TWI268565B - Method for manufacturing conductive balls and carrier for manufacturing the conductive balls - Google Patents
Method for manufacturing conductive balls and carrier for manufacturing the conductive ballsInfo
- Publication number
- TWI268565B TWI268565B TW094127116A TW94127116A TWI268565B TW I268565 B TWI268565 B TW I268565B TW 094127116 A TW094127116 A TW 094127116A TW 94127116 A TW94127116 A TW 94127116A TW I268565 B TWI268565 B TW I268565B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- conductive balls
- fillister
- carrier
- semiconductor substrate
- Prior art date
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
Abstract
A method for manufacturing conductive balls including following steps is provided. First, a carrier having at least one fillister filled with solder material is provided. Then, the solder material is filled into the fillisters such that the conductive ball is formed in the fillister. In addition, a carrier including a semiconductor substrate and an insulating layer for manufacturing the conductive balls is further provided. The semiconductor substrate has a doped region, wherein the semiconductor substrate has at least one fillister filled with solder material and the fillister is located inside the doped region. The insulating layer is disposed on the semiconductor substrate except the fillister.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094127116A TWI268565B (en) | 2005-08-10 | 2005-08-10 | Method for manufacturing conductive balls and carrier for manufacturing the conductive balls |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094127116A TWI268565B (en) | 2005-08-10 | 2005-08-10 | Method for manufacturing conductive balls and carrier for manufacturing the conductive balls |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI268565B true TWI268565B (en) | 2006-12-11 |
TW200707600A TW200707600A (en) | 2007-02-16 |
Family
ID=57910834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094127116A TWI268565B (en) | 2005-08-10 | 2005-08-10 | Method for manufacturing conductive balls and carrier for manufacturing the conductive balls |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI268565B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI384609B (en) * | 2008-06-10 | 2013-02-01 | Advanced Semiconductor Eng | Semiconductor package for package-on-package structure and manufacturing method thereof |
-
2005
- 2005-08-10 TW TW094127116A patent/TWI268565B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI384609B (en) * | 2008-06-10 | 2013-02-01 | Advanced Semiconductor Eng | Semiconductor package for package-on-package structure and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TW200707600A (en) | 2007-02-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |