1254402 五、發明說明（1) '" - 一 【發明所屬之技術領域】 本發明係關於-種半導體封裝元件之檢測機^，特別是 關於一 7L件檢測平台設有一旋轉盤，在該旋轉盤上凹設有 數個定位槽，並利用該旋轉盤之旋轉離心力，使半導體封 裝元件適當定位於該定位槽内以提升檢測精度之元測 •機構。 【先前技術】 習用之7C件檢測機構，如中華民國公告第482332號 「BGA檢測機」新型專利，其係包含一送料機構，其設有 至少厂軌迢，該軌道前方設一接料座，其内部設有一頂座 及一滑座。由驅動源，驅動該頂座進行升降，且由驅動源驅 動該滑座以便進行水平移動；一影像擷取單元’其設於該 = 道一並於一機架上固設-驅動源，以驅 動一支木上设置的該影像擷取單元進行水平移動；一吸取 機弩f設於該送料機構上方，其於該機架上設一驅動 3 3 I3 i吸頭座進行水平移動，該吸頭座設有數個吸 頭，该吸頭由一驅動源驅動而可進行升降位移。 ，然^述元件檢測機構廣泛使用於半導體 檢㈣構在實際使用上仍存在下列缺點，、例如Γ 料般執行ί件檢測時’半導體封裝元件放置於 ’比ϊ導體二-:進！!檢測。然而，由於料盤之凹槽寬度 、、凡的寬度還要大，使得待測之該半導體封 im會產生旋轉與偏移，導致無法提升系統檢測 ，進而影響檢測精度。基於上述因素，確實仍有 第7頁 C:\Logo-5\Five Continents\PK9790.ptd 1254402 五、發明說明（2) 必要進一步 有鑑於此 有一旋轉盤 該旋 位槽 該檢 源模 組照 【發 •本 構， 該旋 該定 加攝 1 構， 源， 使得 I 根 測平 及一 構， 封裝 穿孔 轉盤之 内；此 測平台 組之上 射該半 明内容 發明主 其中利 轉盤旋 位槽内 測精度 發明次 其中一 分別用 本發明 據本發 台、一 影像擷 該旋轉 元件， 可供檢 改良 ，本 ，該 旋轉 外， 之上 方， 導體 ] 要目 用一 之旋 ，使 之功 要目 第一 以檢 具有 明之 取件 取單 盤凹 且該 測光 上述元件檢測機構。 ^明改良上述之缺 ^ Λ 、心缺”、，占其係一檢測平a μ 方疋轉盤之上丰而m W k 卞〇 〇又 表面凹故有數個定位槽，利用 離心力將丰邕蝴 〜 m 一 、，牛豆封I π件適當定位於該定 、 光源模組及一第二光源模組分設於 、下側，且一影像擷取單元設於該第一光 S以操取該第—光源模組及第二光源模 封衣元件之影像。 的係提供一 旋轉盤之上 轉離心；/7， 得本發明具 效。 的係提供一 光源模組利 測及突顯不 增加檢測使 半導體封裝 種半導體封裝元件之檢測機 表面凹設數個定位槽，並利用 將半導體封裝元件適當定位於 有提升系統檢測之重現性及增 種半導 用具高 同類型 用範圍 體封裝 、低角 待測元 之功效 元件之檢測機 元件之檢測機 度之二環形光 件之影像特徵 機構、一第一光源模組 元。該檢測 設有數個定 定位槽的四 線通過。該 平台設 位槽用 個角位 驅動機 構，其包含一檢 一第二光源模組 有一旋轉盤及一驅動機 待測之該半導體 一貫穿孔，該貫 驅動該旋轉盤進 以承載 各設有 構則可1254402 V. INSTRUCTION DESCRIPTION (1) '" - A technical field to which the invention pertains. The present invention relates to a detecting device for a semiconductor package component, and more particularly to a 7L piece detecting platform provided with a rotating disk at which the rotation A plurality of positioning grooves are recessed in the disk, and the rotating centrifugal force of the rotating disk is used to appropriately position the semiconductor package component in the positioning groove to improve the detection accuracy. [Prior Art] A 7C inspection mechanism, such as the new patent of the "BGA Inspection Machine" of the Republic of China Announcement No. 482332, which includes a feeding mechanism, which is provided with at least a factory rail, and a receiving seat is arranged in front of the rail. There is a seat and a slide inside. Driven by the driving source, the top seat is driven to be lifted and lowered, and the sliding seat is driven by the driving source for horizontal movement; an image capturing unit is disposed on the frame and fixed on a frame to drive the source to Driving the image capturing unit disposed on a piece of wood to move horizontally; a suction machine 弩f is disposed above the feeding mechanism, and a driving 3 3 I3 i head holder is disposed on the frame for horizontal movement, the suction The head base is provided with a plurality of suction heads which are driven by a driving source to be lifted and lowered. However, the component detecting mechanism is widely used in semiconductor inspection. The fourth component still has the following shortcomings in practical use. For example, when the component inspection is performed, the semiconductor package component is placed on the 'conductor two-: !Detection. However, due to the groove width and the width of the tray, the semiconductor seal im to be tested may be rotated and offset, which may result in failure to improve system detection and thus affect detection accuracy. Based on the above factors, there is still page 7 C:\Logo-5\Five Continents\PK9790.ptd 1254402 V. Invention Description (2) It is necessary to further consider that there is a rotating disk of the rotating slot. The constitutive, the rotation, the addition of the structure, the source, so that the I root leveling and the structure, the package perforated turntable; the test platform group above the semi-bright content invention main Zhongli turntable rotary slot One of the internal measurement precision inventions is respectively used according to the present invention, an image of the rotating element, which can be used for inspection and improvement, and the rotation, above the rotation, the conductor] should be used to make a function. The first object is to check the component detection mechanism with the clear pickup and the single component disc. ^Improve the above-mentioned lack of Λ, heart deficiency", which accounts for the detection of a flat a μ square turntable above the turntable and m W k 卞〇〇 and the surface is concave, there are several positioning grooves, using the centrifugal force to make the butterfly 〜 m一,, the cow bean seal I π piece is appropriately positioned on the fixed, the light source module and a second light source mode component are disposed on the lower side, and an image capturing unit is disposed on the first light S to be operated The image of the first light source module and the second light source mold sealing component is provided by rotating a rotating disk; /7, the invention is effective. The system provides a light source module for measurement and highlighting without increasing Detecting that a plurality of positioning grooves are recessed on the surface of the detecting device of the semiconductor package type semiconductor package component, and the semiconductor package component is appropriately positioned in the range of the reproducibility of the detection of the lifting system and the high-efficiency type of the semi-conducting device. The detection feature of the detection component of the low-angle to-be-tested element is the image feature mechanism of the ring-shaped optical component, and the first light source module element. The detection is provided with a plurality of fixed positioning slots of four wires. Bit slot A drive mechanism which comprises a detecting a second light source module having a rotating disc and a test driver of the semiconductor through hole, the through driving the turntable for carrying each of the feeding mechanism can be provided
C:\Logo-5\Five Continents\PK9790.ptd 第8頁 1254402 —^---- 五、發明說明（3) 行間歇旋_ — 上方。1^。该取件機構及第一光源模組設於該旋轉盤之 於該旋ίίΐ光源模組相對配置於該第一光源模组，其設 之開口:ί 方。該影像擷取單元設於該第—光源模組 .離心力，脾三错此，在執行檢測時，利用該旋轉盤之旋轉 -【實施方式^半導體封裝元件適當定位於該定位槽内。 為了壤太名弋 易僅，下t明之上述及其他目的、特徵、優點能更明顯 作詳細說ί Ϊ =舉本發明較佳實施例，並配合所附圖式， 響請參照第1 封努_ = 、2及3圖所示，本發明較佳實施例之半導體 件機^30之^測機構包含一檢測平台1〇、一料盤20、一取 模組6。及：：】=主40、一第一光源模組5〇、-第二光源 i i乃一 像擷取單元7 〇。該檢測平台1 〇設有一旋轉盤 栌1词/區盆衣、置12，該旋轉盤11之上表面凹設有數個定位 ‘陳列扭壯用严承載待測之半導體封裝元件80。例如，球 祎炊陆衣兀件（BGA)或四方平面無腳封裝元件（QFN)。上 大 口所^衣70件之檢測項目包含寬度、長度、錫球之 益38卩44壯貝及外圍锡球至切割邊緣之距離；上述四方平面 、軎給夕衣元件之檢測項目包含寬度、長度及平面腳位到達 11之#，離。該定位槽111概呈方形，其凹設於該旋轉盤 ^ ^，位上，且其寬度略寬於該半導體封裝元件80之 見^忒疋位槽1 11之四個角位各設一貫穿孔1 1 2，該貫穿 孑L11 2可供第-|店#。ρ Λ τ π > 乐一先源杈組6 〇之檢測光線通過。當該第二光 ;’、旲、、且60照射待測之該半導體封裝元件㈣時，該貫穿孔C:\Logo-5\Five Continents\PK9790.ptd Page 8 1254402 —^---- V. Invention Description (3) Line intermittent rotation _ — above. 1^. The pick-up mechanism and the first light source module are disposed on the rotating disk, and the first light source module is disposed opposite to the first light source module. The image capturing unit is disposed in the first light source module. The centrifugal force and the spleen are wrong. When the detecting is performed, the rotation of the rotating disk is used. [The embodiment is that the semiconductor package component is properly positioned in the positioning groove. The above and other objects, features and advantages of the present invention can be more clearly described in detail. For the preferred embodiment of the present invention, and with reference to the drawings, please refer to the first _ = , 2 and 3, the measuring mechanism of the semiconductor device 30 of the preferred embodiment of the present invention comprises a detecting platform 1 , a tray 20 and a take-up module 6 . And::] = main 40, a first light source module 5 〇, - the second light source i i is a picture capturing unit 7 〇. The detecting platform 1 is provided with a rotating disk 栌 1 word/area potting and setting 12, and the upper surface of the rotating disk 11 is concavely provided with a plurality of positioning ‘displaying and squeezing the semiconductor package component 80 to be tested. For example, a ball 祎炊 祎炊 兀 (BGA) or a quad flat no-foot package component (QFN). The test items of the 70 pieces of the large mouth of the mouth include the width, the length, the benefit of the solder ball 38卩44 Zhuangbei and the distance from the peripheral solder ball to the cutting edge; the test items of the above-mentioned square plane and the 夕 夕 夕 包含 component include the width and length. And the plane foot reaches the ##, away. The positioning groove 111 is substantially square, and is recessed on the rotating disk, and has a width slightly wider than the four corners of the semiconductor package component 80. 1 1 2, the through 孑L11 2 is available for the first -| shop #. ρ Λ τ π > Le Yi Xian 杈 group 6 〇 detection light passes. When the second light; ', 旲, and 60 illuminates the semiconductor package component (4) to be tested, the through hole
1254402 五、發明說明（4) U2可做為透光之用，如此 一 設於該檢測平台1〇中 f γ $輻廓〜像。遠驅動裝置12 «轉，且該間歇：:精2::驅= 進行間 檢測時間。 干卞分肢封裝元件80之 請再參照第1、2及3圖所示，本發明較佳 20，其設於該檢測平台1()之—侧， γ例之料盤 2!:其用：承戴待測之該半導體封裝元件二個：槽 件機構30 βχ於該旋轉盤n及料盤2q間之上。〆取 免0較佳係—機械手臂，其設有至少—吸嘴31 ’ f件機構 盤20逐一吸取待測之兮丰藤俨 ，以供自該料 、 了州（忒丰導體封裝儿件80。該取株嫌接qn 再將該半導體封裝元件80放置在該旋轉盤样 内，以便進行光學檢測。再者，當該半導體封裝元;;二 ‘成檢||後，该取件機構30另自該旋轉盤u之定位种丨^ •取完樣檢測之該半導體封裝元件8〇，#分類至“回收槽 或不良品回收槽（未繪示）。再者，4目對於該料盤2q及取^ 機構30，該固定柱4〇係立設於該檢測平台丨〇之另一側，以 ‘供固定該第一光源模組5 〇及影像擷取單元7 〇。 _請再參照第1、2及3圖所示，本發明較佳實施例之第一 光源模組50設於該固定柱4〇上，且其設於該旋轉盤u之上 方，以供照射該半導體封裝元件80之檢測正面。該第一光 源模組50設有一第一環型光源51、第二環型光源51，、一 擴散板52及一開口 53，該第一及第二環型光源51及51，較 佳選自發光二極體（LED)，且分別用以檢測及突顯不同類1254402 V. Description of the invention (4) U2 can be used for light transmission, such that it is located in the detection platform 1〇 f γ $ 廓 profile~ image. The remote drive unit 12 «turns, and the interval:: fine 2:: drive = inter-test time. For the dry splitting package component 80, please refer to Figures 1, 2 and 3 again. The present invention is preferably 20, which is disposed on the side of the detection platform 1 (), and the tray 2 of the γ example! : The semiconductor package component to be tested is worn: the slot mechanism 30 is placed between the rotating disk n and the tray 2q. Picking up the 0-free system-mechanical arm, which is provided with at least the suction nozzle 31' f mechanism mechanism disk 20 to absorb the 兮 俨 俨 待 待 俨 俨 俨 俨 俨 俨 俨 俨 俨 俨 俨 导体 导体 导体 导体 导体 导体 导体 导体 导体 导体 导体 导体 导体 导体 导体 导体 导体80. The pick-up device qn and then the semiconductor package component 80 is placed in the rotating disk for optical detection. Moreover, when the semiconductor package element;; two 'inspection||, the pick-up mechanism 30 Another positioning type from the rotating disk u: The semiconductor package component 8〇, #, which is sampled and detected, is classified into a “recycling tank or a defective product recovery tank (not shown). Further, 4 mesh for the material The tray 2q and the receiving mechanism 30 are erected on the other side of the detecting platform , to fix the first light source module 5 and the image capturing unit 7 . Referring to the first, second and third embodiments, the first light source module 50 of the preferred embodiment of the present invention is disposed on the fixed post 4 , and disposed above the rotating disc u for illuminating the semiconductor package. The front surface of the component 80 is provided with a first ring-shaped light source 51, a second ring-shaped light source 51, and a diffusion plate 52. And an opening 53, the first and second ring-shaped light sources 51 and 51 are preferably selected from light-emitting diodes (LEDs), and are respectively used for detecting and highlighting different types.
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五、發明說明（5) 型待測元件之影像特徵，例如. 測四方平面無腳封裝元件（·〜苐一環型光源5丨用以檢 有較高的照明角度，苴有刹π &之正面反射影像，因其具 之平面腳位；“第員四方平面無腳封裝元件 裝元件（BGA)之正面反射影，原51,用以檢測球格陣列封 .顯球格陣列封裝元件之錫球口低角度光源軚有利於犬 錫球側緣可取得較真實球格^ ’利用該低角度光源照射 高品質影像。該第一及第二广」封裝70件之錫球大小及較 該擴散板52，該擴散板光源51及51’之外側設置 •於待測之該半導體:照…得以均勻投射 開設-開口53，該開口53 由：弟-光源模組50上方 件8。反射之光線穿過該開由=之該半導體封裝元 擷取影像。 53後，再由該影像擷取單元70 •針2211 2及3圖所示’本發明較佳實施例，其相 光源杈組50 ,該第二光源模組60設於該旋轉盤 雖fe下：，其用以照射該半導體封裝元件8〇之背面；該第 二光源模組6 0之知、射光線穿過該定位槽丨丨丄之貫穿孔11 2及 第光源杈組50之開口 53後，再由該影像擷取單元7〇擷取 >衫像，如此该影像擷取單元7 〇擷取該半導體封裝元件8 〇之 外型輪廓影像。該第二光源模組6 〇設有一光源6丨及一擴散 板62 ’該光源62較佳選自發光二極體（LED)，且該擴散板 62設於該旋轉盤π及該光源61之間，其用以使照明之光線 得以均勻投射於待測之該半導體封裝元件8 〇之背面，其特 別是照射再四個角隅位置。V. Description of the invention (5) The image characteristics of the type of component to be tested, for example, the square-footless packaged component (·~苐-ring type light source 5丨 is used to detect a higher illumination angle, and there is a brake π & Front reflection image, because of its flat position; "Front reflection of the first member of the square flat footless package component (BGA), original 51, used to detect the grid array seal. Display ball array package component tin The low-angle light source of the ball 軚 is beneficial to the side ball of the dog tin ball to obtain a real ball ^ 'Using the low-angle light source to illuminate the high-quality image. The size of the first and second wide package of 70 pieces of solder balls and the diffusion The plate 52 is disposed on the outer side of the diffusing plate light sources 51 and 51'. The semiconductor to be tested is uniformly projected to open the opening 53. The opening 53 is composed of the upper part 8 of the light source module 50. After the image is captured by the semiconductor package element, the image capture unit 70 is further provided by the image capture unit 70. The needles 2211 2 and 3 are shown in the preferred embodiment of the present invention. The second light source module 60 is disposed on the rotating disk: The rear surface of the semiconductor package component 8 is formed; the light source of the second light source module 60 passes through the through hole 11 2 of the positioning groove and the opening 53 of the first light source group 50, and then The image capturing unit 7 captures the "shirt image, and the image capturing unit 7 captures the outline image of the semiconductor package component 8. The second light source module 6 is provided with a light source 6 and a light source. The light source 62 is preferably selected from the light emitting diode (LED), and the diffusing plate 62 is disposed between the rotating disk π and the light source 61 for uniformly projecting the illumination light to be tested. The back side of the semiconductor package component 8 is in particular illuminated at four corner locations.
C:\Logo-5\Five Continents\PK9790.ptd 第11頁 1254402 五、發明說明（6) 請再參照第1、2及3圖所示，本菸 擷取單元π較佳選自CCD型或⑽影像 件，其設於該第—光源模組50之開口53欠位影像祕取: 取單元70經由一固定座71設於該 ：’二工二： 一光源模組5心二： = :Γ射待測之該半導體封裝元件8〇所 反射之九線〔如附件一及附件二 ^ ^ Μ έθ r η μ ，及同步操取由該 弟一九源核、、且6 0妝射待測之該半導 皋莫妒射驻分处& 干V脰封裝元件80所呈現該 丰；體封衣：件80之角隅外型輪廓影像〔如附件三及附件 四所不〕，精以達到元件檢測之目的。 1件 請再參照第2圖所示，本發明齡 元件之檢測機構之定位槽⑴，tl;二:例之半導體封裂 20吸取至少一半導體封‘二件8(；51取件機構30自該料盤 I寬度僅略寬於該半導體^ % °Λ疋位槽111時，因其 1 I t 件80，該待測之半導體封裝 龜旋轉盤二= = 導：時’本發明可利用 心力，藉由該半導體：=封裝元件8°產生離 •定位於該定位槽111内。該第-光源模組5。用以昭射;V 蠡導體封裝元件80之檢測正面，苴卜古用曰"、、射3牛 於該第-光源模組50，該第二一開口53。相對 κ弟一先源杈組6 0設於該旋轉盤11 之下方、、用以照射該半導體封裝元之 擷取單元7。可經由該第一光源模㈣上方之開口 53:= 由該第一光源模組5 0照射待測之該半導體封裝元件8 〇所反 射之光線，及同步操取由兮@ , y狀田該弟二光源模組60照射待測之該 1254402 五、發明說明（7) 半i體封裝元件8 〇所呈現 輪廓影像，M w、击-扯姐封裝元件80之角隅外型 ^ 错以達到兀件檢測之目的。 如上所述，相較於習用、 槽中進行半導^ 戏測機構直接於料盤之凹 21寬卢裝凡件8〇之檢測，由於該料盤2〇之凹槽 見度比+ V體封裝元件8〇 寬 ^ 但導Μ扭驻-从〇 Λ 見度退要大，使侍待測之該 觀，望I /牛之位置會產生旋轉與偏移等缺點。反 定位料1 Γι之本發明藉由於該旋轉盤11上表面凹設有數個 之，Π-，該旋轉盤U旋#離心力，可使待測 ^ t導封裝元件8〇適當定位於該定位槽111内，因此 可以提升系統檢測之重現性，進而增加元件之檢測精度。 雖然本發明已利用前述較佳實施例詳細揭示，然其並非 用以限定本發明，任何熟習此技藝者，在不脫離本發明之 精^和範圍内，當可作各種之更動與修改，因此本發明之 保護範圍當視後附之申請專利範圍所界定者為準。 _C:\Logo-5\Five Continents\PK9790.ptd Page 11 1254402 V. Description of the invention (6) Please refer to Figures 1, 2 and 3 again, the smoke extraction unit π is preferably selected from the CCD type or (10) The image component is disposed in the opening 53 of the first light source module 50. The image capturing unit 70 is disposed on the fixing unit 71 via a fixing base 71: 'two working two: one light source module 5: two: = : The nine lines reflected by the semiconductor package component 8 to be tested (such as Annex 1 and Annex II ^ ^ Μ έ θ r η μ), and synchronous operation are taken by the younger one, and 60 The semi-conducting 妒 妒 驻 驻 & & & & & & &&;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; To achieve the purpose of component testing. 1 piece, please refer to FIG. 2 again, the positioning groove (1) of the detecting mechanism of the invention component of the invention, tl; 2: the semiconductor sealing 20 of the example picks up at least one semiconductor package 'two pieces 8 (; 51 picking mechanism 30 from When the width of the tray I is only slightly wider than that of the semiconductor device, the semiconductor package to be tested is rotated by the semiconductor package turtle = 2 = = when the invention can utilize the heart force The semiconductor:=the package component 8° is generated and positioned in the positioning groove 111. The first light source module 5 is used for illuminating; the front side of the V 蠡 conductor package component 80 is used for detecting the front surface. ",, shot 3 cattle in the first light source module 50, the second opening 53. The opposite source 先 a source group 60 is disposed under the rotating disk 11, for illuminating the semiconductor package element The capturing unit 7 can pass the opening 53 above the first light source module (4):= the first light source module 50 illuminates the light reflected by the semiconductor package component 8 to be tested, and synchronously operates by @ , y 状田 The second light source module 60 illuminates the 1254402 to be tested. V. Invention description (7) Semi-i-package component 8 Profile image, M w, -- 姐 封装 封装 封装 封装 80 80 80 80 80 80 80 80 80 80 80 80 80 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The detection of the recessed 21 wide Lu fittings 8 ,, because the groove 2 〇 groove visibility is wider than the + V body package component 8 ^ ^ but the guide twisted - from the 退 visibility retreat, so that The view of the waiter is expected to produce the rotation and offset of the position of the I / cow. The invention of the reverse positioning material 1 Γ ι is due to the fact that the upper surface of the rotating disk 11 is concavely provided, Π-, the rotating disk The U-rotational force can make the to-be-tested package component 8〇 properly positioned in the positioning slot 111, thereby improving the reproducibility of the system detection, thereby increasing the detection accuracy of the component. Although the present invention has utilized the foregoing preferred The embodiments are disclosed in detail, and are not intended to limit the scope of the invention, and the scope of the present invention can be modified and modified without departing from the spirit and scope of the invention. The scope defined in the patent application is subject to change. _
Ϊ254402 圖式簡單說明 【圖式簡單說明 第1圖··本發明較佳徐 構之組合立體圖。 n t例之半導體封裝元件之檢測機 第2圖··本發明較件每 構”位槽之局部放V:。例之半導體封襄元件之檢測機 第3圖··本發明較佳每二 構之側剖視圖。 土 3知例之半導體封裝元件之檢測機 附件一 ··本發明較佳每 、構所擷取之球格陣列封之半導體封裂元件之檢測機 附件二··本發明較佳每〃件之正面反射影像。 構所擷取之四方平面無:之半導體封裝元件之檢測機 附件三··本發明較佳杂於1 70件之正面反射影像。 構所擷取之球格陣列封二，例之半導體封裝元件之檢測機 附件四：本發明較佳實像。 |操取之四方平面無腳封裝元= = = = =機 主要元件符號說明】 11 旋轉盤 112 貫穿孔 20 料盤 30 取件機構 40 固定桎 51 第一環型 52 擴散板 10 檢測平台 111 定位槽 12 驅動機構 21 凹槽 31 吸嘴 5 0 第一光源模組 51’第二環型光源 C:\Logo-5\Five Continents\PK9790.ptd 第14頁 1254402Ϊ254402 Brief description of the drawings [Simplified description of the drawings Fig. 1 is a perspective view of a combination of preferred embodiments of the present invention. Detecting machine for semiconductor package components of nt example Fig. 2 · Partial placement of the bit groove of the present invention. V: Example of the detector of the semiconductor package element. Fig. 3 · The preferred structure of the present invention A side view of the semiconductor package component of the invention is disclosed in the present invention. Preferably, the present invention is preferably used in the detection of the semiconductor chip-sealing component of the ball grid array. The front side of each element reflects the image. The square plane of the structure is not included: the detector of the semiconductor package component is attached. 3. The present invention is preferably mixed with the front side reflection image of 1 70 pieces. Sealed two, for example, the semiconductor package component of the detector attachment four: the preferred image of the present invention. | The square plane without the foot package element = = = = = machine main component symbol description] 11 rotating disk 112 through hole 20 tray 30 Pickup mechanism 40 Fixing cassette 51 First ring type 52 Diffuser plate 10 Detection platform 111 Positioning groove 12 Drive mechanism 21 Groove 31 Nozzle 5 0 First light source module 51' Second ring type light source C:\Logo-5 \Five Continents\PK9790.ptd Page 14 12544 02
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