1269460 九、發明說明： 【發明所屬之技術領域】 種具導電特 電訊接點達 本發明係有關一種電子封裝結構，特別是一 性支撐底板之封裝單元，此封裝單元可藉由兩側之 到多晶片堆疊之目的。1269460 IX. Description of the invention: [Technical field of the invention] The present invention relates to an electronic package structure, in particular to a package unit of a supportive bottom plate, which can be The purpose of multi-wafer stacking.
隨著電子產品功能與應用急遽增加之需求，封f 繼續朝著超高密度、微小型、單晶片到多晶片、二維乂度&^ ，尺，等方向發展，故目前出現了較以往所見到之傳統$裝: 態於設計上、製作上，以及材料應用上截然不同之先進封妒社 構，如晶圓級封裝WLP (Wafer Level package)、三維封 多晶片封裝MCP (Multi-Chip Package)和系統級封裝SIp (System In Package)等超高密度的封裝形式。其中，最理 想的狀況為在一個矽晶片内，能將所有的電路容納進去，即系 統化晶片SoC (System-on-Chip)。然而，將逐漸複雜化之電 路功能集中於一晶片内，除了技術上有困難外，晶片大小會增 大，晶片的製程會複雜化，使得良率下降，成本上升；With the increasing demand for electronic product functions and applications, Feng F continues to move toward ultra-high density, micro-miniature, single-chip to multi-chip, two-dimensional &度 & ^, ruler, etc. The traditional $packages seen in the design: the design, production, and material application of the advanced packaging structure, such as wafer level package WLP (Wafer Level package), three-dimensional package multi-chip package MCP (Multi-Chip Package) and system-in-package ultra-high-density packages such as SIp (System In Package). Among them, the most desirable situation is that all the circuits can be accommodated in a single wafer, that is, a system-on-chip (SoC). However, the gradual complication of the circuit functions is concentrated in a single chip. In addition to technical difficulties, the size of the wafer will increase, and the process of the wafer will be complicated, resulting in a decrease in yield and an increase in cost;
SoC技術比較，強調體積小、高頻、高速 '生產週期短與低^ 本之系統化封裝技術SIP (System In Package)為達成前述 目標，及整合具不同電路功能晶片的較佳方法。根據應用需求 之不同可分為平面式的多晶片模組MCM ( Multi—Chip Module)，多晶片封裝 MCP (Multi—Chip package)，以及為了 更有效率地縮減封裝面積，而發展出具多重晶片之立體堆疊式 封裝結構，並進-步地使用薄“關時縮減堆疊封裝於^度 方向之尺寸與封裝體本身重量，而滿足先補裝結構之輕薄短 小需求。 5 1269460 【先前技術】 中華民國專利公告號543，1255中提出一種擴 (fan-out type)晶圓型態（wafer_level)封裝結構及其掣程， 如圖-所示；其中封裝膠體14位於晶片12之兩侧與底^ 該晶片與封裝膠體上佈有介電層圖案8用以定義導電層6之锋 構’同時於封裝體上表面塗佈具保護功用之罩幕層4 ;於= =結，中’第-導電凸塊1G可經由導電層到達第二導電j 之fig散S之目t並且，該專利亦揭露前述封農結構 之策方^匕括.一基板，並塗佈罩幕層（載體)於前述美柄 之上，圖案化罩幕層用以曝露部份該基板 ^ 二t電θ®案之上並曝露部份之上述導電層醜；以第一導 ί凸上述祕露之導電卵案，形成電訊$ ΪΪ凸ίίίΐί曝露出之上述導電圖案，及切割分離 Γ種具I/G擴散特性之晶_態封^籌 具有可堆疊之特性，無法滿足祕化封裝 戶達丨f8,905+，财—化金屬 層違到具I/O擴散特性之電子封褒結構 : 結構包括：具圖案化之金屬層110 塑孰二專匕^ 達封裝結構表面==屬:藉= ===製有造可r:特 能不易循該途徑向封襄體外部子疋件所產生之熱 6 1269460 因此，鑑於具系統整合之多微電子元件堆 成為微電子、高頻通訊或致動感測器等電 = 、i: 的’如何發展出-種高密度、高可靠度 ^之目 ^用需求魏作適當調整^微電子元 為當前急需解決的問題。 ί凌…構’實 【發明内容】 堆巧料統整合之錢電子元件 子將成為被電子、*頻通訊_動感測器等電子结 構拉組之趨勢，本發明具有以下之目的·· 口 本發明提出-㈣子職結構，其目的在 率=電訊傳遞路徑與時間而提“ 一 if明之另—目的在於提供—種電子封裝結構，其封裝 基材上批次製作完成，故可降低單一封裝單 明之另一目的在於提供一種電子封裝結構，其利用 八¥電特性之支撐底板提供電子元件之電訊傳遞 j作=承載之電子元件之接地端，提高該電子元件 同時，忒支撐底板亦為熱之良導體，可有效使由電子元件 ^斤生且積聚於封褒體内部之熱能，循該底板排 部，提高封裝結構之可靠度。 了我骽外 ⑽為，成前述目的，本發明所提出之電子封裝結構，包含 有單或複數個具有導電雜之支撐絲。單或複數個電子元 7 1269460SoC technology comparison emphasizes small size, high frequency, high speed 'slow production cycle short and low ^ system packaging technology SIP (System In Package) to achieve the above objectives, and to integrate the best method with different circuit function chips. According to the application requirements, it can be divided into a planar multi-chip module (MCM), a multi-chip package (MCP), and a multi-chip to reduce the package area more efficiently. The three-dimensional stacked package structure, and the step-by-step use of the thin "off-time reduction of the size of the stacked package in the ^ direction and the weight of the package itself, to meet the light and thin short requirements of the first patching structure. 5 1269460 [Prior Art] Republic of China patent A fan-out type wafer type (wafer_level) package structure and its process are shown in the publication number 543, 1255, as shown in the figure - wherein the package colloid 14 is located on both sides of the wafer 12 and the wafer. A dielectric layer pattern 8 is disposed on the encapsulant for defining the front structure of the conductive layer 6 while coating the protective layer 4 on the upper surface of the package; in the == junction, the middle 'the first conductive bump 1G can reach the second conductive j through the conductive layer. The patent also discloses the above-mentioned method for sealing the agricultural structure, and coating the mask layer (carrier) on the aforementioned handle. Patterned mask For exposing a portion of the substrate to the exposed portion of the conductive layer and exposing a portion of the conductive layer; the first conductive guide to the conductive egg case of the above-mentioned secret dew, forming a telecommunications $ ΪΪ ί ί ί ί ί The conductive pattern, and the crystal separation of the I/G diffusion characteristics of the cutting and separating type have the characteristics of stackability, which cannot satisfy the secret packaging package F8, 905+, and the financial-chemical metal layer violates I/ O-diffusion characteristics of electronic sealing structure: The structure includes: patterned metal layer 110 plastic 孰 two special 匕 ^ package structure surface == genus: borrow = === system has made r: special energy is not easy to follow this route The heat generated by the external components of the sealed body 6 1269460 Therefore, in view of the system integration of the multi-microelectronic component stack becomes microelectronics, high-frequency communication or actuating the sensor, etc. A kind of high-density, high-reliability ^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ Trend of electronic structure, such as electronic, *frequency communication _ motion sensor, etc. The purpose of the following is: · The present invention proposes - (iv) sub-division structure, the purpose of which is to rate = telecommunications transmission path and time to mention "one of the other - the purpose is to provide - an electronic package structure, the package substrate on the batch After the fabrication is completed, another purpose of reducing the single package is to provide an electronic package structure, which uses the support substrate of the eight-characteristic characteristic to provide the telecommunication transmission of the electronic component as the grounding end of the electronic component of the carrier, and the electronic component is improved. At the same time, the support base plate is also a good conductor of heat, which can effectively heat the heat generated by the electronic components and accumulate inside the seal body, and follow the bottom plate to improve the reliability of the package structure. In addition, (10), for the foregoing purposes, the electronic package structure proposed by the present invention comprises a single or a plurality of support wires having conductive impurities. Single or multiple electronic elements 7 1269460
件’佈於前述支撐底板之表面，該支撐底板之面積可大於，等 於或小於該電子元件之面積。單或複數個填充區域，形成於前 述電巧件四周，於該區_具料錢數辦通孔，且 ^亥導^孔内或孔壁填充具導電特性之材料，使該填充區域之 &面，、A述之支撐底板形成電訊連接。單或複數個電 ，於前述電子賴結構之單側或·，魏接點二佈 之表面面積可大於，等於或小於前述之電子元件上表面之面 積。早或複數個電訊通道，形成於前述電子封裝結構之單侧或 雙側:且分別連接々前述之電訊接點，使該電訊通道與前述之 ，子元件内部電路形成通路。複數_著結構， 電訊接點。 士發明之前述與其他目的、特徵、以及優點，將藉由下 文中參照圖示之較佳實施例之詳細說明得以更明確。 【實施方式】 本發明揭露一種電子封裝結構。詳言之，本發明提供一 種具導電特性支撐絲之封裝單元，此聰單元簡由兩^之 電訊接點達到多晶片堆疊之目的。該發明之實施例詳細說明如 下，唯所述之較佳實侧卩做—朗，並_嫌林發明。 圖三A為本發明之封裝單元之截面圖，此第一封裝單元 f 300利用支樓底板320作為結構之骨架，該具導電特性之支 ^底板320，可為銅、鎳、鐵、銘、銘、金、或以上金屬材料 導1性之獅的組合。於支撐底板上侧接合層 316與弟-電子元件綱接合’此電子元件可為主動電子元 件、被動電子元件、感測元件、測試元件、微機電晶片或以上 電子π件之組合。利用充填物310將第一電子元件3〇1周圍進 行填充’該充填物310可為具有熱塑或熱固特性之材料所组 成’且其上平面接近第-電子元件3〇1之上平面。於該填充區 1269460 卩姐壁填充_特性之 2料的組合。利用第一覆蓋層術提供表面之平 if 線層304 ’以濺鍍、電鑛或其他適合之方/ ΙΙΠ 新分佈位於第一，通孔細之電路W ί J路保護層309位於第二内導線箱及第二^層U二 表=’用以保縣二内導線層3〇5 ^ 於第-封裝單元體300之上表面。顿弟四電戒接點325 祕封農單元體300之支撐底板咖因且導雷特 二電訊通道讓於_#構之下表面m ;層314定義第一電訊接點320c位於第一封裝 表面。由前面之敘述可知，第一 300下 ，個電訊接點耻、325，形成於該 第四電訊接點325，作為第一封^單元弟電^妾點320c或 之電訊保護材料;具電4遞 訊接點保護謂、326上3^g於前述之電 其他電子鋪間之電路峨。用雜4 —封裝早元體3〇〇與 刚述第域早赠3〇〇之一種可能製造程序為：將第 1269460 二電子元件301之背面固定於支撐底板32〇 ;利用網版印刷、 ^板印，、，滾筒式塗佈、塗佈、貼合、微影技術或其他適 &之方式形成充填物31〇 ;利用如機械鑽孔、雷射鑽孔、乾 式蝕刻或其他適合之方式，於填充物31〇部份定義出第二導通 孔3ϋ、之i立置，並於内部或孔壁填充導電材料；利用如機械加 坚雷射鑽孔或其他適合之方式，使第一電訊通 k 320a及弟一電矾通道32〇b形成於該支撐底板32〇之上， 填充絕緣層323於電訊通道間，確保不同電路訊號間之獨立 性，利用網版印刷、模板印刷、微影技術或其他適合之方 成第二電路保護層314並定義第一電訊接點32〇c之位置。/ ，用圖案化製雜序職第—覆蓋層3G7、第—内 3〇t、蓋層識以及第二内導線層305，接續利用網‘ 印刷、拉板印刷、微影技術或其他適合之方式形成第一 護層309，並於第一電訊接點32〇c所對應之位置定義第四電 訊接點325 ;最後利用網版印刷、模板印刷、滾筒式塗佈 墨塗佈、微影技術或其他適合之方式，形成第二 ^ ^2=?_缝之上表面，以及第—電== 農曰 於第四電甙接點325之上表面。經由上述之一種製造 移序二可完成本發明所提出之具導電特性支撐底板之封^吉 構’^4之較佳實關結構與製程只做―制，並翻 本發明。 圖二B為對應於圖三A’本發明之封裝單元之第一可能底 祝圖二爲便於說明’此圖中忽略圖三A中第二電路保護層314 以及弟二，訊接點保護層326。支撐底板320經圖案化製程 後=成第一電訊通道320a、第二電訊通道320b，並於^電 訊^周圍填充絕緣層323 ;位於支撐底板另一側之第一電子 3Γ於圖中以虛線表示’第一電子元件301之電路訊號可 藉，ir導通孔311傳遞至支撐底板32〇，再藉由定義於底板 上之電汛通道將電訊連通至第一電訊接點32〇c、第二電訊接 1269460 第二電訊接點320e。由圖案化支撐底板320所產 川=^點可以如第一電訊接點320c，為傳遞第二導通孔 亦可如第二電訊接點320d，並不具有訊號傳 -成為往後封裝體中非電訊傳遞固著結構擺放位置； 诵二雷。，ΐ接點3施，直接傳遞該圖案化接點所連通導 311 Η雷ιΓΪ。支撐底板320經圖案化後，亦可做為導通孔 广把傳遞之媒介，如第二電訊通道320b所示。該支撐 子元:t,?第三導通孔319相連接，導通孔319可為第 板320 地峨舰通道，藉由此—設計，支撐底 Ϊ ιίί第一電子元件3〇1之接地端，可有效提高第—封裝 早兀體300之電氣特性。 布玎衣 、圖二C為對應於圖三A，本發明之封裝單元之第二可能廢 3 ▲爲ίΓ說明，此圖中忽略圖三A中第二電路保護層314 一電汛接點保護層326。支撐底板320經圖宰化製程德 僅保留電訊通路之部份，如第-電訊通道320a 道320b，支撐底板320背面為充填物31〇 320具有電訊通路部份之材料，故裸露内部之接底， 方式之優點為第-電子元件3〇1仍可藉由第二導^ 號置第-電訊通道32Ga或第二電路通道32Qb， 之今撐底板32G可提供如散熱鳍片之功能，進—步強化第、一 裝單元體300之熱驅散特性。 弟封 圖三D為對應於圖三A，本發明之雖單元 視圖。第二電路保護層314覆蓋於支撐紐32〇上二 位於支撐底板上之電訊通道適當之保護，並定義n 多重微電子元狀_級封裝單讀；歧讀盖 只做一說明，並非用以限定本發明- 貫轭例結構 四為本發明n施例’為姻本翻之封裝單元 圖 1269460 d?.式堆疊封裝之截面示意圖。第一封妒單开 _於上下兩侧相對應位^^10與 達成堆疊封裝之目的。及基板4G1形成電訊導通，進而 進行第月之第三實施例，為利用本發明之鮮一 ί 元體520、第三封裝單元體H不7^_、 行堆疊並組裝於基板以以之 材料505;同時爲提 周圍，用4===於具電訊傳遞之嶋_ :利用第-電訊傳遞固著結構602，進行單一 豐及與基板601之電訊連通外(如圖四）；亦可^ ς之隹 ，=接來自嫩寸之第二封裝單元體6以： ^早π，630之電路訊號，並提供承載此兩封裝 ^ 用’此第^實施例中，位於第—封裝單元體⑽之支^ 來自通予6°7，該第二電訊通道607並二專遞 # ί子讀之喊’喊供—傳輸通道可使帛二電子元 tn紅電子元件_，經由第三具電訊傳遞之固著结構 =、第四具電訊傳遞之固著結構612與第二電 〇 ^彼此批誠剌與魏。驗之紐實糊 說明，並非用以限定本發明。 圖七為本發明之第五實施例，為利用本發明之封梦單元 與未經封狀電子元件，進行第四形式堆疊封裝之截面示意 12 1269460 二進行封時 =;==;如; 著级椹ΐί19 J接點謝相接’較小之第—具電訊傳遞之固 第:，相接；第二封裝單元體720與 遞。、置708間之電路訊號可由第一電訊通道7〇6進行傳 與他發六實補，為顧本發明之封裝單元 圖。件’進行第五形式堆疊封裝之上視 示），你土结板別1上利用具電訊傳遞之固著結構（圖八中未桿 ^πΜ—封裝單元體810 111著於基板801 ;第一封裝單元 二封壯ΐ 以具電訊傳遞之固著結構（圖八中未標示）連接第 體84t早、第三封裝單元體830、以及第四封裝單元 ，忒堆豐式封裝中，包含位於第一封裝單元體810中之 件811、位於第二封裝單元體820中之第二電子元 四電子耕822、位於第三封裝單元體830中之第 體五丘832、以及位於第四封裝單元 张姐山弟'、電子兀件如，共六種電子元件；利用本發明 之雷ΐί具導電特性支樓底板之封震單元，以該封裝單元兩側 ，巧點達到多晶片堆疊之目的，並可使該六電子元件間之 革遷讯號依照實際應用需求形成通路。 胺施ί發明較佳實施例說明如上，而熟悉此領域技藝，在不 發明之精神範圍内，當可做些許更動潤飾，其專利保護 _更當視後附之申請專利範圍及其等同領域而定。 13 1269460 【圖式簡單說明】 ϋ明之較佳實施例將於下述說明中輔以下韻形做更詳細 的闡述： 圖一為習知擴散式晶圓型態封裝結構。 習知· _化金屬層達到具I/Q擴散雛之電子封 圖三A為本發明之第—實施例，為封料元之截面圖。 種可能底視 圖一 B為對應於圖三a ,本發明第一實施例之第一 圖。 、 =一 C為對應於圖三a，本發明第一實施例之第二 fD為對應於圖2 a，本發明第一實施例之第三 種可能底視 種可能底視 =====轉㈣娜單元進行第 ====8她她㈣㈣進行第 ===圖她本發明之封裝單元進行第 五實施例，為_本發明 子轉，進行第四形式堆疊_之截面示Γ圖 為利用本發明之封裝單元與他種 抑子讀，進仰五形鱗4封裝之上視圖。 1269460 【主要元件符號說明】 4 罩幕層 6 導電層 8 介電曾圖案 10 第一導電凸塊 12 晶片 14 封裝膠體 16 切割線 18 第二導電凸塊 20 膠帶 110 具圖案化之金屬層 120 具有熱塑或熱固特性之介電層 130 導通孔 132 導電材料 146 底膠 140 電子元件 300 第一封裝單元體 301 第一電子元件 302 接觸墊 303 具電訊傳遞之固著結構 304 第一内導線層 305 第二内導線層 306 第一導通孔 307第一覆蓋層 308 第二覆蓋層 309 第一電路保護層 310 充填物 311 第二導通孔 314 第二電路保護層 15 1269460The piece is disposed on the surface of the support bottom plate, and the area of the support base plate may be larger than, equal to or smaller than the area of the electronic component. A single or a plurality of filling regions are formed around the aforementioned electronic components, and the through holes are formed in the area, and the materials in the holes or the walls of the holes are filled with a conductive property, so that the filling regions are & The surface of the support plate described in A, forming a telecommunications connection. The surface area of the one or the other side of the electronic structure may be greater than or equal to the area of the upper surface of the electronic component. The early or plurality of telecommunication channels are formed on one side or both sides of the electronic package structure: and are respectively connected to the telecommunication contacts, so that the telecommunication channel forms a path with the internal circuit of the sub-element. Plural _ with structure, telecommunications contacts. The foregoing and other objects, features and advantages of the invention will be apparent from Embodiments The present invention discloses an electronic package structure. In particular, the present invention provides a package unit having a conductive characteristic support wire, which is realized by a plurality of telecommunication contacts to achieve multi-wafer stacking. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention are described in detail below, and the preferred ones are described as the best side, and the invention is invented. FIG. 3A is a cross-sectional view of the package unit of the present invention. The first package unit f 300 uses the floor of the support floor 320 as a skeleton of the structure, and the bottom plate 320 with conductive characteristics can be copper, nickel, iron, and Ming, gold, or a combination of the above metal materials. The upper bonding layer 316 and the electronic component are bonded to the support substrate. The electronic component can be a combination of an active electronic component, a passive electronic component, a sensing component, a test component, a microelectromechanical wafer or the above electronic component. The first electronic component 3〇1 is filled with a filler 310. The filler 310 may be composed of a material having thermoplastic or thermosetting properties and its upper plane is close to the upper surface of the first electronic component 3〇1. In the filling area 1269460 卩 sister wall filling _ characteristics of the combination of materials. Using the first overlay to provide a flat if-line layer 304' of the surface to be sputtered, electro-mineral or other suitable square/ΙΙΠ new distribution is located first, and the through-hole fine circuit W ί J protective layer 309 is located in the second The wire box and the second layer U 2 table = ' used to protect the inner conductor layer 3 〇 5 ^ on the upper surface of the first package unit body 300. The fourth telecommunications contact 325 is connected to the support base plate of the agricultural unit 300 and the Leyte two telecommunications channel is placed under the surface of the _# structure; the layer 314 defines the first telecommunications contact 320c on the first package surface. . It can be seen from the foregoing description that, under the first 300, a telecommunications contact is shameful, 325, formed at the fourth telecommunications contact 325, as the first sealed electrical device 320c or the telecommunication protection material; The communication contact protection means that the circuit on the 326 is 3^g in the other electrical shops mentioned above. A possible manufacturing procedure for using the hybrid 4 - packaged early body 3 〇〇 and the early description of the first domain is: fixing the back surface of the 1269460 two electronic component 301 to the support substrate 32 〇; using screen printing, ^ Filling, sheeting, coating, lamination, lithography, or other suitable means to form the fill 31; using mechanical drilling, laser drilling, dry etching, or other suitable means The second via hole 3ϋ is defined in the portion of the filler 31〇, and the conductive material is filled in the inner or the hole wall; the first telecommunications is made by using, for example, mechanically strengthening the laser drilling or other suitable means. The through-k 320a and the second-electrode channel 32〇b are formed on the support bottom plate 32〇, and the insulating layer 323 is filled between the telecommunication channels to ensure the independence between different circuit signals, using screen printing, stencil printing, and lithography. The technology or other suitable means forms the second circuit protection layer 314 and defines the location of the first telecommunications contact 32 〇 c. / , using the patterning system - the cover layer 3G7, the first - 3 〇 t, the cover layer and the second inner wire layer 305, followed by the use of the net 'printing, pull plate printing, lithography or other suitable The first protective layer 309 is formed, and the fourth telecommunication contact 325 is defined at a position corresponding to the first telecommunication contact 32〇c; finally, screen printing, stencil printing, roller coating ink coating, lithography technology are utilized. Or other suitable manner, forming a second surface of the ^^2=?_stitch, and the first electric== farmer is on the upper surface of the fourth electric contact 325. The manufacturing process of the above-mentioned one can complete the preferred structure and process of the sealing structure of the support substrate with the conductive property proposed by the present invention, and the invention is only made. FIG. 2B is a first possible bottom of the package unit corresponding to FIG. 3A', and FIG. 2 is for convenience of explanation. In this figure, the second circuit protection layer 314 and the second circuit protection layer of FIG. 326. The support substrate 320 is patterned into a first telecommunication channel 320a and a second telecommunication channel 320b, and is filled with an insulating layer 323 around the telecommunication device; the first electron 3 located on the other side of the support substrate is indicated by a broken line in the figure. The circuit signal of the first electronic component 301 can be transferred, and the ir via hole 311 is transmitted to the support substrate 32, and the telecommunication channel connected to the first electronic telecommunication terminal 32〇c, the second telecommunication is connected by the electric channel defined on the bottom plate. Connect 1269460 second telecommunications contact 320e. The pattern of the support bottom plate 320 can be like the first telecommunication contact 320c, and the second conductive via can also be the second telecommunication contact 320d, and does not have the signal transmission - becoming the middle package. Telecommunications transmission fixed structure placement position; ΐ 3 3 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , After the support substrate 320 is patterned, it can also serve as a medium for the conduction of the via holes, as shown by the second telecommunication channel 320b. The support sub-element: t, the third via hole 319 is connected, and the via hole 319 can be the first plate 320 ground cell channel, by which the ground end of the first electronic component 3〇1 is supported. The electrical characteristics of the first packaged early body 300 can be effectively improved. The cloth cover, FIG. 2C corresponds to FIG. 3A, and the second possible waste 3 ▲ of the package unit of the present invention is a description. In this figure, the second circuit protection layer 314 in FIG. Layer 326. The supporting bottom plate 320 only retains part of the telecommunication path, such as the first-telecom channel 320a channel 320b, and the back surface of the supporting substrate 320 is filled with material of the telecommunication path portion 31〇320, so the bare inner bottom is exposed. The advantage of the method is that the first electronic component 3〇1 can still be provided with the second telecommunication channel 32Ga or the second circuit channel 32Qb by the second guiding device, and the bottom plate 32G can provide functions such as heat dissipation fins. The step enhances the thermal dissipative characteristics of the first unit cell 300. Figure 3D corresponds to Figure 3A, which is a unit view of the present invention. The second circuit protection layer 314 covers the protection of the telecommunications channel on the support board 32 and on the support substrate, and defines n multiple microelectronics-level package single read; the read cover is only used for explanation, not for LIMITING THE INVENTION - The structure of the yoke example is a schematic cross-sectional view of a packaged package of the present invention. The first one is opened _ on the upper and lower sides corresponding to the position ^^10 and achieve the purpose of stacking and packaging. And the substrate 4G1 forms a telecommunications conduction, and then performs the third embodiment of the month, in order to utilize the present invention, the third package unit body H is not stacked, and is stacked and assembled on the substrate. 