TWI263119B - Imprinting method of non-smooth surface - Google Patents
Imprinting method of non-smooth surfaceInfo
- Publication number
- TWI263119B TWI263119B TW93103053A TW93103053A TWI263119B TW I263119 B TWI263119 B TW I263119B TW 93103053 A TW93103053 A TW 93103053A TW 93103053 A TW93103053 A TW 93103053A TW I263119 B TWI263119 B TW I263119B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- photoresist film
- moldboard
- circuit layout
- top face
- Prior art date
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
This invention relates to an imprinting method of non-smooth surface. It comprises the following procedures: (A) the filler material is filled in the recessed portion of the non-smooth substrate, it makes the top surface of the substrate smooth. (B) A photoresist film is then stacked on the top face of the substrate. (C) On the light-transparent moldboard formed with the recessed circuit layout, the light-blocking material is coated on the predetermined portion. (D) The moldboard is used to cover the top face of the photoresist film, it is pressed to imprint and form a convex portion that has the circuit layout, as well as the concave portion that has no disposed circuit layout upon the photoresist film. (E) It utilized light source to expose the mutually stacked moldboard and substrate, it makes part of the photoresist film change. (F) The moldboard is removed from the top face of the substrate. (G) The concave portion of the photoresist film is washed away and remains the intruded photoresist film with the circuit layout shape on the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93103053A TWI263119B (en) | 2004-02-10 | 2004-02-10 | Imprinting method of non-smooth surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93103053A TWI263119B (en) | 2004-02-10 | 2004-02-10 | Imprinting method of non-smooth surface |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200527142A TW200527142A (en) | 2005-08-16 |
TWI263119B true TWI263119B (en) | 2006-10-01 |
Family
ID=37966266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93103053A TWI263119B (en) | 2004-02-10 | 2004-02-10 | Imprinting method of non-smooth surface |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI263119B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8418355B2 (en) | 2006-10-25 | 2013-04-16 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing circuit board |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI613506B (en) * | 2017-01-04 | 2018-02-01 | How to make the mask |
-
2004
- 2004-02-10 TW TW93103053A patent/TWI263119B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8418355B2 (en) | 2006-10-25 | 2013-04-16 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing circuit board |
Also Published As
Publication number | Publication date |
---|---|
TW200527142A (en) | 2005-08-16 |
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