TWI259173B - Printing and sintering process and materials thereof - Google Patents

Printing and sintering process and materials thereof Download PDF

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TWI259173B
TWI259173B TW93103405A TW93103405A TWI259173B TW I259173 B TWI259173 B TW I259173B TW 93103405 A TW93103405 A TW 93103405A TW 93103405 A TW93103405 A TW 93103405A TW I259173 B TWI259173 B TW I259173B
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Taiwan
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printing
ink
substrate
processing method
glaze
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TW93103405A
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Chinese (zh)
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TW200526542A (en
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Chan-Ming Liu
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Compal Electronics Inc
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Abstract

A printing and sintering process and materials thereof are disclosed. The process comprises the following steps. First of all, inorganic powders are grinded to form inorganic powders with nano-scale diameters. Next the inorganic powders are mixed with an ink to form an ink for jet printing. Then an ink jet printing is performed to draw a desired pattern on a substrate by printing the ink for jet printing having the nano-scale inorganic powders on the substrate. Finally, a sintering process is performed to sinter the nano-scale inorganic powder and form the pattern.

Description

1259173 五、發明說明(1) -、【發明所屬之技術領域】 本發明係有關於一種印刷燒結之加工方法及其印刷材 料,特別是一種有關於應用於塗裝技術之印刷燒結之加工 方法及其印刷材料。 二、【先前技術】 傳統用於在基材 技術包含喷塗、電鍍 效果不佳的共通問題 塗料粉末之粒徑有一 Millimeter)等級至 果例如色澤與附著度 上繪製所需圖案或文 陶釉於基板上繪製所 高溫才能將陶釉燒結 已嫌過高,更何況是 用於外殼的新興材質 金的鎔點。此外,產 程上的困難,因此以 不易又耗時且製程限 例如金屬等上繪製圖案 、陶釉或燒烤上漆等, 。噴塗繪製圖案或文字 定之限制,而傳統粒徑 微米(M i c r ο η)等級之 等並不令人滿意。而利 字的效果則相對較佳, 需圖案或文字則需要以 成形。然而1 0 0 0°C對於 相對於例如is合金特別 ,1 0 0 o°c的高溫已遠超 生並維持1 ο 〇 or以上的 陶釉於基板上繪製所需 制多。 或文字的喷塗 一般均有表面 所用 於基材上 約為毫米 間,而表 用陶釉於 不過傳統 1 0 0 0〇C 以 一般金屬 是銘鎮合 過常用鋁 高溫也造 圖案不僅 面效 基板 利用 上的 而言 金等 基合 成製 生產 有鑑於上述原因,因此極需提出一種新式塗裝技術 以滿足現代對塗裝加工效果與製程便利性的需求。1259173 V. INSTRUCTION DESCRIPTION (1) - [Technical Field to Be Invented by the Invention] The present invention relates to a printing and sintering processing method and a printing material thereof, and in particular to a processing method for printing and sintering applied to a coating technique and Its printed materials. 2. [Prior Art] Traditionally used in the substrate technology, including the common problem of spraying and plating, the particle size of the coating powder has a Millimeter grade to the color, such as color and adhesion, to draw the desired pattern or terracotta glaze. It is too high to draw the high temperature on the substrate to sinter the ceramic glaze, not to mention the new material gold for the outer casing. In addition, the difficulty in production is therefore difficult to draw and time-consuming and process limits such as metal drawing, ceramic glaze or barbecue lacquering. Painting patterns or texts are limited, while conventional particle size micrometers (M i c r ο η) grades are not satisfactory. The effect of the word is relatively good, and the pattern or text needs to be shaped. However, at 100 °C, it is necessary to draw a large amount of ceramic glaze on the substrate, which is far superior to the temperature of, for example, the is alloy, and is maintained at a temperature of 1 ο 〇 or more. Or the painting of the text generally has a surface for about a millimeter on the substrate, and the table is made of ceramic glaze. However, the traditional 1 10000 〇C is a common metal. In view of the above reasons, it is highly desirable to propose a new coating technology to meet the needs of modern coating processing effects and process convenience.

第5頁 1259173 五、發明說明(2) 三、【發明内容】 本發明所欲解決之技術問題為提供一種生產容易且效 果良好的表面塗裝加工方法及其材料。 本發明另一所欲解決之技術問題為提供一種能克服傳 統喷塗技術粒徑限制的表面塗裝加工方法及其材料。 本發明另一所欲解決之技術問題為提供一種成本低廉 、製程簡單的表面塗裝加工方法及其材料。Page 5 1259173 V. INSTRUCTION DESCRIPTION (2) [Draft] The technical problem to be solved by the present invention is to provide a surface coating processing method and a material thereof which are easy to produce and have good effects. Another technical problem to be solved by the present invention is to provide a surface coating processing method and material thereof which overcomes the particle size limitation of conventional spraying techniques. Another technical problem to be solved by the present invention is to provide a surface coating processing method and material thereof which are low in cost and simple in process.

為了達成上述之目的,本發明解決問題之技術手段利 用一種印刷燒結加工方法,此印刷燒結加工方法包含以下 之步驟。首先以研磨法形成奈米級無機粉末。然後將無機 粉末與一油墨混合以形成一喷墨。接著將含有奈米級無機 粉末之喷墨以喷墨印刷法(I nk J e t P r i n t i n g)喷塗圖案 於基材上。最後進行一燒結程序以形成圖案於基材上。無 機粉末則以釉料較佳,而油墨必須具備耐高溫的特性,將 奈米級無機粉末與油墨混合可形成上述喷墨。 對照本發明與先前技術之功效,由於本發明之印刷燒 p 結加工方法利用喷墨印刷法將含有奈米級粒徑無機粉末之 ‘ 喷墨喷塗於基材上,能以相對較低的溫度進行燒結,無須 . 如傳統利用陶釉於基板上繪製圖案或文字以高達1 〇 0 〇°C以 上進行燒結,不僅製程容易且可輕易施作於曲面之上,同 1259173 五、發明說明(3) 時由於粉末具有奈米級粒徑使得燒結後的表面效果佳,無 傳統喷塗、電鍍或燒烤上漆粒徑限制的問題。 上述有關發明的内容及以下的實施方式詳細說明為範 例並非限制。其他不脫離本發明之精神的等效改變或修飾 均應包含在的本發明的專利範圍之内。 四、【實施方式】 在此必須說明的是以下描述之内容並不包含全部細節 本發明可以藉各種製造技術來實施,在此僅提及暸解本 發明所需之技術。以下將根據本發明所附圖示做詳細的說 明,請注意圖示均為簡單的形式。 在本發明的一個實施例中,本發明之印刷燒結加工方 法以具有奈米級粒徑之無機粉末形成喷墨進行喷墨印刷法 (Ink Jet Printi ng),形成圖案於金屬或其他基板上。 第一圖顯示本發明之印刷燒結加工方法流程圖。於步驟 1 0 2中,首先以機械研磨形成奈米級無機粉末。接著於步 驟1 0 3中,將無機粉末與一油墨混合以形成一喷墨。於步 驟1 0 4中,以喷墨印刷法喷塗含有奈米級無機粉末之喷墨 以印刷圖案於基材上。最後於步驟1 0 6中,進行燒結程序 使奈米級無機粉末形成圖案於基材上。 所使用之無機粉末材質包含釉料無機粉末為主。經由In order to achieve the above object, the technical means for solving the problem of the present invention employs a printing and sintering processing method comprising the following steps. First, a nano-sized inorganic powder is formed by a grinding method. The inorganic powder is then mixed with an ink to form an ink jet. Next, an ink jet containing a nano-sized inorganic powder is spray-patterned on a substrate by an ink jet printing method (I nk J e t P r i n t i n g). Finally, a sintering process is performed to form a pattern on the substrate. The inorganic powder is preferably a glaze, and the ink must have a high temperature resistance characteristic, and the nano inorganic powder is mixed with the ink to form the above ink jet. In contrast to the effects of the present invention and the prior art, since the printing paste p-junction processing method of the present invention utilizes an inkjet printing method to ink-jet a nanoparticle-containing inorganic powder onto a substrate, it can be relatively low. If the temperature is used for sintering, it is not necessary. For example, traditionally using ceramic glaze to draw patterns or characters on the substrate to sinter up to 1 〇0 〇 °C, not only the process is easy but can be easily applied on the curved surface, the same as 1259173. 3) Since the powder has a nanometer-sized particle size, the surface effect after sintering is good, and there is no problem of the conventional particle size limitation of coating, plating or baking. The above description of the invention and the following embodiments are described in detail as examples and are not limiting. Other equivalent changes or modifications that do not depart from the spirit of the invention are intended to be included within the scope of the invention. Fourth, [Embodiment] It is to be understood that the following description is not intended to cover all details. The invention can be implemented by various manufacturing techniques, and only the techniques required to understand the present invention are mentioned herein. Detailed description will be made below in accordance with the accompanying drawings of the present invention, and it is noted that the drawings are in a simple form. In one embodiment of the present invention, the printing and sintering processing method of the present invention forms an ink jet printing method (Ink Jet Print) using an inorganic powder having a nanometer-sized particle diameter to form a pattern on a metal or other substrate. The first figure shows a flow chart of the printing and sintering processing method of the present invention. In step 102, first, a nano-scale inorganic powder is formed by mechanical milling. Next, in step 103, the inorganic powder is mixed with an ink to form an ink jet. In step 104, an ink jet containing a nano-scale inorganic powder is sprayed by ink jet printing to print a pattern on the substrate. Finally, in step 106, a sintering procedure is performed to pattern the nanoscale inorganic powder onto the substrate. The inorganic powder material used mainly comprises glaze inorganic powder. via

第7頁 1259173 五、發明說明 研磨成粉 粉末。研 級粒徑之 米粒徑之 械研磨機 設備,以 而才雨溫油 業瓷磚材 料與油墨 油墨混合 案由印刷 表面無須 (4) 末狀以 磨的方 研磨法 機械研 均可使 上述粒 墨混合 料專用 的混合 ,以形 用喷墨 為平面 形成粒徑 式以機械 亦不應排 磨機執行 用。喷墨 徑 2 0 0 n m 形成所需 之而ί向溫 比例為約 成印刷燒 印刷設備 ,基材表 2 0 0 nm (或更小)之奈米級無機 研磨法較佳,但其他可產生奈米 除。機械研磨法可使用研磨出奈 ,一般用於形成奈米級粒徑之機 印刷法可利用印刷用喷墨印刷 (或更小)之奈米級無機粉末與 之喷墨。此耐高溫油墨可為建築 油墨。於一實施例中,喷墨中轴 3〜5 %的轴料與約9 7〜9 5 %之耐兩溫 結加工方法之印刷材料。所需圖 輸入並施作印刷於基材上,基材 面亦可為曲面。Page 7 1259173 V. INSTRUCTIONS Description Ground into powder. Research on the mechanical grinding machine equipment of the particle size of the particle size, so that the rain and temperature oil industry tile material and the ink and ink mixing case are not required to be printed on the surface (4). The above-mentioned granular ink can be made by the grinding method of the grinding method. The mixing of the mixture is specifically carried out in the form of a plane using a jetting machine to form a particle size, and the machine should not be used in a grinding machine. The ink jet diameter of 200 nm is required to form the desired ί-to-temperature ratio to about the printing and printing equipment, and the nanometer-scale inorganic grinding method of the substrate table of 200 nm (or smaller) is preferable, but other can be produced. Nano except. The mechanical polishing method can be carried out by using a milled yarn, which is generally used for forming a nanometer-sized particle size. The printing method can use inkjet printing (or smaller) nano-scale inorganic powder for printing and inkjet. This high temperature resistant ink can be an architectural ink. In one embodiment, the inkjet medium shaft has 3 to 5% of the shaft material and about 9 7 to 95% of the printing material resistant to the two-temperature junction processing method. The required image is input and applied to the substrate, and the substrate surface can also be curved.

以粒徑2 0 0 nm (或更小)之奈米級無機粉末進行喷墨 印刷法(I nk J e t Pr i n t i ng),將所需圖案由印刷用喷 墨印刷設備以上述含有奈米級無機粉末之墨水喷墨印刷於 選用之基板上。基板可為金屬基板,材質可為鋁、鈦、鋁 鎂合金基板等。接著將基板上構成圖案之奈米級無機粉末 進行燒結(Sinter ing),製程可於約8 0 0± 1 00°C或約7 0 0°C 至約9 0 0°C進行1 0分鐘施作於金屬基板上,製程簡單,後 續燒結溫度較傳統陶釉以1 0 0 〇°C以上高溫燒結降低。此外 以喷墨印刷法形成圖案可直接於曲面上施作,即基板施作 面不必限定為平面,製程彈性大,成本低廉、效果良好。The inkjet printing method (I nk J et Pr inti ng) is carried out with a nano-sized inorganic powder having a particle diameter of 200 nm (or less), and the desired pattern is printed by the inkjet printing apparatus for printing with the above-mentioned nano-scale The inorganic powder ink is inkjet printed on the selected substrate. The substrate may be a metal substrate, and the material may be aluminum, titanium, an aluminum-magnesium alloy substrate or the like. Then, the nano-scale inorganic powder constituting the pattern on the substrate is sintered, and the process can be carried out at about 800 ° C 00 ° C or about 700 ° C to about 9000 ° C for 10 minutes. The method is simple on the metal substrate, and the subsequent sintering temperature is lower than that of the conventional ceramic glaze at a high temperature of above 100 °C. In addition, the pattern formed by the inkjet printing method can be directly applied to the curved surface, that is, the substrate application surface is not necessarily limited to a plane, the process flexibility is large, the cost is low, and the effect is good.

第8頁 1259173 五、發明說明(5) 本發明之印刷燒結加工方法可搭配模内嵌入射出法 (In-Mold Decoration)。模内敌入射出法(In -Mold Decoration)為一種形成圖案於物件表面的方法,首先形 成一具有所需圖案之基板,接著將基板置入模具中以形成 模具所定義之立體形狀或三D形狀。接著置入鑄模材料以 禱造形成一表面具有圖案之單一物件。以上述含有奈米級 粒徑無機粉末之喷墨利用喷墨印刷法將所需圖案喷塗於 金屬基板上,接著將基板上構成圖案之奈米級無機粉末進 行燒結,以形成所需圖案於基板上。然後將金屬基板以模 具沖壓等方式形成三D立體形狀,並以金屬基板相同金屬 材料注入模具以形成表面具有圖案之單一物件。 本發明之印刷燒結加工方法利用喷墨印刷法將含有奈 米級粒徑無機粉末之喷墨喷塗於基材上,並可以較低的溫 度進行燒結,不僅製程容易且可輕易施作於曲面之上,同 時由於粉末具有奈米級粒徑使得燒結後的表面效果佳,無 傳統喷塗、電鍍或燒烤上漆粒徑限制的問題。本發明之印 刷燒結加工方法可應用的範圍包含應用鋁鎂合金等或耐高 溫80 0°C以上之金屬或合金的電腦資訊(Computer)、通 訊(Communication)與消費性(Consumer) 3C產品料件 上述有關發明的實施方式僅為範例並非限制。其他不 脫離本發明之精神的等效改變或修飾均應包含在的本發明Page 8 1259173 V. Description of the Invention (5) The printing and sintering processing method of the present invention can be combined with In-Mold Decoration. In-Mold Decoration is a method of forming a pattern on the surface of an object. First, a substrate having a desired pattern is formed, and then the substrate is placed in a mold to form a three-dimensional shape or three-dimensional defined by the mold. shape. A mold material is then placed to pray to form a single object having a pattern on its surface. The desired pattern is sprayed onto the metal substrate by inkjet printing using the above-described inkjet containing the nanometer-sized inorganic powder, and then the nano-scale inorganic powder constituting the pattern on the substrate is sintered to form a desired pattern. On the substrate. The metal substrate is then formed into a three-dimensional shape by die stamping or the like, and is injected into the mold with the same metal material as the metal substrate to form a single object having a pattern on the surface. The printing and sintering processing method of the present invention uses an inkjet printing method to spray an inkjet film containing a nanometer-sized inorganic powder onto a substrate, and can be sintered at a relatively low temperature, which is easy to process and can be easily applied to a curved surface. On the top, at the same time, since the powder has a nanometer-sized particle size, the surface effect after sintering is good, and there is no problem of the conventional particle size limitation of plating, plating or barbecue coating. The applicable range of the printing and sintering processing method of the present invention includes computer information, communication, and consumer 3C product materials using an aluminum-magnesium alloy or a metal or alloy having a high temperature resistance of 80 ° C or higher. The above embodiments of the invention are merely examples and are not limiting. Other equivalent changes or modifications that do not depart from the spirit of the invention are included in the invention.

第9頁 1259173 五、發明說明(6) 的專利範圍之内 iiii 第10頁 1259173 圖式簡單說明 五、【圖式簡早說明】 為了能讓本發明上述之其他目的、特徵、和優點能更 明顯易懂,下文特舉一較佳實施例,並配合所附圖式,作 詳細說明如下: 第一圖顯示本發明之印刷燒結加工方法流程圖。 主要部分之代表符號:Page 9 1259173 V. Inventor's Note (6) Within the scope of patent iiii Page 10 1259173 BRIEF DESCRIPTION OF THE DRAWINGS V. [Brief Description] In order to make the other objects, features, and advantages of the present invention more It is apparent that the preferred embodiment is described below in detail with reference to the accompanying drawings. The first figure shows a flow chart of the printing and sintering processing method of the present invention. Representative symbols of the main part:

1 0 2以機械研磨形成奈米級無機粉末 1 0 3將無機粉末與一油墨混合以形成一喷墨 1 0 4以喷墨印刷法喷塗含有奈米級無機粉末之喷墨 以印刷圖案於基材上 1 0 6進行燒結程序使奈米級無機粉末形成圖案於基1 0 2 is formed by mechanical grinding to form a nano-scale inorganic powder. The inorganic powder is mixed with an ink to form an inkjet 104. The inkjet containing the nano-scale inorganic powder is sprayed by inkjet printing to print a pattern. On the substrate, a sintering process is performed to form a nano-scale inorganic powder on the substrate.

Claims (1)

1259173 案號93103405_年^月^曰 修正_ 六、申請專利範圍 1 . 一種印刷燒結之印刷材料,其特徵在於,該印刷材料係 為奈米級釉料,且該奈米級釉料可為粒徑不大於2 0 0 nm之 無機釉料粉末,並可由喷墨印刷法(I n k J e t P r i n t i n g) 形成圖案於一基板上。 2 .如申請專利範圍第1項所述之印刷材料,其中該無機釉 料粉末係以機械研磨法研磨法研磨形成。 3. —種印刷燒結之印刷材料,其特徵在於,該印刷材料係 由粒徑不大於2 0 0 nm之奈米級無機釉料粉末與耐高溫油墨 混合以形成喷墨者。 4 .如申請專利範圍第3項所述之印刷材料,其中該耐高溫 油墨包含免碑材料專用之耐南溫油墨。 5 .如申請專利範圍第3項所述之印刷材料,其中該噴墨中 釉料與油墨的混合比例為約3〜5 %的釉料與約9 7〜9 5 %之油 墨。 6. —種印刷燒結加工方法,該印刷燒結加工方法包含以下 之步驟: 以研磨法形成一奈米級無機粉末; 將該無機粉末與一油墨混合以形成一喷墨; 將該喷墨以喷墨印刷法(I nk Jet Pr i nt i ng)噴塗一1259173 Case No. 93103405_年^月^曰修正_6. Patent application scope 1. A printed and sintered printing material, characterized in that the printing material is a nano-grade glaze, and the nano-grade glaze can be The inorganic glaze powder having a particle diameter of not more than 200 nm can be patterned on a substrate by inkjet printing (I nk J et Pringting). 2. The printing material of claim 1, wherein the inorganic glaze powder is formed by mechanical grinding. A printing-sintered printing material characterized in that the printing material is mixed with a high-temperature ink of a nano-sized inorganic glaze powder having a particle diameter of not more than 200 nm to form an inkjet. 4. The printing material according to claim 3, wherein the high temperature resistant ink comprises a south temperature resistant ink for use in a monumental material. 5. The printing material according to claim 3, wherein the ratio of the glaze to the ink in the inkjet is about 3 to 5% of the glaze and about 9 to 7.5 % of the ink. 6. A printing and sintering processing method, the printing and sintering processing method comprising the steps of: forming a nano-sized inorganic powder by a grinding method; mixing the inorganic powder with an ink to form an inkjet; Ink printing method (I nk Jet Pr i nt i ng) spraying one 1259173 修正 案號 93103405 六、申請專利範圍 圖案於一基材(Substrate)上;及 進行一燒結程序以形成該圖案於該基材上。 7 .如申請專利範圍第6項所述之印刷燒結加工方法,其中 該無機粉末材質包含釉料為主。 8.如申請專利範圍第6項所述之印刷燒結加工方法,其中 該奈米級無機粉末之粒徑不大於2 0 0 n m。 9 .如申請專利範圍第6項所述之印刷燒結加工方法,其中 該奈米級無機粉末係以一機械研磨法研磨形成。 1 0 .如申請專利範圍第6項所述之印刷燒結加工方法,其中 該喷墨印刷法所用之喷墨包含3〜5 %釉料搭配9 7 : 9 5 %之瓷磚 用而f南溫油墨墨水成分。 —— 〇 11.如申請專利範圍第6項所述之印刷燒結加工方法,其中 該基材包含鋁、鈦、鋁鎂合金基板其中之 1 2 .如申請專利範圍第6項所述之印刷燒結加工方法,其中 該燒結程序係於約7 0 0°C至約9 0 0°C進行約1 0分鐘。 1 3 .如申請專利範圍第6項所述之印刷燒結加工方法,更包 含一模内嵌入射出法(In-Mold Decoration),該模内喪1259173 Amendment No. 93103405 VI. Scope of Application The pattern is patterned on a substrate; and a sintering process is performed to form the pattern on the substrate. 7. The printing and sintering processing method according to claim 6, wherein the inorganic powder material comprises a glaze. 8. The printing and sintering processing method according to claim 6, wherein the nano-sized inorganic powder has a particle diameter of not more than 200 nm. 9. The printing and sintering processing method according to claim 6, wherein the nano-sized inorganic powder is formed by a mechanical grinding method. The printing and sintering processing method according to claim 6, wherein the inkjet used in the inkjet printing method comprises 3 to 5 % glaze with 9 7 : 9 5 % of the ceramic tile and f. Ink composition. The printing and sintering processing method of claim 6, wherein the substrate comprises one of aluminum, titanium, aluminum-magnesium alloy substrates, and printing and sintering as described in claim 6 A processing method, wherein the sintering process is performed at about 70 ° C to about 9000 ° C for about 10 minutes. 1 3. The printing and sintering processing method described in claim 6 of the patent application, further including an in-mold decoration method (In-Mold Decoration), which is in-mold 第12頁 I 1259173 案號93103405 1 <年$月、日 修正_ 六、申請專利範圍 入射出法(In-Mold Decoration)包含以下之步驟: 將具有該圖案之該基材置入一模具中形成該模具所定 義之立體形狀;及 加入一鑄模材料至該模具中與該基材結合以鑄造形成 一表面具有該圖案之一物件。Page 12 I 1259173 Case No. 93103405 1 < Year $ Month, Day Correction _ VI. In Patent Application In-Mold Decoration includes the following steps: placing the substrate having the pattern into a mold Forming a three-dimensional shape defined by the mold; and adding a mold material to the mold to bond with the substrate to cast a surface having one of the patterns. 第13頁Page 13
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