TWI252307B - Temperature sensing device - Google Patents
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- TWI252307B TWI252307B TW93131780A TW93131780A TWI252307B TW I252307 B TWI252307 B TW I252307B TW 93131780 A TW93131780 A TW 93131780A TW 93131780 A TW93131780 A TW 93131780A TW I252307 B TWI252307 B TW I252307B
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1252307 五、發明說明 —案% (1) 93131780 ^ 曰 修正1252307 V. INSTRUCTIONS - Case % (1) 93131780 ^ 修正 Correction
【發明所屬之技術領域】 本發明係一種溫度感測裝置,尤指:種令使用者利用 該裝置檢測各種發熱電子元件上之熱量時’可達成簡便、 快速、節省時間及成本之裝置者。 【先前技術】 按,一般檢測電腦中發熱電子元件(如·中央處理單 元(CPU )、記憶體、硬碟機·· ·等)之方式,係透過 /傳統溫度感測裝置,將該裝置之各感測線分別連接於待 測之電子元件表面上,令待測電孑元件之熱$可經由各感 測線傳送至該習用溫度感測裝置上,而使該習用溫度感測 裝置感測該熱量,並將對應該熱量之數值’透過一列表裝 置列印出來。 惟,/般習用溫度感測裝置皆體積大,不易搬動,而 綠加檢測之困難,且該習用溫度感測裝置價格昂貴’導致 =幅增加使用者之成本,且該習用溫度感測裝置之感測線 雜亂,不易安裝,因此,實有必要開發設計 種體積 <達成簡便、快速、節省時間及成本之溫度感測裝 J 以改善上述習用溫度感測裝置之诸多缺失。 % 發明内容】 發明人有鑑於前述習用溫度感測裝置皆體積大、不易 膚格昂貴、及不易安奘笠綠點,7¾佑t你畫雷聪菸BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature sensing device, and more particularly to a device that allows a user to use the device to detect heat on various heat-generating electronic components, which can be implemented in a simple, fast, time-saving, and cost-effective manner. [Prior Art] Press to generally detect the heating electronic components in the computer (such as the central processing unit (CPU), memory, hard disk drive, etc.), through the / traditional temperature sensing device, the device Each of the sensing lines is respectively connected to the surface of the electronic component to be tested, so that the heat of the electrical component to be tested can be transmitted to the conventional temperature sensing device via the sensing lines, so that the conventional temperature sensing device senses the heat. And print the value of the corresponding heat value through a list device. However, the conventional temperature sensing devices are large in size, difficult to move, and the green detection is difficult, and the conventional temperature sensing device is expensive, resulting in an increase in the cost of the user, and the conventional temperature sensing device The sensing line is messy and difficult to install. Therefore, it is necessary to develop a design volume<to achieve a simple, fast, time-saving and cost-sensitive temperature sensing device to improve the many missing of the above conventional temperature sensing device. Inventors have in view of the above-mentioned conventional temperature sensing devices are large in size, not easy to be expensive, and difficult to install green spots, 73⁄4you t you draw Lei Congyan
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研究各種解決的方法,在經過不斷的研究、實驗與改良 後,終於開發設計出本發明之一種溫度感測裝置,俾能摒 除先前技術所衍生之諸多缺失。 本發明之一目的,係提供一種簡便、快速、節省時間 及成本之溫度感測裝置,該溫度感測裝置之一表面上装级 有一螢幕,另一表面上設有供感測溫度之一感測部,該装 置之内部電路設有一微處理器及一溫度感測器,' ^中該微 處理器與該溫度感測器電氣連接,並與該螢幕電^相速 接,而該溫度感測器則與該感測部相連接,令該2度感測 器可將其感測之數值訊號傳送至該微處理器。 又 當將該感測部貼近待測物(如:中央處理單元 (CPU ))之表面上時,該待測物上之熱量將經由該感測 部傳導至該溫度感測器,令該溫度感測器感測該熱量,並 將對應該熱量之數值訊號傳送至該微處理器,使^微處理 裔將此數值成號轉換成對應之熱量數值,再透 綮幕將 此熱量數值顯示出來,因此,藉由本發明 造,令利用本發明檢測各種發熱電子元件可 更加簡便、快速、節省時間及成本。 之熱里时 為便貴審查委員能對本發明之目的、形狀、構造裝 置特徵及其功效,做更進一步之認識與瞭解,茲舉實施例 配合圖式,洋細說明如下: ' 【實施方式】After studying various solutions, after continuous research, experimentation and improvement, the temperature sensing device of the present invention was finally developed and designed to eliminate many defects derived from the prior art. It is an object of the present invention to provide a temperature sensing device that is simple, fast, time-saving and cost-effective. One surface of the temperature sensing device has a screen mounted on the surface, and the other surface is provided with one sensing temperature. The internal circuit of the device is provided with a microprocessor and a temperature sensor, wherein the microprocessor is electrically connected to the temperature sensor and is connected to the screen, and the temperature sensing is performed. The device is connected to the sensing portion, so that the 2 degree sensor can transmit the sensed value signal to the microprocessor. When the sensing portion is placed on the surface of the object to be tested (for example, a central processing unit (CPU)), heat on the object to be tested is transmitted to the temperature sensor via the sensing portion, and the temperature is obtained. The sensor senses the heat and transmits a value signal corresponding to the heat to the microprocessor, so that the micro-processing person converts the value into a corresponding heat value, and then displays the heat value through the screen. Therefore, by the present invention, it is easier, faster, time-saving and cost-effective to detect various heat-generating electronic components using the present invention. In the case of the heat, the review committee can make a further understanding and understanding of the purpose, shape, structure and function of the present invention, and the embodiments are combined with the drawings, and the details are as follows: 'Embodiment】
第6頁 1252307 93131780_生 月 曰 偬 ^___ 五、發明說明(3) 本發明係一種溫度感測裝置,請參閱第1圖所示,該 裝置係設有/本體丨〇,該本體丨〇之一表面上裝設有一螢幕 1 1 (如:液晶螢幕),另一表面上則設有一供感測溫度之 感測部1 2,請參閱第2、3圖所示,該本體1 〇之内部電路上 設有一微處理器1 3及一溫度感測器1 4,其中該微處理器1 3 與該溫度感測器1 4電氣連接’並與該螢幕11電氣相連接, 而該溫度感測器1 4與該感測部1 2相連接。 當將該感測部1 2貼近待測物(如:中央處理單元 (CPU )、記憶體、硬碟機· ··等)(圖中未示)之表 面上時,該待測物上之熱量將經由該感測部1 2傳導至該溫 度感測器1 4,令該溫度感測器1 4感測該熱量,並將其產生 對應該熱量之數值訊號傳送至該微處理器1 3,使該微處理 器1 3將此數值訊號轉換成對應之熱量數值,透過該榮幕11 將此熱量數值顯示出來。 復請參閱第2圖所示,該感測部1 2上設有至少一個連 接元件15 (如··磁鐵、雙面膠、嵌扣、黏著劑·· · 等)’令將該感測部1 2貼近於待測物之表面上時,可透過 該等連接元件1 5連接於該表面上,而使該感測部丨2可固定 於該表面上。 復睛參閱第1、3圖所示,該本體1 〇之一侧邊上設有一 電源開關1 6,該電源開關丨6與該本體丨〇之内部電路之電源 電氣連接’令該電源開關1 6被切換為斷路狀態(〇 ρ F ) 時’將停止該電源供電予該内部電路,另,當該電源開關 1 6被切換為通路狀態(ON )時,該電源則可供電予該内部Page 6 1252307 93131780_生月曰偬^___ V. DESCRIPTION OF THE INVENTION (3) The present invention is a temperature sensing device, as shown in Fig. 1, the device is provided with a body 丨〇, the body 丨〇 One surface is provided with a screen 1 1 (such as a liquid crystal screen), and the other surface is provided with a sensing portion 12 for sensing temperature. Please refer to Figures 2 and 3 for the body 1 The internal circuit is provided with a microprocessor 13 and a temperature sensor 14 , wherein the microprocessor 13 is electrically connected to the temperature sensor 14 and electrically connected to the screen 11 , and the sense of temperature The detector 14 is connected to the sensing portion 12. When the sensing portion 12 is placed on the surface of the object to be tested (for example, a central processing unit (CPU), a memory, a hard disk drive, etc.) (not shown), the object to be tested is The heat is transmitted to the temperature sensor 14 via the sensing portion 12, and the temperature sensor 14 senses the heat and transmits a numerical signal corresponding to the heat to the microprocessor 13. The microprocessor 13 converts the numerical signal into a corresponding heat value, and the heat value is displayed through the honor screen 11. Referring to FIG. 2, at least one connecting element 15 (such as a magnet, a double-sided tape, an inlay, an adhesive, etc.) is provided on the sensing portion 1 2 to make the sensing portion When the surface of the object to be tested is attached to the surface of the object to be tested, the connecting member 15 is connected to the surface, so that the sensing portion 2 can be fixed to the surface. Referring to Figures 1 and 3, a power switch 16 is provided on one side of the body 1 , and the power switch 丨 6 is electrically connected to the power supply of the internal circuit of the body ' When 6 is switched to the open state (〇ρ F ), the power supply will be stopped to the internal circuit, and when the power switch 16 is switched to the path state (ON), the power supply can be supplied to the internal
案號 93131780 曰 修正 1252307 五、發明說明(4) 電路。 復請參閱第1、3圖所示,該本體1 〇之一側邊上設有一 重置開關1 7,該重置開關1 7與該微處理器1 3相連接,令該 重置開關1 7被觸壓時,該微處理器1 3將消除目前所處理之 數值訊號,並將該螢幕11上所顯示之熱量數值歸零,嗣再 回復至處理該溫度感測器1 4傳送之熱量數值訊號之狀況。 復請參閱第1、3圖所示,該本體1 〇之一側邊上設有一 連接埠1 8 (如:USB連接璋),該連接埠丨8與該微處理器 1 3相連接,令藉由連接該連接埠丨8可轉存該微處理器丨3之 資料,以進行進一步之分析及比對。 復請參閱第1、3圖所示,該本體1〇之内部電路上設有 二記憶體19 (如:SRAM記憶體),該記憶體19與該微處理 杰1 3相連接,令該微處理器1 3可將處理中或完成處理之資 料(或指令)儲存於該記憶體1 9中,或自該記憶體丨9中讀 取事先儲存之資料(或指令)。 復請參閱第1、3圖所示,該本體1 〇之内部電路上設有 一類比數位轉換電路2〇,該類比數位轉換電路2〇 一端與該 溫度感測器1 4相接,另端則與該微處理器丨3相連接,令該 溫度感測器1 4傳送至該微處理器丨3之數值訊號,可經二該 類比數位轉換電路2〇,而由類比訊號轉換為該微處理器ι3 可處理之數位訊號。 據上述可知,藉由本發明裝置簡單之構造,令利用本 發明檢測各種發熱電子元件(如:電腦之中央處理單元 (CPU )、記憶體、硬碟機...等)上之熱量時,可達Case No. 93131780 曰 Amendment 1252307 V. Description of the invention (4) Circuit. Referring to Figures 1 and 3, a reset switch 17 is provided on one side of the body 1 , and the reset switch 17 is connected to the microprocessor 13 to make the reset switch 1 When the 7 is touched, the microprocessor 13 will eliminate the currently processed numerical signal, and zero the amount of heat displayed on the screen 11, and then return to the heat transferred by the temperature sensor 14 The status of the numerical signal. Referring to Figures 1 and 3, one side of the body 1 is provided with a connection port 18 (such as a USB port), and the port 8 is connected to the microprocessor 13. The data of the microprocessor 丨3 can be transferred by connecting the port 8 for further analysis and comparison. Referring to Figures 1 and 3, the internal circuit of the body 1 is provided with two memories 19 (e.g., SRAM memory), and the memory 19 is connected to the microprocessor J 13 to make the micro The processor 13 can store the data (or instructions) being processed or completed in the memory 19 or read the previously stored data (or instructions) from the memory 丨9. Referring to Figures 1 and 3, the internal circuit of the body 1 is provided with an analog-digital conversion circuit 2〇, and one end of the analog-to-digital conversion circuit 2 is connected to the temperature sensor 14 and the other end Connected to the microprocessor 丨3, the digital signal transmitted by the temperature sensor 14 to the microprocessor 丨3 can be converted to the micro by the analog signal conversion circuit 2 Processor ι3 can process digital signals. According to the above, the simple structure of the device of the present invention enables the use of the present invention to detect heat on various heat-generating electronic components (such as a central processing unit (CPU), a memory, a hard disk drive, etc. of a computer). Da
第8頁 1252307 案號 93131780 年 月 修正 五、發明說明(5) 成簡便、快速、節省時間及成本之功效。 以上所述,僅為本發明最佳具體實施例,惟本發明之 構造特徵並不侷限於此,任何熟悉該項技藝者在本發明領 域内,可輕易思及之變化或修飾,皆可涵蓋在以下本案之 專利範圍。Page 8 1252307 Case No. 93131780 Rev. V. Invention Description (5) It is simple, fast, time-saving and cost-effective. The above description is only the best embodiment of the present invention, but the structural features of the present invention are not limited thereto, and any change or modification that can be easily considered by those skilled in the art can be covered. In the following patent scope of this case.
第9頁 1252307 案號 93131780 年月日 修正 圖式簡單說明 【圖式簡單說明】 第1圖係本發明溫 第2 圖係本發明溫 第3圖係本發明溫 度感測裝置之立體外觀圖; 度感測裝置之剖面示意圖; 度感測裝置之電路方塊圖。 【主要元件符號說明】 本體.....................10 螢幕............11 感測部..................12 微處理器……13 溫度感測器............14 連接元件......1 5Page 9 1252307 Case No. 93131780 Year and month correction diagram simple description [schematic description of the drawings] Fig. 1 is a temperature diagram of the present invention. Fig. 3 is a perspective view of the temperature sensing device of the present invention; Schematic diagram of the degree sensing device; circuit block diagram of the degree sensing device. [Description of main component symbols] Ontology.....................10 Screen............11 Sensing section... ..............12 Microprocessor...13 Temperature Sensor............14 Connecting Components...1 5
電源開關...............16 重置開關……17 連接埠..................18 記憶體.........19 類比數位轉換電路…20Power switch..................16 Reset switch...17 Connection 埠..................18 Memory... ...19 analog-to-digital conversion circuit...20
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TW93131780A TWI252307B (en) | 2004-10-20 | 2004-10-20 | Temperature sensing device |
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TW93131780A TWI252307B (en) | 2004-10-20 | 2004-10-20 | Temperature sensing device |
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