TW200306589A - Electrical devices and process for making such devices - Google Patents

Abstract

A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7,8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1) in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, and making a plurality of electrical connections (31, 51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.

Description

200306589 A7 B7 V. Description of the invention (i) 1. [Technical field to which the invention belongs] The present invention relates to an electrical device and an assembly and a method for manufacturing such a device and an assembly. I. [Such Technology] 5 It is well known that circuit protection devices include a conductive polymer composition having a positive temperature coefficient (PTC). Such devices are intended for surface mounting of substrates such as printed circuit boards, and are disclosed in U.S. Patent Nos. 5,831,51 (Zhang et al.), 5,852,397 (Chan et al.), And 5,864,281 (Zhang et al.) 'And international bulletins Nos. 94/01876 (Raychem 10) and 95/08176 (Rayken), the disclosures of which are incorporated herein by reference. This circuit protection device usually includes first and second layer electrodes; a layer of PTC resistance element is sandwiched between two electrodes; a third (residual) layer of conductive member, which is firmly fixed to the second of the PTC element On the same surface of the electrode but spaced from the second electrode; and a cross conductor that passes through the aperture of the PTC 15 element and connects the third conductive member with the first electrode. This allows the same side of the device printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs to be connected to the two electrodes, so the device can be connected flat to a printed circuit board, with the first electrode tied to the top without any leads. The resistance element preferably comprises a layered element composed of a PTC conductive polymer. The preferred arrangement includes an additional conductive member and an additional cross conductor, so the device is symmetrical and can be placed on the circuit board in any manner. A composite device may be formed when two of these devices are physically and firmly joined together in a stacked configuration. Such a composite device has the same small "footprint" of a single device on a printed circuit board, that is, it occupies a small area, but has a lower resistance than the resistance that can be easily generated using a single device.

200306589 A7 B7 V. Description of the invention (0 In addition, the power dissipation of such a composite device is not substantially different from the power dissipation of one of the individual devices. As a result, the composite device has a lower resistance to a specified sustaining current, here " “Maintaining current” is the maximum current that can pass through the device without causing device errors. 5 3. [Inventive Content] As described in International Patent Publication No. WO99 / 53505 (Leiken Company, published October 21, 1999), Its disclosure is described here for reference. A composite device can be prepared by classifying individual devices and then assembling the classified devices into a composite device. This process is tedious because the reading of the resistance of the individual device is required. It was found that a multilayer assembly can be prepared according to the present invention, whereby the assembly can be divided into individual composite devices. Such an assembly allows a large number of composite devices to be prepared at the same time. In addition, the method described herein allows the layers of the assembly to be manufactured before the assembly is completed. Or after being patterned, a variety of different devices can be prepared from the same starting layer. In addition, the combination of each layer is easy to change, allowing 15 simple enhancements Devices with combined functions. Multiple interconnect architectures between layers can be easily implemented, devices with multiple external electrical contacts can be manufactured without changing the basic process. All described here are advanced—additions can be made by the methods disclosed here at a low cost A wide range of different devices mass-produced. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The present invention provides a method and process sequence that can perform a variety of operation steps in the assembly, which are passed along the X and y directions (here X and y are corresponding to the plane direction of the acoustic PTC element) and then divided into composite splits to obtain a complex device. It is better than other methods to prepare a device in this way. No. WO99 / 53505, because for the present invention, individual devices do not need to be individually assembled, which increases the yield and thus reduces the cost of the manufacturing process. Paper standards are applicable to China National Standard (CNS) A4 specifications (210x297 public review). Manufacturing 200306589 A7 B7 V. Description of the invention (3). Finally, the method of combining the layers of materials to form the composite device disclosed herein allows extremely A simple and suitable method for forming a variety of devices without changing the basic manufacturing process. In a first feature aspect, the present invention provides a method for manufacturing a composite polymer 5 circuit protection device, the method comprising (1) providing a polymer total It includes (a) providing first and second layers, each layer including a layer of polymer elements having at least one conductive surface, and (b) providing a pattern of conductive material on at least one side of the conductive surface of a layer; ( C) The stack is firmly fixed in a stack in a predetermined configuration, at least one conductive surface of at least one stack constitutes the outer conductive surface of the stack, and (d) a plurality of electrical connections are made between the conductive surface of the first stack and 15 of the second stack. Between conductive surfaces; and (2) subdividing the stack into individual devices, each device including at least one electrical connection. In a second characteristic aspect, the present invention provides a polymer assembly comprising: 20 (a)-a first layer comprising a layer of a polymer element having at least one conductive surface with a pattern; (b)-a second layer comprising a layer The polymer-like element has a pattern on at least one conductive surface, and the second buildup layer is firmly fixed to the stacked first buildup layer, so the buildup layer has first and second external conductive surfaces; the Chinese National Standard (CNS) applies to this paper scale A4 size (210 X 297 mm)

200306589

And 5 10 15 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 20 (c) A plurality of lateral conductive parts, discovered by Zhe Zhe, interposed between the first and second external conductive surfaces through the first and second layers.曰 "Use the method of the present invention or the total electrode precursor has a suitable shape on the resistance element == by forming the electrical resistance element described in the shape of the final m-plane form, the stack, the stack is also larger than the predetermined final / complex number The stack of resistance elements is divided into individual devices. Any combination of the appropriate shape and then the stack can be re-assigned = can be achieved by removing the conductive surface, Γ). In addition, any of the electrode precursors ™ hunting chemical emulsion phase plating, electrodeposition, and MTC PTC resistor element surface-plating = conductive material patterned to L + or any combination. The conductive material can also be applied to the surface of the PTC resistive element using an adhesive weaving tie layer. Predetermined conductive meter combinations of multiple resistive elements_electrical interconnections can be subdivided into individual positions on the stack. Material, part or “predetermined electrodes or contacts can be connected after the stack is divided into composite devices. The electrical interconnection can be designed to be interposed between the conductive surfaces of the stack or the electrodes of the device In the third characteristic aspect, the present invention provides a composite device which can be manufactured, for example, using the method of the first aspect or the assembly of the second aspect, the device comprising (1) the first and The second outer layered electrode, (2) the third and fourth inner layered electrodes, (3) the first and second layered PTC resistive elements, each of which has a -6- CNS) A4 specification (210 X 297 mm) 200306589 A7 B7 V. Description of the invention (5) PTC surface, and (ii) contains a layered element composed of a PTC conductive polymer, the first resistance element has a first external A first surface on which the electrode is firmly fixed, and a second 5 surface on which the third internal electrode is firmly fixed, and the second resistance element has a first surface on which the second external electrode is firmly fixed and a fourth surface on which the fourth internal electrode is firmly fixed. Second side (4) a fifth external layered conductive member, the ⑴ is firmly fixed on the first surface of the first PTC resistance element, and (ii) is separated from the first external electrode by 10, (5) —the sixth external layered conductive Element, which is firmly fixed to the first surface of the second PTC resistive element, and (ii) is separated from the second external electrode,

(6) —The seventh internal layered conductive member, the ⑴ is firmly fixed on the second side of the first PTC 15 resistance element, and (ii) is separated from the third internal electrode, printed by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (7) —The eighth internal layered conductive member, the ⑴ is firmly fixed to the first surface of the second PTC resistance element, and (ii) is separated from the fourth internal electrode, 20 (8) —the first aperture passes through the first Between the first external electrode of the layered PTC element and the second external electrode of the second layered PTC element, (9) a second aperture, which is interposed between the fifth external layered conductive member of the first layered PTC element and Between the sixth outer layered conductive parts of the second layered PTC element, this paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 200306589 A7

(10) — the first transverse conductive member (a) is located inside the first aperture, ⑼ is between the first external electrode of the-第 PTC element and the second external electrode of the second layered PTC element, 5 (办 _ 定The first PTC element, the third PTC element, and the third layer element are physically and electrically connected to the first external layer electrode, the seventh internal layer conductive element, the first internal layer conductive element, and the second The outer layered electrode is not connected to the third or fourth 10th internal electrode, and (11) a second lateral conductive member (a) is located inside the second aperture, and (b) is located between the fifth outer layered guide Between the first and the sixth external layered conductive parts, printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (C) Niu Gu is fixed on the first pTC element, the second pTC element and the second layered polymer layer, and (d) It is physically and electrically connected to the fifth external layered conductive member, the second internal electrode, the fourth internal electrode, and the sixth external layered conductive member, but is not connected to the first or second external 20-pole. In a characteristic aspect, the present invention provides a method according to the first aspect of the present invention. The method is used to manufacture a composite device, and the electrical components are attached to the device. These components can be added to the assembly before the assembly is subdivided into individual devices, or it can be attached to the device after being subdivided. Applicable to China National Standard (CNS) A4 specification (21〇χ 297 mm) 200306589 A7 B7 V. Description of invention (7) 5 10 15 Printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs 20 In the fifth aspect, the present invention provides —A method of special features—for manufacturing a composite conductive layer with at least one external conductive surface on the external conductive surface. The additional conductive layer can be kept secret.—Wei Lian Lin is a re-linkable contact liner. In addition, the present invention package: the invention of the first shouting and mad special financial aspects of the difficult to achieve device / IV. [Embodiment] as described later and applied for patents and illustrated in the drawings, the name of the invention Combination of multiple features' Here, such features are disclosed or disclosed as a part of a specific combination in some context, and can also be used in other contexts and other combinations including any combination of multiple features. PTC and Resistive Elements The present invention The composition and device roughly include at least one layer of a polymer element or a resistive element. 'It contains a PTC composition, which has a positive temperature coefficient (PTC) performance, that is, in a relatively small temperature range, the resistivity can increase significantly with temperature. The term "PTC" is used here to indicate a combination: or device that has an RM value of at least 2.5 and / or an R! ⑽ value of at least 10, and the preferred composition or device has a chemical deduction value of at least 6, Here r14 is the resistivity ratio between the end point and the starting point in the 14 ° C range, R_ is the resistivity ratio between the end point and the starting point in the i00c range, and Rs () is the end point and Resistivity ratio at the starting point. The PTC composition used in the present invention is preferably a conductive polymer, which contains a crystalline polymer component, and a particulate filler component is dispersed in the polymer component and contains a conductive filler such as carbon black or a metal. The filler composition also contains a -9 · This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

200306589 A7 B7 V. Description of the invention (ο A kind of non-conductive filler, non-conductive filler not only changes the electrical properties of the conductive polymer but also changes the physical properties. The composition also contains one or more other ingredients, such as antioxidants, cross-linking agents, and even Mixture, flame retardant, or elastomer. The PTC composition preferably has a resistivity of less than 50 ohm-cm 5 m at 23 ° c, particularly less than 10 ohm-cm, especially less than 5 ohm-cm. Used in the present invention Suitable conductive polymers are disclosed, for example, in U.S. Patent Nos. 4,237,441 (van Konynenburg et al.), 4,304,987 (van Konynenburg et al.), 4,514,620 (Cheng et al.), 4,534,889 (van Konynenburg et al.), 4,545,926 (Fouts et al.), 10 4,724,417 (Au et al.), 4,774,024 (Deep et al.), 4,935,156 (van Konynenburg et al.), 5,049,850 (Evans et al.), 5,378,407 (Chandler et al.), 5,451,919 (Chu et al.), 5,582,770 ( Chu et al.), 5,747,147 (Wartenberg et al.) And 5,801,612 (Chandler et al.), And U.S. Patent Application No. 15 09 / 364,504 (Iso zaki et al., application date: July 30, 1999). The disclosures of these patents and applications are hereby incorporated by reference. In addition, PTC compositions can be ceramic materials. Laminar elements Consumers of the Intellectual Property Bureau of the Ministry of Economic Affairs The device printed by the cooperative of the present invention preferably includes a PTC resistive element, which is a layered element 20 and may be composed of one or more conductive polymer pieces, wherein at least one conductive polymer piece is composed of a PTC material. When there is more than one conductive polymer piece The current preferably flows sequentially through different compositions, for example, when each composition is in a layered form and stretches across the entire device. When there is a single PTC composition, the predetermined thickness of the PTC element is greater than the thickness that can be conveniently prepared in a single step. , With -10- This paper size applies to China National Standard (CNS) A4 specification (21〇χ 297 public love) 200306589 Α7 V. Description of invention (9) 10 15 Printed by the Intellectual Property Bureau, Ministry of Economic Affairs, Consumer Consumption Cooperative, 20 Scheduled Thick PTC elements can be conveniently prepared by combining two or more layers, such as your body's extruded layer PTC composition, by heating and pressurizing the laminate. When there is more than one The PTC composition, typically based PTC element via, for example by heating and pressing the laminate together the different compositions prepared cartridge engaging element 0 to the invention includes a first and a second laminate, and the laminate comprising the additional. Each of the first and second laminates includes a layer of a polymer element and has at least one conductive surface, for example, in the form of a metal foil electrode described below. In this specification, each laminate refers to one layer. The layered elements of the first and second layers contain the same composition, or each layer contains a different PTC composition. For example, PTC compositions with different resistivities can be used. The interconnect architecture is modified to one layer as a heater and the second layer as an overcurrent protection device. Each layer also contains a PTC composition with a different exchange temperature (i.e. the temperature at which the device switches from a low resistance state to a high resistance). For example, such a device can be used to form a double-layer PTC temperature sensor. One layer is most sensitive to the lower temperature range, while the first layer is most sensitive to the higher temperature range. In addition, one or more of the laminates contains a zero-resistance-temperature-coefficient (ZTC) composition or a negative-resistance-temperature-resistance (NTC) composition. Each laminate does not need to include a -layer conductive layer. For example, the composition of other layered components that can be used in a composite device includes a dielectric material such as a polymer or a filled dielectric, such as FR4 epoxy resin. It can be used as an insulation layer. The county can provide extra rigid _ ', or the material can be selected to help erection and packaging devices. Layered 2 packs 3 — a combination of which has a relatively high thermal conductivity and can assist the compound 5 Heat transfer between layers or one of the surface erection devices for substrates and composites-11. Specifications of this paper (printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and the Ministry of Economic Affairs and Consumer Cooperatives, 2003306589 A7 B7 V. Description of the invention (Interlayer transfer Heat. In contrast, a layered element contains a composition that has a relatively low thermal conductivity and can be used as a thermal insulator between layers or a thermal insulator between a layer and a substrate. When it is desired that the device can respond to an overvoltage, one layer after another Materials include ~ materials which are generally insulating but become conductive when a certain voltage threshold level is reached. This composition includes varistor particles dispersed in a polymer matrix. Other compositions can be used in various embodiments of the present invention Including flame retardant materials, expansion agents, and microwave absorbing materials, allowing the device to use radiant heating in a specific frequency range. The thickness can be different. For example, very thin layered elements can be used as a single layer to provide very low resistance, while thicker layered elements can be used as a second layer to provide mechanical strength. Heavy pole and conductive surfaces by the present invention A particularly useful device made by the method includes at least two metal foil electrodes with a polymer element interposed therebetween. A particularly useful device includes 15-stacks containing n polymer PTC elements, each of which has a two-metal drop electrode 'and (n -1) The adhesive layer is placed in a staggered pattern between the PTC elements to form a composite device. The PTC element includes stacked top and bottom components. This type of device has the electrodes electrically connected, so the PTC elements will be connected in parallel, resulting in a composite device with Low resistance, usually lower than 10 ohms at 20 ° c, preferably 20 lower than 5 ohms, more preferably lower than 1 ohms, especially lower than 0.5 ohms, and lower resistances may also be lower than 0. 〇5ohm. A particularly suitable foil electrode is a micro-rough metal foil electrode, particularly disclosed in U.S. Patent Nos. 4,689,475 (Matthiesen) and 4,800,253 (Kleiner et al.) And International Patent Publication No. WO95 / 3 No. 4081 (Leiken, announcement date December 1995 -12- This paper size applies to China National Standard (CNS) A4 specification (210x297 mm)

200306589 A7 B7 V. Description of the Invention (11) 14), the disclosure cake is described here for reference. The electrode can be modified to produce a predetermined thermal effect, thereby providing electrical contact points for each interconnection point between layers of the composite device, obtaining predetermined functions, and providing electrical contact points for mounting the device on a printed circuit board, receptacle, wafer or other appropriate use. Composite devices incorporating multiple internal and external contact points are shown, for example, in Figures 16 to 20, 22 and 23 ° 10 15 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 20 Similar metal foil types can be used to form laminates in polymer assemblies Conductive surface. In addition, the conductive surface may be formed from a conductive ink, a sputtered or otherwise applied metal layer, a metal mesh, or other suitable layer. A particularly good conductive surface is an etchable surface such as for patterning and / or easy soldering surfaces. The conductive surface of the laminate has a resistivity at 25 ° C of at least 100 times lower than the resistivity of the polymer element to which it is attached at 25 ° C. The σ pattern can be the same or different on both sides of a given layer. Additional patterns can be formed at any point in the process, such as on the outer conductive surface of the stack once the stack assembly is formed, or attached to the inner conductive surface as an accessory before the stack assembly is complete. Pore and cross-conductor The term "void" is used herein to mean an opening that, when viewed at right angles to the plane of the device, (a) has a closed cross-section such as a circle, oval, or rough polygon, or (b ) Has a concave section, the term "concave section" is used herein to mean an open section whose (i) depth is at least 0.15 times the maximum width of the section, preferably at least 0.5 times, and particularly preferably at least 12 times , Such as a quarter-circle or semi-circle or a slot with open ends, and / or (ii) at least 13- this paper size applies to the Chinese National Standard (CNS) A4 (210 X 297 public) 200306589 A7 B7 5 2. Description of the invention (12) The two opposite edges of a section here are parallel to each other. Since the present invention relates to an assembly that can be divided into a plurality of electrical devices, the pores usually have a closed section, but if one or more dividing lines pass through the pores of the closed section, the pores of the resulting device will have an open section. Although it is used for some 5 specific embodiments, it is desirable that the open section is a concave section as defined above, but in order to ensure that the conductor passing through the pores will not be damaged or loosened during the installation or use of the device, it is used for other specific implementations For example, the cross-conducting system is preferably plated on the horizontal flat surface of the device. In order to manufacture such a device, it is preferred that the assembly (to be divided into a plurality of devices) has a plurality of elongated rectangular apertures such as slots and each of which has its own metal key applied thereto. The assembly is then divided into plated apertures to provide flat lateral conductive elements on multiple devices. The pores of the assembly may have different sizes and / or shapes, and match the configuration and current carrying capacity of the device. The pores can be round holes, which is satisfactory for multiple cases. However, if the assembly 15 includes pores and these pores are crossed by at least one dividing line, it is better to use slender pores because the The accuracy requirements are low. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. When the pore is not crossed by the dividing line, it can be as small as a convenient cross conductor with the required current carrying capacity. Usually a single cross conductor is all that is needed to make an electrical connection from the first electrode to the opposite side of the device. But two or more crossed conductors 20 can be used to make the same connection. The number of cross conductors and their heat capacity have an effect on the error rate of the circuit protection device. Pores and cross-conductors usually extend through all layers of the assembly. In addition, the pores and cross-conductors can be extended to only certain layers of the assembly to form devices with different functions. The pores can be formed before the placement and positioning of the cross-conductor, or the formation of pores and -14- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 200306589 A7 B7 V. Description of the invention (13) " Parent The conductors can be placed simultaneously. The preferred procedure is to form the pores by, for example, drilling, slicing, routing, or any other suitable technique, and then plating or otherwise painting or filling the inner surface of the pores. The plating may be performed by electroless plating or electrolytic plating or a combination of the two. Plating can be single or multiple layers and can be composed of 5 soap-metal or metal mixture, especially solder. Plating is often formed on other exposed conductive surfaces of the assembly. If such plating is not desired, other conductive surfaces may be masked or otherwise desensitized, or may be selectively removed unless the plating is desired. The invention includes the possibility of plating to produce not only a cross conductor but also at least a part of a layered conductive member of the device. 10 Plating techniques used to make conductive vias through insulated circuit boards can be used in the present invention. Another technique for providing a cross-conductor is to place a moldable or liquid conductive composition in a pre-formed pore, and if desired or if a conductive composition is required to process the composition in the pore, a cross having predetermined properties is produced. 15 conductors. The composition may be supplied to the pores selectively using, for example, a sieve, or if necessary, at least a part of the assembly is pretreated so that the composition does not stick to the entire assembly. For example, if a desired molten conductive composition and solder are available, wave soldering techniques can be used in this manner. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The conductors can also be provided by pre-formed pieces, such as metal rods or tubes 20 such as rivets. When such a preform is used, voids can be formed when it is positioned in the device. Cross conductors can partially or completely fill pores. When the pores are partially filled, they can be further filled (including fully filled) when the device is connected to other electrical components, especially by welding. Can provide additional solder in the pores -15- This paper size is applicable to China National Standard (CNS) A4 specifications (210 X 297 mmΥ --------— 5. Description of the invention (14) 5 10 15 Economy Printed by the Ministry of Intellectual Property Bureau's Consumer Cooperatives 20 or surrounding auxiliary 'especially including solder gas, a small part of the cross == not all neighbors can be' ^ into a selective connection of some layers, that is, some layers but = 7 嶋, greater than cross The predetermined size of the conductor is absolutely equal to: two: forming an inner hole inside the insulating material, and plating the inner hole is missing 1, so Λ electrical. This method Xiande is insulated from the conductor but still ... ,, allowed The outer electrodes are electrically connected. The electrical connection between any of the remaining conductors on either side of the conductor i and the PTC resistance element is preferably via the aforementioned alternating conductor. However, it can be any type of conductor such as a t The body can remain positioned even if it is not bonded to other parts of the device, such as a U-shaped member that stretches around the end of the device-layer or multi-layer combination. Remaining layered lightning guides The preferred embodiment of the device of the present invention includes additional ( (Remaining) conductive parts, which are firmly fixed to the second and the PTC elements It is on the same plane but separated from the first electrode. This remaining layered conductive member can be provided with a cross conductor or other connection to provide an electrical path to other electrodes. The electrical path is formed by removing part of the layered conductive member, and The remaining part of the layered conductive member is used as an electrode. The remaining layered conductive member may exist on the inner and outer surfaces of the layered element. The shape of the remaining layered conductive member and the shape of the gap between the remaining member and the electrode may be changed to match the device. Expected characteristics and ease of manufacture. Residual conductivity -16- This paper size applies to China National Standard (CNS) A4 specification (21〇297297 love) 200306589

V. Description of the invention (15) 5 10 15 The Ministry of Economic Affairs and Intellectual Property Bureau's Consumer Cooperatives printed 20 pieces which are conveniently placed in the county, rectangular, separated by a moment. In addition, the remaining pieces can be islands. Borrow-seal_surface electricity = on. The device can also be designed to contain no remaining layered conductive parts, as shown in the figure. Ports 12 and 13 and even other layered devices The first and second layered PTC resistor elements or assemblies of the device 物理 -layers can be physically fixed into stacks, using the first member in between to form a stack. The third layered element contains non-two :, such as hot dazzling adhesive or hardenable adhesive dipper, its towels are filled with heat or mechanical properties. The third layered element also includes Kewei and special 3 series: systems such as epoxy resins, acrylates, acrylics are = L, various systems, esters, alkyd resins and so on. If: the piece is used as an electrical insulator, the ohmic resistivity is at least iq6, at least 109 ohm_cm, and in some specific embodiments, it is desirable that the third material be an electrical material. For these specific embodiments, the third layer is formed. First, the layers are connected together by oxygen and physical means. The configuration of the composite device incorporating the guide member is shown in FIG. 15. For other specific applications, it is desirable that the third element contains a conductive material, which is only one side: conductive (refer to FIG. 14). The third layered element also provides other functional examples ^ thermal layers to assist heat transfer between layers of the composite device. In addition, the clothes can be designed without separate layers to hold the device together 1 ^ 1 — U together. For example, a device can be manufactured similar to that shown in FIG. Cross conductors 32 and 52 can rely on electrical connections to join the two layers: and physically hold the layers together. Figure 21 shows another -17- the specifications in this paper size apply to 7 cm

Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 200306589 A7 B7 V. Description of Invention (I6) An example, here the composite device does not need to separate the layered elements between each layer. Device For a simple device, as shown in Figure 5, there are two external electrodes, two internal electrodes, two crossed or other conductors, and four remaining conductive parts. This configuration 5 is useful because the unit is top-to-bottom symmetrical, allowing easy installation by automated equipment or other means. The circuit protection device of the present invention has an electrical group at 23 ° C of less than 1 ohm, preferably less than 0.5 ohm, particularly preferably less than 0.3 ohm, especially less than 0.1 ohm, and includes first and second layered PTC resistance elements, Each of them 10 (a) is composed of a conductive polymer having a resistivity at 23 ° c of less than 50 ohm-cm, preferably less than 10 ohm-cm, particularly preferably less than 5 ohm-cm and having a PTC performance ... and (b) It has a first surface and a second surface. The first external metal foil electrode contacts the first side of the first PTC element, and the second external metal foil electrode contacts the first side of the second PTC element. The 15th and 4th inner metal foil electrodes contact the second faces of the first and second PTC elements, respectively. The device preferably has fifth and sixth remaining external metal foil conductive members, the fifth contacting the first surface of the first PTC element and being spaced from the first external electrode, and the sixth contacting the first surface of the second PTC element and being spaced from the first Two external electrodes are separated. Usually there are seventh and eighth remaining internal metal foil conductive parts, the seventh 20 contacts the second surface of the first PTC element and is separated from the third internal electrode, and the eighth contacts the second surface of the second PTC element and is separated from the first Four internal electrodes are separated. The device also contains one or more additional layered polymer elements which may be conductive or insulating. One of the preferred additional elements is a third layered polymer element, which is insulated, located between the first and second PTC elements, and is firmly fixed at -18- This paper size applies to China National Standard (CNS) A4 (210x297) Mm)

200306589 A7 B7 V. Description of the invention (17 The exposed inner surface of the PTC element printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs may include the inner surface of the PTC element or its internal electrodes or internal conductive parts. PTC elements, electrodes, and remaining conductive parts Two pores are defined, the first pore is between the first external electrode, the seventh and eighth internal remaining conductive members and the second external electrode; and the second pore is between the fifth remaining external conductive member, the third and fourth Between the internal electrode and the sixth remaining external conductive member, and through the first and second PTC elements and the third layered polymer layer (if present). In addition, the device includes first and second lateral conductive members which are composed of metal The first lateral conductive member is located inside the first aperture, and is physically and electrically connected to the first and second external electrodes and the seventh and eighth internal remaining conductive members. The second lateral conductive member is located inside the second aperture. And are physically and electrically connected to the fifth and sixth external remaining conductive members and the third and fourth internal electrodes. Other device embodiments do not include the remaining (also referred to as additional The conductive device. The device of the present invention may have any suitable size. However, one of the great advantages in application is that the device size is reduced as much as possible. The preferred device has a maximum dimension of at most 12 mm, preferably at most 7 mm, and / or a surface area of at most 60 square meters. Millimeters, preferably up to 40 square millimeters, especially up to 30 square millimeters. The surface area can be smaller, such as up to 15 square millimeters. Method The method disclosed here can be manufactured extremely economically by means of a large build-up stack All or most of the method steps, and then accumulate into multiple individual composite devices. The division of the stack can be along the entire conductive surface of any knife or through any, part or all of the conductors: or these division lines are also called divisions The line or demarcation line can have any suitable system = 特 -19- This paper size applies to Chinese National Standards (CNS) ^ JT ^ OX 297 mm)-10 15 20 200306589

5. Description of invention 5 10 15 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 20 = ί = like straight, curved, or angled. Similarly, the "function" is the square before the division; the gap can also have any appropriate shape. In the loading step, you can usually follow any money, for example, on the outside of the group; the internal conductive surface is patterned 'and the H * sample is assembled after assembly. However, the internal and external conductive surface patterns can be patterned before assembly. Others The conductive surfaces are the same or different. For example pre-mirror 2. The tn device has an internal electrode. The internal electrode is an external electrode. Figures 18 and 2G display devices have internal electrodes. The internal column and #rf mode are different from the external electrodes. The conductive surface can be patterned by removing, for example, buttons or grinding conductive materials. In addition, pattern making methods such as screen printing, riding or deposition are used. It is used for some materials. The two opposite sides of the laminate are taken as staggered strips to remove the conductive material and balance the physical stress of the product. The obtained pattern contains gaps or recesses, = the gaps or recesses are suitable for separating the second electrode of the device from the remaining parts, separated by one, and the other -I 'to provide the assembly line and then divided into smoke devices, allowing individual stacking Or assemble stack orientation, or provide marks. The cross-conductor, i.e., the electrical connection, can be formed before or after the stack is formed into a stack. If it is desired to form a cross-conductor that does not cross all the stacked layers, it is convenient to form only a cross-conductor of a predetermined stack and then assemble the stack. In addition, the blind through-hole method can be used to make a connection after the installation of the reactor. The assembly of the stack 4 can be completed in multiple stages, for example, to prepare certain laminates and be firmly fixed at ___ 'to perform a number of further process steps (such as forming and chaining cross-conductors) on a stack of partial structures, and Then the other layers can be firmly fixed to this section. -20- 200306589 A7 V. Description of the invention (19) Stack the components to complete the assembly. Stacking and subdividing into composite devices can be completed using a variety of technologies such as mining, shearing, cutting grains, punching and clamping, such as using mines, shears, blades, wires, spouts, clamping devices, lasers, or i-combinations Reached. Several preferred methods for manufacturing devices from single-layers are disclosed in U.S. Pat. No. 4,2 ". These methods are adaptive to subdividing the stacks, as described herein. In addition, several steps of the method, such as firm fixing Laminated on-stack and completed with multiple conductors using alternating conductors. Ti In order to reduce the curl or lightness caused by shrinkage during subsequent process steps, it is better to apply a pattern to surround at least one layer of the laminate. The better pattern is borrowed A method for manufacturing, which comprises setting a staggered cross-section around the periphery of the laminate, such as "W" or "Z", to selectively remove conductive materials from at least one conductive surface of each laminate, so there is electrical continuity between the outer edges of the conductive surfaces of the outer layer. . Part or all of the external conductive surface may be covered with an insulating layer such as a solder mask or a marker 15 material, such as disclosed in U.S. Patent No. 5,831,510. It is often useful for an external consumer electronics cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs to print and electrically connect passive or active electrical components directly to the device of the present invention or to the assembly before the total components of the present invention are separated into individual devices. of. In these cases, the multilayer structure functions as an electrical 20-circuit board, with jumper conductors fixed so that it can be connected to the internal components of the assembly and / or device. In a preferred embodiment, a single PTC laminate may be located between two insulating laminates. In the PTC laminate, the conductive polymer component is located between two metal foil electrodes, and the insulation layers each include—or Multiple individual layers or films, such as epoxy pre-preg. -21 in the form of foil and ink This paper is suitable for financial specifications (2iGx297l ^ ----- 200306589 A7 V. Description of the invention (20 Metal layer or other layers can be added to the insulation layer) And provide electrical contact from-external conductive meter_other_external surface, "and / or electrical contact to the internal conductive surface by a jumper conductor. Depending on the jumper conductor used, the component can be isolated from the conductive polymer layer . 10 15 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 20 If the electrical connection between the device and the device is achieved through a connection or contact, the connection can be “hard-wired”, which means equivalent. Permanent connections such as soldered or welded electrical leads' or removable, such as reconnectable via pins, springs, wires, or other components Materials, such as / Pb solder, are often on copper. Reconnectable contact liners—generally never form a material or coating that will create a resistive layer that will affect good electrical connection and / or degrade the system. This material. Suitable materials include gold (more Hard gold), and alloys, and other materials used in traditional connectors. These materials are applied using traditional printed circuit board technology. Usually it is better to fix the permanent electrical connection pad to the device or combination One external surface, while the reattachable contact pads are fixed to the opposite external surface, but the type can be on the same side or on both sides, depending on the thermal aspect and / or design considerations. Includes already durable Electrical components that are attached to it and include reconnectable contact pads are more suitable, for example, when a device is intended to be attached to a system, such as a battery charging system. The component may be Electrically passive, such as resistors, capacitors, or thermistors, or electrically active, such as control integrated circuits, field effect transistors, or shunt regulator integrated circuits. To provide additional support for additional components, internal Supporting piece, pier-22- This paper size is in accordance with Chinese national standard (〇 ^) 8.4 (21〇χ297mm) 200306589 A7 B7 V. Description of invention (21) Column, or quite hard The material (such as epoxy) structural element can be fixed in a multilayer assembly, under the connection pad or contact pad. Devices that include electrical components directly fixed to the surface For portable or portable electronics Battery packs for devices such as mobile phones, computers, personal digital assistants 5 (PDAs) are particularly useful and require additional discrete components such as identification resistors, thermistors, or control chips and / or external charging / Connect the contacts or leads. By integrating these components or contacts on the device, space requirements, assembly difficulties, and product complexity can be reduced. The present invention is illustrated in the accompanying drawings, where each structural feature such as the pore 10 And the thickness of the components is not drawn to scale to make each component clearer and easier to understand. Figure 1 is a perspective view of a cross-section of a stack 1. Two layered elements 7 and 8 are stacked, each having a patterned external conductive surface 3 and 3, , And patterned internal conductive surfaces 5 and 5. The elements 7 and 8 are firmly fixed to each other using an insulating layered element 6. The tubular cross conductor 11 extends through the stack (as shown). 15 ® 2 is an exploded view of a stack structured according to the method of the present invention. The consumer cooperation of the Intellectual Property Bureau of the Ministry of Economic Affairs of the second floor has printed printed elements 7 and 8 each having a patterned internal conductive surface 5 and $, and unpatterned. The outer conductive surfaces 3 and 3 are included in the stack, and the layered element 6 is placed between 7 and 8. The alignment holes 4 are used to orient the stacked elements obliquely relative to each other, and to position the stack for subsequent processes, such as patterning of the outer surface 20 and formation of voids. FIG. 3 is a plan view of a patterned outer conductive surface 3 of a stacked section. c Marks are stacked and then divided into composite device positions. FIG. 4 is a cross-sectional view taken along line IV of FIG. 3. The stack includes layered elements 7 and 8 each having internal conductive surfaces 5 and 5, and external conductive surfaces 3 and 3, and a layered element 6 clip -23-

200306589 Α7 --- ^ Β7 V. Description of the invention (22) Placed between 7 and 8. Secret #,, The stack is plated to provide a tubular cross-conductor η in each pore (to provide a recording layer on the other exposed outer surface of the stack. If so, the official cross-conductor can be divided again A cross-conductor with a semi-circular cross-section is formed. Figure 5 is a perspective view of a composite device 2 formed by subdividing and stacking. The two wide-shaped PTC elements 彳 17 17 η 36 ί 18 each have external electrodes 14 and 14, respectively, and 36 ', internal electrodes 16 and 16, and internal remaining conductive parts 38 and 38 ,, a, firm — layered PTC elements 17 and 18 use layered elements 26 10 15 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 20 , Iy 疋 is starting. The first cross member 31 and the second cross member 51 are the medium gas produced by plating 敦 / ίτ, where the exposed surface is plated with copper, and then the first plate is formed with solder to form a first impurity: t The cladding layer 32 is formed on the lateral member 31 and a second plating layer 52 is formed on the lateral surface, and the surface 51. The dielectric coating 55 covers the exterior of the device for electrical connection. The plating 12 is applied to the area of the external electrode. It indicates that the dielectric material f coating 55 does not contain the electrode material shao underneath. Figure 6 is as shown in Figure 5 Cross-section view of orbital line 41 and their welded to the insulation $ 2, 人人 17 is & a variety of ^ plan views shown on line VIII_Vm of FIGS. 8 to U, 14 and 21. The dotted line indicates that it is on the dielectric layer 55. There is no electrode material in the lower one. Note that for the cross-sectional views shown in Figs. 8-11, 14 and 21, add _ & 口 禾 显 不 电 层 55. Figures 8 and 9 show two types of PTr * s connected in parallel Any configuration. For the device shown in FIG. 8, when exchanging high resistance yttrium, the layered element 26 does not have a potential drop across the layered element 26 when the potential is applied to the external electrode 14 and the external remaining conductive member 36. But For -24- This paper size applies the Chinese National Standard (CNS) A4 specification (21 × 297). 5. Description of the invention (23) 10 15 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 20 For the device shown in Figure 9 In the exchange of the electric parts ^ @ &, ~, the shape of the element 20 to the same outer St: 2 potential drop. Solid 10 shows the device change shown in Figure 8, does not include the remaining three layers of the junction element # 17 10 Figure u is not connected in parallel through the mediator: 丨 = and 19 is a composite device, the layered elements 1 in Η and 18 And the remaining conductive members 38,38, '38 " and 38, " of the laminar element. Xm: l: Plan view of the device without remaining conductive members; along 3 == Figure: in Figure 13. The dotted line indicates the outside Below the dielectric layer 55, there is an electrode material. The electro-reading layer 55 is not shown in FIG. 1 14 is a composite device formed by the method of the present invention, in which cross-conductance = not, fully extended through all the layers of the stack. In order to manufacture here The V body 59 shown only extends between the outer and inner conductors of the stacked layer elements, and between the surfaces; then the layer elements are firmly fixed together using an anisotropic conductive substance 57. The conductive substance 57 is only conductive in the z direction Here, z represents the direction from the bottom to the top of the composite device. The conductive substance 57 provides an electrical connection between the remaining internal conductive members 38 and 38 'and the internal electrodes 16 and 16, without causing 38 or 38 to be short-circuited to 16 or 16. Fig. 15 shows a composite device in which layered elements 17 and 18 are connected in series. The layered elements are firmly fixed together using a conductive material 61. Cross conductors are made in the stack and connected to some but not all conductive surfaces. In order to form such a cross-conductor, pores larger than a predetermined dimension of the cross-conductor are formed through the stack. Then the pores are filled with insulating substance 63, and filled with insulator 63. -25- This paper size applies to China National Standard (CNS) A4 (210x297 mm) 200306589 A7

The two parts of the volume form two smaller pores 65 and 67. The pores 65 and 67 and the exposed external electrodes have plated layers 32 and 52. Figure B shows a plan view of the composite device, which includes two devices and shows a solid external electrical connection point. The electrical connection diagrams of the two devices 77 and 79 are shown in FIG. 5 17 and FIG. 18 are sectional views along line XVIII-XVIII in FIG. 16. Cross-conduction The remaining pieces 38 and 38 are in electrical contact ... The gap 46, 38 'is separated from the internal electrodes 16 and 16. There are also additional conductive members 10 FIG. 19 shows a cross-sectional view taken along the line IX-XIX in FIG. 16. The cross-conductor 7 makes electrical contact with the remaining conductive members 38 and 38 at the inner port ρ. The remaining pieces 38 and 38 are separated from the internal electrodes 16 and 16 by a gap. There are also additional conductive members 46, FIG. 20 shows a cross-sectional view taken along the χχ-χχ of FIG. 15 FIG. 21 shows a composite device having only one internal electrode 16 formed by a stack having only one internal conductive surface. The layered element 17 combines the layered element 78. The layered elements can be pressed together to form a joint, so there is no need for a third layered element to hold the layered elements together. For example, layered elements 17 Printed by the Intellectual Property Office of the Ministry of Economic Affairs and Consumer Affairs Agency may include PTC elements, and 78 include dielectric substrates with adhesive properties. Figure 22 is a plan view of the composite device, which has multiple cross-conductors to provide additional current carrying capacity, extra strong, to prevent other cross-conductors from being damaged or open. The dashed line indicates the area without electrode material; the dotted line indicates an additional cross-conductor area. -26- 200306589 A7 B7 V. Description of the invention (25) Fig. 23 is a cross-sectional view taken along the line XXXII-X of Fig. 22 (the dielectric layer 55 is not shown). The third pore 81 has a metal ore coating layer 82 and forms an additional electrical connection between the internal electrodes 16 and 167β. Note that the _ region surrounds the external electrodes μ and 14 'and there is no electrode material there. 5 ® 24 is an exploded view of Stack 1, in which three closed conductive layers 107, 108, and 109 are attached to each other using non-conductive layered layers 106 ', 106 " in the form of adhesive layers. The additional non-conductive layers 106 and 106 " are connected to the bimetallic hafnium layers no and in respectively to the laminated layers 107 and 109 after being carved. The resulting stack: can be divided into individual devices 2, as shown in Figure 25. After the side and / or its tenth processing step, a plurality of metal slabs mlu remain on the exposed adhesive surfaces 116, 116 'as a pad connected to a circuit board or other substrate. Each device has a first-transverse member 31 with a first-wei layer 32 and a second-transverse member 51 with a second plating layer 52. Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 26 is an exploded view of Stack 1, in which a single side and drilled conductive layer U7 are sandwiched between two non-conductive layered layers 116 and 116. Each non-conductive layered layer may be an adhesive such as an epoxy prepreg and includes one or more discrete layers. The layered metal box layers 120, 121 are attached to the non-conductive layered layers 116, 116 'and form other stacked layers. When the layers are laminated together using heat and pressure, the adhesive will fill the pores of the conductive laminate 117. After processing, 20 devices 2 (shown in FIG. 27) can be separated by stack i. The electrical connection pad 122 is formed of a metal foil layer 120, and the pad is used to attach one or more electrical resistors such as a device surface of a silicon device. The attachment of the module is disclosed in International Patent Application No. PCT / US00 / 07801 (filing date: March 17, 2010), which is disclosed and described herein for reference. Electrical connection pads formed by the metal foil layer 121 123 -27- This paper size applies to China National Standard (CNS) A4 ^-20032003589 A7 B7 V. Description of the invention (26 5 10 15 Employees of Intellectual Property Bureau, Ministry of Economic Affairs Cooperative printed 20 is used to attach the device to a circuit board or other substrate. The first and second cross members 31 and 51 are plated with layers 32 and 52, respectively. There are also "isolated" cross members or through holes 124. This system It is formed by the adhesive filling the pores, and another hole is drilled and plated through it. Fig. 28 is a perspective view of the device, in which the conductive laminated layer 117 which is single-etched and drilled is sandwiched between two devices in a manner similar to the device of Fig. 27. Between the non-conductive laminates 116, 116 '. Located on an external surface of the device is a contact liner 125, such as a hard gold layer applied on top of the layered metal foil layer 120. A plurality of electrical components are fixed on the opposite external surface. Bonding (soldering) pad 123, which is made of metal foil layer 121 and plated with solder. There are three isolated transverse pieces 124 connected to the solder pad 123 and / or the contact pad 125 and a conductive polymer One of the laminated ip surface connection dedicated to one 29a to 29d show plan views of the individual layers constituting a device of the type described in Example 5. Fig. 29a shows the top surface of the device to which two isolated crosspieces 124 and two Transverse members 31, and four contact pads 125. The remainder of the surface is covered with a dielectric (seal mask)%. Figure 29b shows the surface of the internal electrode 16, which is attached to the conductive polymer layer 17 (not (Pictured). In this device, there is an epoxy pier 126 located under the contact liner 125 to provide support. Figure 29e shows the surface of the second internal electrode 16 ', which is attached to the electrode 16' opposite to the electrode 16. The other surface of the conductive polymer layer 17. Fig. 29d shows the bottom surface of the device with ten solder pads 123. The present invention is illustrated by the following examples. -28- This paper size applies to China National Standard (CNS) A4 Specification (21〇X 297) 200306589 A7 B7 V. Description of the Invention (27) Example 1 The stacking method according to Figures 1 and 2 was prepared by the following method. The individual thickness of the two layers is about 0.264 mm (0 · 0104 inches). About 0.00356 mm (0.0014 inch) Of nickel / copper foil to a thickness of 193 mm (000076 inches) of conductive polymer 5 sheet. The conductive polymer is prepared by mixing about 40% by volume carbon black (Raven ™ 430 from Colombia Chemical Co., Ltd.) and about 60% of the valley ratio of polyacetate (Qi Furong ((^ νΓΟηΤ) 9659 from Qi Furong)) and then extruded into a thin sheet and laminated in a continuous process. The laminated sheet was cut into each laminated layer The size is 0.30 meters X 0.41 meters (12 inches X 16 inches). The stack was irradiated with 10 4.5 MeV electron beams to 5 million rads. Each layer is drilled around the periphery with an asymmetrical pattern to provide pores and slots. The layers are aligned in a known xy orientation to align the layers. ^ Align the holes and slots to align the plaques on top of each other. For imaging, solder cover and plating operations. 0.0762 mm (0.003 inch) thick modified acrylic 15-series adhesive (PyraluxTM LFO from DuPont) is also drilled with holes aligned for alignment. Printed by an employee consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, a thin layer surface of each of the two layers is patterned using an etching technique, in which an etching resist is first applied and then imaged in a predetermined pattern. The etch resist is developed and etched using copper vaporized copper before the resist is removed. These thin 20 layers are patterned to define the periphery of each device and the remaining conductive parts. In addition, the outer edges of the laminated metal box are carved to provide alternating cross-directional patterns around the periphery. As shown in Figure 2, it provides electrical continuous paths for For subsequent electrolytic plating of tin / lead. By setting two layers, the pattern matching etched edge faces inward, there is a -29- This paper size is applicable to China National Standard (CNS) A4 (210x297 public love) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives 200306589 A7 V. Invention Explanation (28)-The adhesive layer is sandwiched between them to form a stack, as shown in Figure 2. The fixing member is used to align the layered laminated layer 'and heat it under pressure to permanently attach each layer to form a layered structure. The resulting stack has a thickness of about 0.61 mm (0024 inches). 5 Drilling through the entire stack with a diameter of G.94 wire (0.037, holes to form pores. The stack is treated with plasma etching. Then the pores are coated with colloidal graphite 'and the stack is coated with copper for electrolytic plating. Then the outer metal foil layer of the stack is etched The pattern is aligned. The holes are aligned to ensure that the etched pattern is properly aligned with the previously etched internal layers. The pattern of the direction of the parent fork around the edge 10 is as before. The solder mask (Findel DSR 2200 C-7 Obtained from Tamura Kaken Company) applied on the stacked outer metal foil layer, hardened and then applied to the stacked second outer metal foil layer, hardened, and then the solder mask was imaged and developed. Like, mark each part, and then the panel 15 is heated to completely harden the cover. A tin-lead solder plate is deposited in the solder pad area for attaching the circuit board of the device. The assembly is divided to manufacture the device shown in FIG. 5, and the division method In order to first use shears or ore to divide the total composition into multiple strips, and then mechanically clamp the strips into individual devices, the process uses a two-step method, in which the strips are first separated by 20 It bends to form a crack in the conductive polymer, and then cuts along the dividing line. The manufactured device has a dimension of about 45 mm x 3.4 mm x 0.7 mm (0.179 忖 X 〇 · 133 忖 X 0.029 leaf) and a resistance of about 〇31 Ohm. The device has a resistance of about 0.050 ohms after being mounted on a printed circuit board by reflowing the solder. -30- This paper size applies to China National Standard (CNS) A4 (210x297 mm)

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 200306589

Example J A stack according to FIG. 24 was prepared by the following method. As in Example 丨 three layers were prepared, irradiated and drilled to align the holes. Four layers of modified acrylic adhesive as in Example i and two layers of i-ounce copper box (thickness: 0.0034 mm (0.0035 inch)) Use to line up the holes. Using the example 1 engraving technique, the outer surfaces of the two-box electrodes on all three layers were patterned to define the periphery of the individual device and the remaining conductive parts, and to define alternating alternating direction patterns on the periphery of the panel. By setting a layer of steel foil at the bottom (the processing side is facing up) and then a layer of adhesive 10 layers, the etched side of the two-layer laminate whose pattern matches is tied to the fixed component orientation, the adhesive layer is sandwiched between the layers, and then an adhesive layer is at the top The layers are laminated, and then a copper foil layer is placed on top (with the process side facing down) to form a stack. The fixing parts are used to align the laminated layers, and they are stacked under pressure and heated to permanently attach each layer to a laminated structure. The obtained stack of holes having a thickness of about 119 mm (0047 15 inches) / diameter of 0.994 mm (0.037 inches) was drilled through the entire stack to form pores. The stack is plasma-etched, colloidal graphite is applied to the pores, and copper is used as the electrolytic deposit. The stacked outer metal foil layers are then patterned using aligned hole etch patterns to ensure proper alignment. The staggered cross-directional pattern around the edges is etched for 20 etches as previously described. No. 3 and application of solder were the same as in Example 1. The stacking assembly was then divided using the program of Example 1 to manufacture the apparatus shown in FIG. The device of the process has a dimension of about 4.5 mm x 3.4 mm x 1.2 mm (0.179 inch x 0.33 inch X 0.047 忖) and a resistance of about 0.018 ohm. Mounted on printed circuits by reflow of solder -31-This paper size applies to China National Standard (CNS) A4 (210 χ 297 public love)

200306589 A7 V. Description of the invention (3 ()) ~ --- The device behind the board has a resistance of about 0.029 ohms. Example 3 The stacking assembly according to FIG. 26 was prepared by the following method. 〇078078 忖), a method of attaching a nickel / copper foil with a thickness of about 0 0356 mm 5 (0.0014 pairs) to a conductive polymer sheet having a thickness of 27 mm (0.005 inches). On the two main surfaces, the conductive polymer is prepared by mixing about 37% volume ratio carbon black (Raven 430) with about 10.5% volume ratio high density polyethylene (LB832, manufactured by Equistar) and about 52.5 % Copolymer (EBA705, manufactured by Icstastar), as in Example 1 and then extruded 10 in a chain process to form flakes and laminates. The laminated flakes were cut into 0.10 m x 0.41 m (4 pairs x 16 inches) The layers are drilled and aligned as in Example 1. Holes with a diameter of 0127 millimeters (5005 mm) form pores in the layers. Four layers of 0.038 mm (0.0015 hours) epoxy prepreg (44N thin film) (Available from Adon) and two layers of 1 ounce copper foil treated as in Example 1 of 15 are also drilled and aligned to align the holes. The remaining conductive parts are defined by patterning using the remaining technology described in Example 1, and the additional etched structural features are used as alignment reference marks for subsequent isolation processing. The stacking method is to place a layer of copper foil on the bottom (processing surface 20). Then there are two prepreg layers (shown as a single layer in Figure 20), laminated, two prepreg layers, and then a copper foil layer is placed on top (with the processing side facing down) to form a stack. The fixings are used to align the layers. When the stack is pressurized, it is heated and permanently attached to each layer to become a laminated structure, and the epoxy resin is forced to completely fill the pores of the laminated layer. The thickness of the stack is about 0.61 mm (0.024 inches). -32- This paper is timely @ @ 家Standard (CNS) Ai ^ (21〇χ 297 ^ Printed by the Consumer Consumption Cooperative of the Intellectual Property Bureau of the Ministry of Planning and Economics 200306589

Diameters of 0.94 mm (0.037 hrs) and 0.57 mm (0.023 mm) penetrate through the entire pile to form pores, diameter ο "mm ㈣η, and pores run through the entire stack to form pores. The pores Alignment with epoxy resin to fill the pores; the pores to be described later are separated from the laminated electrode by epoxy resin. The stacking is treated with plasma cutting, the pores are coated with colloidal graphite, and the stacking is coated with copper electrolytic ore. Then the outer metal box layer is stacked The pattern is engraved by the last name. The aligned holes are used to ensure that the etching pattern properly aligns the internal layers previously etched. In order to manufacture the device as shown in Figure 27, the assembly is sawed open with a saw 1 ^ blade panel length and then The panel is rotated by 90 degrees and the panel width is

For one-way slicing, use the etched reference structure features on the buildup as the ^ mark. The manufactured device has dimensions of approximately 4.5 mm x 13.77 mm x 0.61 mm (0.177 inch x 0.542 inch x 0.024 inch). These individual devices are heated on a belt furnace to heat the device to a melting point higher than 15 (> 130.00), cooled to room temperature and then irradiated to 7 million rais with a cobalt irradiation source. '' Intellectual Property of the Ministry of Economic Affairs The device printed by the Bureau ’s Consumer Cooperative has a resistance of about 0.028 ohms when measured across conductive polymer laminates, and greater than 1 × 106 ohms when measured across separated vias and conductive polymer laminates. Borrow After the solder is reflowed and mounted on a printed circuit board or a nickel 20 lead, the device has a resistance of about 0.0042 ohms when measuring across conductive polymer laminates, and when measuring across conductive vias with spaced apart conductive holes. The resistance is greater than 1 X 106 ohms. The device is suitable for directly attaching electrical components to the piercing. The holes and lateral conductive parts are positioned based on the exact electrical connection. The attached electrical components such as circuit board components can be electrically connected to the conductive polymer laminate%. And ^ -33- This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) 200306589 A7 B7 V. Description of the invention (32) Conductive polymer laminated for electrical isolation. Example 4 Ministry of Economic Affairs Printed by the Intellectual Property Cooperative Consumer Cooperative unless otherwise specified, a combination is generally prepared in accordance with the procedure of Example 3. The electroplated nickel / copper foil used has a total thickness of 0,0432 mm (0.017 inches) and 5 degrees. The outermost surface of the foil on the individual laminates was scrubbed with a vibratory abrasive scrubber and then immersed in an etchant to remove the nickel plating from the nickel / copper foil, leaving a bare copper surface. These outer surfaces were then used as in Example 1 The photoresist / imaging / developing / etching / stripping technology is used to make patterns to define the electrode characteristics of the device, the remaining electrode structure, and the etch-back characteristics to minimize the electrode burr at the device corner 10 during the isolation process, or After the isolation, there are exposed electrodes on the edge of the device. The outer surfaces are then scrubbed and treated with a series of chemical baths (multiple connections supplied by McDermott) to surface treat the copper panel surface to improve adhesion. Then A stack was formed as in Example 3. The pores had a caliber of 0.57 mm (0.023 inch), which was drilled through the entire 15 stack to form an opening, with an additional caliber of 0.57 mm (0.23 inch) The pores are drilled through the entire stack to form an opening centered at an opening of 1.24 mm (0.049 inches) filled with epoxy; the latter opening is completely through the epoxy with the laminated electrode Isolation. The stack is treated with plasma etching. The openings are then coated with colloidal graphite, and the stack is electrolytically plated with copper. 20 Then the outer metal foil layer of the stack uses the photoresist / imaging / development / Etching / stripping technique to produce patterns to produce usable pads on one side of the panel (for attachment of leads or electronic components) and to produce usable pads on the other side of the panel (for surface contact points) Connection). -34- This paper is also a standard for coincident reference masks used in subsequent isolation procedures. This paper is a timely standard (^ Τ ^ (21〇ϋ 公 幻 200306589 A7 B7) 5. Description of the invention (33) Features. Contact lining The pads are brought together with a width of 0.25 mm (0.010 inches) to facilitate subsequent electroplating of the surface of the lining. The liquid photoimageable solder mask material in Example 1 was applied to the panel using a screen printing process. Both sides. This solder mask layer uses the original image to image 5 on both sides. In the original image, the solder pads and contact pads are left unexposed. The panel is developed and stripped to leave only the exposed solder pads. And the metal contacting the pad. The panel is baked at 102-115 ° C for 4 hours to fully cure the solder mask. The resist is added to the < The contact profile on the side is followed by hard gold ore, after which the resist is stripped. The resist is applied to one side of the panel with gold contact pads and the other side of the panel with solder pads is tin. Dipping and stripping the resist afterwards. Member of Intellectual Property Bureau, Ministry of Economic Affairs The combination printed by the consumer cooperative was divided to make a device as shown in FIG. 28, which uses wafer faults and the last name engraved reference feature on the laminate as a saw positioning mark. It is cut several times along the length of the panel. Rotate the panel 90 degrees, and then cut multiple times along the width of the panel. The devices produced have a size of approximately 28 x 7 · 6 X 0.61 mm (1.102 X 0 · 299 X 0.024 inches). Each device has five Perforated plating channels (two channels are connected to the PTC stack, and three channels are isolated and connected only to the welding and / or contact pads), four 20 key gold contact liners on one side of the outer surface ( Figures 28 and 29a), and a total of 12 tin-plated solder pads on the other side of the outer surface (see Figure 29d). These devices are heat treated and irradiated, as in Example 3. The treated devices are polymerized as transconducting The physical layer has a resistance of 0.021 ohms when measured, and has a greater than -35 when measured across isolated channels and conductive polymer layers. This paper size applies the Chinese National Standard (CNS) A4 specification (210x297 mm) 200306589 A7 B7 V. invention Ming (34) lxlO6 ohm resistance. After the Ni lead is installed by solder reflow, these devices have a resistance of 0.028 ohm when measured across conductive polymer laminates, and when measured across isolated channels and conductive polymer laminates Has a resistance greater than 1 X 106 ohms. 5 Example 5 Except the following, a combination was prepared following the method of Example 4. The laminates were drilled with a calibre of 1.24 mm with registration pores consistent with the laminate fixture ( 0.049 inches) and pores with a diameter of 0.457 mm (0.018 inches) to make the openings in the laminate. 10 The combination was split to produce devices with dimensions of approximately 28x7.6x0.61 mm (1.102 X 0.299 X 〇24 inches). As in the device of Example 4, each device has five perforated plated channels (two channels connected to the PTC stack and three channels isolated and connected only to soldering and / or contact pads) and four gold-plated connection pads on The outer surface of one side, and the outer surface of the other side, has 15 12 key solder linings. In addition, there are four 457 mm (0.018 inch) openings filled with epoxy under each contact pad, gathering around the expected contact force points of each contact pad (see Figure 29b). These devices were heat treated and irradiated, as in Example 4. The processed consumer device printed by the Intellectual Property Bureau of the Ministry of Economic Affairs has a resistance of 0.019 ohms when measured across conductive polymer laminates, and a resistance greater than lxlO6 ohms when measured across isolated channels and conductive polymer laminates . After the Ni leads are mounted by solder reflow, these devices have a resistance of 0.0028 ohms when measured across conductive polymer laminates, and have a resistance greater than 1x10 6 ohms when measured across isolated channels and conductive polymer laminates. -36- 200306589 A7 B7 V. Description of the invention (35) V. [Brief description of the drawings] The present invention is illustrated in the accompanying drawings. In the drawings, FIG. 1 is a stack formed on the first characteristic aspect of the present invention. Sectional perspective view, the stack can be further divided into a plurality of individual composite devices; 5 Figure 2 is an exploded view of the stack that has been patterned on the internal conductive surface; Figure 3 is a top plan view of a stack; Figure 4 is a cross-sectional view of a stack Section 3 taken by line IV-IV, 10 FIG. 5 is a perspective view of the composite device of the present invention; FIG. 6 is a sectional view of the composite device mounted on a printed circuit board and parallel circuit boards; FIG. 7 is a composite device The plan view is further illustrated in Figs. 8, 9, 10, 11, 14, and 21; 15 Figs. 8, 9 and 10 are cross-sectional views of a composite device having two elements connected in parallel along line VIII-VIII of Fig. 7; Figure 11 is a cross-sectional view of a composite device with three components connected in parallel along line VIII · VIII of Figure 7; printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs; Figure 12 is a plan view of another composite device with two components connected in parallel 20 knots but no picture 13 The remaining conductive parts; FIG. 13 is a cross-sectional view taken along the line XI-ΙΙ-χΙΠ of FIG. 12; FIG. 14 is a cross-sectional view of another composite device with two components connected in parallel along the line VIII-VIII of FIG. 7; 15 is a cross-section of a composite device with two components connected in series-37- This paper size is applicable to the national standard (CNS) A4 specification (210x297 mm) 200306589 A7 B7 V. Description of the invention (36) Figure; Figure 10 is A plan view of a composite device with more than two external electrical connection points; FIG. 17 is a circuit diagram of individual devices connected together to form the interconnection structure of the 5 composite device of FIGS. 16 and 18 to 20. 18, 19, and 20 are cross-sectional views taken along the lines χνΐΙΙ-χνΐΙΙ, XIX-XIX, and XX-XX in FIG. 16, respectively; FIG. 21 is a sectional view of a composite device with two external electrodes and an internal electrode; 10 22 is a plan view of a composite device with multiple electrical connections between layers of the composite device; FIG. 23 is a cross-sectional view taken along the line xxm-xxm of FIG. 22; and FIGS. 24 and 26 are exploded views of the stack of the present invention, The stack forms an assembly and can be subdivided into a plurality of individual composite devices; and 15 FIGS. 25 and 27 are perspective views of the device of the present invention made from the stacks of FIGS. 24 and 26, respectively. Figure 28 is a perspective view of a composite device with contact pads; and Θ 29a to 29d are flat printed drawings of employees' cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, which include layers of the composite device of Figure 28. 20 -38- This paper size is applicable to China ^ S ^ CNS) A4 size (210x297). 200306589 A7 B7 Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs

V. Description of the invention (37) Drawing number description: 12 3 '3 * 5 5 > 516 781 110 12 14, 14, 16, 16, 17 18 15 19 26 31 32 36, 36, 20 38, 38, 46, 51 52 55 Stacked composite device patterned external conductive surface patterned internal conductive surface insulation layered element layered element layered element tubular cross-conductor plating layer external electrode internal electrode layered PCT element layered PCT element layered element layered element The first horizontal part, the first conductive layer, and the remaining conductive parts are separated by the remaining extra conductive parts. The second horizontal part, the second plating layer, and the cross-conductor dielectric coating. -39- This paper size is applicable to China National Standard (CNS) A4 Specifications (210x297 mm) 200306589 A7 B7 V. Description of the invention (38) 57 59 61 63 5 65 67 78 81 82 10 106-, 106, 107 108 109 110 15 111 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Anisotropic conductive material Cross conductor Conductive material Insulating material Pore Pore Layered element Pore Metal plating Non-conductive layered layer Conductive layer Conductive layer Conductive layer Conductive layer Metal foil Metal foil layer Exposed adhesive surface conduction Layer-by-layer metal foil Layer-by-layer metal foil layer Electrical connection pad Electrical connection pad through hole -40- 116, 116, 117 120 121 20 122 123 124 This paper size applies to China National Standard (CNS) A4 (210x297) %)

Claims (1)

200306589 A8 B8 C8 D8 6. Scope of Patent Application 1. A method for manufacturing a composite polymer circuit protection device, the method includes (1) providing a polymer assembly, including (a) providing first and second layers, each The build-up layer includes a layer of polymer 5 elements having at least one conductive surface, (b) providing a pattern of conductive material on at least one side of a build-up conductive surface, (c) fixing the build-up to a stack in a predetermined configuration, and at least one build-up layer At least one conductive surface includes the outer conductive surface of the stack, 10 (d) fabricating a plurality of electrical connections between the conductive surface of the first laminate and the conductive surface of the second laminate, and (e) adding a plurality of electrical components to the stack External conductive surfaces; and (2) subdividing the stack into individual devices, each of which includes at least one electrical connection, and (ii) at least one electrical component. 2. The method of claim 1 wherein the combination includes two external conductive surfaces and the electrical component is attached to the two external conductive surfaces. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 3. The method of item 1 in the scope of patent application, in which the electrical component is attached to a durable electrical connection pad. 4. The method of claim 3, wherein the electrical connection liner comprises a solderable material. 5. The method of claim 1 in which the electrical component is attached to a reattachable contact pad. -41-This paper size applies to China National Standard (CNS) A4 (210x297 mm) 91541B 200306589 The scope of the patent application is cleared. 15 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 20 6 · If the method of applying for the scope of patent No. 5 is applied, its gas connection may include gold, metal, or nickel / which should be reconnected. 7 · Such as the method of applying for the scope of the first item of patent scope, 〇 |. Attach to these external conductive surfaces at least in the middle-the additional conductive layer forms an electrical connection pad or at least a part that can be re-connected, in accordance with the method of item 1 of the scope of patent application, touch the pad. The polymer includes layers in the first buildup of the PTC conductive polymer group 2. 9. The method of item 8 in the scope of patent application, which is 0. The polymer element contains a dielectric material. ^ Layers of the second layer10. If the method of the scope of patent application No.9, the third layer, the third layer includes a dielectric, the assembly also includes a second and third layer located in the first Laminated items-layered components, which are used to make a composite polymer circuit protection device. Including and placing the method, the method (1) provides a polymer assembly including first and second layers, each of which includes 70 layers of polymer, which has at least one Conductive surface, ⑼ provide-conductive material pattern on-the conductive surface of the build-up to one side, (c) fix the build-up to a stack in a predetermined configuration, at least one build-up and at least one conductive surface includes the outer conductive surface of the stack, (d) manufacture A plurality of electrical connections are made between the conductive surface of the first laminate and the conductive surface of the second laminate. (2) The stack is subdivided into individual devices, each of which contains at least a small amount of electricity. • 42-This paper size applies to China National Standard (CNS) A4 Specification (21 × 297 Public Love) 200306589 A8 B8 C8 D8 VI. Patent application scope-Electrical connection; and (3) At least one electrical component is attached to one of the external conductive surfaces of each device. 12. The method of claim 11 in which the layered polymer in the first buildup comprises a PTC conductive polymer composition. 5 13. The method of claim 12 in which the layered polymer element of the second laminate comprises a dielectric material. 14. The method of claim 13 in the patent application range, wherein the assembly further includes a third layer, the third layer includes a layer-like element that is a dielectric, and the second and third layers are located on top and bottom of the first layer . 10 15 · —A method for manufacturing a composite polymer circuit protection device, the method includes (1) providing a polymer assembly, including (a) providing first and second layers, each layer including a layer of polymer elements It has at least one conductive surface, 15 (b) provides a pattern of conductive material on at least one side of a laminated conductive surface, (c) provides a pattern of conductive material on at least one side of a laminated conductive surface, Ministry of Economic Affairs wisdom Printed by the Property Cooperative Consumer Cooperative (d) a fixed stack in a predetermined configuration, at least one stack of 20 at least one conductive surface including the stack's outer conductive surface, (e) manufacturing a plurality of electrical connections electrically connected to the first stack Between the surface and the conductive surface of the second laminate, and (f) providing additional electrical conductivity on at least a portion of at least one of the external conductive surfaces to form an electrical connection liner -43-This paper applies to China National Standard (CNS) A4 specification (210x297 mm) 200306589 A8 B8 C8 _D8_ VI. Patent application scope or a reconnectable contact pad; and (2) The stack is subdivided into individual devices, each of which includes (i) at least one electrical connection, and (ii) at least one electrical connection profile or a reconnectable contact liner. 5 16. The method of claim 15 wherein each device includes at least one electrical connection pad on one external surface and at least one reconnectable contact pad on the other external surface. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized for the Chinese National Standard (CNS) A4 (210x297 mm)