505; at the same time, for the surrounding, use 4=== for the transmission of telecommunications _: using the first-telecom transmission fixing structure 602, and performing a single connection with the telecommunications of the substrate 601 (Fig. 4); ς之隹, = connected to the second package unit body 6 from the tender inch to: ^ early π, 630 circuit signal, and provides to carry the two packages ^ used in this embodiment, located in the first package unit (10) The branch ^ from the pass 6 °7, the second telecommunications channel 607 and the second pass # 子 读 read shout 'speak for the transmission channel can make the second electronic element tn red electronic components _, through the third telecommunications transmission The fixed structure =, the fourth telecom transfer fixing structure 612 and the second electric cymbal ^ are mutually sincere and Wei. The invention is not intended to limit the invention. Figure 7 is a fifth embodiment of the present invention, in order to utilize the dream unit of the present invention and the unsealed electronic component, the cross-sectional schematic of the fourth form of the stacked package 12 1269460 is sealed; ===; Level 椹ΐ 19 19 接 接 19 19 19 19 ' ' ' ' ' ' ' 较小 较小 较小 较小 较小 较小 较小 较小 较小 较小 较小 较小 较小 较小 较小 较小 较小 较小 较小The circuit signal of 708 can be transmitted by the first telecommunication channel 7〇6 and the other is provided by the six real complements, which is a package unit diagram of the present invention. The piece 'on the fifth form of the stacked package is shown above), the sturdy structure with telecommunication transmission is used on the soil board (the occupant in Fig. 8 is ^ Μ 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 ; ; ; The package unit has two strong structures. The fixed structure (not shown in FIG. 8) with the telecommunication transmission is connected to the first body 84t, the third package unit body 830, and the fourth package unit, and is included in the first package unit. a member 811 in a package unit body 810, a second electronic unit in the second package unit body 820, a fourth electronic unit 822 in the third package unit body 830, and a fourth package unit Sister Shan's, electronic components, for example, a total of six kinds of electronic components; using the lightning-sensing unit of the Thunder ΐ 导电 导电 支 支 支 支 支 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用The embossing signal between the six electronic components can be formed according to the actual application requirements. The preferred embodiment of the invention is as described above, and is familiar with the art in the field, and in the spirit of not inventing, when some modifications can be made , its patent _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ It is a conventional diffused wafer type package structure. The conventional electronic layer is an I/Q diffusion electronic seal. The third embodiment of the present invention is a cross-sectional view of the sealing element. The bottom view of the first embodiment of the present invention corresponds to FIG. 3a, and the first f of the first embodiment of the present invention corresponds to FIG. 3a, and the second fD of the first embodiment of the present invention corresponds to FIG. 2a. The third possible bottom view of the first embodiment of the present invention may be bottom view ===== turn (four) Na unit to perform the first ====8 her (four) (four) to carry out the === diagram of the package unit of the present invention The fifth embodiment is a cross-sectional view of the fourth form of the stacking of the present invention, which is a top view of the package with the package unit of the present invention and the five-shaped scale 4 package. 