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Application filed by United Microelectronics CorpfiledCriticalUnited Microelectronics Corp
Priority to TW93141025ApriorityCriticalpatent/TWI264550B/en
Publication of TW200624837ApublicationCriticalpatent/TW200624837A/en
Application grantedgrantedCritical
Publication of TWI264550BpublicationCriticalpatent/TWI264550B/en
Testing Or Measuring Of Semiconductors Or The Like
(AREA)
Abstract
A device characteristic testing system for testing a first DUT (device under test), a second DUT, a third DUT and a fourth DUT on a wafer, each of the DUTs includes a first end and a second end, the device characteristic testing system includes: a device characteristic testing circuit formed on the wafer includes a first conducting line connected to the second end of the first and the fourth DUT, a second conducting line connected to the second end of the second and third DUTs, a third conducting line connected to the first end of the first and second DUTs, a fourth conducting line connected to the first end of the third and fourth DUT, and a plurality of testing pads respectively coupled to the first, second, third, and fourth conducting line for receiving at least one testing signal to detect device characteristics of the DUTs.
TW93141025A2004-12-282004-12-28Testing system and testing method for DUTs
TWI264550B
(en)
Film-type semiconductor package and method using test pads shared by output channels, and test device, semiconductor device and method using patterns shared by test channels