1261044 九、發明說明： 【發明所屬之技術領域】 。，特別是-種 能接將光學、電子機構微型化於-元件中， ΐΐ念t微機電元件最常用的。目前微機 會⑽這些巧的以製程 近年來有些研究以元件。 之技術，主要有局部電阻σ°ϋϋ成微機電元件封裝接合 電阻式加熱適用於目朗’口化電磁感應加熱兩種；局部 載具失避免由於對載具加熱^ 將待封裝錢具料裝置可 光學應用特性，容易作？準的對位，無法ίί 成品的整體效能，另外:採i 工良的接合，進而影響到 熱過程中，因為局部加孰的载的電磁感應加 内，不耐熱-离S1:碎I造成不对熱玻璃板上溫度分 馨於以上的問題，本發明的主 h載具平台裝置，可應用於局部微機電封 ，對位’以增加其精確度與 牛加以固定並 所存在之問題。 猎以大體上解決先前技術 因此’為達上述目的，本發明戶斤指 台裝置，供以局部加熱方式對第一待秦封裝之载具平 接座與電磁感應加熱線圈所構成，承、、，主要是由承 磁感應加熱制是裝設在承接座之承接ίί底;熱= l26l〇44 待封裝元件。 為使對本發明的目的、構造、特徴、》甘a At > 解，茲配合實施例詳細說明如下。、 /、功犯有進一步的瞭 【實施方式】 微機電封Ui平、么,】圖本發明之實施例所揭露之 紐ri協:;;ί元;熱 電封裝之載具平台裝置主要是由、域。、此微機 線圈200所組成；其中，承接座1〇〇苴 ^電磁感應加熱 是由非導體材料所製成，it接盤呈直^接f1101261044 IX. Description of the invention: [Technical field to which the invention pertains]. In particular, the type of optical and electronic components can be miniaturized into components, and the most commonly used MEMS devices are used. At present, the computer will (10) these clever processes. In recent years, some research has been done with components. The technology mainly has a local resistance σ°ϋϋ into a micro-electromechanical component package and a joint-resistance heating. It is suitable for the two kinds of mouth-induction electromagnetic induction heating; the partial carrier is not avoided due to the heating of the carrier ^ the device to be packaged Can be used optically, easy to make? Quasi-alignment, can not ίί the overall performance of the finished product, in addition: the joints of the work, and then affect the thermal process, because the localized electromagnetic load of the load is added, heat-resistant - from S1: broken I caused the wrong The temperature of the hot glass plate is different from the above problem. The main h carrier platform device of the present invention can be applied to the local micro-electromechanical seal, and the problem of the alignment is to increase the accuracy and fix the cattle. Hunting to substantially solve the prior art, therefore, in order to achieve the above purpose, the present invention is intended to provide a means for local heating to the first socket and the electromagnetic induction heating coil. Mainly by the magnetic induction heating system is installed in the socket to support the ίί底; heat = l26l 〇 44 components to be packaged. For the purpose, structure, characteristics, and "a" of the present invention, the embodiments are described in detail below. / /, sinners have further [Embodiment] Micro-electromechanical seal Ui Ping, ah, according to the embodiment of the present invention disclosed in the New Zealand ri:;; 元 yuan; thermoelectric package carrier platform device is mainly ,area. The microcomputer coil 200 is composed of; the socket 1 〇〇苴 ^ electromagnetic induction heating is made of non-conductor material, and the it is connected directly to the f110
SS声ii接盤110;方是樓S 此^_之載具平台裝置之機台， 料、座材料係選自非導體材料，如塑膠材 t發明係藉由一熱模擬試驗來協助說明 S 封裝之載具平台裝置於電磁熱 射導體材‘加：臬ϋ’用於與電磁感應後產生感應電流來 熱分佈可以集中在導體材料 板效應，整她材的承接盤也被加熱，因而無法達 1261044 應加熱的效果。 再者本表明所^供之微機電封裝之且 a 甘？ & 厚而jf j電，應加熱ί圈200對待G裝元 (?lfoi：)； 2^2 ;j： ?:ίί應力？線圈200裝設在容置槽130内，並S接盤的ί 白^加孰效Τ子而ί f fii感應加熱線圈200對待封裝元^ “ϊ白ίί产:ifii疋5，，高的陶瓷材料，則可以將 足以避#雷石ί!ί例將承接座100的高度設計成10cm:、此ί产 封裝之載具平其下方讀設此微機ί 例所提供之微機i封以壯；：利用本發明之第三實施 晶圓級封裝接I作衣^於電磁感應加熱方式之 整座5⑻制目^^ 本/施例之承接座_與調 S f,° 700 ^ 600 «SSI； ί 600 700?2is 欲相互接j的;lit知岔移動：可精準控制上下待封裝元件 件進行對&時的平d利，:準直更統_，用以量測待封裝元 ί觀察該待封裝元以對㈤配學 隹,、、;、柄明以前述之實施例揭露如上，然其並非用以限定本 1261044 f明。在不脫離本發明之精神和範圍 屬本發明之專利保護範圍。關於本SS所潤飾，均 所附之申請專利範圍。 1疋之保禮範圍請參考 【圖式簡單說明】 平台ί置1ϋΐ發明之第—實施例所揭露之微機電封裝之載具 平台發明之第—實闕所猶之微機電封裝之載具 磁碭；係顯不本發明之第一實施例之承接座具有供安置電 磁加熱線圈之容置槽之示意圖； 1电 平台發^之第二實施例所揭露之微機電封裝之載具 △壯圖’係利用本發明之第三實施例之微機電封裝之载具平 :广用於電磁感應加熱方式之晶圓級封裝接合作業中的示意情 【主要元件符號說明】 110 120 130 200 300 400 500 600 700 800 1()()承接座 承接盤 腳柱 容置槽 f磁感應加熱線圈 調整座 承接座 調整座 定位系統 位移系統 準直系統SS sound ii pick-up plate 110; side is the floor S. This is the machine platform of the carrier platform device. The material and seat material are selected from non-conductor materials. For example, the plastic material t invention is assisted by a thermal simulation test. The packaged platform device is mounted on the electromagnetic heat-radiating conductor material 'plus: 臬ϋ' for generating an induced current after electromagnetic induction, and the heat distribution can be concentrated on the plate effect of the conductor material, and the receiving plate of the whole material is also heated, thereby failing to Up to 1261044 should be heated. In addition, this shows that the micro-electromechanical package is supplied and a? & thick and jf j electricity, should be heated ί circle 200 treat G loaded yuan (?lfoi:); 2^2 ; j: ?: ίί stress? The coil 200 is installed in the accommodating groove 130, and the S is connected to the ^ ^ ^ 而 而 而 而 感应 f i 感应 感应 感应 感应 感应 ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί The material can be designed to avoid the #雷石ί! ί example, the height of the socket 100 is designed to be 10cm: the carrier of the package is read and the microcomputer is provided below the microcomputer. : Using the third embodiment of the present invention, the wafer level package is connected to the I machine. The whole body of the electromagnetic induction heating method is 5 (8). The socket of the present embodiment is adjusted to S f, ° 700 ^ 600 «SSI; 600 600 700?2is want to connect to each other; lit knowing the movement: can accurately control the upper and lower components to be packaged for the & flatness, and: the collimation is more unified _, used to measure the package to be observed The present invention is disclosed in the foregoing embodiments, and is not intended to limit the scope of the present invention. The invention is not limited to the spirit and scope of the present invention. Scope of protection. For the retouching of this SS, the scope of the patent application attached is attached. For the scope of the privilege, please refer to [Simple Description] Platform ί The invention of the microelectromechanical package disclosed in the first embodiment of the invention is the first embodiment of the invention, and the carrier of the microelectromechanical package is shown in the first embodiment of the invention; A schematic diagram of a accommodating groove for arranging an electromagnetic heating coil; a carrier for a microelectromechanical package disclosed in a second embodiment of the present invention is a carrier for a microelectromechanical package using the third embodiment of the present invention Ping: Description of the wafer-level package bonding operation widely used in electromagnetic induction heating method [Main component symbol description] 110 120 130 200 300 400 500 600 700 800 1()() socket receiving socket pin receiving groove f magnetic induction heating coil adjustment seat socket adjustment seat positioning system displacement system alignment system