TWI250240B - Heat-resistant fiber paper sheet, method for making same, and prepreg and laminate made by same - Google Patents

Abstract

A heat-resistant fiber paper sheet which is formed from staple fibers made from a heat-resistant organic polymer, undrawn or low ratio drawn para-aromatic polyamide staple fibers, and an organic resin binder and/or fibrids comprising a heat-resistant organic polymer as main components, wherein the amount of said staple fibers is 45 to 97 percent by weight based on the total amount of said heat-resistant fiber paper sheet; the total amount of said organic resin binder and/or said fibrids is 3 to 55 percent by weight based on the total amount of said heat-resistant fiber paper sheet; and said organic resin binder is cured, and/or said undrawn or low ratio drawn para-aromatic polyamide staple fibers and said fibrids are partially softened, deformed and/or melted to exhibit the actions of binders. The obtained heat-resistant fiber paper sheet has excellent heat resistance, excellent heat dimensional stability, excellent plybond strength, an excellent electric insulating property in a high humidity, and the like, has good resin impregnability in spite of having a high bulk density, and is especially suitable for use as a substrate for electric insulating materials or as a substrate for laminates used for electric circuits.

Description

1250240 A? B7 V. INSTRUCTIONS (1) TECHNICAL FIELD (Please read the precautions on the back and fill out this page.) The present invention is excellent in electrical insulation properties under heat resistance and high temperature and high humidity, and can be suitably used for circuit boards. Heat-resistant fibrous paper of a laminate, a method for producing the same, and a fibrid using the heat-resistant fibrous paper, more specifically, a short fiber composed of a heat-resistant organic high-molecular polymer and a non-stretched or Heat-resistant fiber paper which is a main component of a low-rate stretched para-type aromatic polyamide short fiber, and an organic resin binder and/or a heat-resistant organic polymer polymer A manufacturing method and a fibrid using the heat resistant fiber paper. BACKGROUND ART A substrate used in a laminate for a circuit board is required to have heat resistance and heat-resistant scale stability, moisture resistance stability, electrical insulation, and deformation resistance (reversing torsion, bending, and wave breaking) Various characteristics such as light weight, etc. 〇 Ministry of Economic Affairs Intellectual Property Bureau employees consumption cooperatives print heat-resistant condition fiber paper than other materials, heat resistance, electrical insulation, heat-resistant scale stability, lightweight It is superior in terms of other aspects, and has recently been continuously used as a substrate for laminates for circuit boards. For example, a paper composed of a staple fiber of poly-isophenylisodecylamine ("Conex" manufactured by Teijin Co., Ltd.) and a pulp of poly-isophenylisodecylamine has been proposed (Special Kaiping 2 - 2) 3 6 9 0 7 7 7 7 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 "Tecnora" and heat-resistant fiber paper made of organic resin adhesive (Specially open paper size applicable to China National Standard (CNS) A4 specification (210X297 mm) -4- 1250240 A7 B7 V. Description of invention (2 ) 1 — 9 2 2 3 Bulletin No. 3, JP-A-2-2 3 3 9 2). (Please read the precautions on the back and fill out this page.) However, if the former heat treatment at a high temperature of 250 °C or higher, the shrinkage will not only cause a scale change, but also the equilibrium moisture content (water content) of the fiber is as large as 5 to 6%, and the content of impure ions is also large, so electrical insulation is particularly poor at high humidity, and it cannot be used in a substrate for electrical insulation which requires high reliability. On the other hand, the latter has a small equilibrium moisture ratio and a small amount of impure ions. However, since an organic resin is used as a binder component, the binder component is migrated and biased in the manufacturing process of the paper. On the back side of the paper, as a result, the amount of the binder component present in the middle portion of the paper is small, and there is a problem that the unevenness in the thickness direction of the paper and the reliability are deteriorated. If the use of such heat-resistant fiber paper is used as a substrate for laminates for circuit boards, the manufacturing department of the Intellectual Property Office of the Ministry of Economic Affairs will, in particular, make impregnation of epoxy resin and the like. The drying prepreg preparation process and the process of laminating the prepreg article, etc., so that the deviation of the impregnation amount (especially the thickness direction) and the adhesion amount of the mixed enamel paint is enlarged, and the adhesive is made Partial melting of the resin and reduction of the adhesion between the fibers are used, so that the cutting of the paper substrate occurs, and the short fibers forming the paper move to each other, which deteriorates the uniformity of the fiber density distribution, particularly in the high-temperature processing. After the end of the countercurrent process, there is a problem that the laminate for the board is deformed (twisted, bent, waved, etc.), which is not preferable. In addition, it is also proposed to use a fibrillar of meta-type aromatic polyamine instead of an organic resin as a binder component, and apply the Chinese National Standard (CNS) to the standard of the para-type aromatic polyamine. A4 size (210X 297 mm) - 5- 1250240 A7 B7 plus coffee.................. w ι------- - V. Description of invention ( 3) a fiber ("Kebra" manufactured by Du ρ ο nt) and a microfiber ("Kebra" manufactured by Dupont Co., Ltd.) of a fibrillated para-type aromatic polyamine. The paper is mechanically combined with the body and the paper is combined (the special opening of the K-6-160 0500, the special fair 5-6564 0), the paper is stable in heat resistance and heat resistance, and is resistant to moisture. Excellent stability, deformation resistance (difficult to produce twist, bend, wave, etc.), etc., but the binder component used is only fibrid, in the engineering of laminates for circuit boards, Maintaining the necessary tensile strength has forced the addition of the fibrids to increase during actual production. However, the fibrids composed of the aromatic aromatic polyamines used in the paper have a high equilibrium moisture content and a high content of impure ions, so that the electricity is carried out under high humidity. In the insulation test, such papers have many problems of defective products. That is, many laminates for boards made of a substrate having a high water absorption ratio (balanced moisture ratio) are used as a main material, and if it is energized for a long period of time under high humidity, the impure ions contained therein are migrated, so electricity is generated. Poor insulation and failure to maintain long-term reliability. Further, an aromatic polyamide fiber paper composed of short fibers composed of a short aromatic fiber composed of a para-type aromatic polyamine and a meta-type aromatic polyamine is also proposed (Special Kaiping 9-28 2 In the case of the use of meta-type aromatic polyamide fibers, the paper has a high water absorption rate and a large amount of impure ions. Therefore, as described above, the electrical insulation test of the substrate is carried out at a high temperature. It also has the problem of being prone to defects, and the large amount of variation in the electric resistance between the layers in the thickness direction of the printed circuit board during repeated suction and desorption. This paper scale applies the Chinese National Standard (CNS) A4 specification (210X 297 mm). (Please read the note on the back and then fill out this page) Order the Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed - 6 - Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 1250240 A7 B7 n Old ηιπι,. , ,. „5. Inventive Note (4) As described above, various heat-resistant fiber papers have been proposed, but the water absorption and impure ion content have not been achieved so far, and the electrical insulation property is excellent and the uniformity in the paper thickness direction is excellent. Paper substrate with electrical insulating material which is excellent in impregnation with enamel, and excellent in interlayer bonding and deformation resistance. The invention aims to provide heat resistance and thermal scale stability. Excellent in properties, interlaminar peel strength, electrical insulation under high humidity, etc., and good impregnation property of the resin even in high bulk density, particularly suitable heat resistance as a substrate for a substrate for electrical insulating materials and a laminate for a circuit. The fiber paper and the prepreg and the laminate thereof using the heat-resistant fiber paper. The inventors of the present invention have made efforts to solve the problems of the prior art described above, and found that the pair currently used in the market is found. One or two or more kinds of short fibers composed of a short fiber-like heat-resistant organic polymer composed of a positional aromatic polyamide fiber, and a non-stretching or low magnification having a specific gravity of 1·380 or less The short fiber composed of the para-type aromatic polyamine is formed by an organic resin binder exhibiting adhesive properties and/or an organic polymer having heat resistance in the papermaking stage. The formed fibrids are combined with papermaking, and thereafter, the organic resin binder is cured at a high temperature and a high pressure, and/or a fibrid composed of the heat-resistant organic high molecular polymer, and / or, the short fiber composed of the unstretched or low-stretched aromatic polyamine is partially softened, and / or the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the notes on the back and fill out this page)

1250240 A7 B7 V. INSTRUCTION DESCRIPTION (5) The fusion makes it possible to obtain a desired heat-resistant fiber paper by strongly bonding the single fibers forming the paper. That is, according to the present invention, it is a short fiber composed of a heat-resistant organic high-molecular polymer, and a non-ducted or low-rate extended para-type aromatic polycondensation having a specific gravity of 1·380 or less. a heat-resistant fibrous paper formed of a fibril short fiber and a fibrid composed of an organic resin binder and/or a heat-resistant organic polymer as a main component, the paper occupies the weight The amount of the short fibers is from 4 5 to 97% by weight, and the amount of the organic resin binder and/or the fibrid is in the range of from 3 to 55% by weight, and the organic resin binder is cured, and / or, the fibrids composed of the organic high molecular polymer, and / or the para-type aromatic polyamide short fibers are partially softened and / or melted and act as a binder a heat-resistant fiber paper characterized by a short fiber composed of a heat-resistant organic high-molecular polymer and an aromatic polyamide short fiber having a specific gravity of 1.38 or less, which is not extended or low-magnification. Fibrid composed of organic resin binder and/or heat resistant organic polymer After being used as a raw material and performing wet papermaking, the dried dried paper is heated and pressurized at a temperature of 2 2 0 to 4 0 0 ° C at a pressure of 150 to 250 kg/cm. The organic resin binder is cured, and/or the fibrid composed of the heat-resistant organic high molecular polymer and/or the unstretched or low-rate extended aromatic polyamide short fiber is partially a method for producing heat-resistant fibrous paper characterized by softening and/or melting, a prepreg formed by impregnating the heat-resistant fiber paper with a thermosetting resin, and a laminate obtained by laminating the prepreg . This paper scale applies to China National Standard (CNS) A4 specification (21〇X297 mm) (please read the note on the back and fill out this page). The Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative prints-8-1250240 A7 B7 (Invention) (6) The best mode for carrying out the invention The heat-resistant fibrous paper according to the present invention is a short fiber comprising a heat-resistant organic high molecular polymer and has a specific gravity of 1 · 3 800. The following short fiber of a non-stretched or low-rate extended para-type aromatic polyamine, a microfiber composed of an organic resin binder and/or a heat-resistant organic polymer; a fibrid composed of an organic polymer binder and/or a heat-resistant organic polymer, and/or the para-type aromatic polyamide short fiber A paper, nonwoven fabric or sheet that is partially softened and/or melted and which acts as a binder. The short fiber composed of the heat-resistant organic polymer may be an aromatic polyamine short fiber having a fiber forming ability and a thermal decomposition initiation temperature of 340 ° C or higher, or a heterocyclic-containing aromatic polymer. The short fibers composed of the short fibers or the polyether ether ketone, and the aromatic polyamine short fibers are preferably used. Further, the above short fibers may be used singly or in combination of two or more kinds. Further, the aromatic polyamide short fiber is an aromatic group represented by the following formula (I), which is 80 mol% or more, preferably 90 mol% or more, of the repeating unit constituting the polyamide. A short fiber composed of a high polyamine or an aromatic copolymerized decylamine. Here, Ari and Ar2 are aromatic groups, and the same or different aromatic groups selected by the following formula (Π) are preferred. However, the hydrogen atom of the aromatic group may be substituted by a halogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group or the like. This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm)~' ' -9- (Please read the note on the back and fill out this page)

1T Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 1250240 A7 B7 V. Invention description (7) (I) A N Η A Ari a N H C 0 A A 2 A C 0 —

(Please read the precautions on the back and then fill out this page.) The manufacturing method and fiber properties of such aromatic polyamide short fibers are described, for example, in British Patent No. 1 5 0 1 9 4 U.S. Patent No. 3,733,964, Japanese Patent No. 3,767,756, Japanese Patent Publication No. 3,8,9,9,9,9, and Japanese Patent Laid-Open Publication No. Sho. No. s. 8 6 No. 3, No. 5 8 - 1 4 4 1 5 2, JP-A-4-65513, etc. The Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperative, printed the aromatic polyamine used in the present invention. Particularly preferred among the fibers are para-type aromatic polyamine short fibers, which are short fibers of 50% by mole or more of the above-mentioned A ri and Ar 2 which are para-coordinated aromatic groups, specifically, A polyparaphenylene-p-amine short fiber ("Kebra" manufactured by Dupont Co., Ltd.), a copolymerized p-phenylene 3,4/monohydroxydiphenyl-p-nonylamine short fiber (Teijin) "Tecnora", etc., and especially in the latter, the impure ion content of the solvent used in the spinning is small and the electrical insulation is excellent. Therefore, it is preferred that the above-mentioned copolymerized phenyl- 3,4/monohydroxydiphenyl-p-nonylamine short fiber has a cationically-transformed non-ionic solid inorganic compound. The creator is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) on the paper scale of the laminate for circuit boards. -10- 1250240 A7 A B7 V. Invention description (8) (Please read the notes on the back first) Fill in this page again. Manufacturing engineering, especially in the process of impregnating epoxy resin with enamel paint, can improve the impregnation of the enamel paint, and also has deformation in the manufacturing process of laminates for circuit boards. The amount (the amount of twisting, bending, wave breaking, etc.) is reduced, and the electrical insulation property under high humidity, the stability of the scale, and the like also have an effect of improving, so it is a better aspect. The cation-transducing and non-ion-adsorbing inorganic compound is a compound having a conversion ability with a cation and further having a nonionic adsorption ability, and specific examples thereof include vermiculite-alumina, vermiculite-magnesia, kaolin, Acidic clay, activated clay, talc, bentonite, Osmoth, etc. These compounds are particularly good if they are fixed to the surface of the fiber by a solid binder type, so that the adhesion effect can be further improved, and the size (particle size) of the particles can be used. 0 · 0 1~5 · 0 0 // The substance of about m. So that the surface of the fiber is fixed with an inorganic compound, for example, the surface of the fiber is softened and melted, and the inorganic compound particles are pressed against the surface of the fiber, so that It can enter the surface layer of the fiber. The Ministry of Economic Affairs, the Intellectual Property Bureau, the employee consumption cooperative, printed the 尙, the para-type aromatic polyamide short fiber can also make one part of its terminal fiber, but the proportion If it is too much, the impregnation property of the enamel paint is uneven, and the problem of lowering the surface smoothness is caused, and the object of the present invention is hindered, which is not preferable. Secondly, the aromatic polyamidamide fiber which has a specific gravity of 3.88% or less and which is not extended or has a low-magnification ratio is preferably used as a para-type aromatic polyamine. The fiber which is usually commercially available has a tensile elongation of more than 5 · 3% (high elongation) and a strength of 17 · 5 g. This paper scale applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) -11 - 1250240 A7 A7 B7 V. Description of the invention (9) / denier (low strength), preferably the breaking strength is 6.0% or more, and the strength is 1 6 · 5 g / denier, and the better specific gravity range is A specific gravity of 1.37 or less is preferred. Such a para-type aromatic polyamide fiber can be used, for example, in the manufacture of a copolymer of p-phenylene-3,4-hydroxyl-phenylene-p-amine fiber, which is not extended. Pulling the fiber), or lowering the draw ratio to such that it does not promote crystallization (for example, a low draw ratio fiber having a stretch ratio of 3 times or less, or a maximum possible stretch ratio of 30 to 40% or less) Those who have gained less experience in manufacturing conditions. Such para-type aromatic polyamide short fibers have greatly different characteristics from the commercially available copolymers of phenyl phenyl 3,4 > hydroxydiphenylene phthalamide fibers. That is, the elongation at break is 5.3 % or more (high elongation), the strength is 1.7 g/d or less (low strength), and the specific gravity is 1.38 or less (low specific gravity). The para-type aromatic polyamide fiber having such characteristics has the same composition as the commercially available fiber, but is softened, deformed, melted (including a semi-molten state), cut, and meta-position under heat and pressure conditions. The type of aromatic polyamide fiber has lower water absorption, and the paper can be produced by using this property, and the above specific gravity exceeds 3.80, which is hard to cause softening, deformation, melting under such heating and pressing conditions, and is difficult to use. Its characteristics make paper. That is, the short fibers composed of the para-type aromatic polyamine which has the special properties of being easily deformed, softened, melted, and cut under heat and pressure conditions are mixed in a small amount and wet-laid paper. When heated and pressurized by optical machining, the fiber is softened, deformed, partially melted, partially cut and applied to the Chinese National Standard (CNS) A4 specification (210X 297 mm) on the paper scale (please read the notes on the back first) Fill in this page again. 'Installation · - Department of Economics, Intellectual Property Bureau, Staff and Consumer Cooperatives Printed -12- 1250240 A7 A7 B7 V. Inventions (10) (Please read the notes on the back and fill out this page) and other The entanglement and adhesion of the aromatic polyamide short fibers and the adhesion area are increased, and the degree of fixation and adhesion between the individual fibers are improved, and the tensile strength and interlayer peel strength of the formed paper are improved. The effect is an effective substrate which is effective for reducing the amount of deformation in the manufacturing process using an electrical material for the paper and a laminate for a circuit board. Printed by the Ministry of Economic Affairs, the Intellectual Property Office, and the Consumers' Cooperatives. In this case, as described above, the surface of the para-type aromatic polyamide fiber with a specific gravity of less than 3.80 is extended or low-magnification. In the case of a solid cation-transformed and non-ion-adsorbing inorganic compound adherent, in the impregnation of an epoxy resin or the like, the impregnation property of the mixed enamel paint is better, and the inorganic compound is permeated. In addition, the adhesion to the enamel lacquer is also improved, so that the amount of deformation is reduced in the manufacturing process such as the laminate for a circuit board, and the electrical insulation property, the scale stability, and the like are also exhibited under high humidity. The effect is preferred. Moreover, such non-stretched or low-rate extended para-type aromatic polyamide fibers have significantly less impure ion content and water absorption than the meta-type aromatic polyamide fibers, and are absorbent and dehumidified. The accompanying scale change is also small, so the electrical insulation resistance, especially for high-humidity, is a long-required substrate for electrical materials, and a circuit board with desired dimensional stability under various environmental atmospheres. As the substrate of the laminate, it is a suitable material. In the present invention, the short fiber composed of the unsupported or low-rate extended para-type aromatic polyamine having a specific gravity of 1·380 or less is based on the total weight of the aromatic polyamide short fibers. The short fibers composed of the aromatic polyamide fibers other than the para-type aromatic polyamide fibers are preferably blended in an amount of from 6 to 6% by weight in an amount of from 4 to 5% by weight. This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) -13- 1250240 A7 ________ B7__ V. Invention description (彳彳) (Please read the note on the back and fill out this page) In the conventional para-type aromatic polyamide fiber, when the water (moisture content) contained in the fiber is dehydrated (dehumidified) by heating or the like, the fiber tends to extend in the fiber axis direction, and In the case of a non-stretched or low-rate extended aromatic polyamide short fiber having a specific gravity of 1 · 380 or less, under the same conditions, the tendency of shrinkage is exhibited in the opposite direction to the fiber axis direction. When the fibers are combined, it is possible to obtain a heat-resistant fibrous paper which is difficult to undergo a scale change even if it is repeatedly wetted, dried, and dehumidified, and which is excellent in heat-resistant scale stability and moisture-resistant scale stability. In particular, the non-stretched or low-rate extended para-type aromatic polyamine short fiber having a specific gravity of 1.38 or less used in the present invention is composed of a meta-type aromatic polyamine. Short fibers, which have less balance of moisture and impure ions, and the scale change of the fiber axis direction under the same treatment conditions as described above is also slightly more than that of the conventional para-type aromatic polyamide fibers. Since the degree of the change is varied, the balance of the whole body can be easily obtained, and it is easy to design a heat-resistant fiber paper having excellent scale stability. The Ministry of Economic Affairs, the Intellectual Property Office, and the Employees' Cooperatives Co., Ltd. printed the above-mentioned aromatic polyamine short fibers with a specific gravity of less than 1.38, which is less than or less than 4% by weight of the paper. More preferably, it is 8% by weight or more. However, because of the unstretched or low-rate extended aromatic polyamine short fibers having a specific gravity of less than 1.38 Å, the water balance of the short fibers composed of commercially available para-type aromatic polyamines is balanced. Since the ratio (water content) is higher, if the amount of the mixture is too large, electrical insulation properties, particularly electrical insulation properties under high temperature and high humidity, are lowered, and it may not be used for laminates for circuit boards requiring long-term high reliability. On the substrate. Therefore, the limit of the mixing amount is at most 35 wt%, preferably 2 wt% or less. Applicable to China National Standard (CNS) A4 specification (; 210X297 mm) than this paper scale -14- Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed 1250240 A7 B7 V. Invention Description (12) Weight is 1 · 3 8 0 or less The mixing ratio of the aromatic polyamide short fibers of the unstretched or low-rate extension is less than the amount of the aromatic aromatic polyamide short fibers which achieve the same effect, and can be equal or more. The performance is preferably from the viewpoint of low water absorption and imperfect ion content which are not contained in the meta-type aromatic polyamide short fibers, but there is a slight fear of lowering heat resistance, so depending on the purpose and use, It is preferred that the foregoing ranges are used in combination.尙, a short fiber composed of a heat-resistant organic high molecular polymer other than the aromatic polyamide short fiber, and examples thereof include polyparaphenylene benzobisthiazole and polyparaphenylene benzobisoxazole. a short fiber composed of a heterocyclic aromatic polymer or a short fiber composed of polyetheretherketone. Thus, the thermal scale change rate after heat treatment at a temperature of 2800 ° C for 5 minutes can be controlled to 0.3 by adjusting the type and mixing ratio of the short fibers composed of the organic polymer having heat resistance to be used. % or less, preferably 0. 2 % or less, and the maximum change amount of the scale change caused by the moisture absorption and desorption of the heat-resistant fiber paper measured by the method described below can be controlled to 6 5 // m or less. It is preferably 5 5 // m or less, more preferably 4 0 // m or less, and the use of such paper can be made into deformation resistance (a phenomenon such as twisting, bending, wave breaking, etc.) and heat-resistant scale stability and moisture resistance. A laminate for electrical insulating materials and circuit boards with excellent dimensional stability. Here, the amount of change in the scale caused by the moisture absorption and desorption of the heat-resistant fiber paper was measured according to the following method. That is, a heat-resistant fibrous paper (length = 20 mm, width of 2 mm) which is allowed to stand for 48 hours or more in an atmosphere having a humidity of 85 % R 常 or more at room temperature The paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill out this page)

-15- 1250240 A7 B7 V. INSTRUCTIONS (13) (Please read the notes on the back and fill in this page.) At a temperature of 1 0 ° C / min, warm up from room temperature to 280 ° C, and then immediately Decrease the temperature to normal temperature at a cooling rate of 10 °C /min and dry it. Continue to repeat the temperature rise from normal temperature to 280 °C under the same conditions for 2 times, and measure the maximum change in the length direction of the paper ( The maximum elongation or maximum shrinkage can be obtained. The single fiber strength of the short fibers composed of the above heat-resistant organic polymer is preferably from 0 to 1 to 10 denier, and more preferably in the range of from 0.3 to 5 mm. When the single fiber fineness is less than 〇·1 denier, there are many difficulties in the spinning technology, and breakage and hairiness occur, and it is not possible to produce a good quality fiber, and the cost is also high, which is not preferable. On the other hand, if the single fiber fineness is more than 1 ’, the mechanical properties of the fiber, particularly the strength reduction is large, and it becomes unpractical. The fiber length of the short fiber composed of the heat-resistant organic high molecular polymer is in the range of 0·5~8 Omm, preferably 1~6 Omm, especially printed by the employee's consumer cooperative of the Ministry of Economic Affairs. In the case of forming a paper by a wet method, it is preferably used in the range of 2 to 12 mm, more preferably 2 to 5 to 6 mm. When the fiber length is less than 55 mm, the mechanical fiber of the obtained aromatic fiber paper as a fiber aggregate is not sufficiently sufficient. On the other hand, if the fiber length exceeds 80 mm, the fiber opening property of the short fiber is The deterioration of dispersibility and the like deteriorates the uniformity of the obtained fiber assembly, and the mechanical properties are still insufficient. Further, as described above, the fiber length when the short fibers composed of the two or more kinds of heat-resistant organic high molecular polymers are mixed may be the same, but the fiber length is at least 0 · 6 mm or more, preferably 1 · It is better to have 〇mm or more different from each other. The reason is because the short fiber lengths of the two are different than the two paper sizes. The Chinese National Standard (CNS) A4 specification (210X297 mm) -16-1250240 A7 B7 5. Inventive Note (14) (Please read the back Note: Please fill in this page. When the length of the short fibers is the same, the adhesion point between the two fibers in the paper is increased, and the thermal scale stability in the thickness direction of the paper is particularly good. In particular, when the para-type aromatic polyamide short fibers which are not stretched or low-rate stretched are mixed with the aromatic polyamide fibers other than the para-type aromatic polyamide short fibers, the effect is remarkable. which performed. However, in the case of heating and pressurization such as calender machining, the non-stretched or low-rate extended para-type aromatic polyamide short fibers having a specific gravity of 1.38 or less are high in elongation and low in strength. Further, the degree of crystallization is small and the specific gravity is low, and if necessary, it can be applied to the periphery of the aromatic polyamide short fibers other than the short fibers composed of the para-type aromatic polyamine which is not stretched or low-rate stretched. The extension, deformation, and cutting allow the individual fibers to be effectively adhered or joined to each other. Next, the organic resin binder used in the present invention is a thermosetting organic resin such as an epoxy resin, a phenol resin, a polyurethane resin, a melamine resin, or the like, wherein an epoxy functional group is contained in the molecule. The water-dispersible epoxy resin is also suitable for compatibility with the impregnated enamel in the prepreg preparation process. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the consumer consortium of the Ministry of Economic Affairs, the fibrid body composed of the organic high molecular polymer used in the present invention preferably has an equilibrium water content of 7.5 % or less, and is used in a wet papermaking process. 'Generally known as a thin leaf, a scaly piece, or a microfibrillated micro-short fiber having a microfibril body for exhibiting adhesive properties, for example, 'Japanese Patent Publication No. 3 5 - 1 1 8 5 1 In the case of the organic polymer solution, the fibrous polymer produced by mixing the organic polymer solution in the presence of the precipitant and the shearing force of the polymer solution is described in Japanese Patent Publication No. 3-7-75. And the paper size of the publication is as follows: Chinese National Standard (CNS) a4 specification (210X297 mm) -17- 1250240 A7 B7 V. Invention description (15) (Please read the back of the note first) In addition, as described in the above, the molded product having molecular orientation formed by the optical polymer solution exhibiting optical anisotropy is subjected to mechanical shearing force such as enthalpy so that it is randomly fibrillated. Method of the former Most appropriate. The organic high molecular polymer ー which forms such a fibrid can be used if it is a fiber or a heat-resistant polymer having a film forming ability and has a thermal decomposition starting temperature of 3 1 〇 ° C or more. For example, an aromatic polyamine, a molten liquid crystalline wholly aromatic polyester, a heterocyclic-containing aromatic polymer, or the like can be used, and among them, a polyphenylene group having a low impurity ion content, particularly a phenyl 3,4 / -hydroxy group, can also be used. A pair of phenylene diamines ("T ec η 〇ra" manufactured by Teijin Co., Ltd.) and a copolymer of p-hydroxybenzoate and 2,6-hydroxynaphthoic acid with a small equilibrium moisture content. In the case where heat resistance is required, it is preferable to use the above-mentioned poly-p-phenylene benzobisazole (Toyobo ( (Bectoran) manufactured by CLARE Co., Ltd.). "PB 0"). The ratio of the fibrids composed of the above organic polymer to the heat-resistant fiber paper is in the range of 3 to 55% by weight, preferably 4 to 4, and the Ministry of Economic Affairs, the Intellectual Property Bureau, the Consumer Cooperative, which prints 4 5 weights. %, more preferably in the range of 5 to 30% by weight. In the case where the mixing ratio of the fibrids is set to be low, for example, it is obtained by the production method described in Japanese Patent Publication No. Sho 355-1815, and Japanese Patent Publication No. 37-57. The fibrids are preferably used, and in the case of being set higher, the fibrids produced by the method described in Japanese Patent Publication No. 59-603, and the two manufacturing methods may be used in combination. The resulting fibrids. If the mixing ratio of the above-mentioned fibrids is less than 3%, it is not possible to apply the Chinese National Standard (CNS) A4 specification (210X297 mm) in the wet-laid paper scale. -18 - 1250240 A7 B7 V. Invention Description (16) When the tensile strength necessary for forming the paper is maintained, on the other hand, if it exceeds 55 wt%, the bulk density of the obtained heat-resistant fibrous paper is too large, and the impregnation property of the enamel paint is inhibited. Further, in the same manner as in the case of the short fibers, in the fibrids composed of the organic polymer, if the moisture (moisture) contained therein is dehydrated (dehumidified), the fibers become shrinkage or elongation. By combining the two, it is possible to obtain a heat-resistant fiber paper which is difficult to adjust the scale even if it is repeatedly washed and dried, and which has excellent heat-resistant scale stability and moisture resistance stability. It is also possible to mix and use the above fibrids. Further, in the wet-type papermaking process, the fibrids composed of the above-mentioned organic high-molecular polymer have a function as a binder for bonding between short fibers, but a bonding strength (adhesion) is higher than that of a thermosetting resin. For example, an epoxy resin, a phenol resin, a polyurethane resin, a melamine resin, or the like is preferred, so that a water-dispersed binder composed of a small amount of these thermosetting resins is added to the wet papermaking process to improve It is also possible to make the papermaking performance, and it is also possible to replace part of the amount with the above-mentioned organic binder resin. In particular, an epoxy resin having water dispersibility having an epoxy functional group in the above-mentioned molecule is used, and it is most suitable as a binder having good compatibility with the enamel paint used in the prepreg process. The ratio of the binder (organic resin binder) to the aromatic fiber paper of the present invention can be preferably 1 / 2 or less by weight of the fibrid composed of the organic polymer. It is 1 / 3 or less, and more preferably 1 / 4 or less. If the ratio of the binder exceeds 1 / 2 of the weight of the fibrid, it may not be possible to suppress the use of the Chinese National Standard (CNS) A4 specification (210X297 mm) for the paper scale in the wet papermaking project. Read the notes on the back and fill out this page.) • Install · - Order - Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Print -19- 1250240 A7 B7 V. Invention Description (17) (Please read the notes on the back first) Fill in the resin migration of this page, and the interlayer adhesion between the side and the middle part of the paper is uneven. In the subsequent polishing project, the single fiber orientation and fiber density of the middle layer of the paper sometimes occur. The uniformity of distribution is reduced. However, depending on the application, it is preferred that the amount of voids in the middle portion of the paper is large and the amount of the layer portion in the paper portion to which the lacquer is applied is large, and in this case, the total amount of the fibrid may be the above-mentioned organic binder resin. Replace it. Further, in the heat-resistant fiber paper of the present invention, glass fibers, ceramic fibers or the like may be blended in a range not impairing the object of the present invention. Generally, in laminates for circuit boards, characteristics such as heat-resistant scale stability, moisture-resistant thermal stability, and deformation resistance (torsion, bending, and waves) of the laminate substrate are important quality items. These characteristics are affected by the number of enthalpy, such as bulk density, tensile strength, interlayer peel strength, and the like of the paper used as the laminate substrate. Therefore, the heat-resistant fibrous paper of the present invention has a bulk density of 0 · 4 5 〜1 · 13 g/cm 3 , preferably 0 · 50 〜 0 · 88 g / cm 3 , more preferably 〇· 55~0 · 75g/cm3. When the bulk density is less than 0.45 g / cm 3 , the adhesion between the short fibers in the middle portion of the paper is lowered, and the impregnation amount of the mixed enamel paint inside the paper becomes excessive, and the prepreg is produced. The manufacturing process of the laminate for engineering and circuit boards, particularly in the lamination press engineering, causes partial movement of the single fibers due to the flow of the impregnated varnish, resulting in uneven density of fibers inside the resulting laminate for the circuit board. , resulting in a reduction in heat resistance scale stability and deformation resistance. On the other hand, when the bulk density is more than 1 · 13g/cm3, the scale of the sheet is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -20- 1250240 A7 B7 5. The invention (18) The enamel paint is hardly impregnated inside the paper, and the electrical insulation of the resulting laminate for the circuit board, the stability of the heat-resistant scale, and the deformation resistance are reduced, so (please read the back sheet and read the following page) good. Further, the heat-resistant fibrous paper of the present invention has a tensile tension of 1 · 5 kg / 15 5 or more, preferably 2 · 5 kg / 15 5 mm or more, more preferably 3 · 5 kg / 15 5 mm or more. Further, the interlayer peeling strength is 1 2 g / 15 mm or more, preferably 15 g / 15 mm or more, and more preferably 20 g / 15 mm or more. If the interlaminar peeling strength is less than 12 g / 15 mm, the adhesion between the single fibers in the middle portion of the paper is lowered and the impregnation amount of the blended enamel in the paper becomes excessive, in the prepreg manufacturing process. And the manufacturing process of laminates for circuit boards, particularly in the lamination press engineering, resulting in partial movement of the single fibers due to the flow of the impregnated varnishes - resulting in uneven density of fibers inside the resulting laminate for the board. This leads to a decrease in the stability and deformation resistance of the heat-resistant scale, and if the tensile strength of the paper is less than 1 · 5 kg / 15 mm, the paper tends to be cut off in the impregnation process with the enamel paint. Therefore, it is not good. The heat-resistant fiber paper printed by the Intellectual Property Office of the Intellectual Property Office of the Ministry of Economic Affairs can be manufactured by a known method. For example, a short fiber composed of a heat-resistant organic polymer and a specific gravity of 1·380 or less a short fiber composed of a para-type aromatic polyamine which is not stretched or a low-magnification type, and a fibrid composed of an organic resin binder and/or a heat-resistant organic polymer. The mixture is weighed and mixed at a specified ratio, and the concentration of the mixture of the short fibers and the fibrids is about 1 1 5~0 · 3 5 % by weight in water and uniformly dispersed and prepared into an I paper scale for the Chinese National Standard (CNS). A4 size (210X297 mm) ' -21 - 1250240 A7 B7 V. Description of invention (19) (Please read the note on the back and fill out this page) In aqueous slurry, add dispersant and viscosity modifier as needed. Forming a wet paper by a wet-type papermaking machine using a short-web or nine-wire paper machine, and in the wet paper, the organic binder resin is sprayed, rinsed, conveyed, dipped, etc. as needed. After being supplied 'The dried paper obtained by drying is heated under pressure to have the above-mentioned bulk density, so that the organic resin binder is partially hardened, and/or the fibrid body and/or the specific gravity of the organic polymer body is 1 · The aromatic polybenzamine staple fiber of 3 80 or less, which is not extended or low-rate, may be partially softened and/or melted, and the above-mentioned heating and pressurization may be obtained by the Intellectual Property Office of the Ministry of Economic Affairs. When using a calender, between a hard surface roller having a diameter of about 15 to 80 cm and an elastic roller having a surface of about 30 to 100 cm in diameter, preferably about 20 to 80 cm in diameter. The two hard surface rollers may be formed between each other. In this case, the partially cured organic resin binder such as dry is hardened, and/or the heat-resistant organic polymer polymer is formed into a fiber strip. The body and/or the unstretched or low-rate extended aromatic polyamine short fiber having a specific gravity of 1·380 or less is softened and/or partially melted, so that it can fully function as a bond. Is at a temperature of 2 2 0 to 4 0 ° C Preferably, the heating is preferably 250 to 350 ° C, and preferably 280 to 330 ° C. Further, it is preferred to pressurize the pressure at a line pressure of 15 〇 2 to 5 〇 kg / cm. More preferably, it is a line pressure of 180 to 250 kg/cm. 尙, the above-mentioned calendering process can be one-stage treatment, but in order to obtain a paper of uniform thickness in the thickness direction, it is preferable to use a pre-heating addition. The paper size of the pressure treatment is applicable to the Chinese National Standard (CNS) A4 specification (21〇X 297 mm) -22- 1250240 A7 B7 V. Invention Description (20) Two-stage treatment. (Please read the notes on the back and fill in the form. On the other hand, the conditions for heating and pressurizing are those in which the organic resin binder does not sufficiently exert its performance in the temperature range ' or the above-described pressure range', and the fibrids composed of the organic high molecular polymer And/or an aromatic polyamide polyamide short fiber having a specific gravity of 1 · 380 or less, which is not extended or low-rate, cannot fully exert its function as a binder' and the bulk density of the obtained heat-resistant fiber paper is Not full 〇· 4 5 g / cm 3, or, more than 1. 1 3 g / c m 3, further, the tensile strength of the aromatic fiber paper obtained may be less than 1 · 5 k g / 1 5 m m ' and the interlaminar peel strength is less than 12 g / 15 mm. Further, the heat-resistant fiber paper obtained by heating and pressurizing under the above conditions has a heat-scale change rate of 〇·30% or less after heat treatment at a temperature of 280 ° C for 5 minutes, and the heat-resistant scale stability is excellent. In addition, it has a low equilibrium moisture ratio and is suitable for use in laminates for circuit boards. The heat-resistant fibrous paper of the present invention thus obtained by the Ministry of Economic Affairs, the Intellectual Property Office, and the Consumers' Cooperatives, is a non-ducted or low-rate extended aromatic polyamide short fiber having a specific gravity of 1.380 or less. The fibrids composed of the heat-resistant organic polymer and/or the organic resin binder function as a binder, so that the tensile strength and the high interlaminar peel strength are high even at a low bulk density. Since the water absorption rate is also small, the change in the scale of the heat and the temperature and the humidity in the thickness direction and the surface direction of the paper is small, and the cutting of the paper substrate in the resin impregnation process or the like is reduced. The resin of the enamel paint has good impregnation property, and the short fibers in the pressure-stacked composite structure also have no partial movement, so the deformation amount in the manufacturing process of the electrical material and the laminate for the circuit board is also reduced, and the flatness can be achieved. And the uniform paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -23- 1250240 A7 B7 V. Inventive Note (21) Laminate. (Please read the precautions on the back side and fill out this page.) That is, the heat-resistant fiber paper of the present invention is (1) an aromatic polyamine which is extended by a specific gravity of 1 · 380 or less and which is not stretched or low-rate. Since the short fibers are low in moisture and used as a part of the binder, the migration of the organic resin binder can be suppressed in the drying process at the time of papermaking, and the partialization of the resin binder can be alleviated. Improve the uniformity of the paper thickness direction. (2) When the dry paper of the specified bulk density is subjected to calendering to bond the short fibers which are uniformly dispersed in the paper, the unfolded or low-rate extended aromatic polyamines having a specific gravity of 1·380 or less The fibrids composed of the short fibers and the heat-resistant organic polymer are partially softened and/or deformed and melted, so that the single fibers are easily fixed or adhered to each other, or the organic resin is used. The adhesive hardens, inhibits the mutual movement of the individual fibers inside the paper, and prevents the disorder of the single fiber sequence. Printed by the Ministry of Economic Affairs, the Intellectual Property Bureau, and the Consumer Cooperatives. (3) Because of the use of the sliver, the single fibers are less charged, and the multi-paste effect of the resin impregnation makes the single fiber density of the paper cross-section and the plane direction. And the fiber sequence is uniform, it is difficult to cause thermal scale changes and deformation. EXAMPLES Hereinafter, the present invention will be specifically described based on examples, but the present invention is not limited by the examples.尙, the physical property measurement method used in the examples is as follows: (1) Bulk density: This paper scale is applicable to China National Standard (CNS) A4 specification (210X297 mm) -24-1250240 Α7 Β7 V. Invention description (22) According to JISC — 2 1 1 1 of 6 · 1 method determination. (2) Tensile strength · The measurement was carried out according to the method of J I S C - 2 1 1 1 using a constant-speed elongation type tensile tester. (3) Specific gravity: Determined according to the density gradient tube method (N-heptane/carbon tetrachloride, 25 ° C). (4) Interlaminar peeling strength: The strength (g / 15 m m ) of the intermediate layer portion of the sample having a length of 20 Omm and a width of 15 m was measured and peeled off in a T shape using a constant-speed elongation type tensile tester. (5) Thermal scale change rate: Using a high-precision quadratic coordinate measuring machine (Mutou) Co., Ltd.), measuring the length of the sample of 300 mm and the width of 50 mm, before the heat treatment and the temperature: 2 8 The length after heat treatment at 0 ° C for 5 minutes, and the rate of change of the thermal scale was calculated according to the following calculation formula.尙, the sample for measurement can be collected and measured from the length direction and the width direction of the continuous paper, and compared with the average 値. Thermal scale change rate (%) two l〇〇x {(length before heat treatment - length after heat treatment) / length before heat treatment} (6) equilibrium moisture rate equilibrium moisture ratio of short fiber, fibrid and fiber paper According to j ISL -1 〇1 3 , the sample is absolutely dried in an atmosphere of 120 ° C, and then adjusted at a temperature of 20 ° C and a relative humidity of 6 5 % R 7 for 72 hours. National Standard (CNS) Α4 Specifications (210χ297 mm) (Please read the notes on the back and fill out this page) • Installed and subscribed to the Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed -25 - 1250240 A7 B7 V. Description of Invention ( 23) The water content contained in the sample was determined, and the weight ratio in the absolute dry state of the sample was calculated and expressed as a percentage (%). (Please read the precautions on the back and fill out this page.) 尙 When the sample contains two or more kinds of short fibers and fibrids, the equilibrium moisture content of each component can be independently determined, and the weight average is based on the mixing ratio. Said. (7) Evaluation of the stability of the temperature and humidity (suction and desorption) scale. The Ministry of Economic Affairs, the Intellectual Property Bureau, the employee consumption cooperative, printed and used the thermal analysis device [Τ Μ A; Thermoflex type manufactured by Rigaku Motor Co., Ltd.], card The initial sample between the plates was measured at a distance of 200 mm, a width of 5 mm, and a temperature rise and fall of 1 〇 ° c / min.尙, the test sample is stored in an atmosphere of a relative humidity of 8 5 % R 常 or more at room temperature for more than 4 8 hours, and a fully hygroscopic person is used. For the comparison of the stability of the temperature and humidity scale, in order to set the sample from the normal temperature to the temperature of 280 °C, the scale change trajectory of the sample during repeated heating and cooling is traced, and the initial temperature rise is compared. The scale change trajectory of the sample at the time of temperature drop or the temperature rise and the temperature after the second time, and the maximum multiplication amount of the scale change trajectory before or after the temperature rise and fall operation or the temperature rise and fall operation (maximum change amount two maximum elongation amount or The maximum contraction amount)' and whether it is appropriate according to its size. In other words, the smaller the amount of multiplication of the scale change trajectory at the time of temperature rise and the temperature drop, the more stable the temperature and humidity change are, and it is judged to be excellent in heat resistance stability and deformation resistance. (8) The amount of deformation of the laminate is to be used as a hardener dicyanodiamide in a high-density brominated bisphenol A epoxy resin and an o-cresol novolac lacquer epoxy resin. This paper scale applies to Chinese National Standard (CNS) A4 specification (210X297 mm) -26- 1250240 Α7 Β7 V. Invention description (24) (Please read the back note first and then fill in this page) 2 for hardening accelerator 2 - An epoxy resin composition composed of ethyl-4-methylimidazole, which is obtained by dissolving the obtained enamel paint in a mixed solution of methyl ethyl ketone and methyl cellosolve, and impregnating the heat-resistant fiber paper. The mixture was dried at a temperature of 1 10 0 to 1 2 0 ° C for 5 to 10 minutes to prepare a B-stage prepreg paper having a resin content of 55% by volume. The prepreg paper was laminated on both sides of a copper foil having a thickness of 18 Å, and the same copper foil was laminated on the outer side thereof, and subjected to heat and pressure to carry out 1 70 ° C X 4 0 kg / cmx under reduced pressure. After pressing for 50 minutes, the resin was cured to obtain a laminate for a circuit board, and then subjected to post-hardening treatment in a hot air dryer at a temperature of 200 ° C for about 20 minutes. The circuit board was cut into a square of 150 nm by the laminate, and the copper foil on both sides was frame-shaped from the end of the laminate to a width of 20 mm, and would be equivalent to the central portion 1 1 Ο ΠΊ The m square portion was subjected to etching to remove the copper foil to prepare a sample for evaluation. Ministry of Economic Affairs, Intellectual Property Office, Staff and Consumers Cooperative, printed this part of the circuit board laminate for heat treatment at 60 ° C for 10 minutes, and measured the maximum deformation amount from the central part (bending amount) , or the amount of floating caused by twisting and wave breaking, is regarded as the amount of deformation 〇 (9) The insulation resistance of the laminate, using the laminate for the circuit board before the copper etch, as described in (8) above, On one side, the comb-shaped electrode pattern with 〇·15 mm spacing is formed by uranium engraving, and in the atmosphere of 60 °C, 9 5 % R ', add 3 5 V to the side between the comb electrodes. The DC voltage is kept for 1 hour. This paper scale applies to the Chinese National Standard (CNS) Α4 specification (2丨〇><297 mm) -27- 1250240 A7 B7 V. Description of Invention (25. Secondly, the comb-shaped electrode was stored in an atmosphere of 20 ° C and 60 % R 1 for 1 hour, and then combed A 60 VDC voltage (3 5 to 9 Ο V ) was applied between the electrodes and the insulation resistance 値 was measured. Example 1 Using a copolymerized p-phenylene 3 , 4 / hydroxy diphenyl phthalate The short fiber composed of the heat-resistant organic high-molecular polymer has a talc of 0.5% by weight on the surface of the fiber, and an elongation of 4·6% when the Osmoth is 〇.1% by weight. The short fiber with a strength of 2 9 · 4 g / denier, a specific gravity of 1 · 3 9 8 , a single fiber dimension of 1.5 denier, a fiber length of 3 mm, and an equilibrium moisture ratio of 1.8% (manufactured by Teijin Co., Ltd.) 83% by weight of "Tecnora", and the use of copolymerized phenyl 3,4 > monohydroxy diphenyl phenyl phthalamide to form a non-stretched or low-rate extended para-type aromatic polyfluorene Amine short fiber, and the talc on the surface of the fiber is 0. 6 wt%, Osmoth is 0.2 wt%, the elongation at the time of adhesion is 13.2%, and the fracture is strong. Short fiber with a degree of 4 · 2 g / denier and a specific gravity of 1 · 3 5 5 with a single fiber fineness of 2 · 5 denier, a fiber length of 5 mm and an equilibrium moisture content of 4 · 1 % (Tec 〇n, manufactured by Teijin Co., Ltd.) 〇ra", stretching ratio: 1.2): 12% by weight, and copolymerized with a balanced water content of 4 · 4 % of p-phenylene 3,4 >-hydroxydiphenylene-p-amine The slats (manufactured by Teijin Co., Ltd.: 5% by weight, dissociated and dispersed in water by a pulper, and a dispersing agent having a concentration of 0. 02% was added thereto (Y Μ -8 0 by Matsumoto Oil Co., Ltd.) ), the flow rate of papermaking with a fiber concentration of 0 · 15 % by weight is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm). Please read the back Ϊ II. Fill in the Ministry of Economic Affairs, Intellectual Property Office, Employees' Consumption Cooperative. -28- 1250240 Α7 Β7 V. Description of invention (26) 〇 (Please read the note on the back and then fill out this page) Secondly, use the carpet type hand-type hand-held machine, use the paper to carry out papermaking with the slurry, and gently add After pressure dehydration, it is dried in a hot air dryer at a temperature of 160 ° C for about 15 minutes. In addition, a calender made of a hard surface metal roller using a diameter of about 400 mm is heated and pressurized at 200 ° C and 160 kg / cm. The short fiber (single fiber denier) composed of the above-mentioned unstretched or low-rate extended para-type aromatic polyamine copolymerized with phenyl- 3,4 /-trans-diphenylene-p-nonylamine : 2 . 5 denier ) and a binder which softens and/or partially melts the fibrids composed of phenyl 3,4 / -hydroxydiphenylene p-phthalamide to make heat resistant The copolymerization of the short fibers composed of the organic polymer is bonded to the single fibers composed of phenyl 3,4 > monohydroxydiphenyl-p-nonylamine, and the amount of the substrate is 7 2 g / ηί heat-resistant fiber paper. Examples 2 to 8 and Comparative Examples 1 to 2, Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperative, printed in addition to the copolymerized p-phenylene group 3, 4 > monohydroxydiphenyl-p-guanamine used in Example 1. Short fiber (single fiber fineness 1.5 dan) As a short fiber composed of a heat resistant organic high molecular polymer, and using the copolymerized p-phenylene 3,4 / hydroxydiphenyl group used in Example 1 The short-fiber composed of a non-stretched or low-rate extended aromatic polyamine is used as the short fiber of the non-stretched or low-rate extended aromatic polyamide, and the copolymerized p-phenyl group used in Example 1 is used. 3,4 / monohydroxydiphenylene • The fibrids composed of decylamine are made into fibrids, and the mixing ratio is as applicable to the Chinese National Standard (CNS) Α4 specification (210X 297厘) -29- 1250240 Δ7 Α7 Β7 V. Inventive Note (In addition to the change shown in Fig. 27, the fiber paper copolymerization was carried out in the same manner as in Example 1 on the benzoic acid (small-fiber styrene composed of a single fiber. 6 wt%, Degree is 5. .1 · 3 *7 Balanced water ratio 3 Extension ratio: 醯 所The phenyl·3 strip is used as the fiber of the same example as the base 3, 4^-denier 1 · 5 denier), and the Osmoth of the base and the decylamine is 8%, and the single fiber at the time of breaking 7 The fineness of 8 % of the short fibers 1 · 8 ) is used as the short fibers, and the 4 - monohydroxy two strips are mixed and implemented to obtain the fiber paper. Please read the back notes first and then try the example 9 except for the implementation. The bis-phenylene-p-acetamide staple fiber used in Example 2 is used as a heat-resistant organic high molecular polymer copolymerized with phenylene-3,4> - and the talc of its fiber surface is 〇〇.2 The strength of the weight-% adhesion fracture time is 6.1 g/denier, the specific gravity is 2.5 denier, the fiber length is 5 mm, and the flat (Tecnora), Yanla or low-rate Yanla aromatic In addition, the blending ratio of the copolymerized p-phenylene-p-amine used in Example 2 was changed as shown in Table 1, and the Ministry of Economic Affairs Intellectual Property Office employee consumption cooperative printed Comparative Example 3 except that Example 1 was used. The user is a short fiber composed of a heat resistant organic polymer and The strips, and all the short fibers of the aromatic polyamine which have a specific gravity of 1.38 or less, which are not extended or low-rate, are not used, and the mixing ratio thereof is changed as shown in Table 1. Example 1 was carried out to obtain fiber paper. The paper scale was applied to the Chinese National Standard (CNS) Α4 specification (210Χ 297 mm) -30-1250240 A7 B7 V. Inventive Note (28) Comparative Example 4 In Comparative Example 3, except A fibrid body is used, and the bisphenol A epichlorohydrin type water-dispersible epoxy resin binder (manufactured by Dainippon Ink and Chemicals Co., Ltd.) is used as the resin component. The fiber paper was obtained in the same manner as in Comparative Example 3 except that the application was carried out by spraying at 5% by weight. Comparative Example 5 In Comparative Example 3, a fiber paper was obtained in the same manner as in Comparative Example 3 except that the mixing ratio of the short fibers and the fibrids formed of the heat-resistant organic polymer was changed as shown in Table 1. Comparative Example 6 In Comparative Example 4, the mixing ratio of the short fiber and the water-dispersible epoxy resin binder composed of the heat-resistant organic polymer was changed as shown in Table 1, and the same as in Comparative Example 4 was carried out. Get fiber paper. Ministry of Economic Affairs, Intellectual Property Bureau, Staff and Consumers Cooperatives, Printing Example 1 is the same as in Example 2 except that the fibrids composed of poly(p-phenylene p-nonylamine) having an equilibrium water content of 5.4% are used. The fibrids were obtained in the same manner as in Example 2 except that the fibrids composed of p-phenylene-3,4 >-hydroxydiphenylene-p-amine were copolymerized. This paper scale applies to the Chinese National Standard (CNS) A4 specification (210X Μ? mm) -31 - Hydroxydiphenylene 酞醯 酞醯 1250240 A7 B7 V. Description of the invention (29 Example 1 1 In Example 2, The single fiber fineness obtained by heat-treating the fiber composed of polyparaphenylene-p-amine in a high temperature atmosphere of 4 ° C: 1 · 4 2 denier, specific gravity: 1 · 4 6 3 , fiber length: 3 Mm, equilibrium moisture ratio: 1 · 7 % of short fibers ("Kebra" manufactured by Dupont Co., Ltd.), instead of copolymerization of short fibers composed of heat-resistant organic polymer, phenyl group 3, 4 In addition to the amine short fibers, the fiber paper was obtained in the same manner as in Example 2. Example 1 2 In Example 1, except that the fibrid composed of polyparaphenylene p-phthalamide having an equilibrium moisture content of 5.4% was used ( Clone (manufactured by Clone Co., Ltd.): Fiber paper was obtained in the same manner as in Example 1 except that the weight was 1% by weight. Example 1 3 In Example 2, except that the copolymer was extended to a phenyl group, 3, 4 > The mixing ratio of the fibrids (manufactured by Teijin Co., Ltd.) composed of phenyl-p-guanamine is 5% by weight. In addition, the water-dispersible epoxy resin binder (manufactured by Dainippon Ink and Chemicals Co., Ltd.) having a solid content concentration of 10% by weight is sprayed by 5% by weight of the resin component. 2 The fiber paper was obtained. Example 1 4 to 2 1. Comparative Example 7 to 1 0 In Example 2, except for the heating and pressing conditions of the high-speed calender, the paper was applied to the Chinese National Standard (CNS) A4 specification. (210 X 297 mm) Please read the notes on the back and then print on the page of the Ministry of Economic Affairs, Intellectual Property Office, Staff and Consumers Cooperatives -32- 1250240 A7 B7 5. Invention Description (30) Example 2 was carried out to obtain a fiber paper. Example 2 2 to 2 5 In Example 2, except that a copolymer of a short fiber composed of a heat resistant organic high molecular polymer was used, a phenyl group 3, 4 > The fiber length of the -hydroxydiphenylene-p-amine short fiber was changed as shown in Table 1, and the fiber paper was obtained in the same manner as in Example 2. Example 2 6 In Example 2, except that the copolymerization of the benzene was used. Base · 3 , 4 / monohydroxy diphenyl • Short fiber ("Tecnora" manufactured by Teijin Co., Ltd.): 9% by weight and poly-p-phenylene benzotriazole (made by Toyobo Co., Ltd.): 20% by weight A heat-resistant fiber paper was obtained in the same manner as in Example 2 except for the short fibers composed of the heat-resistant organic polymer. Example 2 In Example 2, except that a copolymerized p-phenylene group was used, 3, 4 > Monohydroxy diphenyl phenyl phthalate short fiber ("Tecnora" manufactured by Teijin Co., Ltd.): short fiber composed of 6.9 wt% and polyetheretherketone (manufactured by Teijin Co., Ltd.): 10% by weight A heat-resistant fiber paper was obtained in the same manner as in Example 2 except that it was a short fiber composed of a heat-resistant organic polymer. Example 2 8 This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) Please read the notes on the back and write this page. Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed -33· 1250240 A7 B7 V. Description of the invention (31 Please kj read the back of the note and refill the horse on page 2 in addition to the use of copolymerized p-phenylene 3,4 / monohydroxy diphenyl phenyl phthalamide short fiber (Teijin ( "Tecnora" manufactured by Seisakusho Co., Ltd.: short fiber ("Bectron" manufactured by CL ARE Co., Ltd.) of 69% by weight and a liquid crystalline wholly aromatic polyester: 10% by weight as a heat-resistant organic polymer The short fibers thus formed were subjected to heat-resistant fiber paper in the same manner as in Example 2. Example 2 In Example 2, the copolymerized p-phenylene 3,4 /monohydroxydiphenyl group used in Example 2 was used. For the short-acting fiber (Tecnora) manufactured by Teijin Co., Ltd.: 8 wt% as a short fiber composed of a non-stretched or low-rate extended aromatic polyamine, and polybenzazole Isodecylamine A heat-resistant fiber paper was obtained in the same manner as in Example 2 except that the short fiber having a single fiber fineness of 3 · 0 denier and a fiber length of 5 mm ("Conex" manufactured by Teijin Co., Ltd.) was 3% by weight. In addition to the use of short fibers (manufactured by Teijin Co., Ltd.) composed of polyetheretherketone, the short-staple fiber composed of phenylisodecylamine is used in the case of the use of polyetheretherketone. The heat-resistant fiber paper was obtained in the same manner as in Example 29. Example 3 1 In Example 2, except that the fibrid composed of poly-phenylisodecylamine having an equilibrium water content of 7.2% was used. , instead of copolymerization, phenylene · This paper scale applies Chinese National Standard (CNS) A4 specification (210X297 mm) -34- 1250240 A7 B7 V. Description of invention (32 4 hydroxydiphenylene phthalate) A heat-resistant fiber paper was obtained in the same manner as in Example 2 except for the fibrids. Example 3 2

In the second embodiment, a fibrid composed of a molten liquid crystalline aromatic polyester having an equilibrium water content of about 0.05% (manufactured by CLARE Corporation) was used.

Bectran Please read the backing note first and then fill in the heat-resistant fiber paper in the same manner as in Example 2 except that the fibrids composed of 4/monohydroxy group instead of copolymerized p-phenylene-p-phenylene-p-amine were prepared. Example 3 3 In Example 2, except that a fibrid composed of poly(p-phenylene carbazole) having an equilibrium water content of 4.0% was used instead of copolymerization of phenyl-3-, 4/-hydroxyl A heat-resistant fibrous paper was obtained in the same manner as in Example 2 except that the fibrids composed of phenyl-p-nonylamine were used. Example 3 4 Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative was printed in Example 2 except that a fibrid composed of poly-p-phenyl-p-guanamine was used with an equilibrium moisture ratio of 4.6% (Dupont "Kebra": 3% by weight and a blend of p-phenylphenyl-p-amine having an equilibrium moisture content of 5.4% (manufactured by Clone Co., Ltd.: 7 wt%, instead of copolymerization In addition to the fibrids composed of phenyl·3,4 >-hydroxydiphenylene-p-nonylamine, the heat-resistant fiber paper is obtained in the same manner as in Example 2, and the paper size is applicable to the Chinese National Standard (CNS) A4 specification ( 210×297 mm) -35- 1250240 A7 __B7_ V. Inventive Note (33) Example 3 5 In Example 3, except that no copolymerization of p-phenylene, 3,4-trans-diphenylene was used. a fibrid composed of an amine, and a solid concentration of 10% by weight of bisphenol A epichlorohydrin type water-dispersible epoxy resin S (manufactured by Dainippon Ink and Chemicals Co., Ltd.) The heat resistant fiber paper was obtained in the same manner as in Example 3 except that the resin component was 15% by weight. The production conditions of the heat-resistant fiber papers shown in each of the above Examples and Comparative Examples are shown in Table 1. The respective properties evaluated by the above measurement methods are shown in Table 2. A, A / B, A shown in Table 1 are Short fiber composed of a heat-resistant organic high molecular polymer, and B is a short fiber composed of a para-type aromatic polyamine which is not stretched or stretched at a low rate. Further, the fiber paper is used for the above measurement. The method described in the method, the prepreg impregnated with the enamel paint, and the laminate for the circuit board formed using the prepreg, the result of measuring the amount of deformation and the insulation resistance under high humidity are combined Table 2. Ministry of Economic Affairs Intellectual Property Bureau Employees Consumption Cooperatives Printed Paper Size Applicable to China National Standard (CNS) A4 Specification (210X297 mm) -36- 1250240 A7 __B7 V. Invention Description (34) Table 1 Ministry of Economic Affairs Intellectual Property Bureau Consumption and printing rate of the company (%) Short fiber high calender condition Short fiber part of the adhesive component cut (mm) (finished processing conditions of the final machine) Α / 纤 fiber strip / other A / B heating Degree (. 〇 line pressure (kg / cm) Comparative Example 1 8 6/12 2/0 3/5 3 2 0 2 0 0 Example 1 8 3/12 5/0 3/5 3 2 0 2 0 0 Implementation Example 2 79/11 1 0/0 3/5 320 200 Example 3 7 5/1 0 1 5/0 3/5 320 200 Example 4 6 6/9 2 5/0 3/5 3 2 0 200 Implementation Example 5 5 7/8 3 5/0 3/5 3 20 200 Example 6 44/6 5 0/0 3/5 3 2 0 2 0 0 Comparative Example 2 3 5/5 6 0/0 3/5 320 200 Comparative Example 3 9 5/0 5/0 3/5 3 20 200 Comparative Example 4 9 5/0 0/5 3/5 3 2 0 200 Comparative Example 5 5 0/0 5 0/0 3/5 3 2 0 200 Comparative Example 6 5 0/0 0/5〇3/5 3 2 0 200 Example 7 8 5/5 1 0/0 3/5 3 2 0 200 Example 8 7 2/1 8 1 0/0 3/5 320 200 Example 9 6 3/2 7 1 0/0 3/5 3 2 0 200 Example 1 0 7 9/11 1 0/0 3/5 3 2 0 200 Example 1 1 7 9/ 11 1 0/0 3/5 3 2 0 20 0 Example 1 2 7 9/11 1 0/0 3/5 3 2 0 200 Example 1 3 7 9/1 1 5/5 3/5 3 2 0 20 0 Comparative Example 7 7 9/11 1 0/0 3/5 200 20 0 Example 1 4 7 9/11 1 0/0 3/5 2 2 0 200 Example 1 5 7 9/11 1 0/0 3/5 2 8 0 20 0 Please read the notes on the back. Fill in this page. The paper size applies to the Chinese National Standard (CNS) Α 4 specifications (210X). 297 mm) -37- 1250240 Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed A7 B7 V. Invention Description (35) Example 1 6 7 9/1 1 1 0/0 3/5 3 40 200 Example 1 7 7 9/11 1 0/0 3/5 3 8 0 200 Comparative Example 8 7 9/1 1 1 0/0 3/5 4 2 0 2 0 0 Comparative Example 9 7 9/11 1 0/0 3/5 3 2 0 1 3〇Example 1 8 79/1 1 1 0/0 3/5 320 1 6〇Example 1 9 7 9/1 1 1 0/0 3/5 3 2 0 180 Example 2〇7 9/11 1 0/0 3/5 3 2 0 2 2 0 Example 2 1 7 9/1 1 1 0/0 3/5 3 2 0 240 Comparative Example 1〇7 9/1 1 1 0/0 3 /5 3 2 0 2 8 0 Embodiment 2 2 7 9/1 1 1 0/0 1.2/5 3 2 0 200 Example 2 3 79/1 1 1 0/0 5/6 3 2 0 200 Example 2 4 7 9/1 1 1 0/0 8/5 320 200 Example 2 5 7 9/1 1 1 0/0 13/5 3 2 0 2 0 0 Example 2 6 7 9/11 1 0/0 3 /5 3 2 0 2 0 0 Embodiment 2 7 7 9/11 1 0/0 3/5 3 2 0 200 Embodiment 2 8 7 9/1 1 1 0/0 3/5 3 2 0 200 Example 2 9 7 9/1 1 1 0/0 3/5 3 2 0 2 0 0 Embodiment 3〇7 9/1 1 1 0/0 3/5 3 2 0 2 0 0 Embodiment 3 1 7 9/11 1 0/0 3/5 3 2 0 2 0 0 Embodiment 3 2 7 9/1 1 1 0/0 3/5 3 2 0 200 Example 3 3 7 9/1 1 1 0/0 3/5 3 2 0 2 0 0 Embodiment 3 4 7 9/1 1 1 0/0 3/5 3 2 0 2 0 0 Embodiment 3 5 7 9/1 1 0/1 5 3/5 3 2 0 2 0 0 Please read first Note on the back page Fill in this page The paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) -38- 1250240 A7 B7 V. Invention description (36) Table 2 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing Characteristics of heat-resistant fiber paper Laminates for circuit boards Tensile layer peeling heat balance Balance Water absorption Dehumidification deformation Insulation Density strength Deviation from intensity Change fraction scale change resistance g/cm3 kg/15mm g/15mm % % β m mm Ω/cm Comparative Example 1 0.38 1.3 11.0 0.29 2.02 68 3.2 109 Example 1 0.55 3.4 30.7 0.06 2.09 33 2.5 1〇12 Example 2 0.64 4.6 31.2 0.02 2.19 16 1.7 1012 Example 3 0.70 5.4 35.8 0.02 2.30 12 1.3 1012 Example 4 0.74 5.9 43.1 0.12 2.53 39 2.3 10丨1 Example 5 0.85 6.3 45.4 0.19 2.75 48 2.6 1010 Example 6 1.02 7.6 69.3 0.27 2.99 61 3.1 1〇9 Comparative Example 2 1.18 8.3 62.6 0.38 2.31 77 4.6 108 Comparative Example 3 0.42 1.4 20.2 0.21 2.77 59 2.9 101 1 Comparative Example 4 0.40 1.1 9.5 0.33 2.03 69 4.2 1012 Comparative Example 5 1.11 7.8 60.4 0.36 2.95 72 4.5 109 Comparative Example 6 0.92 8.1 62.2 0.32 2.84 76 3.1 1011 Example 7 0.58 3.8 27.6 0.09 2.07 23 1.9 1012 Example 8 0.66 4.4 33.2 0.02 2.35 10 1.1 1012 Example 9 0.74 5.3 36.4 0.04 2.55 7 1.0 1011 Example 10 0.51 3.8 29.9 0.04 2.23 13 1.3 1012 Example 11 0.66 4.8 31.6 0.01 2.12 9 1.2 10丨2 Example 12 0.61 4.2 30.9 0.21 2.15 8 1.1 1012 Example 13 0.63 4.4 31.1 0.03 2.16 14 1.8 1012 Comparative Example 7 0.42 1.8 13.2 0.27 2.23 69 3.1 1011 Example 14 0.50 3.6 18.6 0.23 2.21 62 2.8 1011 Example 15 0.53 3.8 31.0 0.02 2.21 17 1.8 1012 Example 16 0.72 5.7 42.2 0.02 2.18 13 1.5 1012 This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) Please read the note on the back and fill out this page -39- 1250240 A7 ___B7 V. Invention description (37) Economy Ministry of Intellectual Property Bureau Staff Consumer Cooperative Printed Example 17 0.86 7.7 55.4 0.04 2.14 11 1.3 1012 Comparative Example 8 1.21 3.9 64.3 0.41 2.1 6 77 4.8 1011 Comparative Example 9 0.43 2.4 16.7 0.23 2.21 67 3.3 1011 Example 18 0.52 3.9 20.2 0.18 2.20 55 2.3 1012 Example 19 0.58 4.2 20.6 0.13 2.19 48 2.0 1012 Example 20 0.67 5.2 31.8 0.02 2.16 44 3.5 1012 Example 21 0.81 6.5 50.2 0.14 2.14 12 1.8 1012 Comparative Example 10 1.15 7.9 61.1 0.37 2.13 68 4.1 1011 Example 22 0.60 3.9 29.6 0.05 2.20 19 1.9 1〇12 Example 23 0.66 4.9 31.7 0.08 2.21 24 2.1 1012 Example 24 0.69 5.2 32.4 0.12 2.20 36 2.6 1012 Example 25 0.66 5.9 38.2 0.24 2.21 56 3.6 1012 Example 26 0.63 4.4 31.1 0.01 2.14 9 1.1 1012 Example 27 0.66 4.8 31.7 0.05 2.16 26 1.9 1011 Example 28 0.61 4.3 31.2 0.08 2.13 48 2.7 1011 Implementation Example 29 0.62 4.4 30.9 0.07 2.22 21 2.2 1011 Example 30 0.64 4.7 31.5 0.08 2.20 26 2.7 1012 Example 31 0.53 3.9 29.7 0.09 2.59 38 2.4 1011 Example 32 0.58 4.2 30.1 0.02 1.89 13 1.4 1012 Example 33 0.60 4.4 30.4 0.01 2.00 10 1.1 1012 Example 34 0.59 3.9 29.7 0.01 2.23 13 1.2 1011 Example 35 0.67 5.1 34.7 0.02 2.26 11 1.5 1012

This paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -40-1250240 A7 B7_ V. INSTRUCTIONS (38) INDUSTRIAL APPLICABILITY The aromatic fiber paper of the present invention solves the prior art The various problems that are made when the laminate is used in laminates for circuit boards, and in particular, the conditions for changing the temperature caused by temperature and humidity changes, and the water absorption rate (balanced moisture rate) is lowered and improved. Electrically insulating, heat-resistant fiber paper with high tensile strength and interlayer peel strength can be obtained. The heat-resistant fiber paper is used for a laminate for a circuit board of a substrate, and in the manufacturing process and use thereof, since the twisting, bending, and the like are hardly generated, the design of the fine circuit can be performed, and even if directly It is mounted on electronic components with a small temperature-humidity expansion coefficient such as a lead-free ceramic chip carrier (LCCC) and a bare chip, and can maintain high reliability for a long period of time. In particular, the heat-resistant fiber paper of the present invention is required to be highly lightweight, It is suitable as a substrate for laminates for circuit boards in applications with high heat resistance, moisture resistance, and electrical insulation. Please read the notes on reciting and then fill out this page. Ministry of Economic Affairs Intellectual Property Bureau Employees Consumption Cooperatives Printed on this paper scale Applicable to China National Standard (CNS) Α4 Specifications (210X 297 mm) -41 - will be the year of Αβ. Application for the period of August, August 40, Case No. 89116276 Category Bu > 1 Η (, / deduction (the above columns are filled by this Council) Announcement - A4 C4 1250240 '- No. 89116276 Patent Application Revision of Chinese Manual 93 3 曰 曰 曰 93 93 93 93 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热2) (3) (1) Osaka, Ibaraki City, Ibara, Sanchome, Sifan, No. 1 Division, Osaka Research Center, Nei Tetsu Co., Ltd., the creation of a creator, and residence (2) Okuhara, Ogata, Ibaraki, Osaka, Japan No. 1 Osaka Research Center, Teijin Co., Ltd. (3) Japan's Osaka Prefecture, Ibaraki-shi, Ohara, Sanchome, No.1, Osaka Research Center, Teijin Co., Ltd. Name (Name) (1) Teijin Co., Ltd. Teijin Co., Ltd. Ministry of Economic Affairs Intellectual Property Office Staff Cooperatives Printed Nationality Residence, Residence (Office) Representative Name (1) Japan (1) Osaka Prefecture, Osaka City Center District Minamimachi-cho, 1-chome, No. VII (1) Anju Chess Paper size applies to China National Standard (CNS) A4 specification (210X297 mm)

Claims (1)

A8 1250240 VI. Application for Patent Patent No. 89 1 1 6276 Patent Application Revision of Chinese Patent Application (please read the note on the back and fill out this page) Correction of the Republic of China on March, 1993. 1. A heat-resistant fiber Paper, characterized by short fibers and/or copolymerized p-phenyl 3,4 / -hydroxydiphenyl groups formed by poly(p-phenylene) 酞 酞 酞 酞 酞 酞 员工 员工 员工 员工 员工 • • a short-type fiber composed of decylamine, a para-type aromatic polyamine short fiber composed of an organic polymer having a fiber length of 2 to 12 mm, and a specific gravity of Γ. The elongation at break: 5 · 3% or more, and the strength at break: 1 . 5 g / denier or less of the tensile strength or the low-rate extension of the para-type aromatic polyamine The bulk of the short fiber and the organic resin binder and/or the heat-resistant organic polymer is used as a main component to form a bulk density of 0 · 4 5 〜 1 · 1 3 g / cm 3 Heat resistant fiber paper, wherein the heat resistant organic polymer is composed of The fiber length of the short fiber and the length of the para-type aromatic polyamide short fiber which is not extended or low-rate extended are not included in the total weight of the fiber heat-resistant fiber paper of 0 · 6 in in or more The amount of the short fiber is from 45 to 97% by weight, and the amount of the organic resin binder and/or the fibrid is in the range of from 3 to 55% by weight, and the organic resin binder is hardened and And the fibrid composed of the organic high molecular polymer and/or the short fibers composed of the para-type aromatic polyamine are partially softened and/or melted to exhibit the action of a binder, wherein The following method is used to determine the maximum scale change of paper is 6 5 // m or less, <Method for measuring the amount of change in scale caused by dehumidification of paper> This paper scale is applicable to China National Standard (CMS) A4 specification ( 21 O x 297 mm) 1250240 A8 B8 C8 D8 Printed by the Intellectual Property Office of the Ministry of Economic Affairs, Employees' Consumption Cooperatives. VI. The scope of application for patents is kept at 85% of the room temperature at room temperature for more than 4 8 hours. Fully hygroscopic heat-resistant fiber paper (length 2 20 mm, width = 2 5 mm) The temperature is 10 °C / min. The temperature is raised from room temperature to 280 °C, and then immediately cooled to room temperature at a cooling rate of 10 t / min and dried, continuing from room temperature to 2 80 ° under the same conditions. After the temperature of C was repeated for two times, the maximum scale change amount (maximum elongation amount or maximum contraction amount) in the longitudinal direction of the paper was measured. . 2) The heat-resistant fibrous paper of claim 1 wherein the para-type aromatic polyamide short fibers are undrawn or low-rate extended relative to the total weight of the aromatic polyamide short fibers. The short fiber composed of 4 to 35 wt% of the aromatic polyamine other than the para-type aromatic polyamide fiber is formed to contain 65 to 96% by weight. 3. The heat-resistant fibrous paper of claim 1, wherein the non-stretched or low-rate extended para-type aromatic polyamine short fiber is a short fiber composed of polyparaphenylene-p-amine And/or a short fiber composed of a p-phenylene 3,4 / -hydroxydiphenylene p-phthalamide. The heat-resistant fiber paper as described in claim 3, wherein the copolymerization of the benzene The short fibers composed of the base 3,4/monohydroxydiphenyl-p-nonylamine are short fibers whose surface is solid-state cation-transducing and non-ionic-adsorbing inorganic compound adheres. 5. The heat-resistant fibrous paper according to any one of claims 1, 2 or 3, wherein the organic resin binder is an epoxy resin, a phenol resin, a melamine resin, or a fluoropolymer resin. One or more of the water dispersibility selected from the group. This paper scale applies to China National Standard (CNS) A4 specification (2l〇X 297 mm) --------—装------ order----- silk (please read the back of the note first) Matters fill out this page) -2- 1250240 Α8 Β8 C8 D8 Patent application scope Ministry of Economic Affairs Intellectual Property Bureau Employees Consumption Cooperative Printed 6 · If you apply for patent range 1, 2 or 3, the fiber paper, which is heat-resistant organic The high molecular polymer is a short fiber composed of a heterocyclic aromatic polymer. 7. The neutral fiber paper of claim 1, 2 or 3, wherein the heat resistant organic high molecular polymer is a short fiber composed of polyetheretherketone. 8 · The fibrid composed of the heat-resistant fibrillar organic polymer as claimed in item 1 of the patent application is composed of decylamine and/or copolymerized p-phenyl 3,4-hydroxyl-p-amine. The fibrid body formed. 9. The fibrid composed of the heat-resistant and heat-sensitive organic polymer according to the first aspect of the patent application is a fibrid composed of decylamine. 1 〇 The heat-resistant heat-resistant organic high-molecular polymer of the first aspect of the patent application is an aromatic polyester fibrid. 1 1 - A fibrid composed of a fibrid aromatic polymer composed of a heat-resistant organic polymer, as claimed in claim 1. 1 2 The heat-resistant fibrous paper according to any one of the claims 1, 2, 3, and 11, wherein the rate of change in the longitudinal direction of the heat treatment for 5 minutes is lower. 1 3 · A short-fiber staple paper of any one of the heat-resistant short fibers of any one of claims 1, 2, 3, or any one of which is resistant to poly-p-phenylene-based phenyl-based paper , wherein the polyphenylene-resistant phenyl-based fiber paper, wherein the molten liquid crystalline whole fiber paper, wherein the temperature is 8. 30% to 8.9.1 η by the temperature of the heterocyclic ring containing 8, 9 and 1 〇 8 ◦ ° C I II- .......- 1 -- -- 1- -ϋ II iii ....... - - -- - - - -I- (Please read the notes on the back and fill out this Page 12) 1250240 Ministry of Economic Affairs, Intellectual Property Office, Staff and Consumers Cooperative, printed A8 B8 C8 D8^, patentable scope, and heat-resistant fiber paper of any of the items 1 to 1. The tensile strength is 1. 5 kg / 1 5 ill m Above, the interlayer peel strength is 1 2 g / 15 5 mm or more. 1 . A method for producing a heat-resistant fibrous paper, characterized in that a short fiber composed of a heat-resistant organic high-molecular polymer and a non-stretched or low-magnification extension of a specific gravity of 1.380 or less The aromatic polybenzamine short fiber is wet-laid with a fibrid composed of an organic resin binder and/or a heat-resistant organic polymer, and then dried to obtain a dried paper at 2 2 0 to 40 The pellets composed of the heat-resistant organic high molecular polymer are partially softened and/or melted at a temperature of 0 ° C under a pressure of 150 to 250 kg / cm. A method for producing heat-resistant fibrous paper according to claim 14 of the patent application, which is to apply an organic resin binder to the wet papermaking after wet papermaking. 1 6 · The method for producing heat-resistant fiber paper according to claim 14 or item 15 of the patent application, wherein the proportion of the unsupported or low-rate extended-type aromatic aromatic polymer of 1.38 or less The guanamine fiber has an elongation at break: 5.3% or more, and the strength at break: a strong elongation of 17 · 5 g / denier. The method for producing a heat-resistant fibrous paper according to the first or fourth aspect of the invention, wherein the short fiber composed of the heat-resistant organic high molecular polymer is an aromatic polyamide short fiber. 1 8 . The method for producing heat-resistant fibrous paper according to claim 17 , wherein the aromatic polyamine short fiber is a para-type aromatic polyamine (please read the back of the back sheet and fill in this page) - Loading ·, 11 Embroidery paper scale applicable to China National Standard (CNS) A4 specification (2) 〇χ 297 mm) -4 - 1250240 A8 B8 C8 D8 VI. Patented short fiber. 1 9 The method for producing heat-resistant fibrous paper according to claim 18, wherein a non-stretching or low magnification of a specific gravity of 1 · 380 or less is used with respect to the total weight of the aromatic polyamide short fibers. Zara-doped aromatic polyamide short fiber · 4 to 35% by weight and aromatic polyamine short fibers other than the para-type aromatic polyamide fiber: 6 5 to 9 6 wt% 〇 The manufacturing method of the heat-resistant fiber paper according to any one of the claims, wherein the specific gravity is 1.38 or less, and the pair of unstretched or low-magnification is extended. The terminal aromatic polyamine short fiber is a short fiber composed of polyparaphenylene p-nonylamine and/or polyparaphenylene 3,4 /-hydroxydiphenylene p-nonylamine Short fiber composed (please read the note on the back and fill out this page) Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed This paper scale applies Chinese National Standard (CNS) A4 specification (210 X 297 mm)