1267727 九、發明說明： 【發明所屬之技術領域】 一種晶片過溫保護裝置及其方法，特別用於電腦系統 於關機狀態時，仍針對其中晶片溫度進行偵測，並作適卷 之溫度控制。 龟 【先前技術】 電腦裝置使用一段時間後，部分内部元件會產生老化 或損毁等異常狀況，因此可能會造成中央處理器（cpu) 的電源管理電路出現問題，使其工作電壓無法關掉，或在 電腦系統關機時，中央處理器的工作電壓卻是啟動的，最 常出現是筆記型電腦在關機時，仍會產生中央處理器溫度 不斷上升的餘溫，嚴重時，將使電腦外殼熔毁、產生燒焦 異味或是中央處理器燒毀。 習用技術中，常於電腦系統中設置有溫度監控的溫度 感測器，如熱二極體（thermal diode)或設置於晶片内之 基體電晶體（substrate transistor)，其感應之溫度與系統設 定之溫度上下限比對，若溫度落於安全運作溫度之外，即 刻啟動降溫措施，如開啟風扇等。 習知之溫度控制技術如第一圖顯示之美國專利 Νο·6，169,442，其揭露一設置於電腦中之溫度監控晶片 1〇，藉此晶片可遠端監控中央處理器2中熱二極體5所偵 測CPU散熱片3之溫度，溫度監控晶片1〇中有一訊號調 節電路12，將CPU内熱二極體5所偵測之溫度轉達給類 比數位轉換器（A〇C) 14轉換為數位訊號，可得知cPu 1267727 片3之溫度’並做溫差比較以一牛_ 如針^同溫度來控制冷卻風扇之轉速，仃溫控措施， 或是二 扇之氣冷方式冷卻Γ if i _6關水冷或以風 3發明揭露-種晶片過===過熱情形’ 糸統關機時，1中n 我置及/、方法，用於電腦 源供應下仍正Ϊ運作皿以風扇控制電路在微量電 美供中央處理器的過溫保護功能。 【發明内容】 時，仍護裝置’係於-電腦系統關機狀態 括‘電置，該裝置至少包 於電腦系統内之一$ > /、週邊所而之供電系統，設置 執行控溫程庠日^數個積體電路（IC)，針對積體電路 雜電“電=與積體輪接之控溫裝置，積 控制單元。…、砍測早兀，以及控溫裝置並電連接週邊 板與其裝置除供應電 電源供應單元至少有供應主f源與次電源之 裝置、熱感測單元電路（IC)、進行控溫程序之控溫 板，藉以關閉該電腦2控制單元外，更包括麵接於電路 單元各級電源之以:糸統開關，以及轉換電源供應 對盆中曰片，只靶係於關閉電源、待命或休眠等狀態時， f之溫度仍_監控與散熱，電雜鮮元提供 1267727 其中週邊控制單元、熱感測單元與控溫裝置等微小電壓， =利其運作’其巾若發生主電源斷電後仍有晶#升溫的異 吊現象，其控溫之運作流程包括進入電腦系統之關機狀 態，之後，切斷電源供應單元之主電源，並切換為次電源， ^測電腦系統中積體電路之溫度，再判斷是否過溫，若過 服’則轉換該溫度訊息為控制訊號，由控溫裝置執行控溫 程序。 :實施方式】 ^本發明所揭露的晶片過溫保護裝置及其方法，係於電 知系、洗關彳㈣’其巾溫度感丨職與風扇控制電路在微小供 電下仍正^運作，1 貞測到如中央處理器（cpu)或其他晶 片的溫度因為電源管理電路的問題而不斷上升時，並超過 預先設計之溫度上限，其散熱風扇即自行啟動，以提供系 統關機時之巾央處理ϋ的過溫倾功能。 ，、 清參閱第二圖本發明晶片過溫保護裝置示意圖，-連 電或直流電）之供電系統22以電源纔線 連摻電路板2〇,以供應電腦系統電路板20與各週邊所 f 20 (mother oar )、、上設置有積體電路㈤〇㈣ed —賊κ) 24, 一控溫ί置26，控溫裝置26現行包括有水冷、風 ΐ ί S3 ’姆£ 26 f電連接該 士 电積體電路24除電連接週邊控制單元29 感測溫度之賊測單元28，此熱感測單元28 需電連接該供電系統22取電；熱感測單元28耗接早 1267727 控制單元29，週邊控制單元29電連揍該供電系統22取 電，藉以接收熱感測單元28偵測之晶片溫度，並將之轉換 為控制訊號，以控制控溫裝置26之控溫狀態。 本發明晶片過溫保護裝置即針對主機板上，或電腦系 統内之晶片過溫情形進行保護，如第三圖所示，晶片為圖 示中之積體電路（1C) 24，可為中央處理器（CPU)、圖形 顯示晶片（graphic 1C)或其他系統晶片（如南僑、北橋晶 片）等’積體電路24搞接之熱感測單元28偵測晶片溫度， 並將此訊息傳給週邊控制單元29，此週邊控制單元29可 為設置於電路板上之控制晶片，其將溫度訊息轉換為數位 之控制訊號，藉以控制控溫裝置26之狀態，控溫裝置26 接受週邊控制單元29之控制，可以水冷、氣冷或致冷器等 裝置對積體電路24進行冷卻等之溫度控制，於不同狀態給 予不同的控溫程度’如水冷或氣冷（風扇）之速度，或致 冷器之控制電壓等，積體電路24耦接之熱感測單元28可 以熱二極體（thermal diode )或基體電晶體（substrate transistor)實施之。 第三圖所示為本發明之晶片過溫保護裝置功能方塊 圖，其中配接器（adapter) 32接收電源31所提供之電源， 藉由系統開關33之控制，決定是否開敗系統，並接著供給 内部電路/裝置30之電源，經由内部電路/裝置30之電壓 調節器（regulator) 35轉換高電壓至較低電壓，以供應週 邊控制單元29所需電壓。另外，經開關33開啟系統後， 將電源傳送至電源轉換器34,轉換之輸入電源301成為電 源供應單元36所需的各級電壓，如3.3V/5V、1.2V/1.5V、 1267727 2.5V/1.25V或其他電壓值，因為電路板中之各元件所需之 電壓各有不同’故由電源供應單元36取電時，亦會有不同 之而求。電源供應單元36對電腦系統之内部電路/ 將提供一較大耗電量之主電源，而有一部份較小耗電旦 次電源搬提供電腦系統中開機或關機時耗電較小^部 分’如其中指示燈號（如LED)、鍵盤控制器等。 本發明更於系統關機時 ，〜·…·、 4 电娜、、待^1267727 IX. Description of the Invention: [Technical Field of the Invention] A wafer over-temperature protection device and method thereof are particularly useful for detecting a temperature of a wafer in a computer system in a shutdown state, and performing temperature control of the appropriate volume. Turtle [Prior Art] After a period of use of the computer device, some internal components may be abnormal or deteriorated, which may cause problems in the power management circuit of the CPU (CPU), so that the operating voltage cannot be turned off, or When the computer system is shut down, the operating voltage of the central processing unit is activated. The most common occurrence is that when the notebook computer is turned off, the temperature of the central processing unit will continue to rise. In severe cases, the computer casing will melt down. Produce a burnt odor or burn the central processor. In the conventional technology, a