TWI256702B - Pad over active circuit system and method - Google Patents

Pad over active circuit system and method

Info

Publication number
TWI256702B
TWI256702B TW93114432A TW93114432A TWI256702B TW I256702 B TWI256702 B TW I256702B TW 93114432 A TW93114432 A TW 93114432A TW 93114432 A TW93114432 A TW 93114432A TW I256702 B TWI256702 B TW I256702B
Authority
TW
Taiwan
Prior art keywords
metal layer
active circuit
partially
circuit system
over active
Prior art date
Application number
TW93114432A
Other languages
Chinese (zh)
Other versions
TW200504929A (en
Inventor
Inderjit Singh
Howard Lee Marks
Joseph David Greco
Original Assignee
Nvidia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/633,021 external-priority patent/US7495343B1/en
Priority claimed from US10/633,004 external-priority patent/US7453158B2/en
Application filed by Nvidia Corp filed Critical Nvidia Corp
Publication of TW200504929A publication Critical patent/TW200504929A/en
Application granted granted Critical
Publication of TWI256702B publication Critical patent/TWI256702B/en

Links

Landscapes

  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bonding process, the aforementioned metal layer is meshed. Further, another integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bonding process, the aforementioned metal layer may define a frame with an outer periphery and an inner periphery.
TW93114432A 2003-07-31 2004-05-21 Pad over active circuit system and method TWI256702B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/633,021 US7495343B1 (en) 2003-07-31 2003-07-31 Pad over active circuit system and method with frame support structure
US10/633,004 US7453158B2 (en) 2003-07-31 2003-07-31 Pad over active circuit system and method with meshed support structure

Publications (2)

Publication Number Publication Date
TW200504929A TW200504929A (en) 2005-02-01
TWI256702B true TWI256702B (en) 2006-06-11

Family

ID=37614753

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93114432A TWI256702B (en) 2003-07-31 2004-05-21 Pad over active circuit system and method

Country Status (1)

Country Link
TW (1) TWI256702B (en)

Also Published As

Publication number Publication date
TW200504929A (en) 2005-02-01

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