1270648 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種使用於命 一 特 文用於兒子兀件的散埶穿置 別是指-種具高熱效率之震盪型熱管均熱器。、 【先前技術】 均熱片的目地是將小面積之熱源，如電子晶片、中央1270648 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a type of oscillating heat pipe homogenizer for use in a high-efficiency efficiency. . [Prior Art] The purpose of the heat spreader is to heat a small area, such as an electronic chip, the center.
:=Γ元件’將在運轉過程中所產生的熱量利用均 “内顿造均勻的熱傳遞至均熱片各部位，再藉由擴大 的散熱面’配合熱沈(Heat Sink)與風扇把熱排出系、：，二 提昇散熱效率。 稭x ，閱圖1及圖2，係為習知之—蒸汽腔體式（ Chamber)熱管均熱片1，主要包括一上板片n、一與該上 板片11對合的下板片12，及—形成於該等板片心η内 壁面上的毛細結構13。該等板片對合後形成-蒸汽腔體14 。板片11、12係由高熱傳導係數之材質製成，而該毛細結 2 13係位於該蒸汽腔體14内，腔體14中則填充適當的液 月豆’並使该液體能在腔體14中流動。 在實際使用方面，熱源之熱量由下板片12外表面吸收 而傳至条八腔體丨4内的液體，該液體受熱後蒸發為汽體並 彺上及周圍流動。上板片11外部設置該熱沈（Heat Sink)與 几扇寺排熱系統（圖未示），使流體蒸汽釋放潛熱而冷凝於上 片11内壁上’冷凝的凝結液受表面毛細結構1 3之毛細作 用在下板片12熱源處遞補，此一循環達到兩相熱傳效果 ’且於該循環中係以表面毛細結構 13之毛細力作為液相與 Ϊ270648 汽相流體逆向流動之主要驅動力。 准仏使用中’其蒸汽腔體μ 複雜、成本高，封裝 内^毛、-田結構13製程 ^ 14 、义率不易掌握。所形成的基汽# 體14、，構易於變形，影響表面平整度，使节=认 官均熱片1與所熱連接之電子元件的二U空體式熱 觸熱阻變大，而影響其^散熱性能。曰曰 熱片間的接 麥閱圖3，係為習知之—震 括一内徑微小的細管21，田”】Γ 益2,主要包 u型，且_91 21料成多數相連並列之 孓且細官21内置入液體。前述u 熱源大致正交，並可分為一 '丨延伸方向與 熱源的冷凝部23。當细管二；:的蒸發部22及-遠離 為細管2】内徑微小，受敎时戶;產22内液體受熱後，因 2】乃邱產生的蒸汽泡易佔滿細管 二二 ㈣細管21兩側其中一側蒸汽泡厂堅力大 貞而迫使心泡流出該蒸發部22並將液體推向冷凝 部〜同時藉由連續的U3rf折結構，使部分液體受到声 力推擦而再流至另―側蒸《 22 ;高溫的蒸汽泡到了枝 部23會因部分凝結而變小，運動的過程亦會與鄰近的蒸汽 泡結合成較大的汽泡塊。因此汽泡與液體在細管2ι ^溫 度壓力變化，透過u型彎折結構而產生稱為震盪流Y Oscillating Flow)之來回震堡之流動形式，因此達到連續傳 熱的效果。 惟貫際使用時，由於震盪流動特性，以細管2 1同一呻 位來說’隨著汽泡或液體的震堡流動，管壁溫度產生變化 劇烈’並不利於電子設備的使用。 6 1270648 此外，如圖3所示之蒸發部22係位於冷凝部Μ 方，但若該散熱器2所裝設之電子設備為可攜式或可平放 ’甚至可倒立放置使用時’當蒸發部22位於冷凝部23垂 直上方靜置一段時間後，液體可能受重力影響，聚#冷 政部23 ’造成該震盈型熱管散熱裝置2之循環迴路無法啟 動，使局部熱點溫度升高，而導致設備賴壞之狀況。 【發明内容】 :此’本發明之一目的即在提供一種除能有效增加熱 、"㈠卜’製程簡單、易於量產，且結構強度亦高的震盪 型熱管均熱器。 、於疋，本發明震盈型熱管均熱器係緊靠地設置於一熱 源上ώ含· 一第一板片、一第二板片及一溝槽。 该弟二板片與該第一板片密封地對合，該溝槽則凹陷 地設置於該第一板片及該第二板片中的至少一者的内壁面 上’該溝槽以不同延伸方向連續彎折地繞設於該熱源的投 影，置周圍，當該等板片對合後藉以界定出一封閉的流道 。亥:道内充滿-卫作流體，而該流道繞設於靠近熱源的 區域，為蒸發部而相對遠離該蒸發部之區域則為冷凝部。 藉此，本創作震皇型熱管均熱器内的工作流體受熱後 由不同延伸方向的蒸發部將熱量有效地傳向冷凝部，使 熱ΐ有效的向四邊傳遞。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合芬考圖式之一個較佳實施例的詳細說明中，將可 1270648 清楚的呈現。 參關4及圖5，本發明震|型熱f均熱器之較佳實施 例使用時係熱連接於-小面積之熱源上，該熱源是指運轉 時會生熱的電子元件，例如電子晶片、中央處理器等具有 小面積發熱源的產品。該均熱器包含一上板片4、_與該上 板片4密封地對合的下板片5,及一自下板片5表面；形 成之溝槽6。本實施例中，該等板片4、5係由高熱傳導係 數材質製成，且其4、5面積大於該熱源之面積，該下板片 5之底面貼没於熱源外，兩者幾何中心$相對應。 該溝槽6設於該下板片5鄰近上板片4之表面，並以 忒熱源對應於下板片5之幾何中心8為中心以不同延伸方 向連續彎折地繞設，當二板片4、5對合後可界定出一循環 而密閉的流道61。為便於說明蒸發部及冷凝部，本實施例 中先定義三條相互平行的直線，分別為一通過該幾何中心8 的第一直線L1，及分列於該第一直線li二側的一第二直線 L2及一弟二直線L3。·本實施例中，流道61沿該第一直線 L1間隔地形成二區段，蒸發部每一區段婉蜒成多數連續彎 折且並排之U型，且該u型之長側延伸方向平行該第一直 線L1 ;二區段之兩末端朝相反向延伸而出並鄰近板緣，接 著蜿蜒成多數沿第二、第三直線L2、L3方向間隔並排之連 續U型，而與前述另一區段之兩末端相接通，此處之u型 長側延伸方向垂直該等直線LI、L2、L3方向。 本實施例定義流道61在對應幾何中心8處之區段為主 療發部611段，也就是前述二區段相鄰處；該二區段相遠 1270648 離處則定義為主冷凝部 L2、L3上且貪、P 應位於第二及第三直線 上且罪近第— 直線L1處疋義為副墓 而由副蒸發部613遠離eg '，、、土4 613歧 段。 ^㈣―直線U處則為副冷凝部614 流道61内填充有 _ ., 辦7Μ —幻料道61填充該工作流 月豆7之液悲谷積與流道61 7,〇/ . pe > 合積比為不小於40❶/。至不大於 _ 75 /〇之間。在此要說明、 置於下板片5内壁面，二：§ 非如本實施般僅設 面熱知本項技蟄者可知，該溝# 6亦 可以鏡像對稱的位置佈1 曰 士會处去, 师0 又於一板片4、5對合的壁面上，如 此亦月b達到二板片4、5對八描取 的設叶。 對口後形成一循環而密閉流道61 =圖6,熱源由該下板片5傳入，當主蒸發部川段 句副^部613段中的工作流體7受熱後，因為流道61内 =寸u小’產生的汽泡易於佔滿流道6ι内部份區域，當 蒸發部6H ' 613汽祕力大於相鄰段蒸發部⑴、⑴ 猎由連續的U型弯折使部分汽泡流出該蒸發部611、 =亚將液體推擠至冷凝部612、614而產生流動。因 體與汽泡在蜿蜒的流道61中可心超力變化產生前後震 盪之流動，不斷將熱由熱源傳遞至四周。 蒸發部6U、613因此不須靠習知蒸汽腔體式熱管均熱 1之毛細結構即可使工作流體7再流回到蒸發部6u、 ⑴’且藉由主蒸發部611與主冷凝部612切熱量有效傳 向板片4、5兩邊，同時由副蒸發部613傳向副冷凝部… ，使熱源有效向四邊傳遞。此外，由於流道61蜿蜒方向分 1270648 高成本支出、可使熱源有效的向四邊傳遞，且放置方向、 角度不受限，因此確實可達到本發明之功效。 惟以上所述者，僅為本發明之較佳實施例而已，當不 j以此限定本發明實施之範圍’即大凡依本發明申請專利 範圍及發明說明内容所作之簡 專效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 熱片； 圖2 圖3 圖4 之較佳實 圖5 板片與一 圖6 蒸發部與 部傳向副 圖7 圖8 圖1是-立體分解圖，說明習知一蒸汽腔體式熱管均 是圖1結構組合後沿丨方向所得之一剖視圖； 是-立體圖’說明習知—震盪型熱管散熱裝置. 是—立體分解圖’說明本發明震盡型熱管均熱器 施例； 是—類似圖4之視圖，說明該較佳實施例之—上 下板片對合後界定出一條封閉的流道； 是—局部放大透視圖，說明熱量藉工作流體由主 主冷欢部先將熱量傳向板片兩邊，同時由副蒸發 冷凝部，使熱源向四邊傳遞； 疋一圖5沿II方向的剖視圖；及 是一圖5沿III方向的剖視圖。 11 1270648 【主要元件符號說明】 4 ..........上板片 5 ..........下板片 6 ........••溝槽 61.........流道 611……主蒸發部 612 .......主冷凝部 613 .......副蒸發部 614.......副冷凝部 7 ..........工作流體 8 ..........幾何中心 L1.........第一直線 L2.........第二直線 L 3.........第三直線:=Γ Element' will use the heat generated during the operation to “transfer uniform heat to the various parts of the heat spreader, and then use the enlarged heat sink to match the heat sink (Seat) and the fan to heat The discharge system::, two to improve the heat dissipation efficiency. Straw x, see Figure 1 and Figure 2, is a conventional steam chamber type heat pipe fins 1, mainly comprising an upper plate n, a and the upper plate The lower plate 12 of the sheet 11 and the capillary structure 13 formed on the inner wall surface of the plate n are formed. After the plates are joined, the steam chamber 14 is formed. The plates 11 and 12 are high. The heat transfer coefficient is made of a material, and the capillary junction 2 13 is located in the vapor chamber 14, and the cavity 14 is filled with a suitable liquid moon bean 'and allows the liquid to flow in the cavity 14. In practical use. The heat of the heat source is absorbed by the outer surface of the lower plate 12 and transmitted to the liquid in the eight-cavity crucible 4, and the liquid is heated to evaporate into a vapor and flow on and around the crucible. The heat sink is disposed outside the upper plate 11 ( Heat Sink) and several temple heat removal systems (not shown) allow the fluid vapor to release latent heat and condense on the upper sheet 11 The 'condensed condensate on the wall is replenished by the capillary of the surface capillary structure 13 at the heat source of the lower plate 12, and this cycle reaches the two-phase heat transfer effect' and in the cycle the capillary force of the surface capillary structure 13 is used as the liquid. The main driving force of the phase flow and the reverse flow of the Ϊ270648 vapor phase fluid. The use of the quasi-仏 in its steam chamber μ is complex and costly, and the process of the inside of the package is not easy to grasp. The body of the steam body 14, the structure is easy to deform, affecting the surface flatness, so that the two-U hollow body type thermal contact resistance of the joint heat-receiving sheet 1 and the electronic components to be thermally connected becomes large, which affects the heat dissipation performance. Figure 3 between the hot sheets is a well-known one—shocking a small tube 21 with a small inner diameter, Tian 】 益 益 2, mainly including u type, and _91 21 material is connected in a juxtaposition and The fine official 21 is built into the liquid. The u heat source is substantially orthogonal and can be divided into a condensing portion 23 of a '丨 extension direction and a heat source. When the thin tube 2;: the evaporation portion 22 and - away from the thin tube 2] the inner diameter is small, when the household is affected by the sputum; after the liquid in the production 22 is heated, the steam bubble generated by the 2] is easy to occupy the thin tube 22 (four) thin tube On one side of the 21, one side of the steam bubble plant is strong enough to force the bubble to flow out of the evaporation portion 22 and push the liquid toward the condensation portion. At the same time, by continuous U3rf folding structure, part of the liquid is subjected to sound force and reflow. To the other side steaming "22; high temperature steam bubble to the branch 23 will become smaller due to partial condensation, the movement process will also be combined with the adjacent steam bubble into a larger bubble block. Therefore, the bubble and the liquid change in temperature at the temperature of the thin tube 2 ι ^ , and the flow pattern of the oscillating flow called the oscillating flow Y Oscillating Flow is transmitted through the u-shaped bent structure, thereby achieving the effect of continuous heat transfer. However, when used in a continuous manner, due to the oscillating flow characteristics, the temperature of the tube wall changes drastically with the flow of the bubble or liquid as the same position of the thin tube 2 1 is not conducive to the use of electronic equipment. 6 1270648 In addition, the evaporation portion 22 as shown in FIG. 3 is located in the condensing portion, but if the electronic device mounted on the heat sink 2 is portable or can be laid flat, even when placed upside down, when evaporating After the portion 22 is placed vertically above the condensing portion 23 for a period of time, the liquid may be affected by gravity, and the poly-cold department 23' causes the circulation loop of the shock-type heat pipe heat dissipating device 2 to fail to start, so that the local hot spot temperature rises. The condition that causes the device to deteriorate. SUMMARY OF THE INVENTION An object of the present invention is to provide an oscillating heat pipe heat spreader which is simple in process, easy to mass-produce, and high in structural strength, in addition to being capable of effectively increasing heat, "(a)). In the present invention, the shock-type heat pipe heat spreader of the present invention is disposed close to a heat source, including a first plate, a second plate and a groove. The second plate is sealingly engaged with the first plate, and the groove is recessed on the inner wall surface of at least one of the first plate and the second plate. The extension direction is continuously bent around the projection of the heat source, and is placed around, and when the sheets are combined, a closed flow path is defined. Hai: The channel is filled with a tributary fluid, and the channel is wound around a region close to the heat source, and the region that is the evaporation portion and relatively far from the evaporation portion is a condensing portion. Thereby, the working fluid in the seismic heat pipe heat spreader of the present invention is heated to be efficiently transferred to the condensing portion by the evaporation portions in different extending directions, so that the enthalpy is effectively transmitted to the four sides. [Embodiment] The foregoing and other technical contents, features, and effects of the present invention will be apparent from the following detailed description of a preferred embodiment of the Fenchem diagram. Referring to FIG. 4 and FIG. 5, the preferred embodiment of the shock type heat f-heater of the present invention is thermally connected to a small-area heat source, which is an electronic component that generates heat during operation, such as an electron. A product having a small area of heat source such as a wafer or a central processing unit. The heat spreader comprises an upper plate 4, a lower plate 5 which is sealingly engaged with the upper plate 4, and a surface from the lower plate 5; a groove 6 is formed. In this embodiment, the plates 4 and 5 are made of a material having a high thermal conductivity coefficient, and the area of the 4 and 5 is larger than the area of the heat source, and the bottom surface of the lower plate 5 is not attached to the heat source. $ corresponds. The groove 6 is disposed on the surface of the lower plate 5 adjacent to the upper plate 4, and is continuously bent in different extending directions with the heat source corresponding to the geometric center 8 of the lower plate 5 as the two plates. After the 4 and 5 pairs, a circulating and closed flow path 61 can be defined. In order to facilitate the description of the evaporation portion and the condensation portion, three parallel lines are defined in the first embodiment, which are a first straight line L1 passing through the geometric center 8, and a second straight line L2 arranged on two sides of the first straight line li. And a younger brother two straight line L3. In the present embodiment, the flow path 61 is formed at two intervals along the first straight line L1, and each section of the evaporation portion is formed into a plurality of continuously bent and side-by-side U-shaped, and the long side extension direction of the u-shaped is parallel. The first straight line L1; the two ends of the two sections extend in opposite directions and are adjacent to the edge of the board, and then are formed into a plurality of continuous U-shapes spaced along the second and third straight lines L2 and L3, and the other The two ends of the segment are connected, and the u-shaped long side extending direction is perpendicular to the straight lines LI, L2, and L3. In this embodiment, the section of the flow path 61 at the corresponding geometric center 8 is the main treatment part 611 section, that is, the adjacent two sections are adjacent; the two sections are far away from the 1270648 and are defined as the main condensation parts L2 and L3. Corruption, P should be on the second and third straight lines and the crime is close to the first line - the line L1 is the deputy tomb and the sub-evaporation unit 613 is away from the eg ',, and 4,613 segments. ^ (4) - The line U is the sub-condensing part 614. The flow path 61 is filled with _., 7 Μ - 幻料道 61 fills the workflow Moon Bean 7 liquid sorrow product and flow path 61 7, 〇 / . pe > The accumulation ratio is not less than 40❶/. It is not more than _ 75 / 〇. It should be explained here that it is placed on the inner wall of the lower plate 5. Second: § As far as this embodiment is concerned, it is known that the surface of the blade can be mirrored and symmetrical. 1 Gentlemen's Club Go, the teacher 0 is on the wall of a 4, 5 pair of plates, so that the month b reaches the set of leaves of the two plates 4, 5 and eight. After the counter is formed, a cycle is formed and the closed flow path 61 = Fig. 6. The heat source is introduced from the lower plate 5, and when the working fluid 7 in the section 613 of the main evaporating section is heated, since the flow path 61 is inside = The bubble generated by the inch u small is easy to occupy the inner part of the flow path 6ι, when the evaporation part 6H ' 613 vapor force is greater than the adjacent section evaporation part (1), (1) hunting by a continuous U-bend to make part of the bubble out The evaporation portion 611, = sub-pushes the liquid to the condensation portions 612, 614 to generate a flow. The flow of the front and back oscillates due to the change of the body and the bubble in the flow path 61 of the crucible, and the heat is continuously transmitted from the heat source to the surroundings. The evaporation portions 6U, 613 can therefore flow the working fluid 7 back to the evaporation portion 6u, (1)' without the capillary structure of the conventional vapor chamber heat pipe soaking, and can be cut by the main evaporation portion 611 and the main condensation portion 612. The heat is efficiently transmitted to both sides of the sheets 4 and 5, and is transmitted from the sub-evaporating portion 613 to the sub-condensing portion... so that the heat source is efficiently transmitted to the four sides. In addition, since the flow path 61 蜿蜒 direction is divided into 1270648, the cost is high, the heat source can be effectively transmitted to the four sides, and the placement direction and angle are not limited, so the effect of the present invention can be achieved. However, the above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the generalized changes and modifications made by the scope of the invention and the description of the invention. All remain within the scope of the invention patent. [Simple description of the drawing] Hot film; Fig. 2 Fig. 3 Fig. 4 The preferred picture Fig. 5 Plate and Fig. 6 Evaporation part and part transfer direction Fig. 7 Fig. 8 Fig. 1 is an exploded view showing the conventional one The steam chamber heat pipe is a cross-sectional view taken along the 丨 direction of the structure combination of Fig. 1; is a three-dimensional diagram 'illustration of the conventional oscillating heat pipe heat sink. Yes - the three-dimensional exploded view' illustrates the shock-type heat pipe heat spreader of the present invention Example - similar to the view of Fig. 4, illustrating the preferred embodiment - the upper and lower plates are aligned to define a closed flow path; First, the heat is transmitted to both sides of the plate, and the heat source is transmitted to the four sides by the sub-evaporation condensation portion; FIG. 5 is a cross-sectional view taken along line II; and FIG. 5 is a cross-sectional view taken along line III. 11 1270648 [Description of main component symbols] 4 .......... Upper plate 5 .......... Lower plate 6 ........•• Groove 61 .........flow path 611...main evaporation portion 612 . . . main condensation portion 613 ....sub-evaporation portion 614.......sub-condensation portion 7 ..........Working fluid 8 ..........Geometry center L1.........First straight line L2.........Second Straight line L 3.........the third straight line
1212