TWI263119B - Imprinting method of non-smooth surface - Google Patents

Imprinting method of non-smooth surface

Info

Publication number
TWI263119B
TWI263119B TW93103053A TW93103053A TWI263119B TW I263119 B TWI263119 B TW I263119B TW 93103053 A TW93103053 A TW 93103053A TW 93103053 A TW93103053 A TW 93103053A TW I263119 B TWI263119 B TW I263119B
Authority
TW
Taiwan
Prior art keywords
substrate
photoresist film
moldboard
circuit layout
top face
Prior art date
Application number
TW93103053A
Other languages
Chinese (zh)
Other versions
TW200527142A (en
Inventor
Kuan-Zong Fung
Jau-Shiang Shiu
Ing-Chi Leu
Chau-Nan Hong
Min-Hsiung Hon
Original Assignee
Univ Nat Cheng Kung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Cheng Kung filed Critical Univ Nat Cheng Kung
Priority to TW93103053A priority Critical patent/TWI263119B/en
Publication of TW200527142A publication Critical patent/TW200527142A/en
Application granted granted Critical
Publication of TWI263119B publication Critical patent/TWI263119B/en

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

This invention relates to an imprinting method of non-smooth surface. It comprises the following procedures: (A) the filler material is filled in the recessed portion of the non-smooth substrate, it makes the top surface of the substrate smooth. (B) A photoresist film is then stacked on the top face of the substrate. (C) On the light-transparent moldboard formed with the recessed circuit layout, the light-blocking material is coated on the predetermined portion. (D) The moldboard is used to cover the top face of the photoresist film, it is pressed to imprint and form a convex portion that has the circuit layout, as well as the concave portion that has no disposed circuit layout upon the photoresist film. (E) It utilized light source to expose the mutually stacked moldboard and substrate, it makes part of the photoresist film change. (F) The moldboard is removed from the top face of the substrate. (G) The concave portion of the photoresist film is washed away and remains the intruded photoresist film with the circuit layout shape on the substrate.
TW93103053A 2004-02-10 2004-02-10 Imprinting method of non-smooth surface TWI263119B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93103053A TWI263119B (en) 2004-02-10 2004-02-10 Imprinting method of non-smooth surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93103053A TWI263119B (en) 2004-02-10 2004-02-10 Imprinting method of non-smooth surface

Publications (2)

Publication Number Publication Date
TW200527142A TW200527142A (en) 2005-08-16
TWI263119B true TWI263119B (en) 2006-10-01

Family

ID=37966266

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93103053A TWI263119B (en) 2004-02-10 2004-02-10 Imprinting method of non-smooth surface

Country Status (1)

Country Link
TW (1) TWI263119B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8418355B2 (en) 2006-10-25 2013-04-16 Samsung Electro-Mechanics Co., Ltd. Method for manufacturing circuit board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI613506B (en) * 2017-01-04 2018-02-01 How to make the mask

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8418355B2 (en) 2006-10-25 2013-04-16 Samsung Electro-Mechanics Co., Ltd. Method for manufacturing circuit board

Also Published As

Publication number Publication date
TW200527142A (en) 2005-08-16

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