TWI266366B - Method of improving non-uniformity of chemical mechanical polish - Google Patents

Method of improving non-uniformity of chemical mechanical polish

Info

Publication number
TWI266366B
TWI266366B TW91103695A TW91103695A TWI266366B TW I266366 B TWI266366 B TW I266366B TW 91103695 A TW91103695 A TW 91103695A TW 91103695 A TW91103695 A TW 91103695A TW I266366 B TWI266366 B TW I266366B
Authority
TW
Taiwan
Prior art keywords
chemical mechanical
uniformity
mechanical polish
copper layer
improving non
Prior art date
Application number
TW91103695A
Other languages
Chinese (zh)
Inventor
Shao-Chung Hu
Chia-Lin Hsu
Teng-Chun Tsai
Chih-Chan Yu
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW91103695A priority Critical patent/TWI266366B/en
Application granted granted Critical
Publication of TWI266366B publication Critical patent/TWI266366B/en

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

A copper layer is positioned on a semiconductor wafer. A first chemical solution is used to clean a surface of the copper layer. Following this, a second chemical solution is used to perform a chemical mechanical polish to remove portions of the copper layer and make the remaining copper layer have a planar surface.
TW91103695A 2002-02-27 2002-02-27 Method of improving non-uniformity of chemical mechanical polish TWI266366B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91103695A TWI266366B (en) 2002-02-27 2002-02-27 Method of improving non-uniformity of chemical mechanical polish

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91103695A TWI266366B (en) 2002-02-27 2002-02-27 Method of improving non-uniformity of chemical mechanical polish

Publications (1)

Publication Number Publication Date
TWI266366B true TWI266366B (en) 2006-11-11

Family

ID=38191559

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91103695A TWI266366B (en) 2002-02-27 2002-02-27 Method of improving non-uniformity of chemical mechanical polish

Country Status (1)

Country Link
TW (1) TWI266366B (en)

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees