TWI265647B - High brightness light-emitting diode chip - Google Patents

High brightness light-emitting diode chip

Info

Publication number
TWI265647B
TWI265647B TW94146118A TW94146118A TWI265647B TW I265647 B TWI265647 B TW I265647B TW 94146118 A TW94146118 A TW 94146118A TW 94146118 A TW94146118 A TW 94146118A TW I265647 B TWI265647 B TW I265647B
Authority
TW
Taiwan
Prior art keywords
transparent package
package object
led chip
light
reflective
Prior art date
Application number
TW94146118A
Other languages
Chinese (zh)
Other versions
TW200725935A (en
Inventor
Shiou-Mei Jang
Original Assignee
High Power Lighting Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by High Power Lighting Corp filed Critical High Power Lighting Corp
Priority to TW94146118A priority Critical patent/TWI265647B/en
Application granted granted Critical
Publication of TWI265647B publication Critical patent/TWI265647B/en
Publication of TW200725935A publication Critical patent/TW200725935A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Abstract

This invention provided the package structure of a light-emitting diode (LED) chip. The main feature of this invention is that there is a transparent package object whose structure comprises a convex lens, and the transparent package object seals the LED chip and wires. At the periphery, there is a reflective plate having a reflective surface whose structure has a concave surface or an oblique plane. At the top view, the transparent package object and the LED chip are concentric circles whose axis is vertically extended upward from the center of the LED chip. At the lateral view, the transparent package object looks like a convex object with an upper and lower layer structure. The upper layer of the curve surface of the transparent package object can keep the lights upward emitting from the LED chip and passing the upper layer of the curve surface from reflecting that causes scattering or total reflection that reflects the light back to the inside of the transparent package object. The lower layer of the curve surface can refract the light passing through it to the reflective surface of the reflective plate arranged at the periphery of the transparent package object. The light can be then be reflected again from the reflective surface to the outside.
TW94146118A 2005-12-23 2005-12-23 High brightness light-emitting diode chip TWI265647B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94146118A TWI265647B (en) 2005-12-23 2005-12-23 High brightness light-emitting diode chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94146118A TWI265647B (en) 2005-12-23 2005-12-23 High brightness light-emitting diode chip

Publications (2)

Publication Number Publication Date
TWI265647B true TWI265647B (en) 2006-11-01
TW200725935A TW200725935A (en) 2007-07-01

Family

ID=38122276

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94146118A TWI265647B (en) 2005-12-23 2005-12-23 High brightness light-emitting diode chip

Country Status (1)

Country Link
TW (1) TWI265647B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474502B (en) * 2009-03-30 2015-02-21 Ind Tech Res Inst Light emitting diode package structure and method for manufacturing the same
CN102054920A (en) 2009-10-27 2011-05-11 展晶科技(深圳)有限公司 Light-emitting diode encapsulation structure
CN102130252B (en) * 2010-11-03 2013-02-27 映瑞光电科技(上海)有限公司 Light emitting diode and manufacturing method thereof

Also Published As

Publication number Publication date
TW200725935A (en) 2007-07-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees