TWI264831B - Wafer level package and method for making the same - Google Patents
Wafer level package and method for making the sameInfo
- Publication number
- TWI264831B TWI264831B TW094128942A TW94128942A TWI264831B TW I264831 B TWI264831 B TW I264831B TW 094128942 A TW094128942 A TW 094128942A TW 94128942 A TW94128942 A TW 94128942A TW I264831 B TWI264831 B TW I264831B
- Authority
- TW
- Taiwan
- Prior art keywords
- cave
- making
- same
- wafer level
- level package
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/09—Packages
- B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
- B81B2207/098—Arrangements not provided for in groups B81B2207/092 - B81B2207/097
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0127—Using a carrier for applying a plurality of packaging lids to the system wafer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Dicing (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094128942A TWI264831B (en) | 2005-08-24 | 2005-08-24 | Wafer level package and method for making the same |
US11/314,341 US7491568B2 (en) | 2005-08-24 | 2005-12-22 | Wafer level package and method for making the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094128942A TWI264831B (en) | 2005-08-24 | 2005-08-24 | Wafer level package and method for making the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI264831B true TWI264831B (en) | 2006-10-21 |
TW200709452A TW200709452A (en) | 2007-03-01 |
Family
ID=37804761
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094128942A TWI264831B (en) | 2005-08-24 | 2005-08-24 | Wafer level package and method for making the same |
Country Status (2)
Country | Link |
---|---|
US (1) | US7491568B2 (zh) |
TW (1) | TWI264831B (zh) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6492203B1 (en) * | 1997-04-30 | 2002-12-10 | Hitachi Chemical Company, Ltd. | Semiconductor device and method of fabrication thereof |
KR100601598B1 (ko) * | 1998-06-15 | 2006-07-14 | 삼성전자주식회사 | 기록 방지 정보를 저장하는 기록 매체와 기록 방지 방법 |
US6392144B1 (en) * | 2000-03-01 | 2002-05-21 | Sandia Corporation | Micromechanical die attachment surcharge |
US6562656B1 (en) * | 2001-06-25 | 2003-05-13 | Thin Film Module, Inc. | Cavity down flip chip BGA |
-
2005
- 2005-08-24 TW TW094128942A patent/TWI264831B/zh active
- 2005-12-22 US US11/314,341 patent/US7491568B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20070048899A1 (en) | 2007-03-01 |
US7491568B2 (en) | 2009-02-17 |
TW200709452A (en) | 2007-03-01 |
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