1260483 九、發明說明： 【發明所屬之技術領域] 備i發日重介面卡結構，應用於各類㈣處理設 並強化電磁波防制效果的介面卡結構。 日得電腦設備之性能日益強大，然價位卻逐 日低廉，如5貝料處理裝置已然成為產業運作，個人 ϊϊίϊ休閒娛樂中不可或缺的電子產品，而深人社會大眾的 、—電腦設備為滿足不同的需求，而具有多種類型，例如肩負 國豕安全重任的軍用國防超級電腦（s c 為 =吏用的鋼祖機(一個人常用=型= esktop C〇_ter)，或是便於商務人士攜行的筆記型電腦 j ote Book)，甚或是體積更為嬌小的個人數位助理 agonal Dlgltal Assist，PDA)等，已被社會大眾使用行 由於電腦設備的組成日益複雜，電子零組件經常緊靠比鄰 =置=導致分佈密度相當高，此外運作時也產生高頻電磁 ^ (ElectroMagnetic Interference ^ 人#電釋放（Electro Static Discharge，ESD)等問題。 售之前，需經過振動、噪音等各項標準測試作 方;電腦設備中包含眾多電子零組件’電子零組件在運作 、生磁波輻射，將對人體的中枢神經、生物體免疫功 月二二血f系統、血液、視覺系統等造成傷害。因此於該等各 項仏ί測試作業中，尤以EMI電磁波檢測最為重要。 ，，設備中常見的電子零組件，如主機板、音效卡、顯示 人寻ί σ類介面卡，通常是電磁波輻射的主要來源之一。此類 二面:的基本組成，係在印刷電路板上插置晶片組，並鋪設適 畜之走線來連接印刷電路板上其他的電子元件，即告完成。然 1260483 完㈣’會發現印_ 過檢測程序 兀件產生過南的電磁波輻射，而無法通 所士H二2上之走線與電子元件之配置必須重新設計， 以法使用而麵。傳統補救的方法，是額外 =阻^電磁波。'然而，這些作法不僅造成二 ❿ 上、㈣的檢修費用，或是較為昂貴難以實施。再者， 义^刀又撕法直接解決電磁波輻射問題，效果欠佳。 【發=^知技術或現有產品之缺失，應設法予以排除。 的勝此，本發明乃揭露—種介面卡結構，可快速、有效 勺將產口口中之電磁波幸畐射導出。 備，露之介面卡結構’可應用在各種電腦設 ^主要包έ有印刷電路板、散熱模組、固定板與接地 :、:Ρ刷電路板上設有運作所f的晶片組等電子元件，散 有數片散熱縛片，用以對晶片組進行散 固定ί雷ΐϋ 電路板之一側，以供印刷電路板插置 件之兩ί ，件之中段適當處具有彈性段，遂使接地 所產頁抵於散熱拉組與固定板。如此，晶片組運作時 Ξί 將可經由散熱模組與接地件，而導通至電腦 件將子触會猶最短途徑導地的特性，利用接地 磁波輕射傳遞至電腦機殼，可排除產品中過量 輻射/，人體的問題。本發明能快速、有效導出電磁波 田二/、有成本低廉、組成元件簡單、易於實施等優勢。 顯易,m^上述目的和其他目的、特徵、及優點能更明 ΐίϊ下 較佳實施例’並配合所附圖示，作詳細 6 1260483 【實施方式】 本發明之介面卡結構，可應用在包括但不侷限於桌上型電 腦（desktop)、伺服器（server)、筆記型電 之 ”參考「第丨圖」至「第3圖」來說明本發明之 貝轭例。其中電腦設備包含有電腦機殼1〇〇 , 之-側開設有數個介面卡定位槽110。 錢U0 r細ti發較佳實施例主要係由印刷電路板10、散孰 ^组20、固定板30與接地件4〇所組成。印刷電路板iϋ 有晶片組11與其他運作所需之電子元件，並鋪設有走 此，結二由於其等係為既有之成熟技術，是以在本發明中所 =電路板10的技術細節將不再贅述，且 意而未詳㈣製；而不同種類之產品，裝配有不同H中71 ^。係由數片散熱鰭片21 (heat sink)所組成， 板3。裝；在路==、真片散熱作業。固定 3卜可m二!10 f側邊’且固定板3〇上設有螺孔 機請的卜；槽Z印刷電路錢_定在電腦 接地件40係由導電性金屬製成， 散熱模組20與固定板3〇。接地==刀=接，或頂抵於 有對應螺孔31的加4? mi對應疋板30之一端設 折出-健部4320相接之一端卿 段適當處嗎觸3=效果。接地件仙之中 30的與固定板 時所產生的電二 =取也的特性’晶片組20運作 傳導至接地件4〇，二由接…、拉組20上的散熱鰭片21 將可電磁波接地㈣再導通至電腦機殼⑽，而 佳實施例。二二上土圖一」f「第5圖」來說明本發明之第二較 本乐-祕例與前—她實關之組成大致^ 1260483 ，主要包括有印刷電路板10、散熱模組2〇、 板]°上設有晶片組"，散 fm、曰片21所組成，設於晶片組11上。固定板30設於 側’收印刷電路板1ΰ插置固定在電腦機 ^ 卡疋位槽上。特別的是，本第二較佳實施例 可逐 當^設一圓孔32，而接地件50較佳者 100之定"&梓=γΓ4/如疋，印刷電路板10裝配在電腦機殼 上後，將接地件50穿越圓孔32，並以鎖接 ϊΐί ^ ° ? ^ ^11 固定；训、盘个^予工由放熱杈組20與接地件50，而被傳導至 固疋板30與電腦機殼1〇〇。 |丨予守王 關於本發明之第三較佳實施例，請參 5「筮 ^5」’則針對介面卡上的散熱結 3 少設有一曰:=印刷1 路板10上，而此印刷電路板10上至 施例主要:#、、 ’亚谷设在電腦機殼1⑽内。第三較佳實 ；Π BO , 散熱鰭片6i片61與活動鰭片62。 散熱作業。活動韓片62的^用等同對晶片組11進行 邊的散熱鰭片61之一側，且活動w、f —、曰片’鄰設在最側 63。特別的是，活動鰭片62 之—端延伸有傳導部 是，當印刷電路板101 $可相對晶片組11旋轉。於 ，鰭片62即可10亩:^裝作業後，散熱模組60上的活動 二5 ·重ir專，直到搭觸電腦機殼刚為止，以#蔣曰Η 獅㈣導通至= 片62之-端彎财傳導部63^處4有ΐ性段64，且活動韓 100之接觸效果。 寻°又汁，猎以增進與電腦機殼 基方；％子輪射會循最短途徑導 結構使轉料，將發明之介面卡 耵得k至电腦機殼，藉以排除產 1260483 易於實施等優勢。 亚〃有成本低廉、組成元件簡單、 以上所述者，僅為本發明 均寺變化與修飾，皆為杯 Μ μ專利㉚圍所作的 【圖示簡單說明】 乾圍所涵蓋。 圖為本發明之介針結構之第—難實施例之立體 圖為本發明之細切構H佳實關之分解 圖為本發明之介奸結構H佳實關之組配 圖為本發明之介面卡結 稱之弟二較佳實施例之分解 圖為本發明之介面卡結 稱之弟二較佳實施例之組配 圖為本發明之介面卡結構 '^弟二較佳實施例之分解 較佳實施例之第一 較佳實施例之第二 第 示意圖 第 不意圖 第 不意圖 第 示意圖 第 示意圖 第 示意圖 第7圖為本發明之介面卡 作動示意圖。 Ό偁之弟 第8圖為本發明之介面卡 作動示意圖。 下、、。構之第 【主要元件符號說明】 11 20 21 30 10 印刷電路板 晶片組 散熱模組 散熱韓片 固定板 1260483 螺孔 圓孔 接地件 彈性段 透孔 抵壓部 接地件 散熱模組 散熱鰭片 活動鰭片 傳導部 彈性段 電腦機殼 介面卡定位槽 101260483 IX. Description of the invention: [Technical field to which the invention belongs] The i-day heavy interface card structure is applied to various types of interface cards for processing (4) processing and strengthening electromagnetic wave prevention effects. The performance of the Japanese computer equipment is increasingly strong, but the price is low, such as 5 bead processing equipment has become an industrial operation, personal ϊϊ ϊ 不可 ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ ϊ Different needs, but with multiple types, such as military defense supercomputers that are responsible for the safety of the country (sc is the steel machine used by the people (one person = type = esktop C〇_ter), or it is convenient for business people to carry The notebook computer j ote Book), or even the more compact personal digital assistant agonal Dlgltal Assist, PDA), etc., has been used by the public. Due to the increasingly complex composition of computer equipment, electronic components are often close to each other. = The distribution density is quite high. In addition, high-frequency electromagnetic (ElectroMagnetic Interference) (Electro Static Discharge (ESD)) is also generated during operation. Before the sale, it is required to pass various tests such as vibration and noise. Computer equipment contains many electronic components 'electronic components in operation, magnetic wave radiation, will be the central god of the human body The biological immune function of the moon and the blood system, blood, vision system, etc. cause damage. Therefore, in these various 测试ί test operations, especially EMI electromagnetic wave detection is the most important.,, the electronic components commonly used in equipment, Such as motherboard, sound card, display person σ σ interface card, usually one of the main sources of electromagnetic radiation. The basic composition of this two sides: the chip group is inserted on the printed circuit board, and the appropriate animal is laid. The traces are connected to other electronic components on the printed circuit board, and the completion is completed. However, 1260483 (4) will find that the printed _ over-testing component generates electromagnetic radiation from the south, and cannot pass the trace on the H 2 The configuration of the electronic components must be redesigned and used in the same way. The traditional remedy method is extra = resistance to electromagnetic waves. 'However, these practices not only cause the maintenance cost of the second and fourth (4), but also are more expensive and difficult to implement. Furthermore, the Yi knife and the tearing method directly solve the problem of electromagnetic wave radiation, and the effect is not good. [Fa = ^ know the technology or the lack of existing products, should try to be excluded. Exposing the interface card structure, the electromagnetic wave in the mouth of the mouth can be quickly and effectively extracted. The device interface of the device can be applied to various computer devices, including the printed circuit board and the heat dissipation module. Fixing plate and grounding:: The electronic circuit component such as the chip set of the operating circuit board is provided on the circuit board, and a plurality of heat dissipating pieces are scattered to fix the chip set on one side of the circuit board for The two parts of the printed circuit board insert have flexible sections in the middle of the part, so that the grounded page is placed against the heat sink and the fixed board. Thus, when the chip set is in operation, the heat sink module and the grounding part can be passed through. And the characteristics of the conduction to the computer parts will be the shortest way to lead the ground, using the grounding magnetic wave light transmission to the computer case, can eliminate excessive radiation / human body problems in the product. The invention can quickly and effectively derive the advantages of electromagnetic wave field II, low cost, simple component and easy implementation. The above and other objects, features, and advantages of the present invention will become more apparent from the following detailed description. The examples of the yoke of the present invention are described with reference to "the top view" to "the third figure" including but not limited to a desktop, a server, and a notebook. The computer device comprises a computer case 1 〇〇, and a plurality of interface card positioning slots 110 are arranged on the side. The preferred embodiment of the utility model is mainly composed of a printed circuit board 10, a heat dissipation group 20, a fixed plate 30 and a grounding member. The printed circuit board i has the chipset 11 and other electronic components required for operation, and is laid out. The second is due to its mature technology, and is the technical details of the circuit board 10 in the present invention. It will not be described again, and it is not intended to be detailed (4); and different types of products are assembled with different H 71 ^. It consists of several heat sinks, board 3. Loading; in the road ==, the real film cooling operation. Fixed 3 b can be m 2! 10 f side 'and fixed plate 3 设有 on the screw hole machine please; groove Z printing circuit money _ fixed in the computer grounding 40 is made of conductive metal, cooling module 20 with the fixed plate 3 〇. Ground==knife=connected, or the top is applied to the corresponding screw hole 31. 4? mi corresponds to one end of the raft 30. Folding-the health part 4320 is connected to one end. The characteristics of the electricity generated by the grounding member 30 and the fixing plate are as follows: 'The characteristics of the chip group 20 are transmitted to the grounding member 4〇, and the heat radiating fins 21 on the pulling group 20 are electromagnetic waves. Grounding (4) is then conducted to the computer case (10), and the preferred embodiment. The second and second earth maps, "f", the fifth figure, illustrate the second comparative music of the present invention - the secret and the former - her actual composition is roughly ^ 1260483, mainly including the printed circuit board 10, the heat dissipation module 2 A chip group ", a fm, and a chip 21 are provided on the chip, the plate is disposed on the chip set 11. The fixing plate 30 is disposed on the side of the printed circuit board 1 and is inserted and fixed on the computer card slot. In particular, the second preferred embodiment can be provided with a circular hole 32, and the grounding member 50 preferably has a setting of "&梓=γΓ4/, such as 疋, the printed circuit board 10 is assembled in the computer case. After the upper part, the grounding member 50 passes through the circular hole 32 and is fixed by the locking ϊΐ ί ^ ° ^ ^ ^11; the training, the disk is processed by the heat releasing group 20 and the grounding member 50, and is transmitted to the solid plate 30. 1 电脑 with the computer case.丨 守 守 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 守 守 守 守 守 守 守 守 守 守 守 守 守 守 守 守 守 守 守 守 守 守On the circuit board 10 to the main application: #,, 'Yugu is set in the computer case 1 (10). The third preferred embodiment; Π BO , the heat sink fin 6i sheet 61 and the movable fin 62. Cooling operation. The movable Korean film 62 is equivalent to one side of the heat radiating fin 61 on the side of the wafer group 11, and the movable w, f, and the cymbal s are adjacent to the outermost side 63. In particular, the end of the movable fin 62 extends with a conductive portion when the printed circuit board 101$ is rotatable relative to the wafer set 11. Therefore, the fins 62 can be 10 mu: After the operation, the activity on the heat dissipation module 60 is 2, 5, and heavy, until the computer case is just touched, and the #蒋曰Η狮(四) is turned on to = 62 The end-bend-conserving portion 63^4 has a squatting section 64, and the contact effect of the activity Han 100 is achieved. Looking for ° and juice, hunting to enhance the base of the computer case;% of the sub-shot will follow the shortest route to make the material transfer, the interface of the invention will be k-kicked to the computer case, so as to eliminate the advantages of easy production and 1260483 . Aachen has low cost and simple components. As mentioned above, only the variation and modification of the temple are made by the cup Μ μ patent 30. [Simple illustration] Covered by the dry circumference. The figure is a perspective view of the first embodiment of the present invention. The perspective view of the hard cut of the present invention is an exploded view of the fine cut structure of the present invention. The composition of the present invention is the interface of the present invention. The exploded view of the preferred embodiment of the present invention is the interface diagram of the preferred embodiment of the present invention. The combination of the preferred embodiment of the interface card structure of the present invention is the decomposition of the preferred embodiment of the present invention. The second preferred embodiment of the first preferred embodiment of the preferred embodiment is not intended to be the first schematic diagram. FIG. 7 is a schematic diagram of the operation of the interface card of the present invention. Ό偁之弟 Figure 8 is a schematic diagram of the operation of the interface card of the present invention. under,,. Structure [Major component symbol description] 11 20 21 30 10 Printed circuit board chipset heat dissipation module heat dissipation Korean plate fixing plate 1260483 Screw hole round hole grounding piece elastic section through hole pressure part grounding part heat dissipation module heat dissipation fin activity Fin conduction part elastic section computer case interface card positioning slot 10