TWI257685B - IC pick-up head structure suitable for testing bases of different sizes - Google Patents

IC pick-up head structure suitable for testing bases of different sizes Download PDF

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Publication number
TWI257685B
TWI257685B TW94117255A TW94117255A TWI257685B TW I257685 B TWI257685 B TW I257685B TW 94117255 A TW94117255 A TW 94117255A TW 94117255 A TW94117255 A TW 94117255A TW I257685 B TWI257685 B TW I257685B
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Taiwan
Prior art keywords
pick
nozzle
test
seat
place
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TW94117255A
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Chinese (zh)
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TW200642032A (en
Inventor
Wen-Tang Luo
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Motech Taiwan Automatic Corp
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Publication of TW200642032A publication Critical patent/TW200642032A/en

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Abstract

The present invention relates to an IC pick-up head structure suitable for testing bases of different sizes, comprising: fixing a substrate with positioning jig below a vertical bracket whose side is disposed with a sliding board capable of sliding up-and-down through a sliding track bracket; installing a penetratable base and a IC nozzle of the positioning jig below the sliding board whose side is connected to a Z-axis driving source; disposing a pressing tank, whose flexible pole end is fixed to the top of the vertical bracket, on the sliding board. When the Z-axis driving source couples the decline of the sliding board, it is capable of coupling the decline of the vertical bracket and starting a testing base by pressing the positioning jig downward. After that, the Z-axis will keep descending and begin to compress the pressing tank, making the IC nozzle stretching to a proper position to draw the IC in the testing base. Accordingly, by the elevation control of the sliding board by the Z-axis driving source, the extent of the stretching of the IC nozzle can be adjusted so as to apply to testing bases of different sizes and to satisfy the purpose of easy collocation and precise matching.

Description

1257685 九、發明說明: 【發明所屬之技術領域】 配應ί發r尤i旨其提供一種可確保精準對位且便於更換搭 放^結構。而有A降低成本之可_於不同規格測試套座之1C取 【先前技術】 質· ίϋ於完成後’需經過許多的測試才能確保產品的品1257685 IX. Description of the invention: [Technical field to which the invention pertains] The combination of the invention provides a structure that ensures accurate alignment and is easy to replace. And A can reduce the cost of _ can be taken in different specifications of the test set 1 [previous technology] quality · ϋ 完成 after completion ‘ many tests are required to ensure the product

試;往失Ί 2供分別置入並進行預燒測 座2 2圖二表則試套座2主要包括有底座2 1、上 ^19 .坐,&座2 1上設有數個可供1C接腳插設之插 =巧11 ’亚於所需使_之插置孔211内 1之ΓΓΓΡ插人時予以壓夹定位,上座2 2係架設於底 方升方’,、吻黃2 2 1及滑片2 2 2支樓於底座2 1上 顯212外張,Trying; going to the missing 2 for separate placement and pre-burning the test stand 2 2 Figure 2 The test set 2 mainly includes the base 2 1 , the upper ^ 19 . Sitting, & the seat 2 1 is available for several 1C pin insertion plug = Qiao 11 'Achieve the need to insert _ into the hole 211 1 when inserting the person to clamp the position, the upper seat 2 2 is set at the bottom of the rise ',, kiss yellow 2 2 1 and slide 2 2 2 building on the base 2 1 on the display 212,

接聊’以壓夾固定IC,1 2夾合1C 框孥内,糸扯罢士午5丨压J 3係狄於底座2 1及上座2 2之 置導iif #引粒使用’其導斜面2 3 1可供1C . 211:夂門m妾腳對位插入底座21對應之插置孔 百又m从明,丄閱弟4圖,為了便於在測試套座内取放iC,目前 可作直立導架31以滑執組3 2架設於一 3 3,且壓缸,結板4上固設有-壓缸 扳3 5,另1C吸嘴則可由另 0 ^ ^ 降並 3 严兒弟6圖’吾z軸向驅動源持續 力大於測試繼娜⑵彈力, 1257685 、.貝下降,並以定位治具3 4壓縮彈簧2 2丄,而使上 =開啟底座2 1之金屬夾片212 ;請參閱第7圖,⑨定 3 4使上座2 2下降至底點時,若z軸向驅動源未碰 持續下降時,則因Z軸向驅動源之動力大於壓虹3 =而 ^式=1=以’進而以伸縮桿3313=^Talk about 'fixing the IC with a clamp, 1 2 clips 1C inside the box, licking the striker at 5 pm, pressing the J 3 line on the base 2 1 and the upper seat 2 2 guiding the iif #引粒用' its guiding slope 2 3 1 is available for 1C. 211: 夂 妾 m 妾 对 对 插入 插入 插入 插入 插入 插入 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 The upright guide frame 31 is erected in the sliding group 3 2 at a 33, and the pressure cylinder, the base plate 4 is fixed with a pressure cylinder wrench 3 5, and the other 1C nozzle can be lowered by another 0 ^ ^ and 3 6Fig. 'The axial driving force of the z-axis drive source is greater than the test succession (2) elastic force, 1257685, . . . , and the positioning fixture 3 4 compression spring 2 2丄, and the upper metal plate 212 of the base 2 1 Please refer to Figure 7, 9 to 3 4 when the upper seat 2 2 is lowered to the bottom point, if the z-axis drive source does not touch continuously, then the power of the Z-axis drive source is greater than the pressure of the rainbow 3 = =1=to 'further with the telescopic rod 3313=^

万式I方止疋位治具3 4強力擠壓損傷到上座2 9 •过卩G 嘴3 6上:,而可順利的將IC取出脫離測試套座2 : 笛】 0圖,接著z轴向驅動源會反向帶動直立導架 肖 > 兒 業,,射1 1 SI,囉的,當要[放IC時 」 帶動連結板4下降並使定位治具3 4壓抵 ^^=原4 2 2 ;請參閱第1 2圖,妯a听私、店址P 矣庄2〜上座 上座2 2下降至底點定位,以開啟底座2丄2 , 請參閱第13圖,由於底座2丄之金屬夾片卩。^, 内。上述的動作中,特別要說明的是: 丄 1 .請參閱第8圖’1C吸嘴3 6的伸出量 使上座2 2下降至底點定位時,其壓^位治具3 4 u),亦即該距離越大時,IC吸嘴3 f=距離 才能使IC吸嘴3 6伸出接觸到1C表 中須越大, 又取決於測試套座2的離 因=軸⑷則 2,將會產㈣的距以;十目二此不同規格_^^ 卿1 (A ),則1c吸嘴3 6就必須可以 1257685 改變伸出量,以使1C吸嘴3 6伸出時能接觸到1C表面,惟 該取放頭3之1C吸嘴3 6,其伸出量係由壓缸3 7控制伸 縮’而壓缸3 7伸縮位置只有上死點及下死點兩個定點位 置,因此1C吸嘴3 6伸出時只能位在壓缸3 7的下死點位 置,而無法因應不同規格之測試套座2來變換使用,使得當 不同規格之測試套座2時,則必須更換壓缸3 7及ic吸田 餐3 6 ’造成組裝及使用上極大的不便。10,000 type I square stop fixture 3 4 strong crush damage to the upper seat 2 9 • over 卩G mouth 3 6 on:, and can smoothly take the IC out of the test socket 2: flute 0 graph, then z-axis To the driving source, the vertical guide frame will be driven in the opposite direction, and the machine will be 1 1 SI, and when it is to be placed, the connecting plate 4 will be lowered and the positioning fixture 3 4 will be pressed against the ^^= 4 2 2 ; Please refer to Figure 1 2, 妯a listen, shop P 矣 2 2, the upper seat 2 2 descend to the bottom point to open the base 2 丄 2, please refer to Figure 13, due to the base 2 丄The metal clip is 卩. ^, inside. In the above-mentioned actions, it is particularly important to note that: 丄1. Please refer to Fig. 8 '1C. The amount of protrusion of the nozzle 3 6 causes the upper seat 2 2 to descend to the bottom point, and the pressure gauge 3 4 u) , that is, the larger the distance, the IC nozzle 3 f = distance can make the IC nozzle 3 6 reach out to the 1C table, the larger the distance depends on the test socket 2, the axis (4), 2 Will produce (four) the distance; ten mesh two different specifications _^^ Qing 1 (A), then 1c nozzle 3 6 must be able to change the amount of protrusion 1257683, so that the 1C nozzle 3 6 can be reached when extended 1C surface, but the 1C nozzle 3 6 of the pick-up head 3 is extended by the pressure cylinder 37. The cylinder 3 7 has only two fixed positions of top dead center and bottom dead center. When the 1C nozzle 3 6 is extended, it can only be placed at the bottom dead center position of the pressure cylinder 37, and cannot be changed according to the test socket 2 of different specifications, so that when the test socket 2 of different specifications is used, it must be replaced. The pressure cylinder 3 7 and the ic suction table meal 3 6 ' cause great inconvenience in assembly and use.

2 ·請參閱第1 3圖,如前所述,該取放頭3之1C吸嘴3 6,其 伸出量係由壓缸3 7控制伸縮,而壓缸3 7伸縮位置只有^ 死點及下死點兩個定點位置,因此1C吸嘴在以空投的方式釋 放ic日守,只能位在壓缸3 7的上死點位置,而此位置空投釋 放ic仍顯得距離位置過高,導致IC較無法準確沿著導弓j座 2 3之導斜面2 3 1滑入以對位插入底座2 1内。 XA 鑑此 〜本發明即為解決上述的問題,設計一種可更加準確置 為本驗更衫嶋狀寸娜_上,此即 【發明内容】 ^發明之主要目的係提供—種可翻於不同規格測試套座之 動係湘2轴,_源帶騎動板下降時,同時帶 同的所伸出’而可· z軸驅絲控制1c吸嘴伸出至不 吸二,以吸取測試套座内之IC;藉此,即可調整嫩 搭配變換各種不同規格之測試套座使用,達到易於 1C取1=4另=的係提供—種可適驗不同規格測試套座之 動1C吸喈久山糸利用Z軸驅動源帶動滑動板下降時,同時帶 同的所t定^,可^ z軸驅動源控制1C吸嘴伸出至不 式釋放葬侍€吸嘴伸出至最適當的位置,再以空投的方 加準確允投置曰’^J調整控制1^嘴的伸出量,以使得1C更 隹工技置人測咸套座内,達到準確對位之目的。 1257685 本發明之又一目的係提供一種可適用於不同規格測試 套座之1C取放頭結構,其係利用z軸驅動源帶動滑動板下降時, 同時帶動1C吸嘴下降伸出,而可利用Z轴驅動源控制1〇及 出至不同的所需定點,使得1C吸嘴的伸縮勿需再設一壓缸,即能 伸出至最適當的位置;藉此,即可有效降低設備的成本, i 用之目的。 J貝 【實施方式】 請參閱第14、15圖,本發明之取放頭5係具有一直立導 架51,該直立導架51下方橫向固設一基板5 2,以及於基板 5 2下方再連結固設一定位治具5 3,另於直立導架51侧方以 滑軌5 4架設一可升降滑移之滑動板5 5,該滑動板5 5下方 設有一可穿伸基板5 2及定位治具5 3之1C吸嘴5 6,而可由^ 動板5 5帶動升降,另ic吸嘴5 6套設有一導座5 7,一負厭二 路5 8可經由導座5 7通入1C吸嘴5 6内,以使ic吸嘴 呈負壓狀態吸取1C,導座5 7與滑動板5 5間並套設有彈蕃 彈力,可使IC吸嘴5 6連結於滑動板5 5, 用滑動板5 5上滑動,以提供緩衝位移作 用另於π動板5 5上方以-橫向架板6 Q架設—壓缸 使該壓缸61之伸縮桿6 2端部固定限位於直立導架5】 方壓缸6 1於正常通氣狀態時,可由伸縮桿6 2的伸出, 而5 5滑設於直立導架5 1側方最上方位置,另於滑動 板5 5的另-侧連結裝設連結板7 叮j 於-傳動機構上,而帶動料杯7你γ ν 板7則可—又 述)’其中,2軸向_動方式一般 用程式控制馬達’而使連結 會帶;時,2軸_源 1257685 而使滑動板55滑設位於直立導架5!側方最上方 請茶閱第17圖’當z轴向驅動源持續下降時 巧之氣麵力大於測試套座2之彈簧,因 3 ”2績下降,並以定位治具5 3壓縮測試套座2Ϊ彈ί 】^而使上座2 2下降至底點’以開啟底座2工之金屬 取1C ; Ζ軸向驅動源再持續下降,因定位治呈大5^== 旦=ί^Γΐ5^無法再下降,此時又因ζ轴向 下p牛力里大於Μ缸6 1之氣壓壓力,而開始陶 可調整iiue ,用控制ζ軸向驅_的作動, 嘴56吸取1C。 角之負廢官路58,使ic吸 下降:====確f持續 滑動板5 5即開始壓縮彈簧5 9並下降;;==f再下T =時 ^^5 5iff, 1257685 方進而接續帶動直立導架51及定 壓抵測試套座2之上庙9 9 iv — # 一 ΰ d上升,而脫離 元成吸取1。的作業。 ^動賴板7下降,並域結板7帶_棘;2=動^會 疋位!I具5 3壓抵到測試套座2之上座2 2。、牛而使 5 ΐίίίί 2Ζ軸向驅動源持續下降時’直立導架 日+,亚以疋位治具5 3壓縮測試套座2之彈菩、 g ^而使上座2 2下降至底點,啟底座2 ι :金屬夹片 ^閱第2 4圖,當定位紗53使上座2 :’由於已開啟底座2 i之金屬夾片2 2 2,因此 g 放ic; z軸向驅動源再持續下降,使 進仃置 ^ί;ϊ;ί!ί^IC^2 · Please refer to Fig. 1 3, as mentioned above, the nozzle 1 3 of the pick-and-place head 3 is extended by the pressure cylinder 37, and the telescopic position of the cylinder 3 is only dead. And the bottom dead center is two fixed point positions, so the 1C nozzle releases the ic day guard in an airdrop manner, and can only be placed at the top dead center position of the pressure cylinder 37, and the empty release ic at this position still appears to be too high in the distance position. As a result, the IC is less likely to slide accurately along the guide bevel 2 3 1 of the guide jeat 2 3 to be inserted into the base 2 1 in the opposite position. XA _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The test test set is driven by the Xiang 2 axis. When the _ source belt is lowered, the same extension is carried out. The z-axis drive wire controls the 1c nozzle to extend to the second to absorb the test sleeve. The IC inside the seat; by this, you can adjust the tender matching and change the test sockets of various specifications, and it is easy to use 1C to take 1=4 and the other is provided. The type 1C can be tested for different specifications. When Jiushanyu uses the Z-axis drive source to drive the sliding plate to descend, at the same time, the same t-axis can be used. The z-axis drive source controls the 1C nozzle to extend to the non-release release. The nozzle extends to the most appropriate position. Then, the airdrop can be accurately placed to adjust the amount of protrusion of the ^^J to control the 1^ mouth, so that the 1C is more suitable for the technician to test the salty seat to achieve the purpose of accurate alignment. 1257685 Another object of the present invention is to provide a 1C pick-and-place head structure that can be applied to test sleeves of different specifications, which utilizes a z-axis driving source to drive the sliding plate to descend, and simultaneously drives the 1C nozzle to descend and protrude, and can be utilized. The Z-axis drive source controls 1 〇 and out to different required fixed points, so that the 1C nozzle can be extended to the most appropriate position without the need for a pressure cylinder; thereby, the cost of the device can be effectively reduced. i purpose. [Embodiment] Referring to Figures 14 and 15, the pick-and-place head 5 of the present invention has a standing guide frame 51, and a substrate 52 is fixed laterally below the upright guide 51, and below the substrate 52. A sliding fixture 5 5 is disposed on the side of the vertical guide frame 51, and a slideable plate 5 5 is mounted on the side of the vertical guide frame 51. The slide plate 5 5 is provided with a pierceable substrate 52 and Positioning fixture 5 3 of 1C nozzle 5 6, and can be lifted by the movable plate 5 5, another ic nozzle 5 6 sets with a guide seat 5 7, a negative anatomy 2 8 can pass through the guide 5 7 Into the 1C nozzle 5 6 , so that the ic nozzle sucks 1C in a negative pressure state, and the guide seat 57 and the sliding plate 5 5 are sleeved with an elastic force, so that the IC nozzle 56 is coupled to the sliding plate 5 5, sliding with the sliding plate 5 5 to provide a buffer displacement effect and above the π-moving plate 5 5 - transverse frame 6 Q erection - the cylinder makes the end of the telescopic rod 6 2 of the cylinder 61 fixed to the erect Guide frame 5] When the square pressure cylinder 6 1 is in the normal ventilation state, it can be extended by the telescopic rod 6 2 , and 5 5 is slidably disposed at the uppermost position on the side of the vertical guide frame 5 1 , and the other part of the sliding plate 5 5 Side link installation link 7 叮j on the transmission mechanism, and drive the cup 7 you γ ν plate 7 can be - again) 'Where, 2 axial _ motion mode generally uses the program to control the motor' and the connection will bring; 2, 2 axes _Source 1257685 and slide plate 55 is located at the top of the upright guide 5! Please read the 17th figure 'When the z-axis drive source continues to drop, the air force is better than the spring of the test socket 2, because 3 "2 performance decline, and with the positioning fixture 5 3 compression test socket 2 Ϊ ί ^ ^ and the upper seat 2 2 down to the bottom point 'to open the base 2 metal to take 1C; Ζ axial drive source continues to decline Because the positioning treatment is large 5^== Dan = ί^Γΐ5^ can no longer fall, at this time, because the axial force of the 下 下 牛 牛 牛 Μ Μ Μ Μ 6 6 6 6 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶ζAxial drive _ actuation, mouth 56 draws 1 C. The negative angle of the official road 58 makes the ic suction drop: ==== YES f continues to slide the plate 5 5 to start compressing the spring 5 9 and descend;; == f Then, when T = ^^^5 5iff, 1257685, then the erecting guide 51 and the constant pressure against the test pedestal 2 above the temple 9 9 iv — #一ΰ d rise, and the separation from the Yuan into the suction 1. ^ Move the board 7 down, and the domain board 7 belt _ spine; 2 = move ^ will 疋 position! I have 5 3 pressure to the test seat 2 above the seat 2 2, and the cow makes 5 ΐ ί ί ί ί Ζ When the source continues to drop, the 'erect guide day +, the sub-position of the jig 5 3 compression test set 2 of the bomb, g ^ and the upper seat 2 2 down to the bottom point, the base 2 ι: metal clips ^ read In Fig. 24, when the positioning yarn 53 is used to make the upper seat 2: 'Because the metal clip 2 2 2 of the base 2 i has been opened, g is placed on the ic; z axial drive source continues to descend, so that the input is placed; ; ί! ί^IC^

二:“二 狀態,而以近距離空投的方式,使IC 之金ί = ? 25 L,iίIC吸嘴5 6釋放1C後,由於底座2 1 之至廣夾片2 1 2已開啟,因此忙沿著導弓丨座2 2 3 1滑入’而使ic接腳對位插入底座2丄内,由於ic吸嘴 5 6可由Z軸向驅動源控制下降至適#距離,因此可 投的方式將1C纽職套油,使得IC的置㈣蚊 ^ 綜上所述,本發明之取放頭不僅可利用z轴向驅動源 c 吸嘴的伸出量,以配合各種不同規格之測試套座吸取 可近距離空投置放IC,.以提高置放IC6々準確度,且ic吸二# 需另設控制伸出及收回之壓紅,從而大幅提高 。Two: "Two states, and in a close-range airdrop, the IC's gold ί = ? 25 L, iίIC nozzle 5 6 release 1C, since the base 2 1 to the wide clip 2 1 2 is turned on, so busy along The guide bow seat 2 2 3 1 slides into the 'the ic pin is inserted into the base 2丄, since the ic nozzle 5 6 can be controlled by the Z-axis drive source to drop to the appropriate distance, so the investment method will be 1C New Zealand set of oil, so that the IC's (four) mosquitoes ^ In summary, the pick and place head of the present invention can not only use the z-axis drive source c nozzle extension, in order to match the various test suites of different specifications The IC can be placed in close proximity to increase the accuracy of IC6, and the ic suction 2 needs to be additionally controlled to extend and retract the red, which greatly increases.

【圖式簡單說明】 I 第1圖:崩應板陣列插設測試套座之示意圖。 第2圖·· 1C測試套座之零件分解圖。〜 第3圖:1C測試套座之組裝示意圖。 第4圖··習式1C取放頭之示意圖。 10 1257685 第5圖:習式1C取放頭吸取1C之示意圖(一)。 第6圖··習式1C取放頭吸取1C之示意圖(二)。 第7圖:習式1C取放頭吸取1C之示意圖(三)。 第8圖:習式1C取放頭吸取1C之示意圖(四)。 第9圖:習式1C取放頭吸取1C之示意圖(五)。 第1 0圖:習式1C取放頭吸取1C之示意圖(六) 第1 1圖:習式1C取放頭置放1C之示意圖(一) 第1 2圖:習式1C取放頭置放1C之示意圖(二) 第1 3圖:習式1C取放頭置放1C之示意圖(三) Φ 第14圖:本發明取放頭之示意圖。 第15圖:本發明多組取放頭之組裝示意圖。 第1 6圖:本發明取放頭吸取1C之示意圖(一 > 第1 7圖:本發明取放頭吸取1C之示意圖(二h 第1 8圖:本發明取放頭吸取1C之示意圖(三V 第1 9圖:本發明取放頭吸取1C之示意圖(四)c 第2 0圖:本發明取放頭吸取ic之示意圖(五)c 第2 1圖:本發明取放頭吸取1C之示意圖(六 第2 2圖:本發明取放頭置放1C之示意圖(一 > 第2 3圖:本發明取放頭置放1C之示意圖(二)C ⑩ 第2 4圖:本發明取放頭置放1C之示意圖(三> 第2 5圖:本發明取放頭置放1C之示意圖(四 【主要元件符號說明】 習式部份: , 1 :崩應板 2:測試套座 金屬夾片 滑片 21:底座 211:插置孔 212: 2 2 :上座 2 21 :彈簧 2 2 2: 2 3 :導引座 2 31 :導斜面 3 :取放頭 1257685 3 6 : 1C吸嘴 3 1 ··直立導架 3 2 ··滑執組 3 3 :壓缸 3 31 :伸縮桿 3 4 :定位治具 3 5 :基板 3 7 ··壓缸 4 :連結板 本發明部份: 5 :取放頭 5 1 直立導架 5 2 基板 5 4 滑軌 5 5 滑動板 5 7 導座 5 8 負壓管路 6 0 橫向架板 6 1 壓缸 7 :連結板 5 3 :定位治具 5 6 ·· 1C吸嘴 5 9 :彈箐 6 2 :伸縮桿[Simple description of the diagram] I Figure 1: Schematic diagram of the plug-in panel array test set. Figure 2 · Partial exploded view of the 1C test set. ~ Figure 3: Assembly diagram of the 1C test kit. Figure 4 · Schematic diagram of the 1C pick-and-place head. 10 1257685 Fig. 5: Schematic diagram of the 1C pick-up head sucking 1C (1). Figure 6 · Schematic diagram of the 1C pick-up head 1C (2). Figure 7: Schematic diagram of the 1C pick-up head sucking 1C (3). Figure 8: Schematic diagram of the 1C pick-up head sucking 1C (4). Figure 9: Schematic diagram of the 1C pick-up head sucking 1C (5). Figure 10: Schematic diagram of the 1C pick-up head sucking 1C (6) Figure 1 1: Schematic diagram of the 1C pick-up head placement 1C (1) Figure 1 2: Formula 1C pick-and-place placement Schematic diagram of 1C (2) Fig. 1 3: Schematic diagram of the 1C pick-up head placement 1C (3) Φ Figure 14: Schematic diagram of the pick-and-place head of the present invention. Figure 15 is a schematic view showing the assembly of the plurality of sets of pick and place heads of the present invention. Figure 6: Schematic diagram of the pick-and-place 1C of the present invention (1) Figure 17: Schematic diagram of the pick-and-place 1C of the present invention (2h Figure 18: Schematic diagram of the pick-and-place 1C of the present invention) Three V Figure 19: Schematic diagram of the pick-and-place head 1C of the present invention (4) c Figure 20: Schematic diagram of the pick-and-place ic of the present invention (5) c Figure 2: The pick-and-place head of the present invention draws 1C Schematic diagram of the sixth embodiment of the present invention (1) is a schematic diagram of the first embodiment of the present invention. (2) C 10 Figure 24: The present invention Schematic diagram of taking the placement head 1C (three) Figure 25: Schematic diagram of the 1C of the present invention. (Four main symbol descriptions): Part 1: 1 : Collapse board 2: Test set Seat clip slide 21: Base 211: Insert hole 212: 2 2 : Upper seat 2 21 : Spring 2 2 2: 2 3 : Guide seat 2 31 : Guide bevel 3: Pick and place head 1258685 3 6 : 1C suction Mouth 3 1 ··Upright guide frame 3 2 ··Sliding group 3 3 : Pressure cylinder 3 31 : Telescopic rod 3 4 : Positioning fixture 3 5 : Substrate 3 7 · · Pressure cylinder 4 : Connecting plate Part of the invention: 5: pick and place head 5 1 upright guide 5 2 Substrate 5 4 Slide rail 5 5 Sliding plate 5 7 Guide 5 8 Negative pressure line 6 0 Horizontal frame 6 1 Pressure cylinder 7 : Connecting plate 5 3 : Positioning fixture 5 6 ·· 1C nozzle 5 9 : Magazine 6 2 : Telescopic rod

1212

Claims (1)

1257685 1 申請專利範圍: ====放:其 動;;側③;移,,,該滑 動另側則連結裝設於—可由2軸= ❿ 座吸取IC及近距離置放用各種不同規格之測試套 2 項所述之可適用於不同規格測試奢 mu構,該直立導架下方触向固設一基 板,再於基板下方連結固設定位户罝。 土 3 ·依申請專利範圍第i項所述之用 座之!C取放縣構,該直轉架财係;^ 動板,而使滑動板可沿著直立導架滑移 利f圍第1項所述之可適用於不同規格測試套 ^之1C取放祕構’該Ic吸嘴係套設有—導座,並於 ¥座與滑動板間套設有彈箐,而可藉由彈簧的彈力,使 1C吸嘴連結滑動板’並可於壓縮彈簧時於滑動板上滑 動,以提供緩衝位移作用。 5 申請專利範圍第4項所述之可咖於不同規格測試套 6 座之1C取放頭結構,言亥Ic吸嘴套設之導座上係連结 有-負壓管路,以使1C吸嘴呈負壓狀態吸取IC。、、 •依申請專利範圍第1項所述之可適用於不同規格測試套 座之1C取放麟構,該_板上方係以—橫向架板架 没壓缸’並使壓缸於正常通氣狀態時,壓缸伸縮桿伸 出,而使滑動板滑設於直立導架側方最上方位置。 .依申請專利範圍第1項所述之可適用於不同規格測試套 13 7 1257685 座之1C取放頭結構,該帶動連結板升降之Z軸向驅動 源係為馬達及螺桿組。1257685 1 Patent application scope: ==== release: its movement; side 3; shift,,, the other side of the slide is connected to - can be absorbed by 2 axis = ❿ seat IC and close range The test kit described in item 2 can be applied to different specifications of the test luxury structure, the bottom of the upright guide frame is fixed to a fixed substrate, and then the solid set position is connected under the substrate. Soil 3 · According to the seat mentioned in item i of the patent application scope! C pick and place county structure, the straight turn frame financial system; ^ moving plate, so that the sliding plate can be slipped along the vertical guide frame, the first item mentioned in the first item can be applied to different specifications test set ^ 1C pick and place The secret structure of the Ic nozzle is provided with a guide, and a magazine is arranged between the seat and the sliding plate, and the elastic force of the spring can be used to connect the 1C nozzle to the sliding plate and to compress the spring. Slide on the sliding plate to provide cushioning displacement. 5 The scope of the patent application can be applied to the 1C pick-and-place structure of the 6-seat test suite of different specifications. The guide seat of the Yihai Ic nozzle is connected with a negative pressure line to make 1C. The nozzle sucks the IC under negative pressure. According to the first paragraph of the patent application scope, the 1C pick-and-place structure can be applied to test sleeves of different specifications. The top of the _ board is equipped with a transverse frame and a pressureless cylinder and the cylinder is normally ventilated. In the state, the cylinder telescopic rod is extended, and the sliding plate is slidably disposed at the uppermost position on the side of the upright guide. According to the scope of claim 1 of the patent application, the 1C pick-and-place head structure of the test sleeve of different sizes can be applied. The Z-axis drive source for driving the connecting plate is a motor and a screw set. 1414
TW94117255A 2005-05-26 2005-05-26 IC pick-up head structure suitable for testing bases of different sizes TWI257685B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107333400A (en) * 2016-04-29 2017-11-07 深圳市炫硕智造技术有限公司 Depressed suction nozzle adsorption mechanism
CN111106042A (en) * 2019-12-19 2020-05-05 西北电子装备技术研究所(中国电子科技集团公司第二研究所) Accurate positioning and transferring mechanism for pressing plate jig of large-pressure flip-chip bonding machine

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI674411B (en) * 2018-10-15 2019-10-11 致茂電子股份有限公司 Electronic component transfer device with positioning function, testing apparatus having the same and transfer method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107333400A (en) * 2016-04-29 2017-11-07 深圳市炫硕智造技术有限公司 Depressed suction nozzle adsorption mechanism
CN111106042A (en) * 2019-12-19 2020-05-05 西北电子装备技术研究所(中国电子科技集团公司第二研究所) Accurate positioning and transferring mechanism for pressing plate jig of large-pressure flip-chip bonding machine

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