1257898 層固接於该二聚醯亞胺板（1 Ο )間之1 mi 1的熱硬化接 著劑（1 1 )所構成。 如第二圖所示，其係揭示本發明為板厚7mil複合式 聚亞醯胺板實施例之示意圖，該複合式聚亞醯胺板結構之 組成，主要係由三層2mi 1聚醯亞胺板（丄〇 )，以及二 層为別固接於相鄰二聚醯亞胺板（1 〇 )間之〇· 丨】的 熱硬化接著劑（1 1 )所構成。 其匕，右本發明為板厚8mi 1複合式聚亞醯胺板實施 例時，該複合式聚亞醯胺板可由三層2mU聚醯亞胺板， 以及二層固接於相鄰二聚醯亞胺板間之lmil的熱硬化接 著劑所構成（圖未示）；若本發明為板厚9mi丨複合式聚亞 醯胺板實施例時，該複合式聚亞醯胺板可由三層2mi i聚 醯亞胺板，以及二層固接於相鄰二聚醯亞胺板間之丨· 5mi工 的熱硬化接著劑所構成（圖未示）；其它板厚尺寸之複合 式聚亞龜胺板產品依上述之方式類推。 為實現上述複合式聚醯亞胺板結構之產品，本發明所 提出之複合式聚醯亞胺板製法具體實施例，如第三圖本發 明複合式聚醯亞胺板的製作流程圖所示，其製法主要係包 括以下步驟：先依預定5mU以上聚醯亞胺厚板成品之總 板厚選取適當數量之厚度2mil聚醯亞胺板，依序於一聚 醯亞胺板（1 0 )上塗佈一層預定厚度的熱硬化接著劑（ 11)，再熱壓合另一聚醯亞胺板（1〇)之方式進行至 預定層數，使該接著劑因熱熟化固接於相鄰二聚醯亞胺板 之間，元成緣預定板厚之複合式聚驢亞胺板成品。 1257898 以下再以實施例進一步說明本發明之製作流程中，其 中： 實施例1 一 5 m i 1的複合式聚酸亞胺板製作流程： 其主要係取用一 2 m i 1的聚酿亞胺板為基材，塗佈一 層1 m ί 1的熱硬化接著劑於該基材上，再經烘箱將接著劑 的溶劑預熱乾燥後，經熱滾輪壓合一 2mi 1聚醯亞胺板後 ，再經加熱使接著劑熟化完成5mi 1的複合式聚醯亞胺板 ，以取代單層5πι i 1的聚醯亞胺板。 該5mi 1複合式聚醯亞胺板相較於現有單層聚醯亞胺 板所需成本價格比較，表列如下： 產品品名 單層聚醯亞胺 5mil 複合式聚醯亞胺板 成本價格（NT/M2) 740 _223/20/223 466 合計 740 由上表得知’本發明之複合式5mU聚醯亞胺板的成 本相較於單層聚醯亞胺板下降50%左右。且該複合式聚醯 亞胺板的產品性能可達到單層聚醯亞胺的性能，如附件一 及附件二所示。 實施例2 — 7mi 1的複合式聚醯亞胺板製作流程： 其係利用2mi 1的聚醯亞胺板為基材，塗佈一層 〇· 5ιιπ 1的熱硬化接著劑在基材上，再經烘箱將接著劑的溶 劑乾燥後，經熱滾輪壓合一 2mi 1聚醯亞胺板後，形成 4.5ππ1的複合式聚醯亞胺板，再利用2mU的聚醯亞胺板 為基材塗佈一層0.5W1的熱硬化接著劑在基材上，再經 1257898 供箱將接著劑的溶劑乾燥後，經熱滾輪壓合於該4.5mi丄 複合式聚酿亞胺板後，經熱熟化完成7mi 1的複合式聚醯 亞胺板，以取代單層7mi 1的聚醯亞胺板。複合式聚醯亞 月女板的產σ〇性此可達到單層聚醮亞胺的性能，如附件一所 示之私氣特性、抗化學特性及機械特性（如剝離強度）等The 1257898 layer is composed of a 1 mi 1 thermosetting binder (1 1 ) fixed between the dimeric imide plate (1 Ο ). As shown in the second figure, it is a schematic diagram showing an embodiment of the present invention as a 7 mil composite polyimide plate. The composition of the composite polyamidite plate structure is mainly composed of three layers of 2mi 1 poly The amine plate (丄〇) and the second layer are composed of a thermosetting adhesive (1 1 ) which is not fixed between the adjacent dimeric imide plate (1 〇). Hereinafter, when the invention of the present invention is a plate thickness 8mi 1 composite polyamidamine plate, the composite polythene plate can be made up of three layers of 2mU polyimine plate, and the second layer is fixed to adjacent dimerization. a lmil thermosetting adhesive between the yttrium imide plates (not shown); if the invention is a 9 mm 丨 composite polyimide plate embodiment, the composite polythene plate can be three layers 2mi i polyimine plate, and two layers of thermosetting adhesives fixed between adjacent dimeric imipenem plates (not shown); other polythickness Tortoise board products are analogized as described above. In order to realize the product of the above composite polyimine plate structure, the specific embodiment of the composite polyimine plate method proposed by the present invention, as shown in the third figure, shows the flow chart of the composite polyimine plate of the present invention. The method mainly comprises the following steps: firstly selecting an appropriate number of thickness 2 mil polyimine plates according to a predetermined total thickness of the finished polyaniline slabs of 5 mU or more, followed by a polyimide plate (10) Applying a layer of a predetermined thickness of the heat hardening adhesive (11), and then thermocompression bonding another polyimide layer to the predetermined number of layers, so that the adhesive is fixed to the adjacent by heat curing Between the dimeric imipenem plates, the composite polyimine plate with a predetermined thickness is formed. 1257898 Hereinafter, the production process of the present invention will be further illustrated by the following examples, wherein: Example 1 The process of preparing a composite polyamic imide plate of 5 mi 1 : mainly adopting a 2 mi 1 poly-imine plate For the substrate, a layer of 1 m ί 1 of a thermosetting adhesive is applied to the substrate, and then the solvent of the adhesive is preheated and dried in an oven, and then pressed into a 2 mi 1 polyimine plate by a hot roller. The adhesive was then matured to complete a 5 mi 1 composite polyimine plate to replace the single layer of 5πι i 1 polyimine plate. The cost ratio of the 5mi 1 composite polyimine plate compared to the existing single layer polyimide plate is as follows: Product list layer Polyimine 5mil compound polyimine plate cost price ( NT/M2) 740 _223/20/223 466 Total 740 It is known from the above table that the cost of the composite 5 mU polyimine plate of the present invention is about 50% lower than that of the single layer polyimide film. Moreover, the performance of the composite polyimide sheet can reach the performance of a single layer of polyimide, as shown in Annexes 1 and 2. Example 2 - 7mi 1 composite polyimine plate production process: using a 2mi 1 polyimine plate as a substrate, coating a layer of 〇·5 ιιπ1 thermal hardening adhesive on the substrate, and then After the solvent of the adhesive is dried in an oven, a 2 mi 1 polyimine plate is pressed by a hot roller to form a 4.5 μπ1 composite polyimine plate, and then coated with a 2 mU polyimine plate. A layer of 0.5W1 heat-hardening adhesive is applied to the substrate, and the solvent of the adhesive is dried by the 1257998 supply box, and then pressed by the hot roller to the 4.5mi丄 composite type polyiminoimide plate, and then heat-cured. 7mi 1 composite polyimine plate to replace a single layer of 7mi 1 polyimine plate. The compound 醯 女 月 月 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此
貫施例3 — 8mi 1的複合式聚醯亞胺板製作流程： 其係利用2mil的聚醯亞胺板為基材，塗佈一層lmU 的熱硬化接著劑在基材上，再經烘箱將接著劑的溶劑乾燥 後，經熱滾輪壓合一 2mil聚醯亞胺板後，形成5mU的複 。式♦ 亞胺板，再利用2mi丄的聚醯亞胺板為基材塗佈 層lmi 1的熱硬化接著劑在基材上，再經烘箱將接著劑 的’合；^乾秌後經熱滾輪壓合一 5mi丨複合式聚醯亞胺板後 ，並經熱熟化完成8mil的複合式聚醯亞胺板，以取代單 層Siml的聚醯亞胺板。複合式聚醯亞胺板的產品性能可 達到單層聚醯亞胺的性能，&附件一所示電氣特性、抗化 學特性及機械特性（如剝離強度）等。 實施例4—9niil的複合式聚醯亞胺板製作流程： 其係利用2mi 1的聚醯亞胺板為基材，塗佈一層 的熱硬化接著劑在基材上，再經烘箱將接著劑的溶 劑乾燥後’經熱滾輪屢合一 2mU聚酿亞胺板後，形成 的複合式聚酸亞胺板，再利用⑽的聚酿亞胺板 為基材塗H 的熱硬化接著劑在基材上，再經 烘箱將接著劑的溶劑乾燥後經熱滾輪壓合一 1257898 亞胺板後，再μ赦a上、n . 以 、工…元、化凡成9mi 1的複合式聚醯亞胺板， :日、9Π11 1 ^聚酸亞胺板。該複合式聚酸亞胺板的 士-月b可達到單層聚醯亞胺的性能，如附件一所示電氣 特丨生抗化孥特性、機械特性（如剝離強度）等。 =二上之說明可以瞭解，本發明利用多層複合之技 =將低單價的小厚度聚酿亞胺板結合成大厚度的聚酿 二反’ t其可以低成本的複合板材取代高成本單層聚驢 深二辈：可：到相當的材質特性。因此，本發明之設計Example 3 - 8mi 1 composite polyimine plate production process: It uses a 2 mil polyimine plate as a substrate, and coats a layer of lmU heat-hardening adhesive on the substrate, and then passes through an oven. After the solvent of the subsequent agent was dried, a 2 mil polyimine plate was pressed by a hot roller to form a 5 mU complex. ♦ imine plate, then use 2mi丄 polyimide plate as the substrate coating layer lmi 1 thermal hardening adhesive on the substrate, and then the oven's 'combination' The roller was pressed into a 5mi丨 composite polyimide plate and then thermally cured to complete a 8 mil composite polyimide plate to replace the single layer of Siml polyimide plate. The properties of the composite polyimine plate can achieve the properties of a single layer of polyimide, & electrical properties, chemical resistance and mechanical properties (such as peel strength) shown in Annex 1. Example 4—9niil composite polyimine plate production process: using a 2mi 1 polyimine plate as a substrate, coating a layer of heat-hardening adhesive on the substrate, and then passing the adhesive through the oven After the solvent is dried, the composite polyimide plate is formed after the hot roller is repeatedly combined with a 2 mU polyiminoimide plate, and the heat-hardening adhesive agent coated with H (10) is used as the substrate. On the material, the solvent of the adhesive is dried in an oven, and then pressed into a 1257898 imine plate by a hot roller, followed by μ赦a, n. , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Amine plate, : day, 9 Π 11 1 ^ polyimide plate. The composite-polyimide plate can achieve the properties of a single layer of polyimine, as shown in Annex I, which is resistant to antimony and mechanical properties (such as peel strength). = The description of the second can be understood, the present invention utilizes the technology of multi-layer composite = the combination of a low-priced small-thickness polyiminoimide sheet into a large-thickness poly-type, which can replace a high-cost single layer with a low-cost composite sheet. Concentrated deep second generation: can: to a considerable material characteristics. Therefore, the design of the present invention
1價值’並符合發明專利之要件 提出申請。 友m法，、又 【圖式簡單說明】 (一） 圖式部分 第-圖係本發明使用二片2mil聚醯亞胺薄板固接成一 複合式聚醢亞胺板結構之示意圖。 第二圖係本發明使用三片2mil聚醯亞胺薄板固接成一 複合式聚si亞胺板結構之示意圖。1 value' and meet the requirements of the invention patent.友m法,, and [Simplified description of the drawings] (1) Schematic Part The first figure is a schematic diagram of the invention using two sheets of 2 mil polyimine sheets fixed to form a composite polyimine plate structure. The second figure is a schematic diagram of the present invention using three sheets of 2 mil polyimine sheet to form a composite polyimine plate structure.
第二圖係本發明複合式聚醯亞胺板的製作流程圖。 (二） 元件代表符號 (10)聚酸亞胺板 熱硬化接著劑 (三） 附件： 本發明複合式聚醯亞胺板板厚5nul、7mil、 8mil及9mil等產品之特性及規格表。 習用5mi1 I才反式聚酸亞胺板之產寺性及規 格表。 10The second drawing is a flow chart for the production of the composite polyimine plate of the present invention. (2) Symbols of components (10) Polyimide plate Thermosetting adhesive (3) Accessories: The characteristics and specifications of the composite polyimide laminates of 5nul, 7mil, 8mil and 9mil. The use of 5mi1 I is a trans-polyimide plate for the production of temples and specifications. 10