temperature sensor that is often provided with temperature monitoring in a computer system, such as a thermal diode or a substrate transistor disposed in the wafer, the temperature of the sensing and the system setting The upper and lower limits of the temperature are compared. If the temperature falls outside the safe operating temperature, the cooling measures are started immediately, such as turning on the fan. A conventional temperature control technique, as shown in the first figure, U.S. Patent No. 6,169,442, which discloses a temperature monitoring wafer 1 in a computer, whereby the wafer can remotely monitor the thermal diode 5 of the central processing unit 2. The temperature of the CPU heat sink 3 is detected, and a temperature adjustment circuit 12 is arranged in the temperature monitoring chip 1 to transfer the temperature detected by the thermal diode 5 in the CPU to the analog digital converter (A〇C) 14 to convert to a digital position. Signal, you can know the temperature of cPu 1267727 piece 3 'and compare the temperature difference with a cow _ such as the needle ^ with the temperature to control the speed of the cooling fan, 仃 temperature control measures, or two air cooling method cooling Γ if i _6 Closed water or cold 3 inventions exposed - kind of wafer over === overheating situation] When the system is shut down, 1 in n, I set /, method, used for computer source supply, still operating the dish with fan control circuit in trace Electric beauty for the over-temperature protection of the central processor. [Summary of the Invention] When the device is still in the shutdown state of the computer system, the device is at least one of the computer system, and the peripheral power supply system is set to execute the temperature control process. Days of several integrated circuit (IC), for integrated circuit "electricity = temperature control device with integrated body rotation, integrated control unit...., cutting test early, and temperature control device and electrically connected to the peripheral board In addition to the device, the power supply unit has at least a device for supplying the main source and the secondary power source, a thermal sensing unit circuit (IC), and a temperature control plate for performing a temperature control program, thereby closing the control unit of the computer 2, and further including the surface Connected to the power supply of the circuit unit: the switch, and the conversion power supply to the diaphragm in the basin, only the target is in the state of power off, standby or hibernation, the temperature of f is still _ monitoring and heat dissipation, electricity and fresh Yuan provides 1267727 Among them, the peripheral control unit, the thermal sensing unit and the temperature control device and other small voltages, = the operation of its 'when the main power supply is broken, there is still the phenomenon of crystal heating, the temperature is controlled. Including access to the computer system After the power is turned off, the main power supply of the power supply unit is turned off, and the power is switched to the secondary power supply. The temperature of the integrated circuit in the computer system is measured, and then it is judged whether the temperature is too high. If the service is over, the temperature message is converted into a control signal. The temperature control program is executed by the temperature control device. Embodiments: The wafer over temperature protection device and method thereof disclosed in the present invention are based on the electric knowledge system and the cleaning system (4). Under the slight power supply, it is still working. 1 If the temperature of the central processing unit (cpu) or other chip rises due to the problem of the power management circuit and exceeds the pre-designed upper temperature limit, the cooling fan starts up automatically. In order to provide the over-temperature tilting function of the processing of the system when the system is shut down, refer to the second diagram of the wafer over-temperature protection device of the present invention, and the power supply system 22 of the power supply or the direct current is connected with the power board. 2〇, to supply computer system circuit board 20 and each peripheral f 20 (mother oar), set up with integrated circuit (5) 〇 (four) ed - thief κ) 24, a temperature control 26, the temperature control device 26 is currently Included with water cooling, pneumatic ί S3 'm £ 26 f electrically connected to the electric current circuit 24 to electrically connect the peripheral control unit 29 to sense the temperature of the thief measuring unit 28, the thermal sensing unit 28 needs to be electrically connected to the power supply system 22 The power sensing unit 28 consumes the early 1267727 control unit 29, and the peripheral control unit 29 electrically connects the power supply system 22 to receive power, thereby receiving the temperature of the wafer detected by the thermal sensing unit 28, and converting it into a control signal. In order to control the temperature control state of the temperature control device 26. The wafer over temperature protection device protects the wafer over temperature on the motherboard or in the computer system, as shown in the third figure, the wafer is in the figure The integrated circuit (1C) 24 can be a thermal sensing unit 28 that is integrated with the integrated circuit 24 such as a central processing unit (CPU), a graphic display chip (graphic 1C), or other system chips (such as a Nanqiao or a north bridge wafer). Detecting the temperature of the wafer, and transmitting the message to the peripheral control unit 29, the peripheral control unit 29 can be a control chip disposed on the circuit board, which converts the temperature information into a digital control signal, thereby controlling the temperature control device 26 shape The temperature control device 26 is controlled by the peripheral control unit 29, and can perform temperature control such as cooling of the integrated circuit 24 by means of water cooling, air cooling or a refrigerator, and gives different temperature control degrees in different states, such as water cooling or gas. The thermal sensing unit 28 coupled to the integrated circuit 24 may be implemented by a thermal diode or a substrate transistor. The third figure shows a functional block diagram of the wafer over-temperature protection device of the present invention, wherein an adapter 32 receives the power provided by the power source 31, and is controlled by the system switch 33 to determine whether to defeat the system, and then The power supplied to the internal circuit/device 30 is converted to a lower voltage via a voltage regulator 35 of the internal circuit/device 30 to supply the voltage required by the peripheral control unit 29. In addition, after the system is turned on by the switch 33, the power is transmitted to the power converter 34, and the converted input power source 301 becomes the voltage of each stage required by the power supply unit 36, such as 3.3V/5V, 1.2V/1.5V, 1267727 2.5V. /1.25V or other voltage value, because the voltage required for each component in the board is different, so when the power is supplied by the power supply unit 36, there will be a difference. The power supply unit 36 provides a large power consumption to the internal circuit of the computer system, and a part of the smaller power consumption power supply is provided to the computer system. Such as the indicator number (such as LED), keyboard controller, etc. The invention is more when the system is shut down, ~·...·, 4 electric na, to be ^
standby)或休眠（sleep)時，切斷提供内部電路/裝】 30之主電源’而至少持續提供次電源、302給週邊控制^ 29(第-次電源3〇2a)、熱感測單元28 (第二次電源鳩 1溫裝置26 (第三次電源鐵）等，以於系統關機時 =對電路板巾之積體電路24進行溫度監控與散熱，使禾 體，路24不致因為電路板中元件之觀，姐度管控電與 故P早產生不斷升溫而造成損毀的問題。 上述待命與休眠狀態，舉例來說，用於Windows X 作業系統時’目其支援轉縣的進陳態與電源介$ j Advanced Configurati〇n and p〇wer 汕时咖，Acpi)電谈 官理技術’允許作業祕控制電腦和周邊裝置的電源，^ 理功ΐ包含了「休眠」和「待命」。休眠模式會衆 旦1批：、錢時桌面所有開啟的文件和檔案的狀態儲存為 ’然後關機’之後再開啟電源後，檔案和文件會D 關機則的狀態在桌關啟。而待命模式會靖目前未使用 的^體元件（如螢幕、硬碟）的供電，降低電腦耗電量， 但會持續對電腦記憶體供電。 另外’上述控溫裝置26可針對控溫之晶片不同狀態給 1267727 予不同控溫級數’如感測較高溫度給予較高風扇轉速、溫 度較低則予以較低之風扇轉速，以此動態調整可節省電 源，其實施例可如第四圖所示，其中熱感測單元28偵測晶 片溫度’將訊息傳送至週邊控制單元29，轉化為數位控制 訊號’並經包括有第一比較器41、第二比較器42與第三 比較器43之多段比較電路形成控溫裝置之控制電路，判斷 不同的控溫等級。如給予比較器41，42,43之一輸入端不同 的電壓位準，如第一比較器41之第一電壓源a、第二比較 =42之第二電壓源b與第三比較器43之第三電壓源ε等， 曷，週邊控制單元29輸入一控制電壓，經上述各比較器的 電壓源a，b，c與接地位準§作一比較，產生不同的輸出效 果，即不同的控溫等級。 本發明晶片過溫保護方法流程請參閱第五圖所示之多 驟。本發明之實施係針對電腦系統關機時，包括關閉電源 待命或休眠等狀態，對其中晶片之溫度仍進行監控盘背 單元提供其中週邊控制單元、熱感測單元病 二電壓，其中若發生主電源斷電後仍有晶片 ^皿的^現象’於偵測晶片溫度超過—設朽 二腦== 為^二:1)，即切斷主電源(步驟S5〇3)，並切換 模式=:==源供應單元會針對不同電源 1267727 勒此^· ’由次電源供應之裝置至少包括週邊控制單元、 中if單元與控溫裝置，其中熱感測單元持續彳貞測電路板 至、届ΐ電路i晶片）溫度（步驟s5〇7)’將溫度訊息傳送 °邊控制單元，並判斷是否超過預先設定之溫度上限， 是否過溫（步驟㈣9)，若無過溫之現象，則持 507之偵測溫度步驟，若發生過溫現象，藉由周 j制單元將溫度訊息轉換為對控溫裝置之控制訊號（步 ㈣i11)’並更進—步騎其溫度超過的程度，而同樣藉 ^邊控制單元判斷控溫級數（步驟S513)，以執行不同之 ^溫程序，即啟動控溫裝置進行對晶片之控溫程序（步驟 ^)，如水冷、風扇氣冷或致冷機制等，而於此控温程 =期間或之後，仍回到熱感測單元制溫度之步驟s5〇7， 並隨時調整控溫級數。 本發明之另-實關巾，若_於關後晶片有過溫 躺為任何—組電源職器發生問題，該過溫保 邊裝置曰產生觸發訊號主動切斷所有主電源。 綜上所述，本發明制於電_關频，仍持續判 y中晶片是否有過溫現象，並進行散熱等控溫程序，包 正(=系統不需開機’其溫_ ^電路已正^作；⑵任何—組電源轉換器發 該過溫賴裝置會產生觸魏號切_ 本 ^明所述之裝置與方法實為一不可多得之發明，及具產^ 之利用性、新穎性及進步性’完全符合發明專利申請要 發明提出申請，敬請詳查朗準本案專利，以保障 11 1267727 ^上所輔林發明之触可行實關，非因此即 二發明之專利範圍’故舉凡運用本發明說明書及圖示 效結構變化，均同理包含於本發明之範圍 【圖式簡單說明】 第一圖係為習用技術溫度監控裝置之示意圖； 第二圖係為本發明晶片過溫保護裝置示意圖； 第三圖係為本發明晶片過溫保護裝置功能方塊圖： _四圖係為本發明控溫I置實施例示意圖； 第五圖係為本發明實施方法流程圖。 【主要元件符號說明】 溫度監控晶片10 中央處理器2 熱二極體5 CPU散熱片3 訊號調節電路12 類比數位轉換器（ADC) 14 電路板20 供電系統22 積體電路24 控溫裝置26 熱感測單元28 12 週邊控制單元29 電源纜線201 内部電路/裝置30 電源31 配接器32 開關33 電源轉換器34 電壓調節器35 電源供應單元36 輸入電源301 次電源302 第一次電源302a 第二次電源302b 第三次電源302c 第一比較器41 第二比較器42 第三比較器43 第一電壓源a 第二電壓源b 第三電壓源c 接地位準gStandby) or sleep, cut off the main power supply of the internal circuit/installation 30 and at least continue to provide the secondary power supply, 302 to the peripheral control ^ 29 (the first power supply 3 〇 2a), the thermal sensing unit 28 (The second power supply 鸠1 temperature device 26 (third power supply iron), etc., so that when the system is shut down = temperature monitoring and heat dissipation of the integrated circuit 24 of the circuit board towel, so that the body, the road 24 does not cause the circuit board In the view of the components, the sisters control the power and the P have caused the problem of continuous heating and damage. The above standby and dormant state, for example, when used in the Windows X operating system, the purpose of supporting the transition to the county Power supply $ j Advanced Configurati〇n and p〇wer Ac 咖 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The sleep mode will be 1 batch: When the status of all open files and files on the desktop is stored as 'and then turned off' and then the power is turned on, the files and files will be shut down and the status will be turned off. The standby mode will power the power components (such as the screen and hard disk) that are not currently used, and reduce the power consumption of the computer, but will continue to supply power to the computer memory. In addition, the above-mentioned temperature control device 26 can give 1267727 different temperature control stages for different states of the temperature-controlled wafers. For example, if the higher temperature is sensed, the higher fan speed is given, and if the temperature is lower, the lower fan speed is given. The adjustment can save power. The embodiment can be as shown in the fourth figure, wherein the thermal sensing unit 28 detects the wafer temperature 'transmits the message to the peripheral control unit 29, converts it into a digital control signal' and includes the first comparator. 41. The plurality of comparison circuits of the second comparator 42 and the third comparator 43 form a control circuit of the temperature control device to determine different temperature control levels. For example, different voltage levels are input to one of the comparators 41, 42, 43, such as the first voltage source a of the first comparator 41, the second voltage source b of the second comparison=42, and the third comparator 43. The third voltage source ε or the like, 周边, the peripheral control unit 29 inputs a control voltage, and the voltage sources a, b, c of the above comparators are compared with the ground level § to produce different output effects, that is, different control Temperature rating. For the flow of the wafer over-temperature protection method of the present invention, please refer to the steps shown in the fifth figure. The implementation of the present invention is directed to a state in which the computer system is shut down, including power-off standby or hibernation, and the temperature of the wafer is still monitored. The back-panel unit provides the voltage of the peripheral control unit and the thermal sensing unit. After the power is turned off, there is still a phenomenon of the wafer ^ dish 'detecting the wafer temperature exceeds - setting the second brain == ^^:1), that is, cutting off the main power supply (step S5〇3), and switching the mode =:= = The source supply unit will be used for different power supplies 1267727. The device supplied by the secondary power supply includes at least the peripheral control unit, the medium if unit and the temperature control device, wherein the thermal sensing unit continuously measures the circuit board to the circuit. i wafer) temperature (step s5〇7) 'transmit the temperature message to the side control unit, and determine whether it exceeds the preset upper temperature limit, whether it is over temperature (step (4) 9), if there is no over temperature phenomenon, then hold 507 In the temperature measurement step, if an over-temperature phenomenon occurs, the temperature information is converted into a control signal (step (4) i11) of the temperature control device by the unit j system, and the temperature is exceeded by the step, and the same is used. control The unit determines the temperature control level (step S513) to execute a different temperature program, that is, starting the temperature control device to perform a temperature control process on the wafer (step ^), such as water cooling, fan air cooling or cooling mechanism, etc. This temperature control period = during or after, still returns to the step s5〇7 of the thermal sensing unit temperature, and adjusts the temperature control level at any time. In the other embodiment of the present invention, if the wafer is over-temperatureed, any problem occurs in the power supply unit, and the over-temperature protection device generates a trigger signal to actively cut off all the main power sources. In summary, the present invention is based on the electric_off frequency, and still continues to judge whether the wafer has over-temperature phenomenon in the y, and performs temperature control procedures such as heat dissipation, and the package is positive (= the system does not need to be turned on] its temperature _ ^ circuit is positive ^2; (2) Any-group power converter sends the over-temperature device to generate a touch-sensitive device. The device and method described in the present invention are indispensable inventions, and the utilization and novelity of the product Sexuality and Progressiveness are in full compliance with the invention patent application. In order to invent the application, please check the patent of the case in order to protect the feasibility of the invention in the 11 1267727 ^Shanglin, and therefore the patent scope of the invention. The use of the description of the present invention and the structural changes of the drawings are included in the scope of the present invention. [Simplified description of the drawings] The first figure is a schematic diagram of a conventional temperature monitoring device; the second figure is the wafer over temperature of the present invention. The third diagram is a functional block diagram of the wafer over-temperature protection device of the present invention: _ four diagrams are schematic diagrams of the embodiment of the temperature control I of the present invention; and the fifth diagram is a flowchart of the implementation method of the present invention. Symbolic Temperature Monitoring Wafer 10 Central Processing Unit 2 Thermal Diode 5 CPU Heat Sink 3 Signal Conditioning Circuit 12 Analog Digital Converter (ADC) 14 Circuit Board 20 Power Supply System 22 Integrated Circuit 24 Temperature Control Device 26 Thermal Sensing Unit 28 12 Peripheral control unit 29 Power cable 201 Internal circuit/device 30 Power supply 31 Adapter 32 Switch 33 Power converter 34 Voltage regulator 35 Power supply unit 36 Input power supply 301 Secondary power supply 302 First power supply 302a Second power supply 302b Third power supply 302c First comparator 41 Second comparator 42 Third comparator 43 First voltage source a Second voltage source b Third voltage source c Ground level g