TW200707516A - Packaging material for semiconductors - Google Patents

Packaging material for semiconductors

Info

Publication number
TW200707516A
TW200707516A TW094126088A TW94126088A TW200707516A TW 200707516 A TW200707516 A TW 200707516A TW 094126088 A TW094126088 A TW 094126088A TW 94126088 A TW94126088 A TW 94126088A TW 200707516 A TW200707516 A TW 200707516A
Authority
TW
Taiwan
Prior art keywords
frame
accommodating space
semiconductors
packaging material
disposed
Prior art date
Application number
TW094126088A
Other languages
Chinese (zh)
Other versions
TWI259521B (en
Inventor
Sheng-Feng Lu
Original Assignee
Visera Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Visera Technologies Co Ltd filed Critical Visera Technologies Co Ltd
Priority to TW94126088A priority Critical patent/TWI259521B/en
Application granted granted Critical
Publication of TWI259521B publication Critical patent/TWI259521B/en
Publication of TW200707516A publication Critical patent/TW200707516A/en

Links

Landscapes

  • Packaging Frangible Articles (AREA)
  • Buffer Packaging (AREA)

Abstract

The present invention relates to a packaging material for semiconductors, comprising: a frame, a plurality of propping parts, and a plurality of supporting pieces; the frame has an accommodating space, and at least one concave trough is disposed on the corresponding surface of the accommodating space of the frame; each propping part is disposed on the surface corresponding to the accommodating space of the frame and extends toward to the accommodating space from the frame; each supporting piece are protrudently disposed on the top or the bottom of the frame.
TW94126088A 2005-08-01 2005-08-01 Packaging material for semiconductors TWI259521B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94126088A TWI259521B (en) 2005-08-01 2005-08-01 Packaging material for semiconductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94126088A TWI259521B (en) 2005-08-01 2005-08-01 Packaging material for semiconductors

Publications (2)

Publication Number Publication Date
TWI259521B TWI259521B (en) 2006-08-01
TW200707516A true TW200707516A (en) 2007-02-16

Family

ID=37873440

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94126088A TWI259521B (en) 2005-08-01 2005-08-01 Packaging material for semiconductors

Country Status (1)

Country Link
TW (1) TWI259521B (en)

Also Published As

Publication number Publication date
TWI259521B (en) 2006-08-01

Similar Documents

Publication Publication Date Title
MX2007012672A (en) Carton with support.
TW200716459A (en) Packing box for a glass substrate and a package structure of a glass substrate using the same
TW200700297A (en) Packaging
MY159064A (en) Semiconductor die package and method for making the same
NZ581799A (en) Dishwasher with a washing compartment comprising a trough section and a base
TW200711026A (en) Airtight container
CA102531S (en) Arch support
AU2003274908A1 (en) Multi-function jewelry chain primarily for supporting an upper torso garment
CA2603516C (en) Impact pads and a process for manufacturing the same
DE602005004266D1 (en) DISC HOLDING BODY AND INFORMATION PROCESSING BODY
MY170334A (en) Conveyor
GB0224999D0 (en) Conveyors
EP1948946A4 (en) Ensemble support
IS8249A (en) Tablet containing fluvastatin and carmellose calcium
HK1106660A2 (en) A modularly constructed container
TW200707516A (en) Packaging material for semiconductors
TW200738538A (en) Apparatus for receiving workpiece and method of receiving thereof
DE602005016861D1 (en) Carrying device for a feeder
ATE451285T1 (en) TRANSPORT DEVICE WITH STOWABLE ROLLER DEVICE
DE602005011998D1 (en) HERMETICALLY SEALED PACKAGING FOR A CARRIER IMPRESENTED WITH A PRODUCT
WO2007038353A3 (en) Consumer product package
TW200626449A (en) Rubbish bin having a buffering apparatus
TW200711962A (en) Wafer packing
DE502008001992D1 (en) substrate carrier
TW200617506A (en) Backlight module