TWI265947B - Thermal interface pad utilizing low melting metal with retention matrix - Google Patents

Thermal interface pad utilizing low melting metal with retention matrix

Info

Publication number
TWI265947B
TWI265947B TW92119419A TW92119419A TWI265947B TW I265947 B TWI265947 B TW I265947B TW 92119419 A TW92119419 A TW 92119419A TW 92119419 A TW92119419 A TW 92119419A TW I265947 B TWI265947 B TW I265947B
Authority
TW
Taiwan
Prior art keywords
laminae
low melting
opposed surfaces
thermal interface
retention matrix
Prior art date
Application number
TW92119419A
Other languages
Chinese (zh)
Other versions
TW200408666A (en
Inventor
Sanjay Misra
Radesh Jewram
G M Fazley Elahee
Original Assignee
Bergquist Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/543,661 external-priority patent/US6339120B1/en
Priority claimed from US09/946,879 external-priority patent/US6797758B2/en
Priority claimed from US10/279,593 external-priority patent/US6984685B2/en
Application filed by Bergquist Co filed Critical Bergquist Co
Publication of TW200408666A publication Critical patent/TW200408666A/en
Application granted granted Critical
Publication of TWI265947B publication Critical patent/TWI265947B/en

Links

Abstract

A stabilized thermally conductive mechanical compliant laminate pad to be interposed between opposed surfaces of a generating semi-conductor device and a heat sink, with the laminate pad comprising upper and lower laminae on opposed surfaces of a central stabilizing apertured grid. The laminae are subjected to a compressive force at an elevated temperature until portions of the laminae extend through the apertures to form a continuum. The laminae comprise a polymer matrix having a quantity of a low melting indium or gallium alloy and a thermally conductive particulate dispersed there through, with the polymer matrix being a hot wax or melt resin. With the upper and lower laminae positioned on opposed surfaces of a central stabilizing apertured grid a compressive load is applied to force portions of said laminae to pass through apertures in the mesh grid to form a continuum.
TW92119419A 2000-04-05 2003-07-16 Thermal interface pad utilizing low melting metal with retention matrix TWI265947B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/543,661 US6339120B1 (en) 2000-04-05 2000-04-05 Method of preparing thermally conductive compounds by liquid metal bridged particle clusters
US09/690,994 US6624224B1 (en) 2000-04-05 2000-10-17 Method of preparing thermally conductive compounds by liquid metal bridged particle clusters
US09/946,879 US6797758B2 (en) 2000-04-05 2001-09-05 Morphing fillers and thermal interface materials
US10/279,593 US6984685B2 (en) 2000-04-05 2002-10-24 Thermal interface pad utilizing low melting metal with retention matrix

Publications (2)

Publication Number Publication Date
TW200408666A TW200408666A (en) 2004-06-01
TWI265947B true TWI265947B (en) 2006-11-11

Family

ID=38191441

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92119419A TWI265947B (en) 2000-04-05 2003-07-16 Thermal interface pad utilizing low melting metal with retention matrix

Country Status (1)

Country Link
TW (1) TWI265947B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI777043B (en) * 2019-03-06 2022-09-11 裕晨科技股份有限公司 Application method of liquid metal on heating surface or heat conducting surface

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113395875B (en) * 2021-05-25 2022-07-26 深圳市卓汉材料技术有限公司 Heat conducting component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI777043B (en) * 2019-03-06 2022-09-11 裕晨科技股份有限公司 Application method of liquid metal on heating surface or heat conducting surface

Also Published As

Publication number Publication date
TW200408666A (en) 2004-06-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees