1259521 九、發明說明： 【發明所屬之技術領域】 本發明係與半導體有關，特別是指一種半導體用之包 裝材料。 【先前技術】 在半導體工業中，-般都會使用晶舟盒或是晶圓盒作 為存放晶圓的容器，利用晶舟盒或晶圓盒可—次同時存放 多片晶圓’用以使各晶，能_在潔淨陳態下，便於 =儲放與運送等作業；但是，由於晶圓放在晶舟盒内存 ¥ ’晶圓料產生破裂或是被外界環境巾之微粒所污染 2況’因此’利用晶圓盒存放晶圓的方式，比較能減^ 晶圓受到破壞。 15 ^圓盒内裝有多數晶圓，並且要進行搬運作業時， =保麗騎質之包裝材料 ，裝材料連同晶圓盒-併放置於—紙箱内’箱= 衣材料保護晶圓盒’同時提供吸震及緩衝外力的功用。匕 盒當？圓盒利用上述方式進行包農時，若是晶圓 運過晶圓的晶圓厚度小於15别，常會在搬 加裂的狀況’造成產品品質的降低，增 【發明内容】 一種半導體用之 ’即使晶圓盒内 勺壯口此’本發明之主要目的乃在於提供 匕衣材料，該包裝材料可用以包裝晶圓盒 20 1259521 衝及保護效果，不易使晶圓發生破裂之狀況。 為達成前揭目的’本發明所提供铸體用之包裝材1259521 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to semiconductors, and more particularly to a packaging material for semiconductors. [Prior Art] In the semiconductor industry, a wafer cassette or a wafer cassette is generally used as a container for storing wafers, and a wafer cassette or a wafer cassette can be used to store a plurality of wafers at the same time. Crystal, can be _ in the clean state, easy = storage and transport operations; however, because the wafer is placed in the memory of the boat box ¥ 'wafer material is broken or contaminated by particles of the external environmental towel 2 conditions' Therefore, the way in which the wafer is stored in the wafer cassette can be reduced. 15 ^The round box contains a lot of wafers, and when it is to be carried, = Baoli riding quality packaging materials, loading materials together with the wafer cassette - and placed in the - carton 'box = clothing material protection wafer box' At the same time, it provides the function of shock absorption and buffering external force.匕 Box? When the round box is used for the above-mentioned method, if the thickness of the wafer on which the wafer is transported through the wafer is less than 15, the condition of the cracking often occurs, which causes a decrease in the quality of the product, and the content of the invention is increased. The main purpose of the present invention is to provide a garment material which can be used to package the wafer cassette 20 1259521 and protect the wafer from cracking. Packaging material for castings provided by the present invention for the purpose of achieving the foregoing
Li含有一框體、多數抵頂部’以及多數支撐件；該框 5體具有-容置空㈤，該框體於相對該容置 至少-凹槽’各該抵頂部係設於該框體對應該容置空間之 表面’各該抵頂部自該框體朝該容置空間方向延伸各該 支撐件係呈凸起狀地設於該框體之頂側或底側藉此本 =^可_包㈣社賴，達财有較佳 護 W 效果的目的。 【實施方式】 以下，兹配合圖式舉一較佳實施例，用以對本發明之 細部結構與功效做進一步說明，其中所用各圖式之簡要說 I5 明如下： 第一圖係本發明一較佳實施例之正視圖，· t圖係本發明—較佳實關之頂視圖； ，三圖係本發明-較佳實施例之側視圖； -第四圖係本發明一較佳實施例之應用示意圖，主要顯 ⑼示二包裝材料包覆於晶圓盒外圍；以及 =五圖係第四圖中5_5剖線之剖視圖。 口月茶閱第-至第三圖所示，係為本發明所提供半導體 f之包衣材料’包裝材料係為抗靜電發泡聚乙烯(EpE)材質 衣成其包含有一框體（II)、多數抵頂部(21)，以及多數支 1259521 撐件(31)。 該框體（11)具有二長邊（12)，以及二位於長邊（12)之間 的短邊（13)，藉以使框體（11)内部形成出一容置空間（1句， 各長邊（12)之外表面近中央位置設有一凹槽（15)，各凹槽 5係自長邊(12)之外表面朝内表面方向凹陷預定距離；各^邊 (12)之底面具有一間柱（16)，間柱之位置對應於各凹槽 φ (15)之位置，一紐邊（13)之間另設有二連接條（17)，各連接 條(17)之底面具有六承接柱(is)。 各該抵頂部(21)係一體成形於各長邊（12)及各短邊(13) 1〇 =内表面，各抵頂部(21)呈推拔狀地凸出於各内表面，並朝 容置空間（14)方向延伸；各該支撐件(31)係呈四角柱形各 支撐件(31)設於各長邊(12)與各短邊(13)相鄰接之位置的頂 側及底側。 經由上述結構，如第四及第五圖所示，當本發明應用 於包裝了晶圓盒(41)時，係將二包裝材料以上下對合之方式 包住晶圓盒(41)，使晶圓盒(41)位於各框體（11)之容置空間 (14)内，晶圓盒(41)之環周面(42)與各抵頂部(21)之自由端相 互抵接，而晶圓盒⑷)之頂、底面(43、44)則與各連接條(1乃 相互抵接；接著，將二包裝材料連同晶圓盒(41)放入一瓦楞 20紙相中’使框體(11)之各長邊（12)及短邊（13)的外表面、 各支撐件(31)，以及各承接柱（18)分別與紙箱（51)内面相互 抵接。 由於各支擇件(31)與承接柱（18)係凸出框體（11)之頂面 與底面’進而再與紙箱(51)相互接觸，使得紙箱（51)與包裝 1259521Li includes a frame body, a plurality of abutting tops and a plurality of support members; the frame 5 body has a space for accommodating (five), and the frame body is opposite to the accommodating at least - the groove is provided on the frame pair The surface of the space should be accommodated. Each of the abutting tops extends from the frame body toward the accommodating space. The support members are convexly disposed on the top side or the bottom side of the frame body. Package (4) Society, Dacai has the purpose of better protection W effect. [Embodiment] Hereinafter, a preferred embodiment of the present invention will be further described with reference to the drawings, and the detailed structure and function of the present invention will be further described as follows: The first figure is a comparison of the present invention. A front view of a preferred embodiment, a t-picture of the present invention - a top view of a preferred embodiment; a third view of the present invention - a side view of a preferred embodiment; - a fourth embodiment of a preferred embodiment of the present invention The application diagram shows that the main display (9) shows that the two packaging materials are wrapped around the periphery of the wafer cassette; and that the figure of the fifth figure is a cross-sectional view of the 5_5 line in the fourth figure. It is shown in the third to third figures that the coating material for the semiconductor f provided by the present invention is a material for the antistatic foamed polyethylene (EpE) which comprises a frame (II). Most of them reach the top (21), and most of them are 1259521 struts (31). The frame body (11) has two long sides (12) and two short sides (13) located between the long sides (12), thereby forming an accommodation space inside the frame body (11) (1 sentence, each A groove (15) is disposed near the center of the outer surface of the long side (12), and each groove 5 is recessed from the outer surface of the long side (12) toward the inner surface by a predetermined distance; the bottom surface of each of the sides (12) has a bottom surface a column (16), the position of the column corresponds to the position of each groove φ (15), and two connecting bars (17) are additionally arranged between the one edge (13), and the bottom surface of each connecting bar (17) has six receiving Columns (is) Each of the abutting tops (21) is integrally formed on each of the long sides (12) and the short sides (13) 1 〇 = inner surface, and each of the abutting tops (21) protrudes outwardly from each other The inner surface extends toward the accommodating space (14); each of the support members (31) has a quadrangular prism shape. The support members (31) are disposed on each of the long sides (12) adjacent to the short sides (13). The top side and the bottom side of the position. According to the above structure, as shown in the fourth and fifth figures, when the present invention is applied to the package of the wafer cassette (41), the two packaging materials are packaged one above the other. Hold the wafer cassette (41) and make the wafer cassette (41) In the accommodating space (14) of each frame (11), the circumferential surface (42) of the wafer cassette (41) and the free ends of the respective top portions (21) abut each other, and the top of the wafer cassette (4) The bottom surface (43, 44) is in contact with each of the connecting strips (1; then, the two packaging materials together with the wafer cassette (41) are placed in a corrugated paper phase of 20" to make the length of the frame body (11) The outer surfaces of the sides (12) and the short sides (13), the support members (31), and the respective receiving posts (18) abut each other with the inner surface of the carton (51). Since each of the supporting members (31) and the receiving column (18) the top surface and the bottom surface of the protruding frame body (11) and then the carton (51) are in contact with each other, so that the carton (51) and the package 1259521
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材料之間呈點接觸狀態，而設於各長邊（12)外表面之凹槽 (15)亦可提供相同的點接觸效果；同時，各抵頂部(21)係凸 出各長邊（12)及短邊（13)之内表面，再與晶圓盒(41)相互接 觸，因而使得晶圓盒(41)與包裝材料之間亦呈點接觸狀態， 進而使晶圓盒(41)藉由包裝材料以呈點接觸狀態之方式設 於紙箱（51)内部，並且整體晶圓盒(41)都受到包裝材料的抵 頂與支撐；當紙箱(51)在搬運中受到外力的撞擊，或是在運 11過私中义到主自然頻率之振動時，外力或振動皆可在經 由紙箱(51)傳咖包裝材料的過程當巾，细包裝材料本身 的材質特性，以及與晶圓盒(41)之間呈點接觸的結構，減少 外力或振動傳遞並作用至晶圓針41)，使晶圓盒⑼得 衝及保護的絲；_實際試驗的結果，_本發接 供之包裝材料所包裝的晶圓盒’即使晶圓盒喊 的晶圓，仍可通過產品包裝的落下試驗以及振= 達到具有較 藉此’本發明即可包裝材料之結構 仏緩衝及保護效果的目的。 1259521 【圖式簡單說明】 第一圖係本發明一較佳實施例之正視圖； 第二圖係本發明一較佳實施例之頂視圖； 第三圖係本發明一較佳實施例之側視圖； 第四圖係本發明一較佳實施例之應用示意圖，主要顯 示二包裝材料包覆於晶圓盒外圍；以及 第五圖係第四圖中54剖線之剖視圖。 13短邊 16間柱 【主要元件符號說明】 ίο 11框體 12長邊 14容置空間 15凹槽 Π連接條 31支撐件 43頂面 18承接柱 41晶圓盒 44底面 21抵頂部 42環周面 51紙箱The materials are in point contact state, and the grooves (15) provided on the outer surfaces of the long sides (12) can also provide the same point contact effect; at the same time, the respective tops (21) protrude from the long sides (12) And the inner surface of the short side (13), and then contact with the wafer cassette (41), so that the wafer cassette (41) and the packaging material are also in point contact state, thereby allowing the wafer cassette (41) to borrow Provided by the packaging material in a point contact state inside the carton (51), and the entire wafer cassette (41) is subjected to the abutment and support of the packaging material; when the carton (51) is subjected to an external force during handling, or When the vibration of the main natural frequency is transmitted, the external force or vibration can be used in the process of transferring the coffee packaging material through the carton (51), the material characteristics of the fine packaging material itself, and the wafer cassette ( 41) A structure with a point contact between the external force or vibration transmission and acting on the wafer needle 41), so that the wafer cassette (9) can be punched and protected; _ the result of the actual test, _ the packaging material for the hair supply The packaged wafer cassette' can be passed through the drop test of the product package even if the wafer is called by the wafer cassette. = Thereby come to have more 'of the present invention to Fo and protective cushioning packaging materials of Structural purposes. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a front view of a preferred embodiment of the present invention; the second drawing is a top view of a preferred embodiment of the present invention; and the third drawing is the side of a preferred embodiment of the present invention. 4 is a schematic view of the application of a preferred embodiment of the present invention, mainly showing a two-package material wrapped around the periphery of the wafer cassette; and a cross-sectional view taken along line 54 of the fourth figure in the fourth figure. 13 short side 16 columns [main component symbol description] ίο 11 frame 12 long side 14 accommodating space 15 groove Π connecting strip 31 support member 43 top surface 18 receiving post 41 wafer cassette 44 bottom surface 21 to the top 42 circumferential surface 51 carton