1269460 Main component symbol description] 4 mask layer 6 conductive layer 8 dielectric pattern 10 first conductive bump 12 crystal 14 Package Colloid 16 Cutting Line 18 Second Conducting Bump 20 Tape 110 Patterned Metal Layer 120 Dielectric Layer 130 with Thermoplastic or Thermoset Properties Via Hole 132 Conductive Material 146 Primer 140 Electronic Component 300 First Package Unit Body 301 first electronic component 302 contact pad 303 telecommunication structure fixing structure 304 first inner wire layer 305 second inner wire layer 306 first via hole 307 first cover layer 308 second cover layer 309 first circuit protection layer 310 filler 311 second via 314 second circuit protection layer 15 1269460
316 接合層 319 第三導通孔 320 支撐底板(接地底板） 320a 第一電訊通道 320b 第二電訊通道 320c 第一電訊接點 320d 第二電訊接點 320e 第三電訊接點 323 絕緣層 324 第一電訊接點保護層 325 第四電訊接點 326 第二電訊接點保護層 401 基板 402 電訊接點 403 具電訊傳遞之固著結構 410 第一封裝單元體 420 第二封裝單元體. 501 基板 502 電訊接點 503 具電訊傳遞之固著結構 504 接合材料 505 具電訊傳遞之接合材料 510 第一封裝單元體 520 第二封裝單元體 530 第三封裝單元體 540 第四封裝單元體 601 基板 602 第一具電訊傳遞之固著結構 603 第二具電訊傳遞之固著結構 16 1269460 604 電訊接點 605 第一電子元件 606 支撐底板(接地底板） 607 第二電訊通道 608 第二電子元件 609 第三電子元件 610 第一封裝單元體 611 第三具電訊傳遞之固著結構 612 第四具電訊傳遞之固著結構 620 第二封裝單元體 630 第三封裝單元體 701 基板 702 第一具電訊傳遞之固著結構 703 第二具電訊傳遞之固著結構 704 第一電訊接點 705 第二電訊接點 706 第一電訊通道 707 第二電訊通道 708 第一電子裝置 710 第一封裝單元體 720 第二封裝單元體 801 基板 810 第一封裝單元體 811 第一電子元件 820 第二封裝單元體 821 第二電子元件 822 第三t子元件 830 第三封裝單元體 831 第四電子元件 17 1269460 832 840 841 第五電子元件 第四封裝單元體 第六電子元件316 bonding layer 319 third via 320 supporting bottom plate (grounding plate) 320a first telecommunication channel 320b second telecommunication channel 320c first telecommunication contact 320d second telecommunication contact 320e third telecommunication contact 323 insulating layer 324 first telecommunication Contact protection layer 325 fourth telecommunication contact 326 second telecommunication contact protection layer 401 substrate 402 telecommunication contact 403 telecommunication transmission fixing structure 410 first package unit body 420 second package unit body. 501 substrate 502 telecommunication interface Point 503 Fixing structure 504 with telecommunication transmission material 505 Bonding material 510 with telecommunications transfer 510 First package unit body 520 Second package unit body 530 Third package unit body 540 Fourth package unit body 601 Substrate 602 First telecommunications Transfer fixing structure 603 second telecommunication transmission fixing structure 16 1269460 604 telecommunication contact 605 first electronic component 606 support bottom plate (grounding bottom plate) 607 second telecommunication channel 608 second electronic component 609 third electronic component 610 a package unit body 611, a third telecom transmission fixing structure 612, a fourth telecom transmission fixing Structure 620 second package unit body 630 third package unit body 701 substrate 702 first telecommunication transmission fixing structure 703 second telecommunication transmission fixing structure 704 first telecommunication contact 705 second telecommunication contact 706 first Telecommunication channel 707 second telecommunication channel 708 first electronic device 710 first package unit body 720 second package unit body 801 substrate 810 first package unit body 811 first electronic component 820 second package unit body 821 second electronic component 822 Three t sub-element 830 third package unit body 831 fourth electronic element 17 1269460 832 840 841 fifth electronic component fourth package unit body sixth electronic component