at least one electrically conductive surface removes the electrically conductive material so that there is electrical continuity between the outer edges of the outer electrically conductive surface. Some or all of the outer electrically conductive surface may be covered by an insulating layer such as a solder mask or a marking material, such as disclosed in U.S. Patent No. 5,831,510. It is often useful for an external component to electrically connect a passive or active electrical component directly to the device of the present invention or to the assembly prior to the assembly of the present invention as a separate device. In such cases, the multilayer structure The function is that the circuit board 'fixes a jumper conductor to enable connection to internal components of the component and/or device. In a preferred embodiment, a single PTC laminate can be positioned between two insulating laminates in the PTC laminate. The conductive polymer component is between the two metal foil electrodes, and the insulating layer each includes - or a plurality of individual layers or films - such as epoxy semi-curing Pre-preg. -21 in foil and ink form · This paper scale applies to China National Standard (CNS) A4 specification (21〇X297 public) ά Counting line 1275107 A7 B7 V. Invention description (20) 5 10 15 Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperatives, etc. 20 such as metal layers or s other layers may be attached to the insulating layer and provided from the external conductive surface to the surface or layer or through the jumper conductor to the internal conductive surface Depending on the conductor, the components can be isolated from the conductive polymer layer. Depending on the components used and the electrical connections to the device are made by means of a connection. The connection can be, hardwired, meaning That is, the contact lining of the phase, such as soldering or mismatching, can be attributed to a long-lasting connection. Example: Springs, wiring or other components can be re-joined: π-long electrical galvanic mats usually include soldering, soldering, Often secreted on the copper, the re-joining of the copper will affect the electrical connection and/or the formation of the degraded layer, or the coating of such materials. Suitable materials = gold), and _alloys, and others for conventional two-component materials. These materials are applied by conventional printed circuit board technology. It is generally preferred to attach the permanent electrical connection pads to an outer surface of the device or combination, and the re-connectable contact pads are attached to the opposite outer surface, but the two types can be on the same side or on both sides. Depending on the heat and / or design test I. Included are electrical components that have been permanently attached thereto, and combinations or devices that include re-connectable contact pads are useful, for example, when the device is to be attached to a system, such as battery charging system. The components can be electrically passive, such as resistors, capacitors, or thermistors, or electrically active, such as control integrated circuits, field effect transistors, or shunt regulated integrated circuits. In order to provide additional support for the additional components, the internal support, emblem -22- A7 B7 1275107 V, invention description (22) is placed between 7 and 8. The stack is plated to provide tubular cross-conductors 11 in each of the apertures (and to provide a plating layer 12 on the other exposed outer surfaces of the stack). As shown, the stack can be subdivided through the tubular cross-conductor to form a cross-conductor having a semi-circular cross-section. 5 is a perspective view of the composite device 2 formed by subdividing the stack. The two-layered PTC elements 17 and 18 respectively have external electrodes 14 and 1#, external remaining conductive members 36 and 361, internal electrodes 16 and 161 and internal portions. The remaining conductive members 38 and 38', the layered PTC elements 17 and 18 are firmly fixed together using the layered member 26. The first cross member 31 and the second cross member 51 are hollow tubes formed by a plating method, wherein the exposed surface is plated with copper, and then soldered to form a first plating layer 32 on the cross member 31 and A second plating layer 52 is formed on the cross member 51. Dielectric coating 55 covers the outer surface of the device, except where it is desired to make electrical connections. The plating 12 is applied to the exposed portion of the external electrode. The inter-dashed area indicates that there is no electrode material 15 under the dielectric coating 55. Figure 6 shows a cross-sectional view of the trajectories 41 and 43 of the composite device 2 of Figure 5 soldered to an insulating substrate 9. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, Staff Consumer Cooperatives Figure 7 is a cross-sectional plan view of various composite devices shown in Figures VIII-VIII of Figures 8 through 11, 14 and 21. The dashed line indicates the portion 20 below the dielectric layer 55 in which no electrode material is present. Note that for the cross-sectional views shown in Figures 8-11, 14 and 21, the dielectric layer 55 is not shown. Figures 8 and 9 show two PTC component configurations connected in parallel. For the apparatus of Fig. 8, when the high resistance state is switched, the layered element 26 does not have a potential drop across the layered element 26 when applied to the external electrode 14 and the outer remaining conductive member 36 at the potential. However, for the -24- paper scale, the Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applicable. 1275107 A7 B7 In the device shown in Figure 9, the layered component 26 is electrically connected to the same externally in the exchange state. It has electricity across components (10). The ig shows the device variation shown in Figure 8, without the internal remaining conductive members. Figure U shows a composite device formed by a parallel connection of a layered 7L piece Π, 18 and 15), a layered element 5 26 " between 17 and 18, and a layered element 26 between 18 and 19. The device version shown has internal electrodes 16, 16, 16, and 16, and, and internal remaining conductive members 38, 38, 38" and 38,. Figure 12 is a device that does not contain the remaining conductive members. The plan view; the cut along XIII-ΧΙΠ is shown in Fig. 13. The dotted line indicates the area under the outer dielectric layer 55, where there is no electrode material. The dielectric layer is not shown in Fig. 13 and Fig. 14 is a composite formed by the method of the present invention. Apparatus wherein the cross-conductor 70 is fully extended throughout the stack of layers. To fabricate the device shown herein, the cross-conductor 59 extends only outside of the stacked layer elements and is printed by the Ministry of Commerce, Intellectual Property Office, Staff Consumer Cooperative 15 The conductive elements are then firmly fixed together using an anisotropic conductive material 57, and the conductive material 57 is only conductive in the z direction, where z represents the direction from the bottom to the top of the composite device. The conductive material 57 provides internal residual The electrical connection between the conductive members 38 and 38' and the internal electrodes 16 and 16 does not cause 38 or 381 to be short-circuited to 16 or 16. 20 Figure 15 shows a composite device in which the layered members 17 and 18 are connected in series. The pieces are firmly fixed together using a conductive material 61. The cross-conductors are fabricated in the stack and joined to a portion of the conductive faces but not all. To form such cross-conductors, pores larger than a predetermined dimension of the cross-conductors are formed through the stack. Substance 63 is filled and filled with insulator 63 -25 This paper scale applies to China National Standard (CNS) A4 specification (210x297 mm) [275107

V. INSTRUCTION OF THE INVENTION 24 The interior of the volume forms two smaller apertures 65 and 6 and the exposed external electrode has a bonding layer η and & The apertures 65 and 67: 16 show a plan view of the composite device including three external electrical connection points. _ has 5 17 . - The electrical connection diagrams of the devices 77 and 79 are shown in the figure to show that the xvm_xvm body 52 along the line 16 is in the internal _% Α ° plane. The father and the remaining parts 38 and the hard inside two f and make electrical contact... the gap is left, and the internal electrodes are 16 and 16 . There are also a number of 10 Ministry of Economic Affairs Intellectual Property Bureau staff consumption cooperative printing Figure 19 shows a cross-sectional view of Figure 16 along the line ΧΙΧ-ΧΙΧ. The cross conductor 72 has electrical contacts 38 and 38 remaining therein for electrical contact. The remaining members 38 and 38 and the internal electrode I6 are separated by a gap. There are also additional conductive members 46, and Fig. 2A shows a cross-sectional view taken along line ΧΧ-ΧΧ of Fig. 16. Figure 21 shows a composite device having only one internal electrode 16 formed by a stack of conductive surfaces only. The layered member 卩 combines the layered member 78. The layered members can be pressed together to form a joint, so that a third layered member is not required to securely hold the layered members together. For example, the layered element 17 may comprise a PTC element and the 78 comprises a dielectric based material having adhesive properties. Figure 22 is a plan view of a composite skirt with multiple crossover conductors to provide additional current carrying capability with additional robustness to prevent damage to other crossover conductors or to form an open circuit. The dashed line indicates that there is no electrode material area; the dotted line indicates an additional cross conductor area. 15 -26« Loading line The paper size is applicable to China National Standard (CNS) A4 specification (210x297). 1275107 B7 V. Invention description (25 5 10 15 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 20 Figure 23 is along Figure 22 is a cross-sectional view of the TM (the dielectric layer 55 is not shown). The second aperture 81 has a metal ore layer and is formed to be interposed between the internal electrodes 16 and (4). Note that the region surrounds the external electrodes Μ and 1# There is no electrode material present. Figure 24 is an exploded view of the stack 1 in which the three layers of the back (four) laminates 107, 108, 109 are made of non-conductive layered layers 106 in the form of adhesive layers, 106 " attached to each other. Layers 1〇6 and 1〇6, „ respectively connect the metal layer 110, ill to the etched layer 107 and 1〇9. The resulting stack can be divided into side devices 2' as shown in item 25. On the side and / After the other processing steps, the plurality of metal stencils 110, m remain on the exposed adhesive surface 116, 116· as a liner attached to the circuit board or other substrate. The first detecting member 31 is present on each device. A plating layer 32 and a second cross member 51 are provided with a second plating layer 52. ' Figure 26 An exploded view of the stack 1 in which a single etched and drilled conductive buildup 117 is sandwiched between two non-conductive layered layers 116, 116. Each of the non-conductive layered layers may be an adhesive such as an epoxy prepreg and comprise a Or multiple layers. The layered metal foil layers 120, 121 are attached to the non-conductive layered layers 116, 116' and form other stacked layers. The adhesive will fill the conductive laminate 117 when the layers are joined together by heat and pressure. After the processing, each device 2 (shown in Figure 27) can be separated by a stack of iridium. The electrical bond pad 122 is formed by a metal selenium layer 120 for attaching one or more electrical resistives such as a shixi device. The surface of the device. The attachment of the component is disclosed in International Patent Application No. PCT/US00/07801, filed on Jan. 17, 2011, the disclosure of which is incorporated herein by reference. Electrical connection pad 123 -27· This paper size is applicable to China National Standard (CNS) A4 specification (210x297 public Chu) V. Invention description (26

1275107 is used to attach the device to a circuit board or other substrate. The first and second and 51 are respectively applied by layers 32 and 52. There are also "isolation", cross members or through holes 124. This is formed by an adhesive filling pore, through which another hole is drilled and plated. The drill 5 K 28 is a perspective view of the device, wherein the conductive layer 117 of the single-drilled hole is sandwiched between two non-conductive 2 (four) 5 in a manner similar to the device of FIG. 27, for example, applied to the layered Si layer === = = The opposite outer surface is fixed with a complex number (four) flail = ..., which is made of the layer 121 and weighs two isolated crosses of the tandem pad m and/or the contact profile 125. === One of the surface joints of the polymer laminate 117 is force-surface. Figures 29a to 29d show plan views constituting the 15 layers of the type described in Example 5. Figure 29a shows the top surface of the split, three isolated cross members 124 and two cross members 31, and four = 20 ΐ 125 ° The remainder of the surface is made of dielectric (welding mask) 5 = =. Fig. 29b shows the surface of the internal electrode 16, which is an additive layer (not shown). In this dress, there is, ζ = under the contact pad 125 to provide support. Figure 29c shows the surface of the two 3 poles 16' which is attached to the other surface of the conductive polymer layer 17 opposite the 17.h m electrode 16. Figure 29d shows the welded lining 123 of the bottom surface of the device. There are ten forging tins. The invention is illustrated by the following examples. -28^ This paper scale applies to China National Standard (CNS) A4^ grid (210x297^jy 1275107 A7 B7 V. Inventive Note (27) Example 1 The stack according to Figures 1 and 2 is prepared by the following method. 0.264 mm _ 〇 4 忖) is prepared by attaching a thickness of about ο·mm (0.0014 leaf (four) to thick Q 193 嶋 嶋 )) conductive polymer 5 thinner # both sides. The method of the wire-forming compound is mixed with a volume ratio of carbon black (Raven (-ηTM) 430 from Columbia Chemical Company) and about 60% volume ratio high density polyethylene (Chevr〇nTM 9659) Since Qifurong Company) is then extruded into sheets and laminated in a continuous process. The laminated sheets are cut into layers of 0·30 m X 〇·4 m (12 吋χ 16 吋). The laminate was irradiated with a 4.5 4.5 VV electron beam to 4.5 million ret. Each of the laminates is drilled in an asymmetrical pattern around the perimeter to provide voids and grooving layers of the known x-y orientation to the plane of the positive laminate. The holes and slots are used to form a stack of aligned plaques, which are then used for imaging, solder capping, and plating operations. Thick 〇·0762 mm (〇〇〇3吋) modified acrylic 15 series adhesive (pyraiuxTM lfo from DuPont) layer is also drilled for hole alignment. The surface of one of the layers of the two layers is patterned using an etching technique in which an etch resist is first applied and then imaged in a predetermined pattern. Etching resists Printed by the Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperative, developed and etched using copper chloride before the resist is removed. The thin 20 layers are patterned to define the perimeter of each device and the remaining conductive members. In addition, the outer edges of the laminated metal foil are etched to provide an alternate cross-directional pattern around the perimeter.

As shown in Figure 2, an electrical continuous path is provided for subsequent electroplating of tin/lead. X is set by two layers, the pattern matching the etched side facing inward, there is a -29- paper scale for the Chinese National Standard (CNS) A4 specification (210x297 mm) 1275107 Λ7 Β7 5, invention description (28) adhesive layer clip A stack is formed therebetween, as shown in FIG. The fixing member is used to align the layered laminate, and the stack is heated under pressure to permanently adhere the layers to form a layered structure. The resulting stack has a thickness of approximately 〇·6ΐ mm (〇·〇 24 inches). 5 The pores are formed through the entire hole of the stack with a diameter of 〇·94 mm (0.037 吋). The stack is processed using a plasma etch. The pores are then coated with colloidal graphite and stacked in copper for electrolytic plating. The stacked outer metal foil layers are then patterned by the remainder. The holes are aligned to ensure that the money pattern is properly aligned with the internal layers of the previous money. The alternate cross direction pattern around the edge 10 is etched as previously described. A solder mask (Finedel DSR 2200 C-7 from Tamura Kaken) was applied to the outer metal foil layer of the stack, hardened and applied to the second outer metal box layer of the stack. On, it is hardened and then the solder mask is imaged and imaged. Mark the parts and then heat the panel 15 to completely harden the cover. Tin-lead slabs are deposited in the solder pad area for the board of the device. The Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing assembly is divided to manufacture the device shown in Figure 5, which is divided into several strips by first using shears or saws, and then the strips are mechanically clamped and then divided into individual parts. Apparatus, the process uses a two-step process in which the strips are first bent 20 at the dividing line to form a crack in the conductive polymer and then cut along the dividing line. The device was fabricated to have a dimension of about 45 mm χ 3 · 4 mm X 〇 · 7 mm (0.179 吋 X 0.133 吋 X 0.029 吋) and a resistance of about 0.031 ohms. After being mounted on the printed circuit board by solder reflow, the device has a resistance of about 0.050 ohms. -30- This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) A7 B7 [275107 V. Description of invention (29 Example 2) According to the stack of Figure 24, it was prepared by the following method. Three layers, illuminating and drilling holes, four layers of modified acrylic adhesive as in the case, and two layers of one-plate copper foil (thick 〇·〇 34 mm (0.00135 hr)) are treated with gray oxide on one side. The hole is then drilled to fit the aligned holes. Using the Example 1 etching technique, the outer surfaces of the two foil electrodes on all three laminate layers are patterned to define the perimeter of the individual devices and the remaining conductive features, as well as to define alternating cross-directional patterns on the perimeter of the panel. 10 15 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 20 By placing a layer of copper foil on the bottom (processing up), followed by an adhesive layer, three layers of layers matching the pattern of the etched side to the orientation of the fixture, adhesive layer clip Placed between the layers, followed by an adhesive layer on the topmost layer, and then a layer of copper foil placed on top (processed face down) to form a stack. The fixture is used to align the layered layers, stacked At the same time of pressurization, the layers are permanently attached to form a laminated structure. The resulting stack has a thickness of about 119 mm (〇.〇47 吋). A hole having a diameter of 0.94 mm (0.037 Å) is drilled through the entire stack to form pores. The stack is etched using plasma. Treatment, the pores are coated with colloidal graphite, and the stack is electrolytically plated with copper. Then the stacked outer metal foil layers are patterned using the aligned holes to ensure proper alignment. The staggered cross direction pattern of the surrounding edges is as described above. And solder application was as in Example 1. The stacked assembly was then divided using the procedure of Example 1 to produce the apparatus shown in Figure 25. The apparatus of the process had dimensions of about 4.5 mm χ 3 · 4 mm χ 1 · 2 mm (0.179 吋χ θ. 133 吋χ〇 〇47 吋) and the resistance is about 0.018 ohms. Installed on the printed circuit by solder reflow -31 - This paper scale applies to China National Standard (CNS) A4 specification (210x297 mm) 1275107 A7 B7 V. Invention description '- The device has a resistance of about 0.029 ohms. Example 3 The stacking assembly according to Fig. 26 was prepared by the following method. The product of the thickness of about 198 mm (0·〇〇78吋) was prepared. The layer is prepared by attaching a nickel/steel foil having a thickness of about 0.0356 mm 5 (〇·0014 吋) to the two main faces of a conductive polymer sheet having a thickness of 0.127 mm (0.005 Å). The conductive polymer is mixed by about 37 % volume ratio carbon black (Raven 430) and about 1 〇 5% volume ratio high density polyethylene (LB832 'Equistar (manufactured by Equistar)) and about 52 5% copolymer (EBA705, Icta Manufactured, as in the example, and then extruded into 10 sheets and laminates in an interlocking process. The laminated sheets were cut into 0.10 m x 0.41 m (4 吋χ 16 吋) layers. The laminates were drilled in the same manner as in Example 1, and the pores having a diameter of 0.127 mm (〇·050 pairs) formed pores in the laminate. Four layers of thick enamel 〇 38 mm (〇·0015 吋) epoxy prepreg (44 Ν multi film from Adon) and two layers of 1 oz copper foil treated as in Example 1 The alignment is used to align the holes. The outer surface of the laminated two foil electrode was patterned using the residual technique described in Example 1 to define the remaining conductive features, as well as additional etched structural features as alignment marks for subsequent isolation processing. The Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing stack is formed by placing a layer of copper foil on the bottom (processing surface 20) 'Next two-layer prepreg layer (shown as a single layer in Figure 26), laminated, two pre- The dip layer, and then a layer of copper foil placed on top (processed face down) forms a stack. The fixing member is used to align the layers, press and heat while permanently adhering the layers to a laminated structure, and forcing the epoxy resin to completely fill the laminated pores. The stack thickness was formed to be about 0.61 mm (0 024 忖). -32- This paper size is applicable to China National Standard (CNS) A4 specification (210x297 mm) 1275107 Α7 Β7 5. Invention description (η diameter 〇·94 mm (〇·〇37吋) and ο·” mm The hole forms a hole through the entire stack of holes, and the hole with a diameter of 57·57 mm (〇〇23吋) forms a hole through the entire stack of drilled holes, which is centered on the epoxy resin to fill the pores, and the pores are epoxy resin It is isolated from the laminated electrodes. The stack is treated with plasma, the pores are coated with graphite, and the stack is coated with copper. The stacked external metal foil layer is then patterned by etching. The holes are used to ensure that the etching pattern is properly aligned. The inner layers previously etched. 10 15 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 20

To make the device as shown in Figure 27, the assembly is sawed by a saw, the panel length is sliced in one direction and then the panel is rotated at a 90 degree angle and the panel width is unidirectionally sliced, using the etched reference structural features on the laminate as a saw. Positioning token. The manufactured device has a dimension of about 4·5 mm χ 13·77 mm X 〇 · 61 mm (0.177 吋 542 · 542 吋 χ〇 〇 24 hours). These individual devices were heat treated on a belt furnace to heat the device above the polymer melting point (>13 Gt:), cooled to room temperature and then drilled to a source of 7 million Rays. The resulting device has a resistance of about 0.028 Å when measured across a layer of conductive polymer and greater than 1 X 1 G6 ohm when measured across a spaced via and conductive polymer laminate. After the solder is reflowed onto the printed circuit board leads, the device has a resistance of about 0.042 ohms when measured across the conductive polymer laminate, and the resistance is greater than 1 X 106 when the amount of the vias and the conductive polymer are stacked across the spaced apart vias. ohm. The device is suitable for direct attachment of electrical two = to wear, and the aperture and the direction-directing conductive member are positioned according to the exact electrical connection - electrical components such as electrical pure components can be electrically connected to the conductive polymer - 33 - 1275107 A7 B7 5. Description of the invention (32 Conductive polymer laminates are electrically isolated. Example 4 Ministry of Economic Affairs Intellectual Property Bureau Employees Consumption Cooperatives Printing In addition to the specified ones, a combination is generally prepared following the procedure of Example 3. The electroplated nickel/copper foil used has 0.0432 mm ( The total thickness of 0.0017 inches is 5 degrees. The outermost surface of the foil on the individual laminates is scrubbed with a vibratory abrasive scrubber' and then immersed in an etchant to remove the nickel coating from the nickel/copper foil leaving a bare copper surface. These outer surfaces are then patterned using photoresist/imaging/developing/#etching/stripping techniques as in Example 1 to define the electrode characteristics of the device, the remaining electrode structure, and the retroreflective features to provide the device angle during the isolation process. 10 falling electrode burrs are minimized, or electrodes that have a violent path at the edge of the device after isolation. The outer surfaces are then scrubbed and serialized with a series of chemical lodges (McDmitett) The multiple connections of the supply were treated to surface-treat the copper panel surface to improve adhesion. Then a stack as in Example 3 was formed. The pores had a caliber of 0·57 mm (0.023 inch), which was drilled through the entire stack of 15 An opening is formed, and an additional pore having a diameter of 〇·57 mm (0.23 inch) is drilled through the entire stack to form an opening centered at an opening of 124 mm (〇〇 49 inches) and filled with an epoxy; The latter opening is completely isolated from the laminated electrode by an epoxy. The stack is treated by plasma etching. The openings are then coated with colloidal graphite, which is electrolytically plated with copper. The abundance of the outer metal foil layer is patterned using the photoresist/imaging/development/release/stripping techniques described above to produce a weld lining (for attachment of leads or electronic components) on one side of the panel and The other side of the panel produces a feature set a that can be used as a fine (four) (surface contact connection). It also produces a coincident reference mask for use in subsequent isolation procedures.

This paper scale applies to the Chinese National Standard (CNS) A4^^x297 publicly entitled A7 B7 ^75107 V. Invention Description (33) Features. The contact pads are collected in a 0.25 mm (0.010 inch) wide track to facilitate plating of subsequent pad surfaces. The liquid photoimageable solder mask material as in Example 1 was applied to both sides of the panel using a stencil printing procedure. This solder cap layer is imaged on both sides using the original image, leaving the solder pads and the contact pads unexposed in the original image. The panel is developed and stripped to leave only the metal exposed to the solder pads and the contact pads. The panel was baked at 102-115 ° C for 4 hours to fully cure the solder mask. The resist is applied to the side of the panel having the solder pad, and the contact pads on the other side of the panel are plated with nickel followed by hard gold, after which the resist is stripped. The resist is applied to the side of the panel having the gold contact pad, and the other side of the panel having the solder pattern is tin immersed, after which the resist is stripped. Printed by the Ministry of Economic Affairs, the Intellectual Property Office, and the Consumer Cooperatives Division, the assembly is divided to produce the device shown in Figure 28, which uses the wafer mine, and the money on the laminate as a misalignment mark to align the benchmark. Cut the length direction multiple times, rotate the panel 90 degrees, and cut the width of the rear panel multiple times. The device produced has a size of approximately 28 X 7·6 X 0·61 mm (1·102 X 0.299 X 0.024 inches). Each device has five perforated plating channels (two channels are connected to the PTC laminate, three channels are isolated and only connected to the solder and/or contact pads), and four 20 key gold contact pads are on one side The outer surface (as in Figures 28 and 29a), and a total of 12 tin-plated solder pads on the other side of the other surface (Figure 29d). The devices were heat treated and irradiated as in Example 3. The treated device has a resistance of 〇〇2i ohms when measured across the conductive polymer laminate, and greater than -35-A7 when measured across the isolation channel and the conductive polymer laminate. V7 1275107 5. Invention (34) lxio6 ohms Resistance. After the Ni leads were mounted by solder reflow, the devices had a resistance of 0.028 ohms when measured across the conductive polymer laminate and a resistance of greater than 1 X 106 ohms when measured across the isolation channel and the conductive polymer laminate. 5 Example 5 A set was prepared following the procedure of Example 4 except as described below. The laminates are drilled with apertures of 1.24 mm (0.049 inch) and calibers of 457 mm (0.018 inch) with registration apertures conforming to the buildup fixture to create openings in the laminate. 10 The combination was divided to produce a device measuring approximately 28 X 7.6 X 0.61 mm (1·1〇2 X 0.299 X 0.024 inches). As in the apparatus of Example 4, each device has five perforated channels (two channels connected to the PTC laminate and three channels are isolated and connected only to the solder and/or contact pads) and four gold-plated bond pads There are 15 12 tinned solder pads on the outer surface of one side and the outer surface on the other side. In addition, there are four epoxide-filled 457 mm (0·018 inch) openings under each contact pad that collect around the desired contact force of each contact pad (as shown in Figure 29b). ). The devices were heat treated and irradiated as in Example 4. The processed Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing device has a resistance of 〇 ohm when measured across the conductive polymer laminate, and has a resistance greater than lx10 6 ohms when measured across the isolation channel and the conductive polymer laminate. After the Ni wire is mounted by solder reflow, the devices have a resistance of 0. 028 ohms when measured across the conductive polymer laminate and have a resistance greater than lxlO6 ohms when measured across the isolation channel and the conductive polymer laminate. -36- This paper size is applicable to the cap@^标格(2)Gx297 $ -~—- A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 1275107 V. Invention description (35) V. [Simple description] The present invention is based on BRIEF DESCRIPTION OF THE DRAWINGS In the drawings, FIG. 1 is a perspective view of a stacked-formed stack formed in the first aspect of the present invention, the stack being subdivided into a plurality of individual composite devices; 5 FIG. 2 is already on the inner conductive surface Figure 3 is a top plan view of a stack; Figure 4 is a cross-section of a stack taken along line IV_IV of Figure 3, 园5Ί · 园, 10 Figure 5 is a perspective view of the composite device of the present invention Figure 6 is a cross-sectional view of the composite device mounted on a printed circuit board and parallel to the circuit board; Figure 7 is a plan view of the composite device, further illustrated in Figures 8, 9, 10, η, 14 and 21; 15 Figure 8, 9 and 10 are cross-sectional views taken along line VIII-VIII of Fig. 7 of a composite device having two elements connected in parallel; Fig. 11 is a cross-sectional view taken along line VIII.VIII of Fig. 7 of the composite device having three elements connected in parallel; Figure 12 is a plan view of another composite device Figure 2 shows a cross-sectional view taken along line ΧΙΙΙ-ΧΙΙΙ of Figure 12; Figure 14 shows another composite device with two elements connected in parallel. Figure 14 is a cross-sectional view taken along line ΧΙΙΙ-ΧΙΙΙ of Figure 12; Section taken along line VIII-VIII of Figure 7; Figure 15 is a section of a composite unit with two elements connected in series -37- This paper scale applies to China National Standard (CNS) A4 specification (210x297 mm)

A7 1275107 B7 5. Inventive Note (36) Figure; Figure 16 is a plan view of a composite device with more than two external electrical connection points; Figure 17 is a composite device with individual devices joined together to form Figure 16 and Figures 18 to 20 Circuit diagram of the interconnect architecture. 18, 19 and 20 are cross-sectional views taken along lines XVIII-XVIII, XIX-XIX and XX-XX of Fig. 16, respectively; Fig. 21 is a cross-sectional view of a composite device having two external electrodes and an internal electrode; Figure 22 is a plan view of a composite device having a plurality of electrical connections between layers of the composite device; Figure 23 is a cross-sectional view taken along line XXIII_XXIII of Figure 22; Figures 24 and 26 are exploded views of the stack of the present invention, the stack An assembly is formed and subdivided into a plurality of individual composite devices; and 15 Figures 25 and 27 are perspective views of the device of the present invention, respectively, made from the stack of Figures 24 and 26. Figure 28 is a perspective view of a composite device having a contact pad; and Figures 29a to 29d are printed by the Ministry of Finance, Intellectual Property Office, and the Consumers' Cooperative of the Ministry of Plane, including the layers of the composite device of Figure 28. Figure 20 applies to the Chinese National Standard ( CNS)A4 specification (210x297 mm) 1275107 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 5, invention description (37) Figure number description: 1 2 3 ^ 3! 5 5,5, 6 7 8 11 10 12 14,14,16,16, 17 18 15 19 26 31 32 36,36, 20 38,38, 46, 51 52 55 Stacking composite device patterning external conductive surface patterning internal conductive surface insulating layer element layer element layer Element-shaped tubular cross-conductor plating layer external electrode internal electrode layered PCT element layered PCT element layered element layered element first cross-piece first plating layer outer remaining conductive member gap separated remaining piece additional conductive member second Cross-piece second plating layer, cross-conductor dielectric coating-39- This paper scale applies to China National Standard (CNS) A4 specification (210x297 mm) 1275107 at B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative System

V. Description of invention (3〇57 59 61 63 5 65 67 78 81 82 10 106', 106 107 108 109 110 15 111 116, 1161 117 120 121 20 122 123 124 Anisotropic conductive material Cross conductor Conductive material Insulating material Porosity pore Layered element Pore metal plating layer Non-conductive layered layer Conductive laminated layer Conductive laminated layer Conductive laminated layer Metal foil Metal foil layer Exposed adhesive agent surface Conductive laminated layer Metal foil layer Layered metal foil layer Electrical connection pad Electrical connection lining Through hole -40- This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm)

Claims (1)

Japanese revision (table) original six, patent application scope Δβ patent application No. 91 135771 Α 8 ROC Patent Appln. No. 91135771 B8 Corrected non-lined Chinese application 4 Patent scope amendments - Annex (II) _Amended Claims in Chinese - Enel. ΠΙ)_ ^ (Represented on the Republic of China 95th & 7th) D8 (Submitted on September 7, 2006) 10 15 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 20 i. Manufacturing a Composite Polymer Circuit Protection A method of apparatus comprising: (1) providing a polymer assembly comprising () kt, first and second laminates, each laminate comprising a layered polymeric component having at least one electrically conductive surface, (b) providing a conductive material pattern on at least one of the conductive surfaces of the laminate, (C) fixed stacking in a predetermined configuration as a stack, at least one conductive surface of at least one of the stacks comprising an outer conductive surface of the stack, (4) = complex number Electrically coupled to the first layer of the conductive layer - a conductive surface between the first layer, and T plus a plurality of electrical components on the outer conductive surface of the stack; and (2) the total Re-booking is divided into one less electrical connection ^==set' each device contains (1) to, mouth, and (u) at least - Ray 2 · as claimed in the second paragraph, , and external guide mine # & Wherein, the assembly includes two L-tables and the electrical components are attached to the two outer conductive surfaces. 3. The permanent electrical connection is added as in the scope of the claims. #中 The electrical component is attached. 4. If the third item of the patent application is included, it contains weldable materials. , "Gas connection pad 5", such as the method of Shen Qing patent range, item 1, the Thai electrical component is attached -41 This paper scale applies to China National Standard (CNS) A4 specification (210x297 dongdong) 91541B Order A8 B8 C8 D8 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 1275107 VI. Patent application scope Add to reconnectable contact pads. 6. The method of claim 5, wherein the re-attachable contact comprises gold, tantalum or alloy. 7. The method of claim 1, wherein an additional conductive layer 5 is attached to at least a portion of at least one of the outer conductive surfaces to form an electrical connection pad or a re-bondable contact pad. 8. The method of claim 1, wherein the layered polymer element in the first laminate comprises a PTC conductive polymer composition. 9. The method of claim 8, wherein the layered 10 polymer element of the second laminate comprises a dielectric material. 10. The method of claim 9, wherein the assembly further comprises a third laminate, the third laminate comprising a layered component that is a dielectric, the second and third laminates being located at the top and bottom of the first laminate . 11. A method of making a composite polymer circuit protection device, the method 15 comprising (1) providing a polymer assembly comprising (a) providing first and second laminates, each laminate comprising a layer of polymeric components, Having at least one electrically conductive surface, (b) providing a conductive material pattern on at least one of 20 of the laminated conductive surfaces, (c) fixing the laminate in a predetermined configuration to form a stack, at least one electrically conductive surface of the at least one laminate comprising the Stacking one of the external conductive surfaces, (d) manufacturing a plurality of electrically conductive surfaces connected to one of the first laminates - 42 - This paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 1275107 A8 B8 C8 D8 Printed by the Intellectual Property Office of the Ministry of Economic Affairs, Employees' Cooperatives. VI. Between the scope of application for patents and one of the conductive layers of the second laminate. (2) The assembly is subdivided into individual devices, each of which contains at least one electrical Connecting; and (3) attaching at least one electrical component to an external conductive surface of each of the devices. The method of claim 11, wherein the layered polymer element in the first laminate comprises a PTC conductive polymer composition. 13. The method of claim 12, wherein the layered polymer element of the second laminate comprises a dielectric material. 14. The method of claim 13, wherein the assembly further comprises a 10th buildup layer, the third buildup layer comprising a layered component that is a dielectric, the second and third buildup layers being located on top of the first buildup layer and bottom. 15. A method of making a composite polymer circuit protection device, the method comprising (1) providing a polymer assembly comprising 15 (a) providing a first laminate, the first laminate comprising a layered polymer component, The layered polymer element comprises a conductive polymer composition and has at least one electrically conductive surface, (b) providing a second laminate, the second laminate comprising a layered polymer element comprising an insulating polymer combination 20 And having at least one electrically conductive surface, (c) providing a pattern of a conductive material on at least one of the laminated conductive surfaces, (d) fixing the laminate in a predetermined configuration to form a stack, at least one of the at least one electrically conductive surface comprising One of the stacks of external conductive meters -43 - This paper size applies to China National Standard (CNS) A4 specifications (210x297 mm) 4 order 1275107 as B8 C8 _D8_ VI. Patent application scope, (e) manufacturing a plurality of electrical connections between one of the conductive surfaces of the first laminate and one of the conductive surfaces of the second laminate, and (f) providing an additional conductive layer At least a portion of at least one of the five outer conductive surfaces to form an electrical connection pad or a re-connectable contact pad; and (2) subdividing the assembly into individual devices, each of the devices Including (1) at least one electrical connection, and (ii) at least one electrical connection pad or a re-bondable contact pad. 10. The method of claim 15, wherein each device comprises at least one electrical connection pad on an outer surface and at least one rejoinable contact pad on the other outer surface. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumer Cooperatives. This paper scale applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm).