TWI264726B - Integrated content addressable memory architecture - Google Patents
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1264726 五、發明說明(1) 發明所屬之技術領域 本發明提供一種積體電路化之内容可定址記憶體 (content addressable memory, CAM)構造,尤指一種奠 基於複數個新穎的1 0 -電晶體内容可定址記憶體單元的積 體電路化之内容可定址記憶體構造。 先前技術 大多數記憶元件以特定的記憶位址來存取資料。結果這 樣的處理方法經常成為依賴快速記憶體存取之系統的限 制因素。若是一個資料可依其内容而非依其儲存位址來 確認存取,則由記憶體中找出一儲存資料所需的時間可 明顯減少。依此處理方法存取的記憶體稱為内容可定址 記憶體(CAM)。簡單地說,内容可定址記憶體的基本特徵 可視為一標準儲存系統,例如隨機存取記憶體(RAM )與一 比較裝置的結合。因此,内容可定址記憶體為隨機存取 記憶體技術的自然發展而且提供一個比其他記憶體搜尋 結構更優異的優點。内容可定址記憶體可應用在加速任 何需要快速搜尋的領域,例如資料庫、目錄或是圖案, 圖形、聲音辨識或是電腦和通訊設計。另外内容可定址 記憶體也適合其他幾種功能,包括電腦中央處理單元 (CPU)的資料處理、乙太網路位址查詢、資料壓縮、搜尋 引擎、加解密的圖像辨識以及壓縮/解壓縮應用等等。1264726 V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) Field of the Invention The present invention provides an integrated circuitizable content addressable memory (CAM) structure, especially one based on a plurality of novel 10 - crystals The content of the content-addressable memory unit can be addressed to the memory structure. Prior Art Most memory elements access data at specific memory addresses. As a result, such processing methods often become a limiting factor in systems that rely on fast memory access. If a material can be accessed based on its content rather than its storage address, the time required to find a stored data in memory can be significantly reduced. The memory accessed by this processing method is called Content Addressable Memory (CAM). Briefly, the basic characteristics of content-addressable memory can be viewed as a standard storage system, such as a combination of random access memory (RAM) and a comparison device. Therefore, content addressable memory is a natural development of random access memory technology and provides an advantage over other memory search structures. Content addressable memory can be used to accelerate any area that requires fast search, such as databases, catalogs or graphics, graphics, sound recognition, or computer and communication design. In addition, content-addressable memory is also suitable for several other functions, including data processing of computer central processing unit (CPU), Ethernet address query, data compression, search engine, image recognition for encryption and decryption, and compression/decompression. Application and more.
1264726 五、發明說明(2) 習知内容可定址記憶體單元是使用靜態隨機存取記憶體 (SRAM)排成行列來執行。利用靜態隨機存取記憶體完成 的内容可定址記憶體單元是使用靜態隨機存取記憶體單 元的快速存取速度以及其靜態特性。基於前述内容可定 址記憶體的特徵,還有靜態隨機存取記憶體讀取和儲存 資料的功能,内容可定址記憶體也被使用於搜尋及比較 已儲存的資料,用以確認記憶體中的資料是否與一組比 較資料(搜尋資料)相符。當比較資料(搜尋資料)與已儲 存在記憶體的資料相符時,會顯示出一個配稱結果;當 比較資料(搜尋資料)與已儲存在記憶體的資料不符時, 則顯示一個不配稱結果。請參見圖一,圖一為一個以複 數個記憶體列1 Ο A〜1 Ο K排列之習知内容可定址記憶體構造 的示意圖。如圖一中所示,每一記憶體列(1 Ο A〜1 Ο K )耦接 至一對應配稱線1 2 (1 2 A〜1 2 K ),此對應配稱線1 2可用來顯 示比較資料是否與已儲存在記憶體列中的資料相符。在 此例中,比較資料和預先儲存的資料皆為N位元數位資 料。舉記憶體列1 Ο A為例,當N位元比較資料與儲存在内 容可定址記憶體構造1 0之記憶體列1 Ο A的N位元資料完全 相同時,對應的配稱線會輸出一邏輯高位準。相反的, 當N位元比較資料的任一資料位元與儲存在内容可定址記 憶體構造1 0之記憶體列1 Ο A的對應N位元資料不同時,對 應的配稱線則轉為輸出一邏輯低位準。1264726 V. INSTRUCTIONS (2) Conventional content addressable memory cells are arranged in a row and column using static random access memory (SRAM). The content addressable memory unit implemented using static random access memory is the fast access speed and static characteristics of the static random access memory unit. Based on the foregoing content of the addressable memory, and the function of the SRAM to read and store data, the content addressable memory is also used to search and compare the stored data for confirming the memory. Whether the data matches a set of comparative data (search materials). When the comparison data (search data) matches the data already stored in the memory, a matching result is displayed; when the comparison data (search data) does not match the data already stored in the memory, an unqualified result is displayed. . Referring to Figure 1, Figure 1 is a schematic diagram of a conventional content addressable memory structure arranged in a plurality of memory columns 1 Ο A 〜 1 Ο K. As shown in FIG. 1, each memory bank (1 Ο A~1 Ο K ) is coupled to a corresponding matching line 1 2 (1 2 A~1 2 K ), and the corresponding matching line 1 2 can be used. Shows whether the comparison data matches the data already stored in the memory column. In this example, the comparison data and the pre-stored data are all N-digit data. Taking the memory column 1 Ο A as an example, when the N-bit comparison data is identical to the N-bit data stored in the memory column 1 Ο A of the content addressable memory structure 10, the corresponding matching line is output. A logic high level. Conversely, when any data bit of the N-bit comparison data is different from the corresponding N-bit data stored in the memory column 1 Ο A of the content-addressable memory structure 10, the corresponding matching line is converted to The output is a low logic level.
1264726 五、發明說明(3:) 參考圖一,於前述用來作為資料比對之内容可定址記憶 體構造1 0之記憶體列包括一遮罩單元1 5 ( 1 5 A〜1 5 K )耦接至 複數個相關的内容可定址記憶體單元。遮罩單元1 5 ( 1 5 A〜 1 5 K)可以開啟或關閉該些内容可定址記憶體單元的比對 作業。舉例來說,在記憶體列1 0A中的遮罩單元1 5A連接 該些相關的内容可定址記憶體單元1 〇 A ( 2 )和1 0 A ( 3 ),而 且該些内容可定址記憶體單元1 0 A ( 2 )和1 0 A ( 3 )可被遮罩 單元1 5 A遮罩起來。以此法實行的例子也出現在N a t a r a j e t a 1 ·所中請的美國專利 6,1 5 4,3 8 4號"Ternary content addressable memory cell” ,以及 Voelkel申請的美國專 利 6,108,22 7號 ’’Content addressable memory having binary and ternary modes of operation”中 。 —般來 說,當遮罩單元被設定成作動時,該些内容可定址記憶 體單元將會在比對作業中被遮罩起來;而當遮罩單元被 設定成不作動時,則不會在比對作業中被遮罩起來。 每一記憶體列(1 0 A〜1 0 K )包含複數個(二元的)内容可定址 記憶體單元。例如記憶體列1 0 A包含N個内容可定址記憶 體單元10A(1)〜10A(N)。每一内容可定址記憶體單元可以 儲存一數位資料值,該數位資料值具有二種資訊狀態, 邏輯壹和邏輯零。如圖一所示,儲存在每一記憶體列 (1 0 A〜1 0 K )中的N個位元資料是由儲存在對應的n個(二元 的)内容可定址記憶體單元中的N個數位資料值所組成。 圖二為習知内容可定址記憶體單元2 0之一示意圖。内容1264726 V. INSTRUCTIONS (3:) Referring to FIG. 1, the memory column of the addressable memory structure 10 used as the content of the data comparison includes a mask unit 1 5 (1 5 A~1 5 K ) Coupled to a plurality of related content addressable memory cells. The mask unit 1 5 (1 5 A to 1 5 K) can turn on or off the alignment of the content addressable memory cells. For example, the mask unit 15A in the memory column 10A connects the related content addressable memory units 1 〇A ( 2 ) and 1 0 A ( 3 ), and the content addressable memory Units 1 0 A ( 2 ) and 1 0 A ( 3 ) can be masked by mask unit 15 5 A. The example implemented by this method also appears in the US Patent 6,1 5 4,3 8 4 "Ternary content addressable memory cell", and the U.S. Patent 6,108,22, filed by Voelkel. No. ''Content addressable memory having binary and ternary modes of operation'. In general, when the mask unit is set to operate, the content-addressable memory unit will be masked in the comparison operation; and when the mask unit is set to be inactive, it will not Masked in the comparison job. Each memory bank (1 0 A~1 0 K ) contains a plurality of (binary) content addressable memory cells. For example, the memory bank 10 A contains N content addressable memory cells 10A(1) to 10A(N). Each content addressable memory unit can store a digital data value having two information states, a logical state and a logical zero. As shown in FIG. 1, the N bit data stored in each memory column (10 A~1 0 K ) is stored in the corresponding n (binary) content addressable memory cells. It consists of N digit data values. 2 is a schematic diagram of one of the conventional content addressable memory cells 20. content
1264726 五、發明說明(4) 可定址記憶體單元2 0 (使用二元靜態隨機存取記憶體)被 使用在圖一的内容可定址記憶體構造1 0的一記憶體列 中。以圖一中的記憶體列1 Ο A為例,圖二中的内容可定址 記憶體單元2 0可被用於記憶體列1 Ο A中的每一個内容可定 址記憶體單元1 0 A ( 1 )〜1 0 A ( N )。内容可定址記憶體單元2 0 包含一靜態隨機存取記憶體單元2 6、一比較器模組2 4、 以及一配稱線2 2。比較器模組2 4可用來比對儲存在靜態 隨機存取記憶體單元2 6中的數位資料值與一輸入資料 值。當輸入資料值與儲存在靜態隨機存取記憶體單元2 6 中的數位資料值相同時,配稱線2 2會保持在預先充電的 高位準。當輸入資料值與儲存在靜態隨機存取記憶體單 元2 6中的數位資料值相反時,配稱線2 2會被拉下至一低 位準。内容可定址記憶體單元2 0另包含一字元線2 8、一 第一位元線3 0以及一第二位元線3 2,其中靜態隨機存取 記憶體單元2 6和比較器模組2 4共用第一和第二位元線 30、32。請再次參考圖一和圖二,若是如圖一中内容可 定址記憶體單元2 0被用於記憶體列1 0 A中且被連接至遮罩 單元1 5 A,則内容可定址記憶體單元2 0變成一個可以有效 儲存三種資訊狀態的可遮罩型内容可定址記憶體單元 2 0,該三種資訊狀態為邏輯壹、邏輯零、和忽略比對作 業狀態。可遮罩型之内容可定址記憶體單元的設計讓使 用者可以循列遮罩部分位元來進行比對作業。 圖三為圖二中習知内容可定址記憶體單元之一詳細實施1264726 V. DESCRIPTION OF THE INVENTION (4) The addressable memory unit 20 (using binary static random access memory) is used in a memory bank of the content addressable memory structure 10 of Fig. 1. Taking the memory column 1 Ο A in FIG. 1 as an example, the content addressable memory unit 20 in FIG. 2 can be used for each content addressable memory unit 10 A in the memory column 1 Ο A ( 1) ~1 0 A ( N ). The content addressable memory unit 20 includes a static random access memory unit 26, a comparator module 2 4, and a matching line 2 2 . The comparator module 24 can be used to compare digital data values and an input data value stored in the static random access memory unit 26. When the input data value is the same as the digital data value stored in the SRAM cell 26, the matching line 2 2 will remain at the pre-charged high level. When the input data value is opposite to the digital data value stored in the SRAM cell 26, the matching line 2 2 is pulled down to a low level. The content addressable memory unit 20 further includes a word line 2 8 , a first bit line 3 0 and a second bit line 3 2 , wherein the static random access memory unit 26 and the comparator module 2 4 share the first and second bit lines 30, 32. Referring again to FIG. 1 and FIG. 2, if the addressable memory unit 20 is used in the memory column 10 A and connected to the mask unit 1 5 A as shown in FIG. 1, the content addressable memory unit 20 becomes a maskable content addressable memory unit 20 that can effectively store three information states, which are logical 壹, logical zero, and ignore comparison job status. The content of the maskable content addressable memory unit allows the user to follow the mask bits to perform the alignment. Figure 3 is a detailed implementation of one of the conventional content addressable memory units in Figure 2.
1264726 五、發明說明(:5) 例的示意圖。圖三詳細說明了内容可定址記憶體單元2 0 的實施方法。内容可定址記憶體單元2 0為一個1 0 -電晶體 内容可定址記憶體單元,其中靜態隨機存取記憶體單元 2 6為一個6 -電晶體靜態隨機存取記憶體單元,而比較器 模組2 4為一個4 -電晶體比較器模組。在實際應用時,配 稱線2 2會在比對輸入資料值和儲存在6 -電晶體靜態隨機 存取記憶體單元2 6中的數位資料值之前,先預先充電至 一預設的高位準。然而因為6 -電晶體靜態隨機存取記憶 體單元26和4-電晶體比較器模組24共用相同的第一和第 二位元線1 0、3 2,配稱線2 2的預先充電電位可能被6 -電 晶體靜態隨機存取記憶體單元2 6或是4-電晶體比較器模 組2 4中的任何其他點(例如N I點)的初始狀態所干擾。此 外配稱線2 2的預先充電電位會被配稱線2 2和内部接點(例 如N I點)之間的電荷分配作用拉下,而配稱線2 2的電壓下 降幅度取決於配稱線2 2和内部接點之間的電容值。所有 上述習知技藝的操作結果,將不利於内容可定址記憶體 使用在低功率作業中。 此外,為了順應整合多種功能於一個電子裝置的潮流, 希望能盡可能保持内容可定址記憶體構造的強大功能而 不增加每一單元尺寸。因此,一種保有使用靜態隨機存 取記憶體的特性同時具有高效率和充分選擇性,而且具 有比習知技藝更好的保護機制、更大的比對彈性以及更 快的操作速度的内容可定址記憶體單元,,將成為相關1264726 V. Illustration of the invention (: 5). Figure 3 details the implementation of the content addressable memory unit 20. The content addressable memory unit 20 is a 10-O-crystal content addressable memory unit, wherein the SRAM cell 26 is a 6-transistor SRAM cell, and the comparator mode is Group 2 4 is a 4-transistor comparator module. In practical applications, the matching line 2 2 is pre-charged to a preset high level before comparing the input data value with the digital data value stored in the 6-transparent SRAM cell 26. . However, since the 6-transistor SRAM cell 26 and the 4-transistor comparator module 24 share the same first and second bit lines 10, 3 2, the precharge potential of the line 2 2 is assigned. It may be disturbed by the initial state of the 6-transistor SRAM cell 26 or any other point in the 4-transistor comparator module 24 (e.g., the NI point). In addition, the pre-charging potential of the matching line 2 2 is pulled down by the charge distribution between the matching line 2 2 and the internal contact (for example, the NI point), and the voltage drop of the matching line 2 2 depends on the matching line. 2 2 and the capacitance value between the internal contacts. The results of all of the above-described prior art techniques will be detrimental to the use of content addressable memory in low power operations. In addition, in order to conform to the trend of integrating multiple functions into one electronic device, it is desirable to maintain the powerful function of the content addressable memory structure as much as possible without increasing the size of each unit. Therefore, a content retaining the characteristics of using static random access memory while having high efficiency and sufficient selectivity, and having a better protection mechanism than conventional techniques, greater flexibility of alignment, and faster operation speed can be addressed. Memory unit, will become relevant
1264726 五、發明說明(6丨 產業的主要需求。 發明内容 因此本發明之主要目的在於提供一種1 〇 -電晶體内容可定 址記憶體單元和一種積體電路化之内容可定址記憶體構 造,以解決上述習知訊號干擾的問題,並提供整合功能 以解決前述習知問題。 根據本發明之申請專利範圍,係揭露一種10 -電晶體内容 可定址記憶體單元和一種積體電路化之内容可定址記憶 體構造。實施過程中,根據本發明之10 -電晶體内容可定 址記憶體單元,一個結合1 0 -電晶體内容可定址記憶體單 元之配稱線的預先充電電位不會被1 〇 -電晶體内容可定址 記憶體單元中其他接點的初始狀態所干擾。此外在積體 電路化之内容可定址記憶體構造的每一記憶體列(1 Ο A〜 1 0K)中的總體重設功能,提供一有效位元單元和一保護 位元單元,以充分確保進行比對作業時的正確性。此外 結合習知的遮罩作業,使用1 0 -電晶體内容可定址記憶體 單元的積體電路化之内容可定址記憶體構造可以提供整 合且多樣的功能以充分發揮内容可定址記憶體特性。 本發明之目的為提供一種1 0 -電晶體内容可定址記憶體單 元5其包含有一字元線第一位元線、一第二位元1264726 V. INSTRUCTION DESCRIPTION (6) The main needs of the industry. SUMMARY OF THE INVENTION Accordingly, it is a primary object of the present invention to provide a 1 〇-transistor content addressable memory unit and an integrated circuitizable content addressable memory structure, Solving the problem of the above-mentioned conventional signal interference, and providing an integrated function to solve the aforementioned conventional problems. According to the patent application scope of the present invention, a 10-crystal content addressable memory unit and an integrated circuitized content are disclosed. Addressing memory structure. In the implementation process, according to the 10-crystal content of the present invention, the memory unit can be addressed, and a pre-charge potential of a matching line of the addressable memory unit combined with the 10 - transistor content is not 1 〇. - The contents of the transistor can interfere with the initial state of other contacts in the address memory unit. In addition, the overall weight of each memory column (1 Ο A~ 1 0K) in the memory structure can be addressed in the integrated circuit. A function is provided to provide a valid bit unit and a protection bit unit to fully ensure the correctness of the comparison operation. The known masking operation, using the 10 - transistor content addressable memory cell, the integrated circuitizable addressable memory structure can provide an integrated and diverse function to fully exploit the content addressable memory characteristics. The object is to provide a 10 - transistor content addressable memory unit 5 comprising a word line first bit line and a second bit
第10頁 1264726 五、發明說明(τ) 線、一 6 -電晶體靜態隨機存取記憶體單元、一配稱線、 一第三位元線、一第四位元線以及一 4 -電晶體比較器模 組。其中該6 -電晶體靜態隨機存取記憶體單元耦接至該 字元線、該第一位元線以及該第二位元線用來儲存一數 位資料值;該配稱線用來提供一配稱訊號;該4 -電晶體 比較器模組耦接至該配稱線、該第三位元線、該第四位 元線以及該6 -電晶體靜態隨機存取記憶體單元用來比較 儲存在6 -電晶體靜態隨機存取記憶體單元中的數位資料 值與一由該第三位元線或該第四位元線所提供之輸入資 料值。 本發明之另一目的為提供一種積體電路化之内容可定址 記憶體,其包含有複數條配稱線、複數個記憶體列、一 有效位元單元以及一保護位元單元。其中複數條配稱線 用來提供複數個對應的配稱訊號;複數個記憶體列耦接 至對應的配稱線,該些對應的配稱線耦接至複數個内容 可定址記憶體單元;該有效位元單元耦接至該配稱線用 以儲存一有效位元,該有效位元用來表示該積體電路化 之内容可定址記憶體之記憶體列是否含有有效資料;該 保護位元單元耦接至該有效位元單元,用來當該保護位 元單元被設定成不作動時將有效位元設成零,而當該保 護位元單元被設定成作動時將有效位元保持不變。 本發明之又一目的為提供一種積體電路化之内容可定址Page 10 1264726 V. Invention Description (τ) Line, a 6-Opto SRAM cell, a matching line, a third bit line, a fourth bit line, and a 4-cell Comparator module. The 6-epoxy SRAM cell is coupled to the word line, the first bit line, and the second bit line are used to store a digital data value; the matching line is used to provide a The 4-channel transistor comparator module is coupled to the symmetrical line, the third bit line, the fourth bit line, and the 6-transistor SRAM cell for comparison The digital data value stored in the 6-transistor SRAM cell and an input data value provided by the third bit line or the fourth bit line. Another object of the present invention is to provide an integrated circuit addressable addressable memory comprising a plurality of matching lines, a plurality of memory columns, a significant bit unit, and a protection bit unit. The plurality of matching lines are used to provide a plurality of corresponding matching signals; the plurality of memory columns are coupled to the corresponding matching lines, and the corresponding matching lines are coupled to the plurality of content addressable memory units; The effective bit cell is coupled to the matching line for storing a valid bit, wherein the valid bit is used to indicate whether the memory column of the integrated circuitizable addressable memory contains valid data; the protection bit The meta cell is coupled to the effective bit cell for setting the effective bit to zero when the protection bit cell is set to be inactive, and maintaining the valid bit when the protection bit cell is set to be active constant. Another object of the present invention is to provide an integrated circuitizable content addressable
1264726 五、發明說明(8) 記憶體構造,其包含有複數條配稱線以及複數個記憶體 列。每一記憶體列包含有複數個1 0 -電晶體内容可定址記 憶體單元、一有效位元單元、一保護位元單元以及至少 一遮罩單元◦每一個1 0 -電晶體内容可定址記憶體單元包 含有一字元線、一第一位元線、一第二位元線、一 6 -電 晶體靜態隨機存取記憶體單元、一第一輸入線、一第二 輸入線以及一 4 -電晶體比較器模組。其中複數條配稱線 用來提供複數個對應配稱訊號;複數記憶體列,其每一 記憶體列耦接至一對應配稱線;複數個1 0 -電晶體内容可 定址記憶體單元耦接至對應的配稱線;該第一位元線和 該第二位元線為互補位元線對;該6 -電晶體靜態隨機存 取記憶體單元耦接至該字元線、該第一位元線以及該第 二位元線,用來儲存一數位資料值;該第一輸入線和該 第二輸入線為互補輸入線對;該4 -電晶體比較器模組耦 接至該配稱線、該第一輸入線、該第二輸入線以及該6 -電晶體靜態隨機存取記憶體單元,用來比較儲存在6 -電 晶體靜態隨機存取記憶體單元中的數位資料值與一由該 第一輸入線或該第二輸入線所提供之輸入資料值;該有 效位元單元用來儲存一有效位元,該有效位元用來表示 該積體電路化之内容可定址記憶體之記憶體列是否含有 有效資料,其中存放於該積體電路化之内容可定址記憶 體構造之記憶體列的資料是由存放於該6 -電晶體靜態隨 機存取記憶體單元之該數位資料值所組成;該保護位元 單元耗接至該有效位元單元,用來當該保護位元單元被1264726 V. INSTRUCTIONS (8) Memory structure, which includes a plurality of matching lines and a plurality of memory columns. Each memory bank includes a plurality of 10 - transistor content addressable memory cells, a valid bit cell, a guard bit cell, and at least one mask cell, each of the 10 - transistor content addressable memories The body unit includes a word line, a first bit line, a second bit line, a 6-transistor static random access memory unit, a first input line, a second input line, and a 4- Transistor comparator module. Wherein a plurality of matching lines are used to provide a plurality of corresponding matching signals; a plurality of memory columns each coupled to a corresponding matching line; a plurality of 10-0-crystal content addressable memory unit couplings Connecting to the corresponding matching line; the first bit line and the second bit line are complementary bit line pairs; the 6-transistor SRAM cell is coupled to the word line, the first a bit line and the second bit line are used to store a digital data value; the first input line and the second input line are complementary input line pairs; the 4-transistor comparator module is coupled to the a matching line, the first input line, the second input line, and the 6-transistor SRAM cell for comparing digital data values stored in a 6-transistor SRAM cell And an input data value provided by the first input line or the second input line; the effective bit unit is configured to store a valid bit, the valid bit is used to indicate that the integrated circuitized content is addressable Whether the memory column of the memory contains valid data, in which The data of the memory column of the addressable memory structure is composed of the digital data value stored in the 6-transistor SRAM cell; the protection bit cell is consumed To the effective bit cell, when the protection bit cell is used
第12頁 1264726 五、發明說明(9:) 設定成不作動時’错由一總體有效位元重設步驟將有效 位元設成零,而當該保護位元單元被設定成作動時,藉 由一總體有效位元重設步驟將有效位元保持不變;該遮 罩單元耦接至複數個選定的1 〇 -電晶體内容可定址記憶體 單元,用來當該遮罩單元被設定成作動時,將該被選定 的1 0 -電晶體内容可定址記憶體單元遮罩起來,而當該遮 罩單元被設定成不作動時不將該被選定的1 0 -電晶體内容 可定址記憶體單元遮罩起來。 實施方式 圖四為一個本發明之1 0 -電晶體内容可定址記憶體單元4 0 的示意圖。該1 0 -電晶體内容可定址記憶體4 0包含一字元 線4 8、一第一位元線5 0、一第二位元線5 2、以及一 6 -電 晶體靜態隨機存取記憶體單元4 6,該6 -電晶體靜態隨機 存取記憶體單元4 6耦接至該字元線4 8、該第一位元線 5 0、以及該第二位元線5 2,用來儲存一數位資料值。該 第一位元線5 0和該第二位元線5 2為第一互補位元線對。 該6 -電晶體靜態隨機存取記憶體單元4 6包含二個各自執 行負載元件功能的PMOS類型負載電晶體P1和P2、二個各 自執行驅動器功能的NMOS類型驅動電晶體N 1和N2,以及 二個用來存取6 -電晶體靜態隨機存取記憶體單元4 6之資 料的NMOS類型存取電晶體N3和N4。以儲存一個數位資料 值π 1 ’’為例說明,在資料儲存過程中,第一位元線5 0被輸Page 12 1264726 V. Invention Description (9:) When set to not operate, the error is set to zero by an overall effective bit reset step, and when the protected bit element is set to be active, The effective bit remains unchanged by an overall effective bit resetting step; the mask unit is coupled to a plurality of selected one-turn crystal content addressable memory cells for setting the mask unit to be When the operation is performed, the selected 10 - transistor content addressable memory unit is masked, and the selected 10 - transistor content addressable memory is not selected when the mask unit is set to be inactive The body unit is covered. Embodiment FIG. 4 is a schematic diagram of a 10-O-crystal content addressable memory cell 40 of the present invention. The 10 - transistor content addressable memory 40 includes a word line 4 8 , a first bit line 5 0 , a second bit line 5 2 , and a 6 - transistor static random access memory The body unit 4 6 is coupled to the word line 4 8 , the first bit line 5 0 , and the second bit line 5 2 , and is used for the 6 - transistor SRAM cell 4 6 Store a digital data value. The first bit line 50 and the second bit line 5 2 are first complementary bit line pairs. The 6-transistor SRAM cell 46 includes two PMOS type load transistors P1 and P2 each performing a load element function, and two NMOS type drive transistors N 1 and N2 each performing a driver function, and Two NMOS type access transistors N3 and N4 for accessing the data of the 6-transistor SRAM cell 46. Taking a digital data value π 1 ’' as an example, in the data storage process, the first bit line 5 0 is lost.
第13頁 1264726 五、發明說明no) 入一較高電位,第二位元線5 2被輸入一較低電位。因 此’負載電晶體P1和驅動電晶體N 2被開啟’而負載電晶 體P2和驅動電晶體N1被關閉◦如此一來,BF點中的部分 電流經由開啟的驅動電晶體N 2流入電源供應端V ss,但是 在B T點的電流會被關閉的驅動電晶體N 1阻隔在電源供應 端V ss之外。所以BT點在較高電位狀態而BF點在較低電位 狀態。最後關閉字元線48使得BT和BF點保持在相同狀 態,而且數位資料值會各自儲存在BT和BF點(BT點和BF點 可視為一對互補點)。 1 0 -電晶體内容可定址記憶體4 0另包含一配稱線4 2,用以 提供一配稱訊號、一第三位元線5 4、一第四位元線5 6、 以及一 4-電晶體比較器模組44。具有DB點的第三位元線 5 4和具有D點的第四位元線5 6為第二互補位元線對。在本 實施例中,4-電晶體比較器模組44構成一互斥反或 (XN0R)電路用來執行比對作業,該4-電晶體比較器模組 44包含有一對第一 NM0S類型電晶體N5和N6,以及一對第 二NM0S類型電晶體N7和N8,而且每對NM0S類型電晶體耦 接在配稱線42和接地端GND之間。4-電晶體比較器模組44 耦接至配稱線4 2、第三位元線5 4、第四位元線5 6、以及 6 -電晶體靜態隨機存取記憶體單元4 6,用來比對儲存在 6 -電晶體靜態隨機存取記憶體單元4 6中的數位資料值與 一由該第三位元線5 4或該第四位元線5 6所提供之輸入資 料值。配稱線4 2提供的配稱訊號顯示儲存在6 -電晶體靜Page 13 1264726 V. INSTRUCTION DESCRIPTION no) At a higher potential, the second bit line 5 2 is input to a lower potential. Therefore, 'the load transistor P1 and the drive transistor N 2 are turned on' and the load transistor P2 and the drive transistor N1 are turned off. As a result, part of the current in the BF point flows into the power supply terminal via the turned-on drive transistor N 2 . V ss, but the drive transistor N 1 whose current at the BT point is turned off is blocked from the power supply terminal V ss . Therefore, the BT point is at a higher potential state and the BF point is at a lower potential state. Finally, the word line 48 is turned off so that the BT and BF points remain in the same state, and the digital data values are stored at the BT and BF points (the BT point and the BF point can be regarded as a pair of complementary points). 1 0 - transistor content addressable memory 40 further includes a matching line 4 2 for providing a matching signal, a third bit line 5 4, a fourth bit line 5 6 , and a 4 - a transistor comparator module 44. The third bit line 5 4 having the DB point and the fourth bit line 56 having the D point are the second complementary bit line pair. In the present embodiment, the 4-transistor comparator module 44 forms a mutually exclusive or (XN0R) circuit for performing a comparison operation, and the 4-transistor comparator module 44 includes a pair of first NM0S type electrical The crystals N5 and N6, and a pair of second NMOS type transistors N7 and N8, and each pair of NM0S type transistors are coupled between the matching line 42 and the ground GND. The 4-transistor comparator module 44 is coupled to the matching line 4 2, the third bit line 5 4 , the fourth bit line 5 6 , and the 6 - transistor static random access memory unit 4 6 The digital data value stored in the 6-transistor SRAM cell 46 is compared with an input data value provided by the third bit line 454 or the fourth bit line 5.6. The matching signal provided by the matching line 4 2 is stored in the 6-electrode static
第14頁 1264726 五、發明說明(in 態隨機存取記憶體單元4 6中的數位資料值與輸入資料值 是否相同。在比對輸入資料值與儲存在6 -電晶體靜態隨 機存取記憶體 被預充電至一 對作業時,若 取記憶體單元 都確定在低電 的南電位V cx。 靜態隨機存取 為B T點的電位 由預設的南電 單元46中的數位資料值之前,配稱線42會 預設的高電位V cc。如圖四中所示,進行比 輸入資料值與儲存在6 -電晶體靜癌隨機存 4 6中的數位資料值相同時,例如BT點和D點 位狀態(B T = D = 0 ),則配稱訊號保持在預設 相反地,若輸入資料值與儲存在6 -電晶體 記憶體單元4 6中的數位資料值相反時,即 狀態不等於D點的電位狀態,則配稱訊號會 位V c被拉下至一低電位。 因為耦接至4-電晶體比較器模組44的第二互補位元線對 (第三位元線5 4和第四位元線5 6 )與耦接至6 -電晶體靜態 隨機存取記憶體單元4 6的第一互補位元線對(第一位元線 5 0和第二位元線5 2 )是分開的,而且各自連結至第三位元 線5 4和弟四位兀線5 6的N Μ 0 S類型電晶體N 7和N 8被接至接 地端GND,所以配稱線42的預充電電位不會被6-電晶體靜 態隨機存取記憶體單元46或是4-電晶體比較器模組44中 任何其他點的初始狀態所干擾。配稱線4 2上的電壓下降 以及任何可能錯誤的配稱訊號,也可藉由此方法避免。 此外,在使用軟體模擬確認後,將位元線分開可以減少 1 0 -電晶體内容可定址記憶體4 0的位元線負載而達到更快 速的表現。Page 14 1264726 V. Description of the Invention (The digital data value in the in-state random access memory unit 46 is the same as the input data value. The input data values are compared and stored in the 6-transparent static random access memory. When pre-charging to a pair of jobs, if the memory unit is determined to be at the low potential south potential V cx. The static random access is the potential of the BT point before the digital data value in the preset souther electric unit 46 The line 42 will have a preset high potential V cc. As shown in Fig. 4, when the input data value is the same as the digital data value stored in the 6-electrode static cancer random memory, for example, BT point and D When the point status (BT = D = 0), the matching signal remains at the opposite of the preset. If the input data value is opposite to the digital data value stored in the 6-plasma memory unit 46, the status is not equal. At the potential state of point D, the matching signal position Vc is pulled down to a low potential because of the second complementary bit line pair coupled to the 4-transistor comparator module 44 (third bit line 5 4 and fourth bit lines 5 6 ) and coupled to 6-transistor static random access memory The first complementary bit line pair (the first bit line 50 and the second bit line 5 2 ) of the unit 46 are separated, and each is connected to the third bit line 5 4 and the fourth bit line 5 The N Μ 0 S type transistors N 7 and N 8 of 6 are connected to the ground GND, so the precharge potential of the matching line 42 is not affected by the 6-transistor SRAM 46 or 4- The initial state of any other point in the crystal comparator module 44 is disturbed. The voltage drop on the nominal line 42 and any mismatched signal that can be erroneous can also be avoided by this method. In addition, after using the software simulation confirmation Separating the bit lines can reduce the bit line load of the 10 - transistor content addressable memory 40 for faster performance.
第15頁 1264726 五、發明說明(12) 圖五為一根據本發明之第一較佳實施例之積體電路化之 内容可定址記憶體列6 0的示意圖。積體電路化之内容可 定址記憶體列6 0包含一條用來提供對應配稱訊號的配稱 線6 2、複數個内容可定址記憶體單元7 0 ( 7 0 ( 1 )〜7 0 ( N ))、 一有效位元單位6 4、以及一保護位元單位6 8 ◦圖五中的 每一内容可定址記憶體單元7 0可以使用圖四中的1 0 -電晶 體内容可定址記憶體4 0單元或是其他種類内容可定址記 憶體單元來達成。如果將圖四中的1 0 -電晶體内容可定址 記憶體4 0單元應用於圖五的内容可定址記憶體單元7 0 中,圖五的積體電路化之内容可定址記憶體列6 0會具有 本發明之1 0 -電晶體内容可定址記憶體4 0單元的前述所有 優點,例如低位元線負載和預防干擾。本實施例的主要 特點是設置有效位元單元6 4與保護位元單元6 8組合。有 效位元單元6 4用來儲存一有效位元,該有效位元顯示積 體電路化之内容可定址記憶體列6 0是否含有有效資料。 保護位元單元6 8耦接至有效位元單元6 4,用來當保護位 元單元6 8被設定成不作動時,將有效位元設定成零,當 保護位元單元6 8被設定成作動時,將有效位元設定成保 持不變。在積體電路化之内容可定址記憶體列6 0中,當 有效位元為邏輯π 0 f’時,顯示該記憶體列含有無效資料。 反過來說,當有效位元為邏輯π 1π時,顯示該記憶體列含 有有效資料。此外,當有效位元為邏輯π 1π時,允許進行 一比對作業·用來比對比較資料和儲存在積體電路化之Page 15 1264726 V. INSTRUCTION DESCRIPTION (12) FIG. 5 is a schematic diagram of an integrated addressable memory bank 60 in accordance with a first preferred embodiment of the present invention. The integrated circuitizable addressable memory bank 60 includes a matching line 6 for providing a corresponding matching signal. 2. A plurality of contents addressable memory unit 7 0 (7 0 (1)~7 0 (N )), a valid bit unit 64, and a protection bit unit 6 8 每一 Figure 5 Each of the addressable memory cells 70 can use the 10 - transistor content addressable memory in Figure 4 Unit 40 or other types of content can be addressed by addressing the memory unit. If the 10 - transistor content addressable memory 40 unit in FIG. 4 is applied to the content addressable memory unit 70 of FIG. 5, the integrated circuitized content of FIG. 5 can address the memory column 6 0. There will be all of the aforementioned advantages of the 10 - transistor content addressable memory 40 unit of the present invention, such as low bit line load and prevention of interference. The main feature of this embodiment is that the effective bit unit 64 is combined with the protection bit unit 68. The valid bit cell 64 is used to store a valid bit that shows whether the integrated circuitizable addressable memory bank 60 contains valid data. The protection bit cell unit 6 8 is coupled to the effective bit cell unit 6 4 for setting the effective bit element to zero when the protection bit cell unit 6 8 is set to be inactive, and when the protection bit cell unit 6 8 is set to When active, the valid bit is set to remain unchanged. In the integrated circuit addressable memory bank 60, when the valid bit is logic π 0 f', the memory column is displayed to contain invalid data. Conversely, when the effective bit is logic π 1π, it is displayed that the memory column contains valid data. In addition, when the effective bit is logic π 1π, a comparison operation is allowed, which is used to compare the data and store it in the integrated circuit.
第16頁 1264726 五、發明說明(13) 内容可定址記憶體之記憶體列中的資料。與圖一之習知 技藝類似,本實施例中的比較資料和先前已儲存的資 料,皆為N位元數位資料◦在比對作業之前,配稱線6 2的 配稱訊號會預先充電至一預設的高電位。當(N位元)比較 資料和儲存在積體電路化之内容可定址記憶體之記憶體 列6 0中的(N位元)資料完全相同時,對應配稱訊號會保持 在預設的高電位。當(N位元)比較資料的任一資料位元和 儲存在積體電路化之内容可定址記憶體之記憶體列6 0中 的(N位元)資料的資料位元相反時,對應配稱訊號會由預 設的高電位改變至低電位。圖六為圖五之另一實施例的 示意圖,其顯示了一保護位元單元6 8與有效位元單元6 4 所組合之架構。有效位元單元6 4由一個典型6 -電晶體靜 態隨機存取記憶體單元6 6 (如圖三所示)以及一個耦接至 保護位元單元6 8的有效重設模組7 0所組成。保護位元單 元6 8也由6 -電晶體靜態隨機存取記憶體單元7 6以及一保 護重設輸入模組7 2所構成,用來接收一總體訊號GS2,所 以,保護位元單元6 8可被總體訊號GS2設定成不作動。如 圖六中所示,以在保護位元單元6 8的一個PT點上的儲存 位元而言,在輸入一高位準總體訊號GS2至保護重設輸入 模組7 2時,可將該儲存位元總體重設為邏輯” 0 ’’。同樣 地,當該保護位元單元6 8被設定成不作動時(PT點上的儲 存位元為’f Ο π,PF點上的儲存位元為π 1π ),輸入一高位準 總體訊號GS 1至有效重設模組7 0,可將儲存於有效位元單 元6 4的一個VT點上的有效位元總體重設為邏輯” Ο π。若保Page 16 1264726 V. INSTRUCTIONS (13) The information in the memory column of the addressable memory. Similar to the prior art of FIG. 1, the comparison data and the previously stored data in this embodiment are all N-digit data. Before the comparison operation, the matching signal of the matching line 6 2 is pre-charged to A preset high potential. When the (N-bit) comparison data is identical to the (N-bit) data stored in the memory column 60 of the content-programmable content addressable memory, the corresponding matching signal will remain at a preset high. Potential. When any data bit of the (N-bit) comparison data is opposite to the data bit of the (N-bit) data stored in the memory column 60 of the content-programmable content addressable memory, the corresponding data bit The signal will change from a preset high level to a low level. Figure 6 is a schematic diagram of another embodiment of Figure 5 showing the architecture of a combination of protection bit unit 68 and effective bit unit 64. The effective bit cell 64 is composed of a typical 6-transistor SRAM cell 6 6 (shown in FIG. 3) and a valid reset module 70 coupled to the protection bit cell 6 8 . . The protection bit unit 6 8 is also composed of a 6-transistor static random access memory unit 7 6 and a protection reset input module 7 2 for receiving an overall signal GS2. Therefore, the protection bit unit 6 8 Can be set to be inactive by the overall signal GS2. As shown in FIG. 6, in the case of a storage bit on a PT point of the protection bit unit 68, when a high level overall signal GS2 is input to the protection reset input module 7 2, the storage can be performed. The bit population is reset to logic "0''. Similarly, when the protection bit cell 68 is set to be inactive (the storage bit at the PT point is 'f Ο π, the storage bit on the PF point) For π 1π ), a high level overall signal GS 1 is input to the effective reset module 70, and the effective bits stored at a VT point of the effective bit unit 64 can be reset to logic “Ο π”. If
第17頁 1264726 五、發明說明(15) NMOS類型電晶體N10會被關閉,因此有效位元單元64會在 總體重設之後保持其先前狀態。 圖八為本發明之積體電路化之内容可定址記憶體列8 0的 第二實施例的示意圖。本實施例與前述圖五之實施例的 主要差別在於遮罩單元8 5的設置。積體電路化之内容可 定址記憶體列8 0包含一條用來提供對應配稱訊號的配稱 線8 2、複數個内容可定址記憶體單元9 0 ( 9 0 ( 1 )〜9 0 ( N ))、 一有效位元單位8 4、一保護位元單位8 8、以及一遮罩單 元8 5。該遮罩單元8 5搞接至數個内容可定址記憶體單 元,用來當遮罩單元8 5被設定成作動時,將該些相關的 内容可定址記憶體單元遮罩起來,而且當該遮罩單元85 被設定成不作動時,不將該些相關的内容可定址記憶體 單元遮罩起來。在本實施例中,二個内容可定址記憶體 單元9 0 (1 )和9 0 ( 2 )耦接至遮罩單元8 5。請注意,於本實 施例中,連接至遮罩單元8 5之相關内容可定址記憶體單 元的數量並不加以限制。在本實施例中的相關内容可定 址記憶體單元9 0 ( 1 )和9 0 ( 2 )可視為可遮罩之内容可定址 記憶體單元,而且有效地儲存三種資訊狀態,邏輯壹、 邏輯零和忽略比對作業狀態。參考圖九,其顯示了圖八 之遮罩單元8 5以及連接至遮罩單元8 5之相關内容可定址 記憶體單元9 0 ( 9 0 ( 1 )或9 0 ( 2 ))的一實施例。當該相關内 容可定址記憶體單元9 0為本發明中的一個1 0 -電晶體内容 可定址記憶體單元(如圖三所示)時,遮罩單元8 5由一個Page 17 1264726 V. INSTRUCTIONS (15) The NMOS type transistor N10 will be turned off, so the effective bit cell unit 64 will maintain its previous state after the total weight setting. Figure 8 is a schematic illustration of a second embodiment of an integrated addressable memory bank 80 of the integrated circuit of the present invention. The main difference between this embodiment and the aforementioned embodiment of Fig. 5 is the arrangement of the mask unit 85. The integrated circuitizable addressable memory bank 80 includes a matching line 8 for providing a corresponding matching signal. 2. A plurality of content addressable memory cells 9 0 (9 0 (1)~9 0 (N )), a valid bit unit 8 4, a protection bit unit 8 8 , and a mask unit 8 5 . The mask unit 85 is connected to a plurality of content addressable memory units for masking the related content addressable memory units when the mask unit 85 is set to be activated, and When the mask unit 85 is set to be inactive, the related content addressable memory cells are not masked. In the present embodiment, two content addressable memory cells 90 (1) and 90 (2) are coupled to the mask unit 85. Please note that in this embodiment, the number of addressable memory cells connected to the mask unit 85 is not limited. The related content addressable memory cells 9 0 ( 1 ) and 90 ( 2 ) in this embodiment can be regarded as a maskable content addressable memory unit, and effectively store three kinds of information states, logic 壹, logic zero And ignore the comparison job status. Referring to FIG. 9, an embodiment of the mask unit 85 of FIG. 8 and the associated content addressable memory unit 90 (90 (1) or 9 0 (2)) connected to the mask unit 85 is shown. . When the related content addressable memory unit 90 is a 10-0-crystal content addressable memory unit in the present invention (as shown in FIG. 3), the mask unit 85 is composed of one
第19頁 1264726 五、發明說明(16) 6 -電晶體靜態隨機存取記憶體單元8 6組成,其中該1 0 -電 晶體内容可定址記憶體單元含有一 6 -電晶體靜態隨機存 取記憶體單元9 6和一 4 -電晶體比較器模組9 4,而且該6 -電晶體靜態隨機存取記憶體單元8 6與一個耦接至相關内 容可定址記憶體單元90中之4-電晶體比較器模組94的 NMOS類型電晶體Nl 1結合。當遮罩單元85被送入一邏 輯π 1π (遮罩單元8 5被設定成作動,Μ T點的儲存位元為邏 輯π 1 ’’,MF點的儲存位元為邏輯π (Γ )時,該NMOS類型電晶 體Ν 1 1被關閉。對應内容可定址記憶體單元9 0 (可遮罩型 内容可定址記憶體單元)的配稱線8 2會一直保持在一預設 的高位準。此即稱為忽略比對作業狀態,而且該相關内 容可定址記憶體單元9 0—直會被遮罩起來。當遮罩單元 8 5被送入一邏輯’’(Γ (遮罩單元8 5被設定成不作動,ΜΤ點 的儲存位元為邏輯π 0 π而且M F點的儲存位元為邏輯π 1π ) 時,NMOS類型電晶體Nl 1作為一個虛擬接地。圖八和圖九 中的相關内容可定址記憶體單元9 0執行一般的内容可定 址記憶體相關功能。再次強調,不限制遮罩單元8 5以及 相關内容可定址記憶體單元9 0 (連接至遮罩單元8 5 )的數 目。圖十為一個積體電路化之内容可定址記憶體列8 0的 第三實施例,其延續圖八之實施例的特性。在本實施例 中,遮罩單元8 5的數量被設定為二個◦所以該積體電路 化之内容可定址記憶體列8 0包含有二個遮罩單元8 5 ( 1 )和 8 5 ( 2 ),而且每一遮罩單元8 5耦接至二個内容可定址記憶 體單元,用來將該二個内容可定址記憶體單元遮罩起來Page 19 1264726 V. INSTRUCTION DESCRIPTION (16) 6 - A transistor static random access memory cell 8 6 wherein the 10 - transistor content addressable memory cell contains a 6-transistor static random access memory The body unit 96 and the 4-transistor comparator module 94, and the 6-transistor SRAM unit 86 and a 4-electrode coupled to the associated content addressable memory unit 90 The NMOS type transistor N11 of the crystal comparator module 94 is combined. When the mask unit 85 is fed a logic π 1π (the mask unit 85 is set to operate, the storage bit of the ΜT point is logic π 1 '', and the storage bit of the MF point is logic π (Γ) The NMOS type transistor Ν 1 1 is turned off. The matching line 8 2 of the corresponding content addressable memory unit 90 (the maskable content addressable memory unit) is always maintained at a predetermined high level. This is called ignoring the comparison job status, and the related content can address the memory unit 90 - it will be masked. When the mask unit 85 is sent into a logic '' (Γ (mask unit 8 5 When it is set to be inactive, the storage bit of the defect is logic π 0 π and the storage bit of the MF point is logic π 1π ), the NMOS type transistor Nl 1 acts as a virtual ground. The correlation in Figure 8 and Figure 9 The content addressable memory unit 90 performs general content addressable memory related functions. Again, the number of masking units 85 and related content addressable memory unit 90 (connected to the mask unit 8 5 ) is not limited. Figure 10 is an integrated circuitizable content addressable memory The third embodiment of 80 continues the characteristics of the embodiment of Fig. 8. In the present embodiment, the number of mask units 85 is set to two, so the integrated circuitizable content addressable memory column 8 0 includes two mask units 8 5 ( 1 ) and 8 5 ( 2 ), and each mask unit 85 is coupled to two content addressable memory units for addressing the two contents. Memory unit is covered
第20頁 1264726 五、發明說明(14) 護位元單元6 8儲存” Γ ( PF點上的儲存位元為"0 ")時,該 有效重設模組70的一個NMOS類型電晶體N9會被關閉,因 此有效位元單元6 4會在總體重設之後保持其先前狀態。 先前所述的雙重保護設計(將有效位元單元6 4與保護位元 單元6 8組合)以及總體重設機制,可用來充分確保運作的 正確性並使得比對作業更具彈性。 圖七為另一實施例的示意圖。該實施例將有效位元單元 6 4與保護位元單元6 8組合◦圖七中所有元件的標號和圖 六相同,並執行同樣的作業。有效位元單元6 4同樣由一 個6 -電晶體靜態隨機存取記憶體單元6 6以及一個耦接至 保護位元單元6 8的有效重設模組7 0所組成。保護位元單 元6 8也由6 -電晶體靜態隨機存取記憶體單元7 6以及一保 護重設輸入模組7 2所構成,用來接收一總體訊號G S 2,所 以保護位元單元6 8可被總體訊號GS 2被設定成不作動,如 同圖六之實施例所示。根據本實施例的獨特電路設計, 在保護位元單元68的一個PT點上的儲存位元,在輸入一 高位準總體訊號GS2至保護重設輸入模組72時,可將該儲 存位元總體重設為邏輯π 0 π。再者,當該保護位元單元6 8 被設定成不作動時(ΡΤ點上的儲存位元為” 0 π ),輸入一低 位準總體訊號G S 1至有效重設模組7 0可將儲存於有效位元 單元6 4之一 VT點上的該有效位元總體重設為邏輯’’ 0 ’’。如 同前述圖六中的實施例,若保護位元單元6 8儲存π 1 n ( PF 點上的儲存位元為”(Γ )時,該有效重設模組7 0的一個Page 20 1264726 V. INSTRUCTIONS (14) The protector unit 6 8 stores “ Γ (the storage bit on the PF point is "0 "), an NMOS type transistor of the active reset module 70 N9 will be turned off, so the effective bit cell 64 will maintain its previous state after the overall reset. The dual protection design previously described (combining the effective bit cell 6 4 with the protection bit cell 6 8) and the overall weight A mechanism can be used to fully ensure the correctness of the operation and make the comparison work more flexible. Figure 7 is a schematic diagram of another embodiment. This embodiment combines the effective bit unit 64 and the protection bit unit 6 8 The reference numerals of all the components in the seventh are the same as those in Fig. 6, and the same operation is performed. The effective bit cell 6 4 is also coupled by a 6-transistor static random access memory cell 6 6 and a coupled to the protection bit cell 6 8 The effective reset module 70 is composed of a 6-transistor static random access memory unit 7 6 and a protection reset input module 7 2 for receiving a total Signal GS 2, so protect the bit unit 6 8 can be set to be inactive by the overall signal GS 2, as shown in the embodiment of Figure 6. According to the unique circuit design of the present embodiment, the storage bit at a PT point of the protection bit unit 68 is input. When a high level overall signal GS2 to the protection reset input module 72, the storage bit element can be reset to logic π 0 π. Further, when the protection bit unit 6 8 is set to be inactive (ΡΤ The storage bit at the point is “0 π”, and inputting a low level overall signal GS 1 to the effective reset module 70 can weight the effective bit stored at a VT point of the effective bit unit 64. Set to logic ''0''. As in the foregoing embodiment of FIG. 6, if the protection bit unit 6 8 stores π 1 n (the storage bit on the PF point is “(Γ), one of the effective reset modules 7 0
第18頁 1264726 五、發明說明(17) (遮罩單元8 5 ( 1 )耦接至二個内容可定址記憶體單元9 0(: 1 ) 和9 0 ( 2 ),遮罩單元8 5 ( 2 )耦接至二個内容可定址記憶體 單元9 0 ( 3 )和9 0 ( 4 ))。然而,一個總體訊號G S可將該二個 遮罩單元85(1 )和8 5 ( 2 )總體設定成不作動。大致說來, 根據圖五至圖十的實施例,在一個積體電路化之内容可 定址記憶體列中,組合一有效位元單元、一保護位元單 元以及至少一個遮罩單元,可以在比對作業中增進安全 性並增加使用彈性。 接下來的實施例為一個新型積體電路化之内容可定址記 憶體構造1 0 0,其延續前述圖四至圖十實施例的特性,由 複數個新穎的1 0 -電晶體内容可定址記憶體單元所構成, 該些1 0 -電晶體内容可定址記憶體單元由一有效位元單 元、一保護位元單元,以及至少一個遮罩單元(此至少一 遮罩單元耦接至每一記憶體列中複數個相關的1 0 -電晶體 内容可定址記憶體單元)所組成。參考圖十一,其為一本 發明之積體電路化之内容可定址記憶體構造1 0 0的示意 圖。積體電路化之内容可定址記憶體構造1 0 0包含複數記 憶體列1 Ο Ο A〜1 Ο Ο K以及對應複數記憶體列1 Ο Ο A〜1 Ο Ο K的複 數條配稱線1 0 2 ( 1 0 2 A〜1 0 2 K ),用來提供複數個對應配稱 訊號。耦接至對應配稱線1 0 2的每一記憶體列,包含複數 個圖四中的1 0 -電晶體内容可定址記憶體單元1 1 0,其耦 接至對應配稱線1 0 2、一有效位元單元1 0 4 ( 1 0 4 A〜1 0 4 K )、 一保護位元單元1 0 8 ( 1 0 8 A〜1 0 8 K ),以及至少一個遮罩單Page 18 1264726 V. Description of the Invention (17) (Mask unit 8 5 ( 1 ) is coupled to two content addressable memory cells 9 0 (: 1 ) and 9 0 ( 2 ), mask unit 8 5 ( 2) coupled to two content addressable memory cells 9 0 ( 3 ) and 9 0 ( 4 )). However, an overall signal G S can generally set the two mask units 85(1) and 8 5 ( 2 ) to be inactive. Broadly speaking, according to the embodiments of FIG. 5 to FIG. 10, in an integrated circuit addressable addressable memory column, combining a valid bit cell, a protection bit cell, and at least one mask unit may be Improve safety and increase flexibility in use. The following embodiment is a novel integrated circuitizable content addressable memory structure 100 that continues the characteristics of the foregoing embodiments of Figures 4 through 10, and is composed of a plurality of novel 10 - transistor content addressable memories. Forming, the 10-O crystal content addressable memory unit comprises a valid bit unit, a protection bit unit, and at least one mask unit (the at least one mask unit is coupled to each memory) The column consists of a plurality of related 10 - transistor content addressable memory cells. Referring to Fig. 11, there is shown a schematic diagram of a content-addressable memory structure 100 of the integrated circuit of the present invention. The contents of the integrated circuit can be addressed to the memory structure 1 0 0 including the complex memory column 1 Ο Ο A~1 Ο Ο K and the corresponding complex memory column 1 Ο Ο A~1 Ο 的 K multiple number matching line 1 0 2 ( 1 0 2 A~1 0 2 K ), used to provide a plurality of corresponding matching signals. Each of the memory columns coupled to the corresponding matching line 1 0 2 includes a plurality of 10 - transistor content addressable memory cells 1 1 0 in FIG. 4 coupled to the corresponding matching line 1 0 2 a valid bit cell 1 0 4 (1 0 4 A~1 0 4 K ), a protection bit cell 1 0 8 (1 0 8 A~1 0 8 K ), and at least one mask list
第21頁 1264726 五、發明說明(18) 元1 0 5 ( 1 0 5 A〜1 0 5 K ) ◦以記憶體列1 〇 〇 A加以詳細說明:遮 罩單元1 0 5 A耦接至記憶體列1 0 〇 A中的二個相關1 〇 -電晶體 内容可定址記憶體單元1 1 0 A ( 2 )和1 1 〇 A ( 3 ),用來當遮罩 單元1 0 5 A被設定成作動時,將相關1 〇 -電晶體内容可定址 記憶體單元1 1 0 A ( 2 )和1 1 0 A ( 3 )遮罩起來。此外,記憶體 列1 Ο Ο A中的遮罩單元1 0 5 A被連接至複數個其他記憶體列 中的相關1 0 -電晶體内容可定址記憶體單元(如圖十一中 的1 0 -電晶體内容可定址記憶體單元11 Ο B ( 2 )和11 Ο B (3))。每一記憶體列中的有效位元單元1〇4(104Α〜104K) 被用來儲存顯示存放在積體電路化之内容可定址記憶體 構造1 0 0之記憶體列中的資料是否有效的有效位元,其中 存放在積體電路化之内容可定址記憶體構造1 〇 〇之記憶體 列中的資料,是由存放在1 〇 -電晶體内容可定址記憶體單 元1 1 0中之6 -電晶體靜態隨機存取記憶體單元1 〇 6的數位 資料值所組成。在積體電路化之内容可定址記憶體構造 10 0的每一記憶體列中,保護位元單元1 0 8 ( 1 0 8^108]()耦 接至有效位元單元1 0 4 ( 1 0 4A〜104K),用來當保護位元單 几1 〇 8 ( 1 〇 8 A〜1 0 8 K )被設定成不作動時,將有效位元設定 成〇’而當保護位元單元1〇8(108Α〜108K)被設定成作動 時’將有效位元設定成保持不變。最後,注意在本發明 的積體電路化之内容可定址記憶體構造1 〇 〇中,複數個遮 罩單儿105(1〇5Α〜105K)、複數個有效位元單元1〇4(1〇4Α〜 104K)、以及複數個保護位元單元1 0 8 ( 1 0 8A〜108K)可以被 複數個總體訊號G S總體重設。Page 21 1264726 V. Invention Description (18) Yuan 1 0 5 (1 0 5 A~1 0 5 K ) 详细 Detailed description of memory column 1 〇〇A: mask unit 1 0 5 A coupled to memory Two related 1 〇-transistor contents in the body array 1 0 〇A can address the memory cells 1 1 0 A ( 2 ) and 1 1 〇A ( 3 ) for setting the mask unit 1 0 5 A When the action is made, the associated 1 〇-transistor content addressable memory cells 1 1 0 A ( 2 ) and 1 1 0 A ( 3 ) are masked. In addition, the mask unit 1 0 5 A in the memory column 1 Ο Ο A is connected to the associated 10 - transistor content addressable memory unit in a plurality of other memory columns (such as 1 0 in FIG. 11) - The transistor contents address the memory cells 11 Ο B ( 2 ) and 11 Ο B (3)). The valid bit cell 1〇4 (104Α~104K) in each memory column is used to store whether the data stored in the memory column of the integrated addressable memory structure 100 of the integrated circuit is valid. The valid bit, wherein the data stored in the memory column of the integrated circuit addressable memory structure is stored in the 1 0-transistor content addressable memory unit 1 1 0 - The crystal static random access memory unit 1 〇6 is composed of digital data values. In each memory column of the integrated circuit-addressable memory structure 100, the protection bit cell 1 0 8 (1 0 8^108]() is coupled to the effective bit cell 1 0 4 ( 1 0 4A~104K), used to protect the bit unit 1 when the protection bit number is 1 〇8 (1 〇8 A~1 0 8 K) is set to be inactive. 〇8 (108Α~108K) is set to be active 'set the effective bit to remain unchanged. Finally, note that in the integrated circuitizable addressable memory structure 1 〇〇 of the present invention, a plurality of masks The single 105 (1〇5Α~105K), the plurality of valid bit units 1〇4 (1〇4Α~104K), and the plurality of protection bit units 1 0 8 (1 0 8A~108K) can be plural The signal GS is reset overall.
第22頁 1264726 五、發明說明(19) 根據本發明,揭露一種新穎的1 〇 -電晶體内容可定址記憶 體單元以及一種積體電路化之内容可定址記憶體構造。 該新穎的1 0 -電晶體内容可定址記憶體單元可以預防在配 稱線上的干擾和電荷分享以及避免低位元線負載,用以 改善快速和低功率的表現。此外本發明提供具有總體重 設功能的有效位元單元、保護位元單元以及遮罩單元, 以充分確保比對作業中的正確性和靈活性。 以上所述僅為本發明之較佳實施例,凡依本發明申請專 利範圍所做之均等變化與修飾,皆應屬本發明專利之涵 蓋範圍 。Page 22 1264726 V. INSTRUCTION DESCRIPTION (19) In accordance with the present invention, a novel 1 电-transistor content addressable memory unit and an integrated circuitizable content addressable memory structure are disclosed. The novel 10-O crystal content addressable memory cell prevents interference and charge sharing on the nominal line and avoids low bit line loading to improve fast and low power performance. Further, the present invention provides a valid bit cell, a protection bit cell, and a mask unit having a general reset function to sufficiently ensure correctness and flexibility in the alignment work. The above are only the preferred embodiments of the present invention, and all equivalent changes and modifications made to the patent scope of the present invention should fall within the scope of the present invention.
第23頁 1264726 圖式簡單說明 圖式之間早說明 圖一為一個習知内容可定址記憶體構造之示意圖。 圖二為一個習知内容可定址記憶體單元之示意圖。 圖三為一個習知内容可定址記憶體單元的詳細說明之示 意圖。 圖四為本發明的一個1 〇 -電晶體内容可定址記憶體單元之 示意圖。 圖五為本發明一積體電路化之内容可定址記憶體列之第 一實施例的示意圖。 圖六為本發明的一個有效位元單元之示意圖。 圖七為本發明的另一個有效位元單元之示意圖。 圖八為本發明一積體電路化之内容可定址記憶體列之第 二實施例之示意圖。 圖九為圖八中的遮罩單元和連接至該遮罩單元的對應内 容可定址記憶體單元之示意圖。 圖十為本發明一積體電路化之内容可定址記憶體列之第 二貫施例之不意圖。 圖十一為本發明一積體電路化之内容可定址記憶體構造 之示意圖。 圖式之符號說明 10 、1 0 0 内容可定址記憶體構造Page 23 1264726 Schematic description of the diagram Early description between the diagrams Figure 1 is a schematic diagram of a conventional content-addressable memory structure. FIG. 2 is a schematic diagram of a conventional content addressable memory unit. Figure 3 is a schematic illustration of a detailed description of a conventional content addressable memory unit. Figure 4 is a schematic illustration of a 1-turn-transistor content addressable memory cell of the present invention. Figure 5 is a schematic diagram of a first embodiment of an integrated circuit addressable memory bank according to the present invention. Figure 6 is a schematic diagram of a valid bit cell of the present invention. Figure 7 is a schematic diagram of another effective bit cell of the present invention. Figure 8 is a schematic diagram of a second embodiment of an integrablely addressable addressable memory bank of the present invention. Figure 9 is a schematic illustration of the mask unit of Figure 8 and corresponding content addressable memory cells connected to the mask unit. Figure 10 is a schematic diagram of a second embodiment of an addressable memory array of an integrated circuitized circuit of the present invention. Figure 11 is a schematic diagram showing the structure of an addressable memory of an integrated circuitized circuit of the present invention. Symbol description of the schema 10, 1 0 0 content addressable memory structure
第24頁 1264726 圖式簡單說明 2 0、4 0、6 6、7 0、7 6、9 0、i 1 0 内容可定址記憶體單元 1 Ο A 〜1 Ο K、6 0、8 0、1 Ο Ο A 〜1 Ο Ο K 記憶體列 1 2 A 〜1 2 K、2 2、4 2、6 2、8 2、1 0 2 配稱線 24> 44、 94 比較器模組 26 ^ 46 ^ 86 ^ 96 靜態隨機存取記憶體單元 28 > 48 字元 線 30 ^ 32、 50 ^ 5 2、5 4、5 6 位元線 64、 84、 104 有效位元單位 68 ^ 88、 108 保護位元單位 7 2保護重設輸入模組 85、105 遮罩單元Page 24 1264726 Schematic description 2 0, 4 0, 6 6 , 7 0, 7 6 , 9 0, i 1 0 Content addressable memory unit 1 Ο A 〜1 Ο K, 6 0, 8 0, 1 Ο Ο A 〜1 Ο Ο K Memory column 1 2 A ~1 2 K, 2 2, 4 2, 6 2, 8 2, 1 0 2 Matching line 24 > 44, 94 Comparator module 26 ^ 46 ^ 86 ^ 96 SRAM unit 28 > 48 word line 30 ^ 32, 50 ^ 5 2, 5 4, 5 6 bit line 64, 84, 104 Effective bit unit 68 ^ 88, 108 protection bit Unit 7 2 protection reset input module 85, 105 mask unit
第25頁Page 25
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