TWI265947B - Thermal interface pad utilizing low melting metal with retention matrix - Google Patents
Thermal interface pad utilizing low melting metal with retention matrixInfo
- Publication number
- TWI265947B TWI265947B TW92119419A TW92119419A TWI265947B TW I265947 B TWI265947 B TW I265947B TW 92119419 A TW92119419 A TW 92119419A TW 92119419 A TW92119419 A TW 92119419A TW I265947 B TWI265947 B TW I265947B
- Authority
- TW
- Taiwan
- Prior art keywords
- laminae
- low melting
- opposed surfaces
- thermal interface
- retention matrix
- Prior art date
Links
Abstract
A stabilized thermally conductive mechanical compliant laminate pad to be interposed between opposed surfaces of a generating semi-conductor device and a heat sink, with the laminate pad comprising upper and lower laminae on opposed surfaces of a central stabilizing apertured grid. The laminae are subjected to a compressive force at an elevated temperature until portions of the laminae extend through the apertures to form a continuum. The laminae comprise a polymer matrix having a quantity of a low melting indium or gallium alloy and a thermally conductive particulate dispersed there through, with the polymer matrix being a hot wax or melt resin. With the upper and lower laminae positioned on opposed surfaces of a central stabilizing apertured grid a compressive load is applied to force portions of said laminae to pass through apertures in the mesh grid to form a continuum.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/543,661 US6339120B1 (en) | 2000-04-05 | 2000-04-05 | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
US09/690,994 US6624224B1 (en) | 2000-04-05 | 2000-10-17 | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
US09/946,879 US6797758B2 (en) | 2000-04-05 | 2001-09-05 | Morphing fillers and thermal interface materials |
US10/279,593 US6984685B2 (en) | 2000-04-05 | 2002-10-24 | Thermal interface pad utilizing low melting metal with retention matrix |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200408666A TW200408666A (en) | 2004-06-01 |
TWI265947B true TWI265947B (en) | 2006-11-11 |
Family
ID=38191441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92119419A TWI265947B (en) | 2000-04-05 | 2003-07-16 | Thermal interface pad utilizing low melting metal with retention matrix |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI265947B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI777043B (en) * | 2019-03-06 | 2022-09-11 | 裕晨科技股份有限公司 | Application method of liquid metal on heating surface or heat conducting surface |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113395875B (en) * | 2021-05-25 | 2022-07-26 | 深圳市卓汉材料技术有限公司 | Heat conducting component |
-
2003
- 2003-07-16 TW TW92119419A patent/TWI265947B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI777043B (en) * | 2019-03-06 | 2022-09-11 | 裕晨科技股份有限公司 | Application method of liquid metal on heating surface or heat conducting surface |
Also Published As
Publication number | Publication date |
---|---|
TW200408666A (en) | 2004-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |