TWI268565B - Method for manufacturing conductive balls and carrier for manufacturing the conductive balls - Google Patents

Method for manufacturing conductive balls and carrier for manufacturing the conductive balls

Info

Publication number
TWI268565B
TWI268565B TW094127116A TW94127116A TWI268565B TW I268565 B TWI268565 B TW I268565B TW 094127116 A TW094127116 A TW 094127116A TW 94127116 A TW94127116 A TW 94127116A TW I268565 B TWI268565 B TW I268565B
Authority
TW
Taiwan
Prior art keywords
manufacturing
conductive balls
fillister
carrier
semiconductor substrate
Prior art date
Application number
TW094127116A
Other languages
Chinese (zh)
Other versions
TW200707600A (en
Inventor
Mon-Chin Tsai
Chao-Fu Weng
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW094127116A priority Critical patent/TWI268565B/en
Application granted granted Critical
Publication of TWI268565B publication Critical patent/TWI268565B/en
Publication of TW200707600A publication Critical patent/TW200707600A/en

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  • Electrodes Of Semiconductors (AREA)

Abstract

A method for manufacturing conductive balls including following steps is provided. First, a carrier having at least one fillister filled with solder material is provided. Then, the solder material is filled into the fillisters such that the conductive ball is formed in the fillister. In addition, a carrier including a semiconductor substrate and an insulating layer for manufacturing the conductive balls is further provided. The semiconductor substrate has a doped region, wherein the semiconductor substrate has at least one fillister filled with solder material and the fillister is located inside the doped region. The insulating layer is disposed on the semiconductor substrate except the fillister.
TW094127116A 2005-08-10 2005-08-10 Method for manufacturing conductive balls and carrier for manufacturing the conductive balls TWI268565B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094127116A TWI268565B (en) 2005-08-10 2005-08-10 Method for manufacturing conductive balls and carrier for manufacturing the conductive balls

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094127116A TWI268565B (en) 2005-08-10 2005-08-10 Method for manufacturing conductive balls and carrier for manufacturing the conductive balls

Publications (2)

Publication Number Publication Date
TWI268565B true TWI268565B (en) 2006-12-11
TW200707600A TW200707600A (en) 2007-02-16

Family

ID=57910834

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094127116A TWI268565B (en) 2005-08-10 2005-08-10 Method for manufacturing conductive balls and carrier for manufacturing the conductive balls

Country Status (1)

Country Link
TW (1) TWI268565B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI384609B (en) * 2008-06-10 2013-02-01 Advanced Semiconductor Eng Semiconductor package for package-on-package structure and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI384609B (en) * 2008-06-10 2013-02-01 Advanced Semiconductor Eng Semiconductor package for package-on-package structure and manufacturing method thereof

Also Published As

Publication number Publication date
TW200707600A (en) 2007-02-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees