1257882 15677twf.doc/m 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種清洗方法與裝置，且特別是有關 於一種流體供應裝置的清洗方法及其使用的清洗模組。 【先前技術】 在目前的半導體及顯示器產業中，大多會使用喷墨製 程來形成具有圖案的膜層。舉例來說，彩色濾光片0〇1沉 .filter，CF)上的色層、有機電激發光顯示器（沉职士 electro-luminescence display，OELD)中的高分子有機發光 層及聚合物(PI)保護層等等，均可藉由噴墨製程來形成。 目前喷墨製程所使用的喷墨頭之喷孔孔徑約介於2〇 微米至90微米之間，因此若墨水中含有不純物或是大顆粒 懸浮物時，容易造成喷墨頭之喷孔堵塞，因而降低喷墨頭 之哥命。此外’當喷孔被異物或氣泡堵塞時，墨滴將無法 順利喷出，導致此喷墨製程中所形成的膜層厚度不均勻， 因而降低生產良率。 ►習知解決上述問題的方法之一是施加驅動電壓於喷 墨頭，以進行多次試喷。但此種方法相當浪費墨水，且會 增加成本負荷。習知另一種方法則是改變喷墨頭 黏诂 形，以增加墨水的瞬間喷射力，但其成效有限，並無法完 全解決喷孔堵塞的問題。此外，尚有人提出以無塵^擦= 喷孔或是以高溫喷墨的方式來清除噴孔上的異物，然:: 以無塵布擦弒喷孔可能會發生無塵布的纖維堵塞喷孔的現 象，而高温喷墨並非適用於任何種類的墨水，且其需耗費 5 1257882 15677twf.doc/m 許多工時來進行升溫及降溫。 【發明内容】 有鑑於此，本發明的目的就是在提供一種清洗模組， 其能夠有效地清洗任何流體供應裝置的喷孔，以提高此流 體供應裝置的使用壽命。 本發明的另一目的是提供一種流體供應裝置的清洗方 法，其可有效地清洗任何流體供應裝置的喷孔，並其清洗 時間。 ^ 本發明提出一種清洗模組，其是用以清洗流體供應裝 置之喷孔。此清洗模組包括基座、超音波產生器以及刮刀。 其中，基座具有一清洗槽，而超音波產生器與刮刀均配置 於清洗槽内，且刮刀適於在清洗槽的底部移動。 在本發明的較佳實施例中，此清洗模組更包括一固定 件，此1]定件是配置於基座上，用以將清洗模組固定於流 體供應裝置上。在-實例中，此固定件例如是扣合爽具。 在本發明的較佳實施例中，上述之清洗模組例如是更 ，括一刀座，其是用以承載刮刀。其中，刮刀的材質例如 是矽膠，而刀座的材質例如是磁性材料。此外，上述之清 洗核組更可以包括一磁鐵，其是可移動地配置於基座下 方，以便於控制刮刀在清洗槽底部之移動。在一實施例中， 基座底部例如是具有滑軌，而磁鐵即是配置於滑軌上，並 沿著此滑執而移動。 '' 在本發明的較佳實施例中，上述之清洗槽的底部是具 有多個抽氣孔，且上述之清洗模組例如是更包括一抽氣1257882 15677twf.doc/m IX. Description of the Invention: [Technical Field] The present invention relates to a cleaning method and apparatus, and more particularly to a cleaning method for a fluid supply device and a cleaning module therefor. [Prior Art] In the current semiconductor and display industries, an ink jet process is often used to form a patterned film layer. For example, a color filter on a color filter 0 〇 1 sink. filter, CF), a polymer organic light-emitting layer and a polymer (PI) in an organic electroluminescent display (OELD) The protective layer or the like can be formed by an inkjet process. At present, the ink jet head used in the ink jet process has a pore size of about 2 μm to 90 μm. Therefore, if the ink contains impurities or large particles of suspended matter, the nozzle hole of the ink jet head is easily clogged. Thus reducing the fate of the inkjet head. Further, when the orifice is clogged with foreign matter or bubbles, the ink droplets will not be ejected smoothly, resulting in uneven thickness of the film formed in the ink jet process, thereby lowering the production yield. ► One of the methods for solving the above problems is to apply a driving voltage to the ink jet head to perform a plurality of test sprays. However, this method wastes ink and increases the cost load. Another conventional method is to change the sticking shape of the ink jet head to increase the instantaneous ejection force of the ink, but the effect is limited, and the problem of nozzle clogging cannot be completely solved. In addition, it has been proposed to remove the foreign matter on the nozzle hole by means of dust-free wiping = nozzle or by high-temperature inkjet. However:: rubbing the nozzle with a dust-free cloth may cause fiber blockage of the dust-free cloth. Hole phenomenon, high temperature inkjet is not suitable for any kind of ink, and it takes 5 1257882 15677twf.doc / m many hours to heat up and cool down. SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide a cleaning module that can effectively clean the orifice of any fluid supply device to increase the useful life of the fluid supply device. Another object of the present invention is to provide a cleaning method for a fluid supply device which can effectively clean the orifice of any fluid supply device and its cleaning time. ^ The present invention provides a cleaning module for cleaning an orifice of a fluid supply device. The cleaning module includes a base, an ultrasonic generator, and a scraper. Wherein, the pedestal has a cleaning tank, and the ultrasonic generator and the squeegee are disposed in the cleaning tank, and the squeegee is adapted to move at the bottom of the cleaning tank. In a preferred embodiment of the present invention, the cleaning module further includes a fixing member, and the fixing member is disposed on the base for fixing the cleaning module to the fluid supply device. In the example, the fixing member is, for example, a fastening device. In a preferred embodiment of the invention, the cleaning module described above is, for example, a tool holder for carrying the blade. The material of the blade is, for example, silicone, and the material of the holder is, for example, a magnetic material. In addition, the cleaning core assembly described above may further include a magnet movably disposed below the base to facilitate control of movement of the blade at the bottom of the cleaning tank. In one embodiment, the bottom of the base has, for example, a slide rail, and the magnet is disposed on the slide rail and moves along the slip. In a preferred embodiment of the present invention, the bottom of the cleaning tank has a plurality of air vents, and the cleaning module includes, for example, a pumping air.
1257882 15677twf. doc/m 泵’其即是連接於這些抽氣孔。 在本發明的較佳實施例中，當基座固定於待清洗之流 體供應裝置上時，流體供應裝置的喷孔是對應於清洗槽底 部之抽氣孔以外之處。 本發明提出一種清洗模組，其是用以清洗流體供應裝 置之噴孔。此清洗模組包括基座、到刀、刀座以及磁鐵。 其中，基座具有一清洗槽，刮刀是配置於清洗槽内，且適 於在清洗槽的底部移動。刀座是用以承載刮刀，且其材質 為磁性材料。磁鐵是可移動地配置在基座下方，用以控制 刮刀在清洗槽底部的移動。 在本發明的較佳實施例中，上述之基座之底部例如是 具有一滑執，且磁鐵例如是配置於此滑執上，並沿此滑執 而移動。 在本發明的較佳實施例中，上述之清洗槽的底部是具 有多個抽氣孔，且上述之清洗模組例如是更包 泵，其即是義於這些減孔。 # & 本發明還提出一種流體供應裝置的清洗方法，其是用 以清洗流體供應裝置的噴孔。此方法是先將—清洗模袓固 定於流體供應裝置上，其中此清洗模組具有一清洗槽、，而 流體供應裝置之噴孔是位於此清洗槽内。接著，提^夜體 於清洗槽内。然後，提供超音波，以於清洗槽内產生超音 波震盘。郷’刮除噴孔上_著物。之後再將清洗模二 與流體供應裝置分離。 、 在本發明的較佳實施例中，提供液體於清洗槽内的方 1257882 15677twf.doc/m • 法例如是藉由上述之流體供應裝置來提供。 在本發明的較佳實施例中，上述清洗方法中所使用之 起曰波的頻率例如是介於20kHz至80kHz之間。 在本發明的較佳實施例中，上述清洗方法在刮除喷孔 上之附著物的同時，例如是更包括將液體抽出清洗槽。 本發明之清洗模組可有效地清除流體供應裝置之喷孔 上的阻塞物，進而延長流體供應裝置的使用壽命。此外， φ 本發明之清洗方法能夠大幅縮短工時，進而提高清洗製程 的效率。 >為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 ΰ V 口 【實施方式】 圖1繪示為本發明之一較佳實施例中清洗模組的立體 透視圖。圖2則繪示為待清洗之流體供應裝置配置於圖工 ，清洗模組上的立體示意圖。請參照圖丨，清洗模組1〇〇 _ 疋用以清洗流體供應裝置（未緣示）的喷孔。舉例來說， ，淪是用以形成彩色濾光片上之色塊、有機電激發光顯示 器之有機發光層或是聚合物保護層的喷墨頭，均可利用本 發明之清洗模組100來進行喷孔的清洗。 請參照圖1及圖2,清洗模組丨⑻例如是由基座11〇、 起曰波產生态120以及刮刀130所構成。其中，基座11〇 例如是呈長條狀，且其長度L約為1〇〇毫米。而且，基座 具有一清洗槽112，用以容置待清洗之流體供應裝置 1257882 15677twf.doc/m HM的贺孔（未缘示）’如圖2所示。而且，本實施例特 在基座110上設置-固定件102，其例如是位於基座11〇 兩端的扣合夾具。如此-來，當待清洗之流體供應裝置104 配置於/月洗模組100上時，即可藉由固定件1〇2將待清洗 之流體供應裝置1〇4與基座110扣合，以使待清洗之流體 供應裝置104在清洗過程中能夠固定於清洗模組上， 如圖2所*。當，然’待清洗之流體供應裝置1〇4也可以以 其他方式a定於基座no上，本發明縣對其加以限定。 請繼續參照ϋ 1，刮刀130是可移動地配置於清洗槽 112之底部’用以刮除待清洗之噴孔（未緣示）上的阻塞 物。特別值得注意的是，本發明例如是以超距力來控制到 刀=在清洗槽112底部的移動。舉例來說，清洗模組⑽ 歹1如疋包括用以承載刮刀130的刀座132(如圖3所示）， ^刀座132㈣是由磁性材料所構成，而基座11〇下方則 5ft鐵134。其中’磁鐵134例如是配置於基座底 :戶=:丄 並沿著滑軌m而移動。因此，磁性材 座132將受到其與磁鐵134之間的磁力而隨 m m，動，進而使刮刀13。亦隨著磁鐵134而在清 ，无槽112之底部移動。 此外，刮刀130的材質為軟質材料 程中對噴孔造成磨損。在—奸㊣㈣φ 3免在心先過 質例如是石夕膠。 在幸乂“域中’刮刀130的材 112 ί再tt!、、圖卜超音波產生器120是配置於清洗槽 3曰波產生為120例如是由兩組線圈所構成， 1257882 15677twf. doc/m 其是分別配置於清洗槽112的兩側邊。在—實施例中，超 音波產生器120例如是用以產生2_ζ至8〇kHz的超音 波，以於清洗槽112内產生超音波震堡而去除待清洗之喷 孔上的阻塞物。 值得提的疋，在一較佳實施例中，清洗模組丨⑻更 包括一抽氣泵140，且基座110之清洗槽112底部具有多 個抽氣孔116，其孔徑例如是丨毫米。抽氣泵14〇即是連 φ 接至這些抽氣孔116，用以將清洗過程中在清洗槽112内 所產生的廢液抽出，以便於進一步地提高清洗模組1〇〇的 清洗功效。特別注意的是，當清洗模組1〇〇之基座11〇固 定於待清洗之流體供應裝置1〇4上時，此流體供應裝置的 喷孔係對應於這些抽氣孔116以外之處。換言之，抽氣孔 116不與待清洗之噴孔相對，以避免在抽氣過程中對流體 供應裝置造成損壞。 為使熟習此技藝者更加瞭解使用本發明之清洗模組來 對流體供應裝置進行清洗的方法，以下將舉實施例說明之。 _ 圖4繪示為本發明之較佳實施例中流體供應裝置的清 洗步驟流程圖。請同時參照圖1、圖2及圖4,首先進行步 驟S400,以將待清洗之流體供應裝置1〇4固定於清洗模組 100上。在此，其例如是利用固定件1〇2而將流體供應裝 置104固定於清洗模組10〇之基座ι10上。此時，流體供 應裝置104的喷孔是位於清洗槽112内。之後，進行步驟 S402，以於清洗槽112内提供用以清洗噴孔的液體。在一 實施例中，提供此液體的方法例如是藉由流體供應裝置 1257882 15677twf.doc/m 舉例來說’若流體供應裝置104為喷墨擊r 中所使用的1 墨頭，在步驟_中則是進行觸發喷黑衣心 以使其持續喷墨約5秒鐘。 X、土碩， §然’熟習此技蔽者雁辞左苦 ^ 液體除了由流體供應裝置104本身所提 以是機溶劑，本發明並未對其加以限= 口月參妝圖1、圖2及圖4，接 S404,也就是在清洗槽112喊供超音波，以使 内的液體產生超音波難，進岐流體供縣置^ 孔上的附者物掉落至清洗槽112内的液體中 驟 由圖1及圖2所示之超音波產生器120^ 生超曰波’且其例如是持續啟動超音波產生器12〇約 秒，以產生頻率介於20脱至8〇趾之間的超音波。 然後’進行步驟S406，以刮除噴孔上所剩餘的附著 物。在此，步驟S406例如是利用圖丨之刮刀13〇來刮 噴孔亡的附著物。而且’在一較佳實施例中，其例如是在 刮除喷孔上之附著物的同時，利用圖〗之抽氣泵14〇將清 洗槽112内含有從喷孔上刮下來之異物的廢液抽$，以確 保些異物不會再附著至喷孔上。其中，步驟S4〇6的操 作時間（包括刮除附著物與抽出液體）約為1〇秒鐘。” 之後，將流體供應裝置104與基座110分離，如步驟 S408所述。此即完成流體供應裝置1〇4之喷孔的清洗。 綜上所述，本發明之清洗模組係先以超音波震盪來去 除流體供應裝置之喷孔上的阻塞物，接著再以刮刀刮抹喷 11 1257882 15677twf.doc/m 孔:以便於進-步去除殘留在喷孔上的阻塞物。並且在刮 抹喷孔的同時，以錢泵抽取清洗槽_液體，以將清洗 過程中所產生的廢液抽出清賴。由此可知，本發明之清 洗模組可有效地清除流體供縣置之似上的阻塞物，進 而延長流體供應裝置的使用壽命。 此外’習知清洗流體供應裝置所需的工時長達分鐘 至15分鐘’㈣用本發明之清洗方法來清洗流體供應裝置 僅需約80秒至120秒。由此可知，本發明與習知相較之下 能夠大幅縮短工時，進而提高清洗製程的效率。1257882 15677twf. doc/m pump's which are connected to these suction holes. In a preferred embodiment of the invention, when the base is fixed to the fluid supply means to be cleaned, the orifice of the fluid supply means is outside the suction opening of the bottom of the cleaning tank. The present invention provides a cleaning module for cleaning an orifice of a fluid supply device. The cleaning module includes a base, a knife, a holder, and a magnet. The susceptor has a cleaning tank, and the squeegee is disposed in the cleaning tank and is adapted to move at the bottom of the cleaning tank. The holder is used to carry the scraper and is made of magnetic material. The magnet is movably disposed below the base to control the movement of the scraper at the bottom of the wash tank. In a preferred embodiment of the invention, the bottom of the base has, for example, a slip, and the magnet is, for example, disposed on the slide and moves along the slide. In a preferred embodiment of the invention, the bottom of the cleaning tank has a plurality of air venting holes, and the cleaning module is, for example, a further pump, which is intended to be used for these holes. # & The present invention also proposes a cleaning method of a fluid supply device for cleaning an orifice of a fluid supply device. In this method, the cleaning mold is first fixed to the fluid supply device, wherein the cleaning module has a cleaning tank, and the orifice of the fluid supply device is located in the cleaning tank. Next, the night body is lifted in the cleaning tank. Ultrasonic waves are then provided to create an ultrasonic shock disk in the cleaning tank.郷 'Scrape the hole on the nozzle. The cleaning die 2 is then separated from the fluid supply. In a preferred embodiment of the invention, the means for providing liquid in the bath is provided, for example, by the fluid supply means described above. In a preferred embodiment of the invention, the frequency of the chopping waves used in the cleaning method is, for example, between 20 kHz and 80 kHz. In a preferred embodiment of the invention, the cleaning method, while scraping off the deposit on the orifice, for example, further includes drawing the liquid out of the cleaning tank. The cleaning module of the present invention can effectively remove the obstruction on the orifice of the fluid supply device, thereby prolonging the service life of the fluid supply device. Further, φ the cleaning method of the present invention can greatly shorten the man-hour and further improve the efficiency of the cleaning process. The above and other objects, features, and advantages of the present invention will become more apparent from the description of the appended claims appended claims ΰV Port [Embodiment] FIG. 1 is a perspective perspective view of a cleaning module in accordance with a preferred embodiment of the present invention. FIG. 2 is a schematic perspective view showing the fluid supply device to be cleaned disposed on the drawing and cleaning module. Referring to the drawing, the cleaning module 1 〇〇 _ 疋 is used to clean the orifice of the fluid supply device (not shown). For example, the crucible is an inkjet head for forming a color patch on a color filter, an organic light emitting layer of an organic electroluminescence display, or a polymer protective layer, and the cleaning module 100 of the present invention can be utilized. The nozzle is cleaned. Referring to FIGS. 1 and 2, the cleaning module (8) is composed of, for example, a susceptor 11 〇, a choking generating state 120, and a doctor blade 130. The pedestal 11 〇 is, for example, elongated and has a length L of about 1 mm. Further, the base has a cleaning tank 112 for accommodating a hole (not shown) of the fluid supply device 1257882 15677twf.doc/m HM to be cleaned as shown in Fig. 2 . Moreover, the present embodiment is provided with a fixing member 102 on the base 110, which is, for example, a fastening jig located at both ends of the base 11'. In this way, when the fluid supply device 104 to be cleaned is disposed on the monthly cleaning module 100, the fluid supply device 1〇4 to be cleaned can be fastened to the base 110 by the fixing member 1〇2, The fluid supply device 104 to be cleaned can be fixed to the cleaning module during the cleaning process, as shown in FIG. When the fluid supply device 1 to 4 to be cleaned can also be fixed to the susceptor no other way, the present invention defines it. Referring to ϋ 1, the blade 130 is movably disposed at the bottom of the cleaning tank 112 to scrape the obstruction on the nozzle to be cleaned (not shown). It is particularly noteworthy that the invention is controlled, for example, by over-range force to the knife = movement at the bottom of the cleaning tank 112. For example, the cleaning module (10) 疋1 includes, for example, a holder 132 for carrying the scraper 130 (as shown in FIG. 3), the holder 132 (four) is made of a magnetic material, and the base 11 is 5 ft under the base. 134. Here, the magnet 134 is disposed, for example, at the bottom of the base: household =: 丄 and moves along the slide rail m. Therefore, the magnetic material holder 132 will be subjected to the magnetic force between it and the magnet 134 to move with the m m to further the blade 13. It also moves with the magnet 134 at the bottom of the clear, non-groove 112. In addition, the scraper 130 is made of a soft material that causes wear to the nozzle holes. In the case of traits (four) φ 3 in the heart of the first quality, such as Shi Xijiao. In the "domain" of the scraper 130, the material of the scraper 130 is Δ!, and the ultrasonic generator 120 is disposed in the cleaning tank 3. The chopping wave is 120, for example, composed of two sets of coils, 1257882 15677twf. doc/ m is disposed on both sides of the cleaning tank 112. In the embodiment, the ultrasonic generator 120 is used to generate ultrasonic waves of 2_ζ to 8〇 kHz, for example, to generate ultrasonic sound waves in the cleaning tank 112. And removing the obstruction on the nozzle hole to be cleaned. It is worth mentioning that, in a preferred embodiment, the cleaning module (8) further includes an air pump 140, and the bottom of the cleaning tank 112 of the base 110 has a plurality of pumping The air hole 116 has a hole diameter of, for example, 丨 mm. The air pump 14 is connected to the air venting holes 116 to extract the waste liquid generated in the cleaning tank 112 during the cleaning process, so as to further improve the cleaning mode. The cleaning effect of the group 1〇〇. It is particularly noted that when the base 11 of the cleaning module 1 is fixed to the fluid supply device 1〇4 to be cleaned, the orifice of the fluid supply device corresponds to these Outside the air vent 116. In other words, the air vent 116 Opposite the orifice to be cleaned to avoid damage to the fluid supply during pumping. To familiarize those skilled in the art with a better understanding of the method of cleaning the fluid supply using the cleaning module of the present invention, 4 is a flow chart of a cleaning step of a fluid supply device according to a preferred embodiment of the present invention. Referring to FIG. 1, FIG. 2 and FIG. 4 simultaneously, step S400 is first performed to remove the liquid to be cleaned. The fluid supply device 1〇4 is fixed to the cleaning module 100. Here, for example, the fluid supply device 104 is fixed to the base 1010 of the cleaning module 10 by using the fixing member 1〇2. At this time, the fluid supply The orifice of the device 104 is located in the cleaning tank 112. Thereafter, step S402 is performed to provide a liquid for cleaning the orifice in the cleaning tank 112. In one embodiment, the method of providing the liquid is, for example, by a fluid supply. Device 1257882 15677twf.doc/m For example, 'If the fluid supply device 104 is the 1 ink head used in the inkjet r, in step _ it is triggered to spray the black core to make it continue to eject ink for about 5 seconds. Clock. X, Master, § 然 'Family familiar with this technology geese geese left bitter ^ liquid in addition to the fluid supply device 104 itself is a machine solvent, the invention does not limit it = mouth month makeup Figure 1, Figure 2 and 4, connected to S404, that is, the ultrasonic wave is shouted in the cleaning tank 112, so that the liquid inside is difficult to generate ultrasonic waves, and the inlet fluid is supplied to the liquid in the cleaning tank 112. The ultrasonic generator 120 shown in FIGS. 1 and 2 generates a super-chopper' and it is, for example, continuously activated the ultrasonic generator 12 for about two seconds to generate an ultra-frequency between 20 and 8 toes. Sound wave. Then, step S406 is performed to scrape off the deposit remaining on the orifice. Here, in step S406, for example, the blade 13 〇 is used to scrape the deposit of the hole. Moreover, in a preferred embodiment, for example, while scraping off the deposit on the orifice, the waste liquid of the cleaning tank 112 containing the foreign matter scraped from the orifice is used by the air pump 14 of the drawing. Pump $ to make sure that some foreign objects do not stick to the orifice. The operation time of step S4〇6 (including scraping the attached matter and extracting the liquid) is about 1 second. After that, the fluid supply device 104 is separated from the base 110, as described in step S408. This completes the cleaning of the nozzle holes of the fluid supply device 1〇4. In summary, the cleaning module of the present invention is first super The sound wave is oscillated to remove the obstruction from the orifice of the fluid supply device, and then the nozzle is sprayed with a scraper 11 1257882 15677 twf.doc/m hole: in order to further remove the obstruction remaining on the orifice, and scrape At the same time of the injection hole, the cleaning tank_liquid is pumped by the money pump to extract the waste liquid generated during the cleaning process. It can be seen that the cleaning module of the invention can effectively remove the fluid for the county. Obstruction, thereby extending the service life of the fluid supply device. Further, the conventional cleaning fluid supply device requires a working time of up to 15 minutes. (4) It takes only about 80 seconds to clean the fluid supply device by the cleaning method of the present invention. 120 seconds, it can be seen that the present invention can significantly shorten the working hours and improve the efficiency of the cleaning process as compared with the prior art.
雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作些許之更動與潤飾，因此本發明之^護 範圍當視後附之申請專利範圍所界定者為準。 X 【圖式簡單說明】 圖1繪示本發明之一較佳實施例中清洗模組的立體 視圖。 一 圖2緣示為待清洗之流體供應裝置配置於圖1之清洗 模組上的立體示意圖。 月’ 圖3緣示為圖i之刮刀與刀座的放大示意圖。 圖4綠示為本發明之較佳實施例中流體供應裝置的产 洗步驟流程圖。 β 【主要元件符號說明】 100 :清洗模組 102 :固定件 12 1257882 15677twf.doc/m 104 :流體供應裝置 110 :基座 112 :清洗槽 114 :滑軌 116 :抽氣孔 120 :超音波產生器 130 :刮刀 132 :刀座While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application. X [Simple Description of the Drawings] Figure 1 is a perspective view of a cleaning module in accordance with a preferred embodiment of the present invention. Figure 2 is a perspective view showing the fluid supply device to be cleaned disposed on the cleaning module of Figure 1. Month' Figure 3 is a magnified view of the blade and the holder of Figure i. Figure 4 is a flow chart showing the steps of the washing of the fluid supply device in the preferred embodiment of the present invention. β [Main component symbol description] 100: Cleaning module 102: Fixing member 12 1257882 15677twf.doc/m 104: Fluid supply device 110: Base 112: Cleaning tank 114: Slide rail 116: Ventilation hole 120: Ultrasonic generator 130: scraper 132: knife holder
134 :磁鐵 140 :抽氣泵 S400 :將一清洗模組固定於待清洗之流體供應裝置上 S402 :於清洗槽内提供用以清洗喷孔的液體 S404 :在清洗槽内提供超音波，以使清洗槽内的液體 產生超音波震盪 S406 :刮除喷孔上之附著物，並抽出清洗槽内含有從 喷孔上刮下來之異物的廢液 S408 :將流體供應裝置與清洗模組分離 13134: magnet 140: air pump S400: fixing a cleaning module to the fluid supply device to be cleaned S402: providing a liquid S404 for cleaning the nozzle hole in the cleaning tank: providing ultrasonic waves in the cleaning tank for cleaning The liquid in the tank generates ultrasonic oscillation S406: scraping off the deposit on the nozzle hole, and extracting waste liquid S408 containing the foreign matter scraped from the spray hole in the cleaning tank: separating the fluid supply device from the cleaning module 13