TWI265727B - Image sensor inspection system - Google Patents

Image sensor inspection system

Info

Publication number
TWI265727B
TWI265727B TW094118901A TW94118901A TWI265727B TW I265727 B TWI265727 B TW I265727B TW 094118901 A TW094118901 A TW 094118901A TW 94118901 A TW94118901 A TW 94118901A TW I265727 B TWI265727 B TW I265727B
Authority
TW
Taiwan
Prior art keywords
image sensor
inspection
inspected
processing device
data
Prior art date
Application number
TW094118901A
Other languages
Chinese (zh)
Other versions
TW200618612A (en
Inventor
Akihiro Uchida
Norihide Fujiki
Masahiro Ishibashi
Original Assignee
Yokogawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokogawa Electric Corp filed Critical Yokogawa Electric Corp
Publication of TW200618612A publication Critical patent/TW200618612A/en
Application granted granted Critical
Publication of TWI265727B publication Critical patent/TWI265727B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Abstract

The invention provides an image sensor inspection system with high freedom of design, which may readily cope with the change in the type of inspected objects, and the thus obtained image data or inspection data may be applied to other devices without using special interfaces. The present invention is characterized by including a DUT board, which carries an inspected image sensor; a light source, which illuminates the inspected image sensor; an inspection device, which drives the inspected image sensor, the DUT board, and the light source with specified inspection program; an image data processing device, which is connected to the inspection device through networks and processes the image data of the inspected image sensor output from the DUT board; a test system server, which is connected to the inspection device and the image processing device through networks, and supplies the inspection device and the image processing device with specified inspection program corresponding to the inspected image sensor; a monitor, which is connected to and displays the data of each of the inspection device, the image processing device, and the test system server through networks.
TW094118901A 2004-11-29 2005-06-08 Image sensor inspection system TWI265727B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004343872A JP4645174B2 (en) 2004-11-29 2004-11-29 Solid-state image sensor inspection system

Publications (2)

Publication Number Publication Date
TW200618612A TW200618612A (en) 2006-06-01
TWI265727B true TWI265727B (en) 2006-11-01

Family

ID=36634546

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094118901A TWI265727B (en) 2004-11-29 2005-06-08 Image sensor inspection system

Country Status (3)

Country Link
JP (1) JP4645174B2 (en)
KR (1) KR100675766B1 (en)
TW (1) TWI265727B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI627854B (en) * 2013-03-04 2018-06-21 Sony Corp Uneven spot inspection system, uneven spot inspection method and uneven spot inspection program

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4683267B2 (en) * 2005-01-19 2011-05-18 横河電機株式会社 Solid-state image sensor inspection system
DE102008020772A1 (en) * 2008-04-21 2009-10-22 Carl Zeiss 3D Metrology Services Gmbh Presentation of results of a measurement of workpieces

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001016622A (en) * 1999-06-30 2001-01-19 Agilent Technologies Japan Ltd Debug device and test method for image pickup device
JP2001183406A (en) * 1999-10-15 2001-07-06 Sony Corp Electronic apparatus evaluating device, electronic apparatus evaluating method, and computer-readable information storage medium for recording program having function of evaluating electronic apparatus
JP2001141601A (en) * 1999-11-11 2001-05-25 Sony Corp Method and system for evaluating/sorting display or imaging device
JP2002027506A (en) * 2000-07-12 2002-01-25 Yokogawa Electric Corp Solid state image sensing element inspection device
JP2002252161A (en) * 2001-02-23 2002-09-06 Hitachi Ltd Semiconductor manufacturing system
JP2004045052A (en) * 2002-07-08 2004-02-12 Sharp Corp Apparatus and method for inspecting image data
JP4243500B2 (en) * 2003-03-12 2009-03-25 日本Ｃｍｏ株式会社 Display panel defect inspection system
JP2004294358A (en) * 2003-03-28 2004-10-21 Hitachi High-Technologies Corp Method and apparatus for inspecting defect

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI627854B (en) * 2013-03-04 2018-06-21 Sony Corp Uneven spot inspection system, uneven spot inspection method and uneven spot inspection program
US10089754B2 (en) 2013-03-04 2018-10-02 Saturn Licensing Llc Unevenness inspection system, unevenness inspection method, and unevenness inspection program

Also Published As

Publication number Publication date
JP2006156641A (en) 2006-06-15
JP4645174B2 (en) 2011-03-09
KR20060059788A (en) 2006-06-02
TW200618612A (en) 2006-06-01
KR100675766B1 (en) 2007-01-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees