TWI254033B - Method and apparatus for treating wastewater from copper chemical mechanical polishing - Google Patents

Method and apparatus for treating wastewater from copper chemical mechanical polishing Download PDF

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TWI254033B
TWI254033B TW91118654A TW91118654A TWI254033B TW I254033 B TWI254033 B TW I254033B TW 91118654 A TW91118654 A TW 91118654A TW 91118654 A TW91118654 A TW 91118654A TW I254033 B TWI254033 B TW I254033B
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Taiwan
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wastewater
sludge
chemical mechanical
coagulant
tank
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TW91118654A
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Chinese (zh)
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Max Sha
Howard Ting
Anderson Chen
Lung-Chi Yang
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Taiwan Semiconductor Mfg
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Abstract

A method and apparatus for treating wastewater from copper chemical mechanical polishing (Cu-CMP wastewater). A coagulant is diluted with a predetermined amount of wastewater from Cu-CMP. Next, the diluted coagulant and a large amount of Cu-CMP wastewater are introduced into a reaction tank respectively, such as to cause flocculation reaction of wastewater and coagulant. Next, the flocculated solution is introduced into a clarifier to mix with a coagulant aid, forming sludge. Finally, the sludge is removed and the treated water is discharged. According to the present invention, the sludge can also be recycled back to the clarifier. Thus, the difficultly-settled particles are settled by co-precipitation with sludge, which is helpful to flocculation of particles in wastewater. The present invention successfully treats Cu-CMP wastewater and the turbidity of the treated water reaches below 10 mg/L.

Description

1254033 β— 號 91118654 五、發明說明(1) 發明t景 本發明有關於一種處理鋼化學機械研磨廢水的方法和 裝置,特別有關於一種利用廢水稀釋混凝劑以及使用污泥 導回官的技術來處理銅化學機械研磨廢水的方法和裝置。1254033 β—No. 91118654 V. INSTRUCTION DESCRIPTION (1) Invention The present invention relates to a method and a device for treating steel chemical mechanical polishing wastewater, in particular to a technology for diluting a coagulant with wastewater and using a sludge to return to the official. A method and apparatus for treating copper chemical mechanical grinding wastewater.

傳統上,通常以鋁作為半導體裝置之内連線。為了内 連線的平坦化,常使用化學機械研磨漿液(CMP slurry ), 以CMP方式來磨平鋁線。由於漿液中含有許多高硬度的 研磨顆粒,為了環境保護的考量,有必要對於鋁CM P廢水 進行處理,再作排放。在完成CMP之後,對於鋁CMP廢水的 處理,一般是使用PAC (polyaluminum chloride;多元氣 化銘)為混凝劑來做混凝沈降,形成小膠羽(f 1 0 C )。接著 ,再使用聚合物(ρ ο 1 y m e r )為助凝劑,例如使用陰離子型 粉狀聚合物,使得所形成之膠羽更大更重,以利沈降。這 種PAC處理方法可成功地除去鋁CMP廢水中的顆粒 (particles) 〇 目前,使用銅作為半導體内連線的銅製程,已非常普 遍。然而,銅CMP廢水的處理還在起步的階段。本發明之 發明人發現,使用傳統上常用作處理鋁CMP廢水的PAC處理 方法來處理銅CMP廢水,並沒有膠羽形成,無法成功處理Traditionally, aluminum has been used as an interconnect for semiconductor devices. For the flattening of the interconnect, a chemical mechanical polishing slurry (CMP slurry) is often used to smooth the aluminum wire by CMP. Since the slurry contains many high-hardness abrasive particles, it is necessary to treat the aluminum CM P wastewater for environmental protection considerations. After the completion of CMP, for the treatment of aluminum CMP wastewater, PAC (polyaluminum chloride) is generally used as a coagulant for coagulation sedimentation to form a small rubber feather (f 1 0 C ). Next, the polymer (ρ ο 1 y m e r ) is used as a coagulant, for example, an anionic powdery polymer, so that the formed rubber feathers are larger and heavier to facilitate settling. This PAC treatment method can successfully remove particles from aluminum CMP wastewater. Currently, copper is widely used as a copper interconnect for semiconductor interconnects. However, the treatment of copper CMP wastewater is still in its infancy. The inventors of the present invention have found that the use of a PAC treatment method conventionally used for treating aluminum CMP wastewater to treat copper CMP wastewater has no gel formation and cannot be successfully processed.

銅CMP廢水。 發明之目的及概述 有鑑於此,本發明之目的為解決上述問題而提供一種 處理銅化學機械研磨廢水的方法和裝置,以成功處理銅 CMP廢水,經處理水的水質可達到濁度小於1 0 mg/L。Copper CMP wastewater. OBJECT AND SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide a method and apparatus for treating copper chemical mechanical polishing wastewater to solve the above problems, in order to successfully treat copper CMP wastewater, and the treated water can achieve a turbidity of less than 10 Mg/L.

0^03-8388TWFl · TSMC2002-0347 · Cathy.ptd 第5頁 1254033 案號 91118654 年 月 曰 修正 五、發明說明(2) 為達成本 水的方法包括 發明之目的 以下步驟。 來稀釋一混凝劑,將稀釋 磨廢水分別導 應。接著,將 入 反應槽 上述步驟所 與一助凝劑混合,而產 放經處理之水 除了上述 處理銅化學機 殿槽内之後, 槽内,以幫助 本發明處 一混合單 械研磨廢水, 一反應槽 之混凝劑和大 生;旋集反應, 步驟之外, 械研磨廢水 更包括以下 廢水中顆粒 理銅化學機 元,用以容 使混凝劑被 ,位於該混 量之銅化學 ,本發明處 以既定量之 之混凝劑和 内,使廢水 得之凝集液 生污泥。最 為了達到更 的方法,在 步驟:將部 的凝集。 械研磨廢水 理銅化學機械研磨廢 銅化學機械研磨廢水 大量之銅化學機械研 和混凝劑產生凝集反 導入一慢混沈澱槽内 後,除去污泥,而排 佳處理效果,本發明 將凝集液導入慢混沈 分污泥導回慢混沈澱 的裝置包括: 納一混凝劑和既定量之銅化學機 稀釋; 合單元之下 機械研磨廢 游,用以容納經稀釋 水,使兩者混合而產 一慢混沈澱槽,位於 凝劑以及由反應槽而來之 以及 混沈澱槽而來 為了達到 置可更包括: 出流管,位於該慢 之經處理水 更佳處理效 該反應槽之下游,用以容納一助 廢水,使兩者混合而產生污泥; 混沈澱槽之下游,用以排出由慢 〇 果,本發明處理銅CMP廢水的裝0^03-8388TWFl · TSMC2002-0347 · Cathy.ptd Page 5 1254033 Case No. 91118654 月 Amendment V. Description of invention (2) The method for achieving this water includes the purpose of the invention. To dilute a coagulant and direct the dilution mill wastewater. Then, the above step of the reaction tank is mixed with a coagulant, and the treated water is prepared in addition to the above-mentioned treated copper chemical machine tank, in the tank, to help the present invention to mix a single mechanical grinding wastewater, a reaction In addition to the steps of the coagulant and the Dasheng; the spin-drying reaction, the mechanical grinding wastewater further comprises a granular copper chemical machine in the following wastewater for containing the coagulant, the copper chemistry located in the mixture, the present invention The coagulant and the inner part of the wastewater are used to make the sludge of the wastewater get sludge. Most to achieve a more method, in the step: the agglutination of the part. Mechanical grinding wastewater copper chemical mechanical grinding scrap copper chemical mechanical grinding wastewater a large amount of copper chemical mechanical research and coagulant production agglutination reverse introduction into a slow mixing sedimentation tank, remove the sludge, and the best treatment effect, the present invention will agglutinate The device for introducing the liquid into the slow mixed sediment and returning to the slow mixed sediment comprises: a nano-coagulant and a quantitative copper chemical machine dilution; and a mechanical grinding waste under the unit to accommodate the diluted water to make the two Mixing and producing a slow mixing tank, located in the coagulant and from the reaction tank and mixing the sediment tank to achieve the inclusion: the outlet pipe is located in the slow treated water for better treatment efficiency Downstream, for accommodating a waste water to mix the two to produce sludge; downstream of the mixed sedimentation tank for discharging the slow citrus fruit, the copper CMP wastewater treatment of the present invention

0503-8388TWF1 : TSMC2002-0347 ; Cathy.ptd 第6頁 1254033 案號 91118654 年 —月 曰 修正 五、發明說明(3) 一污泥導回官,用以將污泥導回該慢混沈澱槽内 幫助廢水中顆粒的凝集。 或者,本發明處理銅C Μ P廢水的裝置可更包括: 一污泥分流裝置’位於該慢混沈澱槽之下游,用以將 由慢混沈殿槽排出之污泥分為兩部分,而分別導入一污泥 導回管和一污泥收集管, 其中該污泥導回管可用以將一部分之污泥導回該慢混 沈澱槽内,以幫助廢水中顆粒的凝集,該污泥收集管可用 以將另一部分之污泥導入一污泥濃縮池中。 實施例 第1圖顯不依據本發明較佳實施例之處理銅化學機械 研磨廢水的裝置之示意圖。 請參閱第1圖,本發明處理銅化學機械研磨廢水的裝 置包括:一銅CMP廢水供應裝置1 〇,一廢水分流裝置20, 一混合單兀30,一反應槽4〇,一慢混沈澱槽5〇,一污泥分 流裝置6 0,和一出流管7 〇。 首先’由鋼CMP廢水供應裝置iq供應銅CMp廢水。廢水 流至廢水分流裝置2 0時,廢水分為兩部分。少量的廢水經 由管路22和流量指示器24,而流入混合單元30中,大部分 的廢水則經由管路2 6而流入反應槽4 〇中。 混凝劑32經由一第一流量控制單元34 (FC1 ),而進入 混合單元30内,與經由管路22而來的少量銅CMP廢水混合 。第一流量控制單元3 4可用以控制混凝劑3 2至混合單元3 0 的流量。如此,在混合單元30内,少量銅CMP廢水可稀釋 以0503-8388TWF1 : TSMC2002-0347 ; Cathy.ptd Page 6 1254033 Case No. 91118654 Year - Month Revision 5, Invention Description (3) A sludge guide back to the sludge to be returned to the slow mixing tank Helps agglomerate particles in wastewater. Alternatively, the apparatus for treating copper C Μ P wastewater of the present invention may further comprise: a sludge splitting device 'located downstream of the slow mixing sedimentation tank for dividing the sludge discharged from the slow mixed sedimentation tank into two parts and respectively introducing them a sludge return pipe and a sludge collection pipe, wherein the sludge return pipe can be used to guide a part of the sludge back into the slow mixing sedimentation tank to help agglomerate particles in the wastewater, and the sludge collection pipe can be used The other part of the sludge is introduced into a sludge concentration tank. EXAMPLES Figure 1 is a schematic view showing an apparatus for treating copper chemical mechanical polishing wastewater in accordance with a preferred embodiment of the present invention. Referring to FIG. 1 , the apparatus for treating copper chemical mechanical polishing wastewater comprises: a copper CMP wastewater supply device 1 , a wastewater separation device 20 , a mixing unit 30 , a reaction tank 4 , and a slow mixing tank. 5〇, a sludge splitting device 60, and an outflow pipe 7〇. First, copper CMp wastewater is supplied from the steel CMP wastewater supply unit iq. When the wastewater flows to the wastewater splitting device 20, the wastewater is divided into two parts. A small amount of waste water flows into the mixing unit 30 via the line 22 and the flow indicator 24, and most of the waste water flows into the reaction tank 4 through the line 26. The coagulant 32 enters the mixing unit 30 via a first flow control unit 34 (FC1) and is mixed with a small amount of copper CMP wastewater via line 22. The first flow control unit 34 can be used to control the flow of the coagulant 32 to the mixing unit 30. Thus, in the mixing unit 30, a small amount of copper CMP wastewater can be diluted

0503-8388OVF1 : TSMC2002-0347 : Cathy.ptd 第7頁 1254033 修正 ____案號 9in8fi54 五、發明說明(4) 混凝劑。使經稀釋 反應槽4 0内,同時 反應槽4 0内。此時 生膠羽(f loc )。 之思凝劑以很快的 ’大部分的廢水則 廢水和混凝劑會 速度’經管路36流入 是經由管路2 6而流入 產生凝集反應,而產 本發明以少量銅化學機械研磨廢水來稀釋混凝劑,可 使混凝劑擴散地更均勻。由於混凝劑已經過部分銅CMp廢 水的稀釋’混凝劑被稀釋成很小的單元,因此,在反應槽 40内’混凝劑與銅CMP廢水中顆粒的有效接觸面積增大,0503-8388OVF1 : TSMC2002-0347 : Cathy.ptd Page 7 1254033 Revision ____ Case No. 9in8fi54 V. Inventive Note (4) Coagulant. The reaction vessel 40 is diluted and simultaneously in the reaction tank 40. At this time, the rubber feather (f loc ). The sulphate is quickly passed into the 'most of the wastewater, and the wastewater and the coagulant will flow' through the line 36 to flow through the line 26 to produce an agglutination reaction, and the present invention uses a small amount of copper chemical mechanical polishing wastewater. Diluting the coagulant allows the coagulant to diffuse more evenly. Since the coagulant has been diluted with a portion of the copper CMp waste water, the coagulant is diluted into a small unit, so that the effective contact area of the coagulant with the particles in the copper CMP wastewater increases in the reaction tank 40,

混凝劑能夠很均勻地與廢水中的顆粒產生凝集反應。又由 於少量廢水與混凝劑混合後,導入反應槽的速度很快,因 此,不致造成有混凝劑在進入反應槽4 〇後失效的情況發 生。 適合於本發明之混凝劑,可為一聚合物,例如,可為 聚丙醯胺。再者,用以稀釋混凝劑之少量銅CMP廢水,其 量可為導入反應槽中之大量廢水的5 %至1 0 %體積比。The coagulant is capable of producing agglutination reaction with particles in the wastewater very uniformly. Further, since a small amount of waste water is mixed with the coagulant, the speed of introduction into the reaction tank is fast, so that the coagulant does not fail after entering the reaction tank 4 。. A coagulant suitable for the present invention may be a polymer, for example, may be polyacrylamide. Further, a small amount of copper CMP wastewater for diluting the coagulant may be a 5% to 10% by volume of a large amount of waste water introduced into the reaction tank.

為了使在反應槽40内進行較佳的凝集反應,可利用酸 液(如H2S04)或鹼液(如NaOH)來調整廢水的pH值。例如’可 將反應槽内廢水的ρ Η值調至驗性,如p Η值8 - 1 1之間’較仏 者為pH值9-10之間。 接著,將反應槽4 0内所得之凝集液導入一慢混沈澱槽 5 0内。助凝劑5 2 (例如可為一聚合物)經由一第二流量控制 單元54 (FC2),而進入慢混沈澱槽50内,與凝集液混合’ 而產生污泥(s 1 u dg e )。第二流量控制單元5 4可用以控制助 凝劑5 2至慢混沈殿槽5 0之流量。In order to carry out a preferred agglutination reaction in the reaction tank 40, an acid (e.g., H2SO4) or an alkali solution (e.g., NaOH) may be used to adjust the pH of the wastewater. For example, the value of ρ Η of the wastewater in the reaction tank can be adjusted to an inspectivity, such as a p Η value between 8 and 1 1 ', which is between pH 9-10. Next, the aggregating liquid obtained in the reaction tank 40 is introduced into a slow mixing sediment tank 50. The coagulant 5 2 (for example, a polymer) can enter the slow mixing settling tank 50 via a second flow control unit 54 (FC2) to mix with the agglomerate to produce sludge (s 1 u dg e ). . The second flow control unit 54 can be used to control the flow of the coagulant 52 to the slow mixing chamber 50.

1254033 —案號 91118654 年 月 曰 修正 五、發明說明(5) 慢混沈澱槽5 0中所排出之污泥可由污泥分流裝置6 〇而 分為兩部分,分別經由污泥導回管6 2而將一部分之污泥導 回fe混沈殿槽5 0内,經由污泥收集管6 4而將另一部分之污 泥導入一污泥濃縮池6 6中。 廢水中有些顆粒,無法靠混凝劑或助凝劑等藥劑而沈 降下來。由污泥導回管6 2而導入慢混沈澱槽5 0内的污泥, 則可捕捉小膠羽,藉由污泥共沈而將這些難沈降的顆粒沈 降下來,幫助廢水中顆粒的凝集。 經由污泥導回管6 2而導回慢混沈澱槽5 0内之部分污泥 ,可佔由慢混沈澱槽中所排出全部污泥的1 0%至30%重量比 。例如,經由污泥導回管6 2而導回慢混沈澱槽5 0内之污泥 可佔2 0 %,而經由污泥收集管6 4而導入污泥濃縮池6 6中的 污泥可佔80%。 最後,經由出流管7 0而排放經處理水,本發明經處理 水的濁度(t u r b i d i t y )可達到1 〇 m g / L,水質非常好。再者 ,傳統上使用PAC來處理鋁CMP廢水,由於PAC在水中會解 離,經處理水會有高導電度,需進一步作處理。至於本發 明,係使用聚合物來處理銅CMP廢水,經處理水不會有高 導電度的問題,不需進一步作降低導電度的處理。 綜合上述,本發明以少量銅CMP廢水來稀釋混凝劑, 可使混凝劑擴散地更均勻,使混凝劑可更有效地與廢水進 行凝集反應。再者,本發明將污泥導回慢混沈澱槽中,可 藉由污泥共沈而將難沈降的顆粒沈降下來,幫助廢水中顆 粒的凝集。因此,本發明可成功地處理銅CMP廢水,使經1254033 — Case No. 91 918 654 Revision 5, Invention Description (5) The sludge discharged from the slow mixing tank 50 can be divided into two parts by the sludge splitting device 6 and passed through the sludge return pipe 6 2 A part of the sludge is led back into the tank 50, and another sludge is introduced into a sludge concentration tank 6 6 via the sludge collection pipe 64. Some particles in the wastewater cannot be settled by agents such as coagulants or coagulants. The sludge introduced into the slow mixing tank 50 by the sludge return pipe 6 2 can capture small rubber feathers, and settle these difficult-to-precipitate particles by sludge co-precipitation to help agglomerate the particles in the wastewater. . Part of the sludge in the slow-mixing sedimentation tank 50 is led back through the sludge return pipe 62, and may account for 10% to 30% by weight of the total sludge discharged from the slow-mixing sedimentation tank. For example, the sludge introduced into the slow mixing tank 50 via the sludge return pipe 6 2 may account for 20%, and the sludge introduced into the sludge concentration tank 6 6 via the sludge collecting pipe 64 may be Accounted for 80%. Finally, the treated water is discharged via the outlet pipe 70, and the turbidity (t u r b i d i t y ) of the treated water of the present invention can reach 1 〇 m g / L, and the water quality is very good. Furthermore, PAC is traditionally used to treat aluminum CMP wastewater. Since PAC will dissociate in water, the treated water will have high conductivity and require further processing. As for the present invention, the use of a polymer to treat copper CMP wastewater does not have a high conductivity problem with the treated water, and no further treatment for lowering the conductivity is required. In summary, the present invention dilutes the coagulant with a small amount of copper CMP wastewater, so that the coagulant can be more uniformly diffused, so that the coagulant can more effectively agglutinate with the wastewater. Furthermore, the present invention directs the sludge back into the slow mixing sedimentation tank, and the difficult-to-precipitate particles can be settled by the co-precipitation of the sludge to help the agglomeration of the particles in the wastewater. Therefore, the present invention can successfully treat copper CMP wastewater and make

0503-8388TWF1 · TSMC2002-0347 : Cathy.ptd 第9頁 1254033 _案號 91118654 曰 修正 五、發明說明(6) 處理水的濁度達到1 〇 m g / L以下。 具體實施例 使用第1圖所示之裝置來處理銅化學機械研磨廢水 (C u - C Μ P廢水)。所使用之混凝劑3 2為F S C ( Π 〇 c t a n t s t r ο n g c a t i ο η )聚合物混凝劑,使其流入混合單元3 0中。 取廢水供應裝置10中Cu-CMP廢水總量的5%至1〇%體積比之 廢水,使其流入混合單元3 0中,以稀釋F S C聚合物混凝 劑。 然後,將稀釋過之FSC聚合物混凝劑以及剩餘之大量 Cu-CMP廢水(即,Cu-CMP廢水總量的90%至95%體積比之廢 水)分別導入反應槽4 0中。 然後,將氫氧化納(N a 0 Η)和硫酸(H2 S 04)注入反應槽4 0 中,以將反應槽40中廢水的pH調整至pH二9〜10。然後,將 反應槽4 0中的廢水快速攪拌約5〜2 0分鐘以凝集其中的化合 物,特別是銅離子。 然後,將反應槽40内所得之凝集液導入一慢混沈澱槽 5 0内。此時,將聚合物助凝劑5 2導入慢混沈澱槽5 0内,與 凝集液混合,而產生污泥。將慢混沈澱槽5 0中所排出全部 污泥之2 0 %重量比的污泥,經由污泥導回管6 2而導回慢混 沈澱槽5 0中,以幫助廢水中顆粒的凝集。另外,經由污泥 收集管6 4,將慢混沈澱槽5 0中所排出之其餘污泥(即,全 部污泥之80%重量比的污泥)導入污泥濃縮池66。 經由出流管7 0而排放出之經處理水,經過檢測,可發 現經處理水的濁度(turbidity; Tu)可達到1〇 mg/L,表示 水質非常好。0503-8388TWF1 · TSMC2002-0347 : Cathy.ptd Page 9 1254033 _ Case No. 91118654 修正 Amendment V. Description of invention (6) The turbidity of treated water is less than 1 〇 m g / L. BEST MODE FOR CARRYING OUT THE INVENTION Copper chemical mechanical polishing wastewater (C u - C Μ P wastewater) was treated using the apparatus shown in Fig. 1. The coagulant 3 2 used is a F S C ( Π 〇 c t a n t s t r ο n g c a t i ο η ) polymer coagulant which is allowed to flow into the mixing unit 30. The wastewater of 5% to 1% by volume of the total amount of Cu-CMP wastewater in the wastewater supply device 10 is taken into the mixing unit 30 to dilute the F S C polymer coagulant. Then, the diluted FSC polymer coagulant and the remaining large amount of Cu-CMP wastewater (i.e., 90% to 95% by volume of the total amount of Cu-CMP wastewater) are introduced into the reaction tank 40, respectively. Then, sodium hydroxide (N a 0 Η) and sulfuric acid (H 2 S 04) are injected into the reaction tank 40 to adjust the pH of the wastewater in the reaction tank 40 to pH 2 to 10-10. Then, the waste water in the reaction tank 40 is rapidly stirred for about 5 to 20 minutes to agglomerate the compound therein, particularly copper ions. Then, the agglomerate obtained in the reaction tank 40 is introduced into a slow mixing sediment tank 50. At this time, the polymer coagulant 52 is introduced into the slow-mixing precipitation tank 50, and mixed with the aggregating liquid to produce sludge. The sludge of 20% by weight of the total sludge discharged from the slow mixing tank 50 is led back to the slow mixing tank 50 via the sludge return pipe 6 2 to assist in the aggregation of the particles in the wastewater. Further, the remaining sludge discharged from the slow-mixing sedimentation tank 50 (i.e., the sludge of 80% by weight of the entire sludge) is introduced into the sludge concentration tank 66 via the sludge collecting pipe 64. The treated water discharged through the outflow pipe 70 is tested to find that the turbidity (Tu) of the treated water can reach 1 〇 mg/L, indicating that the water quality is very good.

0503-8388TWF1 ; TSMC2002-0347 ; Cathy.ptd 第10頁 1254033 案號 91118654 年 月 曰 修正 五、發明說明(7) 雖然本發明已以較佳實施例揭露如上,然其並非用以 限制本發明,任何熟習此項技藝者,在不脫離本發明之精 神和範圍内,當可做更動與潤飾,因此本發明之保護範圍 當以後附之申請專利範圍所界定者為準。0503-8388TWF1 ; TSMC2002-0347 ; Cathy.ptd Page 10 1254033 Case No. 91918654 Revision 5, Invention Description (7) Although the present invention has been disclosed in the preferred embodiments as above, it is not intended to limit the present invention. Any person skilled in the art will be able to make changes and refinements without departing from the spirit and scope of the invention, and the scope of the invention is defined by the scope of the appended claims.

0503-8388TWF1 ; TSMC2002-0347 : Cathy.ptd 第11頁 1254033 案號 9Π18654 年 月 曰 修正 圖式簡單說明 第1圖顯示依據本發明較佳實施例之處理銅化學機械 研磨廢水的裝置之示意圖。 標號之說明 10〜銅CMP廢水供應裝置; 2 0〜廢水分流裝置; 2 2〜管路; 2 4〜流量指示器; 26〜管路; 3 0〜混合單元; 3 2〜混凝劑; 3 4〜第一控制單元; 36〜管路; 4 0〜反應槽; 5 0〜慢混沈澱槽; 5 2〜助凝劑; 5 4〜第二流量控制單元 6 0〜污泥分流裝置; 6 2〜污泥導回管; 6 4〜污泥收集管; 6 6〜污泥濃縮池; 7 0〜出流管。0503-8388TWF1 ; TSMC2002-0347 : Cathy.ptd Page 11 1254033 Case No. 9Π18654 月 修正 Correction Schematic description of the drawings Fig. 1 is a schematic view showing an apparatus for treating copper chemical mechanical polishing wastewater according to a preferred embodiment of the present invention. Description of the label 10~ copper CMP wastewater supply device; 2 0~ waste water splitting device; 2 2~ pipeline; 2 4~ flow indicator; 26~ pipeline; 3 0~ mixing unit; 3 2~ coagulant; 4~first control unit; 36~ pipeline; 4 0~ reaction tank; 5 0~ slow mixing sedimentation tank; 5 2~ coagulant; 5 4~ second flow control unit 6 0~ sludge splitting device; 2 ~ sludge return pipe; 6 4 ~ sludge collection pipe; 6 6 ~ sludge concentration tank; 7 0 ~ outflow pipe.

0503-8388TWF1 ; TSMC2002-0347 ; Cathy.ptd 第12頁0503-8388TWF1 ; TSMC2002-0347 ; Cathy.ptd Page 12

Claims (1)

...τ 案號 91118654: V::年 月 修正 六 二ίϋ.Μ挺圍 1 · 種 入 以既定 將稀釋 反應槽 將上述 助凝劑混合 除去污 2. 如申 廢水的方法 3. 如申 廢水的方法 4 ·如申 廢水的方法 5 ·如申 廢水的方法 磨廢水為導 10%體積比’ 6.如申 廢水的方法 以下步驟: 中顆粒的凝 7 ·如申 廢水的方法 混沈澱槽中 處理銅化學 量之銅化學 之混凝劑和 内,使廢水 步驟所得之 ,而產生污 泥,而排放 請專利範圍 ,其中該混 請專利範圍 ,其中該混 請專利範圍 ,其中該助 請專利範圍 ,其中用以 入反應槽中 ) 請專利範圍 ,在將凝集 將部分污泥 集。 請專利範圍 ,其中該導 所排出全部 機械研磨廢水的方法,其包括: 機械研磨廢水來稀釋一混凝劑; 大量之銅化學機械研磨廢水分別導 和混凝劑產生凝集反應; 凝集液導入一慢混沈澱槽内,與一 泥;以及 經處理之水。 第1項所述之處理銅化學機械研磨 凝劑為一聚合物。 第2項所述之處理銅化學機械研磨 凝劑為聚丙醯胺。 第1項所述之處理銅化學機械研磨 凝劑為一聚合物。 第1項所述之處理銅化學機械研磨 稀釋混凝劑之既定量銅化學機械研 之大量銅化學機械研磨廢水之5 %至 第1項所述之處理銅化學機械研磨 液導入慢混沈澱槽内之後,更包括 導回該慢混沈殿槽内,以幫助廢水 第6項所述之處理銅化學機械研磨 回慢混沈澱槽内之部分污泥佔由慢 污泥的1 0 %至3 0 %重量比。...τ Case No. 91118654: V:: Years and months corrections 六 ϋ ϋ Μ Μ · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · Waste water method 4 · Method for applying wastewater 5 · For example, the method of wastewater treatment is to guide the wastewater to a 10% by volume ratio. 6. The following steps: The method of wastewater treatment: The condensation of medium particles 7. The method of mixing waste water In the treatment of copper chemistry of copper chemical coagulant and inside, so that the waste water step is obtained, and the sludge is produced, and the scope of the patent is discharged, wherein the scope of the patent is mixed, wherein the scope of the patent is mixed, wherein the assistance The scope of the patent, which is used to enter the reaction tank) Please patent the range, in the agglomeration will be part of the sludge. The patent scope, wherein the guide body discharges all mechanical grinding wastewater, comprising: mechanically grinding wastewater to dilute a coagulant; a large amount of copper chemical mechanical polishing wastewater respectively and coagulating agent to generate agglutination reaction; Slowly mix the sedimentation tank with a mud; and treated water. The copper chemical mechanical polishing agent described in item 1 is a polymer. The copper chemical mechanical polishing agent described in item 2 is polyacrylamide. The copper chemical mechanical polishing agent described in item 1 is a polymer. The copper chemical mechanical polishing dilution coagulant described in item 1 is quantified by copper chemical mechanical research and development of a large amount of copper chemical mechanical polishing wastewater by 5% to the treatment of copper chemical mechanical polishing liquid introduced into the slow mixing precipitation tank After the inside, it also includes returning the slow mixing chamber to help the copper chemical mechanical grinding back to the slow mixing tank in the wastewater mentioned in item 6 to account for 10% to 30% of the slow sludge. %weight ratio. 0503-8388TWF] : TSMC2002-0347 : Cathy.ptd 第13頁 Π54033 案號 91118654 $'申請專利範圍 月 曰 修正 8.如申請專利範圍第7項所述之處理銅化學機械研磨 廢水的方法,在將稀釋之混凝劑導入一反應槽内之後,更 包括以下步驟:調整反應槽内廢水的p Η值至8 — 1 1之間。 9 ·如申請專利範圍第8項所述之處理銅化學機械研磨 廢水的方法,在將稀釋之混凝劑導入一反應槽内之後,更 包括以下步驟:調整反應槽内廢水的pH值至9至1 0之間。 1 0 · —種處理鋼化學機械研磨廢水的裝置,其包括: 一混合單元,用以容納一混凝劑和既定量之銅化學機 械研磨廢水,使混凝劑被稀釋; 一反應槽,位於該混合單元之下游,用以容納經稀釋 之混凝劑和大量之鋼化學機械研磨廢水,使兩者混合而產 生凝集反應; 一慢混沈澱槽,位於該反應槽之下游,用以容納一助 凝劑以及由反應槽而來之廢水,使兩者混合而產生污泥; 以及 一出流管,位於該慢混沈澱槽之下游,用以排出由慢 混沈殿槽而來之經處理水。 1 1 ·如申請專利範圍第丨0所述之處理銅化學機械研磨 廢水的裝置,更包括一第一流量控制單元,位於該混合單 元之上游,用以控制混凝劑至混合單元之流量。 1 2 ·如申請專利範圍第1 〇項所述之處理銅化學機械研 磨廢水的裝置,更包括一第二流量控制單元,位於該慢混 沈澱槽之上游,用以控制助凝劑至慢混沈澱槽之流量。 1 3 ·如申請專利範圍第1 〇項所述之處理銅化學機械研0503-8388TWF] : TSMC2002-0347 : Cathy.ptd Page 13 Π 54033 Case No. 91118654 $ 'Application for Patent Range Month Revision 8. The method for treating copper chemical mechanical grinding wastewater as described in claim 7 After the diluted coagulant is introduced into a reaction tank, the method further comprises the steps of: adjusting the p Η value of the wastewater in the reaction tank to between 8 and 11. 9) The method for treating copper chemical mechanical polishing wastewater according to claim 8 of the patent application, after introducing the diluted coagulant into a reaction tank, further comprising the steps of: adjusting the pH of the wastewater in the reaction tank to 9 Between 10 and 10. 1 0 · A device for treating steel chemical mechanical grinding wastewater, comprising: a mixing unit for accommodating a coagulant and a predetermined amount of copper chemical mechanical grinding wastewater to make the coagulant diluted; Downstream of the mixing unit, the diluted coagulant and a large amount of steel chemical mechanical grinding wastewater are mixed to form an agglutination reaction; a slow mixing sediment tank is located downstream of the reaction tank to accommodate a help The coagulant and the waste water from the reaction tank are mixed to produce sludge; and an outflow pipe is located downstream of the slow mixing sedimentation tank for discharging the treated water from the slow mixing tank. 1 1 The apparatus for treating copper chemical mechanical polishing wastewater as described in claim 0, further comprising a first flow control unit located upstream of the mixing unit for controlling the flow of the coagulant to the mixing unit. 1 2 · The apparatus for treating copper chemical mechanical grinding wastewater according to claim 1 of the patent application, further comprising a second flow control unit located upstream of the slow mixing sedimentation tank for controlling the coagulant to the slow mixing The flow rate of the sedimentation tank. 1 3 ·Research on copper chemical mechanical research as described in item 1 of the patent application scope 0503-8388TWF1 ; TSMC2002-0347 ; Cathy.ptd 第14頁 1254033 案號 91 1 18654 年 月 曰 修正 六、申請專利範圍 磨廢水的裝置,更包括: 該混合單元和反應槽之上游, 分為既定量之廢水以流至混合 水以流至反應槽中。 〇項所述之處理銅化學機械研 一廢水分流裝置,位於 用以將銅化學機械研磨廢水 單元中,以及分為大量之廢 1 4 .如申請專利範圍第1 磨廢水的裝置,更包括: 一污泥導回管,用以將污泥導回該慢混沈澱槽内,以 幫助廢水中顆粒的凝集。 1 5 .如申請專利範圍第1 0項所述之處理銅化學機械研 磨廢水的裝置,更包括: 該慢混沈澱槽之下游,用以將 為兩部分,而分別導入一污泥 以將一部分之污泥導回該慢混 粒的凝集,該污泥收集管可用 污泥濃縮池中。 一污泥分流裝置,位於 由慢混沈澱槽排出之污泥分 導回管和一污泥收集管, 其中該污泥導回管可用 沈澱槽内,以幫助廢水中顆 以將另一部分之污泥導入一0503-8388TWF1 ; TSMC2002-0347 ; Cathy.ptd Page 14 1254033 Case No. 91 1 18654 Lunar New Year Amendment Six, the application for patented range of wastewater treatment equipment, including: The mixing unit and the upstream of the reaction tank, divided into two The wastewater is passed to the mixed water to flow into the reaction tank. The copper chemical mechanical research and development wastewater separation device described in the above-mentioned item is located in the chemical mechanical grinding wastewater unit for copper, and is divided into a large amount of waste. The apparatus for the first grinding wastewater of the patent scope includes: The sludge return pipe is used to guide the sludge back into the slow mixing sedimentation tank to help agglomerate the particles in the wastewater. 1 5 . The apparatus for treating copper chemical mechanical polishing wastewater according to claim 10 of the patent scope, further comprising: downstream of the slow mixing sedimentation tank, which is to be introduced into two parts and separately introduced into a sludge to be part of The sludge is led back to the agglutination of the slow mix, and the sludge collection pipe can be used in a sludge concentration tank. a sludge splitting device, located in a sludge splitting pipe and a sludge collecting pipe discharged from the slow mixing sedimentation tank, wherein the sludge conducting pipe can be used in the sedimentation tank to help the waste water to contaminate another part Mud into one 0503-8388TWF1 : TSMC2002-0347 ; Cathy.ptd 第15頁0503-8388TWF1 : TSMC2002-0347 ; Cathy.ptd Page 15
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