TWI268552B - Method of treating a structured surface - Google Patents
Method of treating a structured surfaceInfo
- Publication number
- TWI268552B TWI268552B TW094142382A TW94142382A TWI268552B TW I268552 B TWI268552 B TW I268552B TW 094142382 A TW094142382 A TW 094142382A TW 94142382 A TW94142382 A TW 94142382A TW I268552 B TWI268552 B TW I268552B
- Authority
- TW
- Taiwan
- Prior art keywords
- region
- layers
- treating
- contact openings
- structured surface
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000000137 annealing Methods 0.000 abstract 1
- 238000005498 polishing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/043,950 US7208416B2 (en) | 2005-01-28 | 2005-01-28 | Method of treating a structured surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200627533A TW200627533A (en) | 2006-08-01 |
| TWI268552B true TWI268552B (en) | 2006-12-11 |
Family
ID=36757151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094142382A TWI268552B (en) | 2005-01-28 | 2005-12-01 | Method of treating a structured surface |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7208416B2 (zh) |
| JP (1) | JP2006216946A (zh) |
| TW (1) | TWI268552B (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| HUE034646T2 (hu) | 2007-12-06 | 2018-02-28 | Ericsson Telefon Ab L M | Eljárás UE képességi információ frissítésére mobil távközlési hálózatban |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW388100B (en) * | 1997-02-18 | 2000-04-21 | Hitachi Ulsi Eng Corp | Semiconductor deivce and process for producing the same |
| US6342715B1 (en) * | 1997-06-27 | 2002-01-29 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device |
-
2005
- 2005-01-28 US US11/043,950 patent/US7208416B2/en not_active Expired - Fee Related
- 2005-12-01 TW TW094142382A patent/TWI268552B/zh not_active IP Right Cessation
-
2006
- 2006-01-27 JP JP2006019743A patent/JP2006216946A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| US20060172539A1 (en) | 2006-08-03 |
| TW200627533A (en) | 2006-08-01 |
| US7208416B2 (en) | 2007-04-24 |
| JP2006216946A (ja) | 2006-08-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |