TWI247898B - Device and method for labeling grade of IC substrate - Google Patents

Device and method for labeling grade of IC substrate Download PDF

Info

Publication number
TWI247898B
TWI247898B TW89124603A TW89124603A TWI247898B TW I247898 B TWI247898 B TW I247898B TW 89124603 A TW89124603 A TW 89124603A TW 89124603 A TW89124603 A TW 89124603A TW I247898 B TWI247898 B TW I247898B
Authority
TW
Taiwan
Prior art keywords
substrate
unit
automatic
workpiece
electronic data
Prior art date
Application number
TW89124603A
Other languages
Chinese (zh)
Inventor
Wen-Gung Chen
Ming-Hu Jang
Deng-Guei Jang
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW89124603A priority Critical patent/TWI247898B/en
Application granted granted Critical
Publication of TWI247898B publication Critical patent/TWI247898B/en

Links

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • General Factory Administration (AREA)

Abstract

The invention provides a device and a method for labeling grade of IC substrate. The method includes first decoding a message issued from a detecting unit and further screening out the grades of all products; then using one type of laser or ink print to perform an automatic labeling operation on the products, and classifying the grades of the products according to different messages, for example, the grades of perfect product, first-class well product, second-class well product, junk product, etc. Accordingly, it is able to completely avoid the problem of low production efficiency and manual mistake caused by executing quality control manually in the conventional skill, thereby achieving the effect of saving manufacturing time and reducing the production cost.

Description

五、發明說明(ί) (一) 發明技術領域: 本發明係為一種1C基板之等級標示裝置及方法,其主要 乃運用自動檢測單元來檢測積體電路基板之不良品,並透過 -系列自動之流程來標示及分類所有產品,而可提高生產效 率及降低生產製程的時間。 (二) 發明技術背景·· 按,科學的腳步就如時間的流逝,其研究發展的速度一 刻也不停歇,尤其於電子的產針更深具有代表性,而幾乎 以跳躍的方式來成長,在所有的電子產品中皆莫不追求輕、 薄、短、小細個重要性的指標前進,gj此積體電路(In吨rated Circuit,1C)基板的製造技術就成為重要的關鍵,由於忙基 板製造朝向小體積及可容置多元件的方向來製作,於是便^ 要壓縮1C基板内部各元件之空間,而形成各元件之間距極為 細小,若於生產的過程中產生微小的誤差時,便可能造成忙 基板的不良產生,因而需要於生產的過財排人適當的檢測 流程,方可保持產品之穩定品質。 請參閱圖-所示,係為習用之1(:基板以人工作分類及等 級標示麟程示意圖,-般忙基板生產業者面對其產品的不 良產生,只能以人工的方法來作處理,在一 IC基板之生產線 11上,品保人員必需檢視一檢測單元12測試後所印出的報 表來找尋不良品,而檢測單元包括有二部份,—為電子測試 機,另一為自動目檢機,其電子測試機乃利用於一 Ic基板之 連線關係在各個線路施加適當之電壓,而依據輪出的特性正 本紙張尺度刺_ 規格(210V. DESCRIPTION OF THE INVENTION (I) Technical Field: The present invention relates to a 1C substrate level marking device and method, which mainly uses an automatic detecting unit to detect defective products of an integrated circuit substrate, and transmits through-series automatically The process of labeling and classifying all products increases productivity and reduces production time. (II) Technical background of invention · According to science, the pace of science is like the passage of time, and the speed of its research and development does not stop for a moment, especially the needles of electrons are more representative, and grow almost in a jumping way. All electronic products are not pursuing the indicators of light, thin, short, and small importance. The manufacturing technology of this integrated circuit (1C) substrate becomes an important key, due to the manufacture of busy substrates. It is made to be small in size and can accommodate multiple components. Therefore, it is necessary to compress the space of each component inside the 1C substrate, and the distance between the components is extremely small. If a slight error occurs during the production process, it may be This leads to the poor production of the busy substrate, so it is necessary to have a proper inspection process for the production of the product, in order to maintain the stable quality of the product. Please refer to the figure - for the use of 1 (the substrate is classified by human work classification and graded schematic diagram, - the busy substrate manufacturer faces the bad production of its products, can only be handled by manual methods, On an IC substrate production line 11, the quality assurance personnel must inspect the report printed after the test unit 12 is tested to find defective products, and the detection unit includes two parts, namely, an electronic test machine and another automatic item. In the inspection machine, the electronic testing machine uses an Ic substrate connection relationship to apply an appropriate voltage to each line, and according to the characteristics of the wheeled paper size thorn _ specification (210

X 292公釐) 五、發明說明(> ) 確性與否來判斷該1C基板是否良好,再者,自動目檢機乃利 用複數個攝衫裝置來拍攝各1C基板的正、反二面之影像,再 由人工設定檢測標準使自動目檢機能自動依據正確型樣作一 比對,以判斷該1C基板是否為良好,利用該檢測單元中之二 裝置作檢測後,再以人工分類及人工標示13的方法來區分產 品等級,而可粗淺分類出良品14及不良品15,但以此種方 法易流於因人為疏失所產生分類錯誤及誤標的情事發生,且 以人工的方式來介人生產的製程中時,畢竟人工的檢視終究 跟不上機械社紐度,於是便要停下或降低賊的運作來 遷就人工的檢視及標示,因而浪費諸多的生產時間,以及降 低了生產效率,再者,以人卫的方絲作檢視時,無法統計 各種不良品的所有產生狀況,祕生產的難後就無法針對 各種不良品喊縣作細部的分析及作製㈣改善,基於上 述的種種缺失而有待從事此行業者加以改進。 (三)發明簡要說明: 本發明係為-1C基板之等級標示裝置及方法,其係利用 中央控制單元來解檢測單元所發出的訊息,進而可筛選 出所有產品的等級,而根據不同的訊絲區分產品之等級, 而可完全改善習知技術中以人I來作品質管制巾,其所產生 效率不佳及人為疏失之問題,以達到節省製程時間及降低生 產成本之功效,並可於生產過後,依财央控制單元所統計 的數據來分析製程的缺失而加以改善。 本發明乃袭設於-積體電路⑽基板之生產線令,經 12478搜號 第〇八九一二四六〇三專利案之說明臂修正本) B7 五、發明說明(}) 由一檢測單元以測試出IC基板之等級區分(例如:報廢品、 完美品、—品、二級良品及其他分_品),而檢測單 兀(包含有:電子測試機及自動目檢機)便會將此等級區分 之電子資騎制-巾央控制單元,而巾央控制單元經運算 後,傳送—電子資料檔至―自動標示單元,自動標示單元二 用错射(Laser)或者是油墨印刷(Ink prin〇或其他標記的 方法等…來做一記號,該自動標示單元便會區分各產品之等 級,續利用-自動分類單元將其區分歸類,而品保人員只需 ^檢視中央控鮮元己分析完狀各概據,以翻可精細 分析不良品的產生狀況及將製造流程來作一改善。 、較佳者,該檢測單元所檢測IC基板單元之等級標示訊息 可透過如··電腦槽案、網路連線或(D/I、D/Ο)的控制連線 來傳U、、、e +央控制單元,且該巾央控制單元亦以同樣的方 式來與自動標示單元及自動分類單元來連接控制。 較佳者4 1C基板單元的等級區分標準可依照生產需要 作不同來作彈性調整。 經濟部智慧財產局員工消費合作社印製 者’雜已區分出的IC基板單元之等級標示完成後 之隹携_方式可以不_方法為之,例如:直接堆疊、 卡匣儲存及彈匣儲存等…方式。 心佳者’該等缝分之電子資料檔可依照檢測單元之等 訊息直接傳遞於—巾央控解元作監控麟,並可更 蓉十如·產品數量、不良品總數及不良品之分佈狀況 4···、、封訊息,可供進一步之製程分析。 者利用-中監控單元來監控Ic基板之生產線的所 本紙張尺錢财目 1247898 (案號第〇八九一二四六〇三專利案之說明着%正本) .— --- B7 玉、發明說明(Lf ) ^二可絲如:操作狀況、開機率及停機率之相關數 據以仏氣各改善分析時使用。 為進-步使貴審查委員能更瞭解本案技術之重點與 内容’乃藉由下觸式、職說明與發明之詳細說明,堂能 對審查工作有所助益。 (四)發明圖式說明: 圖一係為習用之1C基板以人工作分類及等級標示的流程 示意圖; 圖一係為本發明之1C基板以自動判別方式作分類及等級 標示的流程示意圖; 圖二其係為本發明之批次生產1C基板工件的示意圖; 圖四其係為本發明之1C基板之等級標示方法的流程示意 圖0 圖號說明: 經濟部智慧財產局員工消費合作社印製 11 1C基板之生產線 12檢測單元 13 人工標示及人工分類 14良品 15不良品 21 1C基板之生產線 22檢測單元 221電子測試機 本紙張尺度_巾_家標準(CNS)A4規格咖X 2砂公爱) 12 (案絲〇八九-二四六〇三專繼之賴f修正本) ----------- B7 五、發明說明(f ) 222自動目檢機 123中央控制單元 24自動標示單元 25自動分類單元 26報廢品 27完美品 28 —級良品 29二級良品 30其他分類 41 1C基板工件 42 1C基板單元 43標示記號 51接受由一 1C基板生產線所送來之IC基板工件 52以-細單讀應IC基板卫魏行_,㈣檢測 產生至少一對應之電子資料檔 53將電子資料槽送至一中央控制單元以進行記錄,並統計 出1C基板工件上之瑕疲品的座標位置及數量 54該巾央控制單元將賊品的座標位置及數量傳送至一自 動標示單元,再將已送至自動標示單元之1C基板工件作 對應之瑕疵品標示 55該1C基板工件傳送至一自動分類單元,並依據瑕疯品的 數量比例來決定該1C基板工件作—正確的堆疊分類 本紙張尺度適用中國國家標準(CNS)A4規袼⑵〇Ti9g公爱)_ 五、發明說明(t) (五)發明詳細說明: 本發明為一種1C基板之等級標示裝置及方法,其係先解 讀測試機台所發出的訊息,進而可篩選出所有產品的等級, 並可利用如:鐘射(Laser)、油墨印刷(Ink Print)等方式 於產品上來進行自動標示,而根據不同的電子資料 ^ 產品之等級,例如:完美品、-級良品、二級心^ 等之等級上的區分,而可完全改善習知技術中以人工來作品 質管制中’其所產生效率不佳及人為疏失之問題,以達到g 省製程時間及降低生產成本之功效。 煩請參閱圖二所示,係為本發明之IC基板以自動判別方 式作分類及等級標示的流程示意圖,其快—IC基板生產線 上21依序排列有複數個已完成加工處理的IC基板工件,而 ic基板生產線上連接有—檢測單元22,而該檢測單元^内 部包括有二裝置,其分別為電子測試機221及自動目檢機 222’而電子測試機221及自動目檢機222分別以電腦檀案、 網路連線或(D/I、D/〇)的控制連線之連線方式連接至一中 央控制單元23 ’並將一裝置檢測後產生之電子資料檔傳送到 中^控制單元23,域測單元22於生產線的後方連接一自 動‘示單元24 ’此自動標示單元24可由中央控制單元23取 得等級分_動作域,而自動標示單元24會頌射(L繼) 或者是油墨印刷(InkPrint)的方式來標示於1(:基板上,而 1C基板工件即可區分出不同之等級,再利用一自動分類單元 自1C基板工件中筛選出不同的等級並作一歸類,而可區 分出如:報廢品26、完美品27、一級良品28、二級良品29 12478逆號第〇八九一- •四六〇三專利案之說明I7修正本) B7 五、發明說明( 及其它分類30的產品。 注 請同時參閱圖三,其係為本發明之批次生產忙基板工件 的不意圖,其中於前圖例所揭示的IC基板之生產線^中, 包括有複數個1C基板工件41 ’域板工件41上排置有複數 個1C基板單元42,當該複數個1C基板單元42經過前圖例 所揭示之檢,單元22、中央控制單元23、自動標示單元24 及自動分類早7L 25...等裝置中,經由測試後電子資料檀的傳 輸’即可由自動標示單元來對IC基板單元42做不同的標示 記號43 ’而1C基板工件41中的標示記號43愈多,即為表 不生產之等級區分上為不良率的提高,例如:當ic基板工件 41中有10%以上之Ic基板單元似被標示上了標示記號把, 則表不該ic基板單元42為—鑛品26;當ic基板工件41 中有5% 10%被;^不上了標示記號43,則表示該I。基板單 線 兀42為一級良品29 ;再依此類推,當1C基板工件41中產 生有^%〜5%被標示上了標示記號43為-級良品28,當IC 基板單元42 + %全無標*記號43者即為完美品。 再進-步分析上述的結構,其中該檢測單元22中會傳輸 電=資料槽給中央控制單元Μ,並經由中央控制單元Μ作 4异後’並雜-動作信號至自祕林元%及自動分類單 兀25,而電子資料槽中記載有於同一忙基板工件41中,第 成個1C基板單元42上具有任何之瑕癌,其中電子測試機η 上I產生一電子資料槽’以及自動目檢機222可產生二個電 子資料檔:其中電子測試機221上的電子資料檔之產生結果 乃利用於每—IC基财^ Μ之魏各鱗路施加電 本紐尺度舶+目驛標準(CNS)A4^^^ ^9»公釐) 五、發明說明() f ’而依據輸出的特性正確性與否來判斷該IC基板單元42 是否為良好,進而產生了—電子資料檔,再者,自動目檢機 乃利用-攝影裝置絲攝各IC基板的正、反二面之影像,因 反面的1C基板單元42的序號恰與正面之IC基板單元42相 反,,需要藉助一軟體將排列位置作鏡射排列,而使正面IC 基板單το 42歧向Ic基板單元可以完全對應,故正、反面 的資料各形成一電子資料檔,藉由電子測試機221與自動目 檢機222所產生之電子資料檔,可傳輸至-中央控制單元 23 ’而將資料做一彙整,以統計出在1C基板工件41中,那 些位置的1C基板單元42需要被標示記號43,而中央控 制f元23將所彙整之資料傳送至自動標示單元24及自動^ 類早疋25,且該自動標示單元24及自動分類單元25亦可為 同一機台’以減少賴機台之成本,而完成藉由電子資料檔 來自動標示1C基板工件μ之等級標示。 抑本發明之積體電路基板之等級系統及方法,其中該1C基 板早兀42的等級區分標準可依照生產需要作不同來作彈性 "周,例如·客戶要求標準極高時,於生產時就可將十央控 制^兀内所設定之參數提高,以符合需要,該等級區分之電 子資料檔可依照檢測單元22之等級區分訊息直接傳遞於一 ^央控制單元23作監控用途,並可更進_步統計如:產品數 畺不良σσ總數及不良品之分佈狀況等…統計訊息,可供進 一步之製程分析。 本發明亦可利用一中監控單元23來監控1C基板之生產 線21的所有機台,並可荒集如··操作狀況、開機率及停機率 1247898 四,、〇三專利案之說明1¾正本) B7 C案號第〇八九一·二 五、發明說明 之 .相關數據以供製程改善分析 板單元42之荨纫庐_Λ將已區分出的1C基 m /專考示不元成後之堆疊歸類的方式可以不π的 方法為之,例如:直接堆叠卡 =了以不同的X 292 mm) 5. Invention Description (>) Whether the 1C substrate is good or not, the automatic visual inspection machine uses a plurality of camera devices to capture the front and back sides of each 1C substrate. The image is manually set to the detection standard so that the automatic visual inspection machine can automatically make an alignment according to the correct type to determine whether the 1C substrate is good. After using the two devices in the detection unit for detection, manual classification and manual The method of labeling 13 is to distinguish the product grade, and the good product 14 and the defective product 15 can be classified roughly, but in this way, it is easy to flow in the classification error and mislabeling caused by human error, and the manual method is used to introduce the person. In the process of production, after all, the manual inspection can not keep up with the mechanical society, so it is necessary to stop or reduce the operation of the thief to accommodate manual inspection and labeling, thus wasting a lot of production time and reducing production efficiency. In addition, when using Fang Wei's square wire for inspection, it is impossible to count all the production conditions of various defective products, and it is impossible to call the county for details of various bad products after the difficult production. Analysis and production (4) Improvement, based on the above-mentioned various shortcomings to be improved in the industry. (III) Brief Description of the Invention: The present invention is a level indicating device and method for a -1C substrate, which uses a central control unit to solve the message sent by the detecting unit, thereby screening out the grades of all products, and according to different messages. Silk distinguishes the grade of the product, and can completely improve the quality control towel produced by the human I in the conventional technology, which has the problems of poor efficiency and human error, so as to save the process time and reduce the production cost. After production, the data from the control unit of the fiscal control unit is used to analyze the lack of process and improve. The invention is based on the production line of the substrate of the integrated circuit (10), and is described in the description of the arm of the No. 819, 146, pp. To test the level of the IC substrate (for example: scrap, perfect, -, second-class and other products), and the test unit (including: electronic tester and automatic inspection machine) will This level distinguishes the electronic riding system-the towel central control unit, and the towel central control unit transmits the electronic data file to the "automatic labeling unit" after the operation, and the automatic labeling unit uses the laser or ink printing (Ink). Prin〇 or other methods of marking, etc. to make a mark, the automatic marking unit will distinguish the grades of each product, and continue to use the automatic classification unit to classify them, and the quality assurance personnel only need to view the central control elements. After analyzing the various data, it can be used to improve the production status of the defective products and improve the manufacturing process. Preferably, the level marking information of the IC substrate unit detected by the detecting unit can be transmitted through the computer. Case, network connection or (D/I, D/Ο) control connection to transmit U, ,, e + central control unit, and the central control unit of the towel is also in the same way with automatic marking unit and automatic The classification unit is used for connection control. The preferred 4 1C substrate unit classification standard can be flexibly adjusted according to the production needs. The Ministry of Economic Affairs, Intellectual Property Bureau, the employee consumption cooperative, the manufacturer's classification of the IC substrate unit. After the completion of the labeling, the _ method can be _ method, such as: direct stacking, cassette storage and magazine storage, etc. The heart of the person's electronic data files can be in accordance with the detection unit and other information Directly transferred to the towel central control solution for monitoring the forest, and more Rong Shiru, such as the number of products, the total number of defective products and the distribution of defective products 4···, and the message, for further process analysis. - The medium monitoring unit monitors the production line of the Ic substrate. The paper size is 1247898 (the original number of the patent case No. 891, 2246). ---- B7 jade, invention description (Lf) ^二可丝如如: The data on the status, start-up rate and downtime rate are used in the analysis of each improvement of the radon. In order to make the review committee more aware of the focus and content of the technology in this case, it is through the following touch, job description and invention. In detail, the church can help the review work. (IV) Description of the invention: Figure 1 is a schematic flow chart of the 1C substrate used in the human work classification and grade; Figure 1 is the 1C substrate of the present invention. Schematic diagram of the process of classifying and classifying the automatic discriminating method; FIG. 2 is a schematic diagram of the 1C substrate workpiece produced by the batch of the present invention; FIG. 4 is a schematic flow chart of the level marking method of the 1C substrate of the present invention. : Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 11 1C substrate production line 12 detection unit 13 manual labeling and manual classification 14 good products 15 defective products 21 1C substrate production line 22 detection unit 221 electronic testing machine paper size _ towel _ home standard (CNS) A4 specification coffee X 2 sand public love) 12 (Case silk 〇 eight nine - two four six three three special success depends on f revision this) ----------- B7 five, invention description ( f ) 222 Moving visual inspection machine 123 central control unit 24 automatic marking unit 25 automatic classification unit 26 scrap 27 perfect product 28 - grade good 29 secondary good 30 other classification 41 1C substrate workpiece 42 1C substrate unit 43 mark 51 accepts a 1C substrate The IC substrate workpiece 52 sent by the production line is read by the IC substrate Wei Weixing, (4) detecting at least one corresponding electronic data file 53 to send the electronic data slot to a central control unit for recording, and counting The coordinate position and quantity of the fatigue on the 1C substrate workpiece 54 The central control unit transmits the coordinate position and quantity of the thief to an automatic labeling unit, and then corresponds to the 1C substrate workpiece that has been sent to the automatic labeling unit. Product Marking 55 The 1C substrate workpiece is transferred to an automatic sorting unit, and the 1C substrate workpiece is determined according to the proportion of the madness product. The correct stacking classification The paper scale applies to the Chinese National Standard (CNS) A4 gauge (2) 〇 Ti9g (public)) _ 5, invention description (t) (5) Detailed Description of the Invention: The present invention is a 1C substrate grade marking device and method, which is first interpreted test machine The message is sent to select the level of all products, and can be automatically marked on the product by means of, for example, Laser, Ink Print, etc., depending on the electronic data. For example, the distinction between the perfect product, the good grade, the second grade ^, etc., can completely improve the problem of the inefficiency and human error caused by the manual control of the artificial technique in the prior art. Achieve g provincial process time and reduce production costs. Please refer to FIG. 2, which is a schematic diagram of the process of classifying and classifying the IC substrate of the present invention by an automatic discrimination method. The fast-IC substrate production line 21 sequentially arranges a plurality of IC substrate workpieces that have been processed. The ic substrate production line is connected to the detecting unit 22, and the detecting unit 2 includes two devices, which are respectively an electronic testing machine 221 and an automatic visual inspection machine 222', and the electronic testing machine 221 and the automatic visual inspection machine 222 respectively The computer cable, network connection or (D/I, D/〇) control connection is connected to a central control unit 23' and transmits the electronic data file generated by a device to the control Unit 23, the domain measuring unit 22 is connected to an automatic 'display unit 24' at the rear of the production line. The automatic labeling unit 24 can obtain the graded_action field by the central control unit 23, and the automatic labeling unit 24 will shoot (L) or The method of ink printing (InkPrint) is marked on 1 (: substrate, and the 1C substrate workpiece can be distinguished by different grades, and then an automatic classification unit is used to screen different grades from the 1C substrate workpiece. And a classification, and can be distinguished as: scrap 26, perfect 27, first-class good 28, second-class good 29 12478 reverse number 〇 891 - • four six three patent case description I7 amendment) B7 V. INSTRUCTIONS (and other products of category 30. Note Please also refer to Figure 3, which is a schematic diagram of the production of a busy substrate workpiece in the batch of the present invention, wherein in the production line of the IC substrate disclosed in the previous figure, A plurality of 1C substrate workpieces 41 are included. The plurality of 1C substrate units 42 are arranged on the domain plate workpiece 41. When the plurality of 1C substrate units 42 are inspected by the previous legend, the unit 22, the central control unit 23, and the automatic indicator are automatically marked. In the unit 24 and the automatic sorting early 7L 25... and other devices, the transmission of the electronic data sheet by the test can be made by the automatic labeling unit to make different marking marks 43' to the IC substrate unit 42 and the marking in the 1C substrate workpiece 41. The more the mark 43, the difference in the level of the non-production is the improvement of the defect rate. For example, when more than 10% of the Ic substrate unit in the ic substrate workpiece 41 is marked with a mark, it is not the ic. The substrate unit 42 is - Product 26; 5% 10% of the ic substrate workpiece 41; ^ not marked with the mark 43, it means the I. The substrate single line 兀 42 is a good quality 29; and so on, when the 1C substrate workpiece 41 is produced ^%~5% is marked with the mark 43 as the grade-good 28, and the IC substrate unit 42 + % is completely unmarked * mark 43 is the perfect product. Further analysis of the above structure, wherein the test In the unit 22, the electric=data slot is transmitted to the central control unit Μ, and the central control unit is used to make 4 different and then mixed-action signals to the self-secret forest element% and the automatic classification unit ,25, and the electronic data slot records In the same busy substrate workpiece 41, the first 1C substrate unit 42 has any carcinoma, wherein the electronic tester η generates an electronic data slot and the automatic visual inspection machine 222 can generate two electronic data files: The result of the electronic data file on the electronic testing machine 221 is utilized for each of the IC-based financial resources, and the application of the electric standard to the standard scale (CNS) A4^^^ ^9»mm 5, invention description () f ' and judge the IC substrate single according to the correctness of the output characteristics 42 is good, and then the electronic data file is generated. Furthermore, the automatic visual inspection machine uses the image of the photographic device to capture the image of the front and back sides of each IC substrate, because the serial number of the 1C substrate unit 42 on the reverse side is exactly the same. In contrast, the IC substrate unit 42 on the front side needs to be mirror-arranged by a software body, so that the front IC substrate can be completely aligned with the Ic substrate unit, so that the front and back sides of the data form an electronic data file. The electronic data file generated by the electronic test machine 221 and the automatic visual inspection machine 222 can be transmitted to the central control unit 23' to collect the data to calculate the 1C of those positions in the 1C substrate workpiece 41. The substrate unit 42 needs to be marked with the mark 43, and the central control f element 23 transfers the collected data to the automatic labeling unit 24 and the automatic labeling unit 25, and the automatic labeling unit 24 and the automatic sorting unit 25 can also be the same machine. In order to reduce the cost of the machine, the station automatically marks the level of the 1C substrate workpiece μ by electronic data file. The hierarchical system and method for the integrated circuit substrate of the present invention, wherein the 1C substrate early stage 42 classification standard can be made according to the production needs for flexibility, for example, when the customer requirements are extremely high, at the time of production The parameters set in the ten central control unit can be improved to meet the needs, and the electronic data files of the level can be directly transmitted to the central control unit 23 for monitoring purposes according to the level distinguishing information of the detecting unit 22, and More _ step statistics such as: the number of products 畺 bad σσ total and the distribution of defective products, etc.... statistical information for further process analysis. The present invention can also utilize a monitoring unit 23 to monitor all the machines of the 1C substrate production line 21, and can be ruined as: · operating conditions, operating rate and shutdown rate 1247898 four, the description of the third patent case 13⁄4 original) B7 C Case No. 〇 九 一 二 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Stacking can be done in a way that is not π, for example: direct stacking card = different

I 者。 及化費較少納空間之優點 方法圖音Γ示’其係為本發明之IC基板之等級標示 、L王不’竭’其係包括有下列之步驟·· 接又由-1C基板生產騎送來之IC基板工件; 53 52以-檢解元對應IC紐工件進行檢測,針對檢 測結果產生至少—對應之電子資料檔; ,電子資觸送至—巾央控鮮元⑽行記錄,並 f計出1C基板工件上之贼品的座標位置及數 54 该中央控制單元將瑕疲品的座標位置及數量傳送 至一自動標示單元,再將已送至自動標示單元之 1C基板工件作對應之瑕疵品標示 ;以及, 經濟部智慧財產局員工消費合作社印製 55该1C基板工件傳送至一自動分類單元,並依據瑕 疵品的數量比例來決定該1C基板工件作一正確的 堆疊分類。 一 ‘、上所述’本發明之結構特徵及各實施例皆已詳細揭 不,就1C基板之生產製程而言,可完全改善習知技術中以人 工來作品質管制巾,其所產生效率不佳及人為疏失之問題, 以達到節省製程時間及降低生產成本之功效 ,充分顯示出本 本紙張尺玉適用?ii^(CNS)又_4規格(210 χ 29Ϊ^- 五、發明說明(f) 發=案在目的及功效上均深富實施之進步性,極具產業 用價值,且為目前市面上前所未見之運用,依專利法之精 所述,本發明案完全符合發明專利之要件。 唯以上所述者,僅為本發明之較佳實施例而已,當不能 以之限定本發明所實施之範圍。即大凡依本發明申請專利範 圍所作之均等變化與修飾,皆應仍屬於本發明專利涵蓋之範 圍内,謹請貴審查委員明鑑,並祈惠准,是所至禱。I. The advantages of the method and the lesser space of the method are shown in the figure, which is the level marking of the IC substrate of the invention, and the L-wang is not exhausted. The system includes the following steps: · The production is carried out by the -1C substrate. The IC substrate workpiece is sent; 53 52--detection element corresponds to the IC button workpiece for detection, and at least the corresponding electronic data file is generated for the detection result; the electronic asset is touched to the towel control central unit (10) line record, and f Calculate the coordinate position and number of the thief on the 1C substrate workpiece. The central control unit transmits the coordinate position and quantity of the fatigue product to an automatic marking unit, and then corresponds to the 1C substrate workpiece that has been sent to the automatic marking unit. The product labeling; and the Ministry of Economic Affairs Intellectual Property Office employee consumption cooperative printed 55 the 1C substrate workpiece is transferred to an automatic sorting unit, and the 1C substrate workpiece is determined to be a correct stacking classification according to the proportion of the product. The structural features and the embodiments of the present invention have been disclosed in detail, and the production process of the 1C substrate can completely improve the efficiency of the artificially controlled fabric in the prior art. The problem of poor and human error, in order to save the process time and reduce the cost of production, fully demonstrate that the paper jade is suitable for use? Ii^(CNS) and _4 specifications (210 χ 29Ϊ^- five, invention description (f) hair = case in the purpose and efficacy of the rich implementation of the progressive, very industrial value, and is currently on the market The present invention is fully compliant with the requirements of the invention patents as described in the patent law. The above is only the preferred embodiment of the present invention, and the invention may not be limited thereto. The scope of the application, that is, the equal changes and modifications made by the applicant in accordance with the scope of the patent application of the present invention should still fall within the scope of the patent of the present invention. Please ask the reviewing committee to give a clear understanding and pray for the best.

Claims (1)

1247曙 A8 號第〇八九一二四六〇三專利案之說明書彳 本) D8 六、申請專利範圍 1· -種1C基板之等級標示裝置,其係包括有: < ie 胃Ie^紐上承置有複數 個已完成加工之ic基板工件,並可帶動IC基板工件 移動至下一處理單元; -檢測單元,㈣制ic基板轉是縣正f,並將檢 查之結果產生複數個電子資料檔; 中央控制單元,接收自檢測單元所傳來電子資料檔, 而做一記錄及處理,並將IC基板工件作等級分類,並 將已作分類之電子資料檔傳送至下一處理單元; 一自動標示單元,接收中央控制單元已處理之電子資料 檔,而於1C基板工件上作記號以區分其等級;以及, 一自動分類單元’根據自動標示單元所分類之記號,而 將1C基板工件作一堆疊分類。 2·如申請專利範圍第丨項所述之一種IC基板之等級標示裝 置,其中該ic基板工件内更係包含有複數個IC基板單元。 3·如申味專利範圍第1項所述之一種IC基板之等級標示裝 置,其中該檢測單元包括有電子測試機及自動目檢機。 4·如申請專利範圍第3項所述之一種IC基板之等級標示裝 置,其中該電子測試機產生有一電子資料檔。 5·如申請專利範圍第3項所述之一種IC基板之等級標示裝 置,其中該自動目檢機產生有至少一電子資料檔。 6·如申請專利範圍第1項所述之一種1C基板之等級標示裝 置’其中該1C基板單元的等級區分標準可依照生產需要 本紙張尺度適用中國國家榡準(CNS ) M規格(21〇>4297公董) (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 12478歡第0八九 一二四六〇三專利案之說明書丨#本) D8 申請專利範圍 作不同來作彈性調整。 7·如申請專利範圍第1項所述之一種1C基板之等級標示裝 置,其中該將已區分出的不良品標示完成後之堆疊歸類的 方式為直接堆疊。 8·如申請專利範圍第1項所述之一種1C基板之等級標示裝 置’其中該將已區分出的不良品標示完成後之堆疊歸類的 方式為卡匣儲存。 9·如申請專利範圍第1項所述之一種1C基板之等級標示裝 置’其中該將已區分出的不良品標示完成後之堆疊歸類的 方式為彈匣儲存。 10·如申請專利範圍第1項所述之一種IC基板之等級標示裝 置,其中可利用一中央監控單元來監控1C基板之生產線 的所有機台。 η·如申請專利範圍第1項所述之一種1C基板之等級標示裝 置,其中該等級區分之電子資料檔可依照檢測單元之等級 區分訊息直接傳遞於一中央控制單元作監控用途。 12·如申凊專利範圍第1項所述之一種1C基板之等級標示裝 置,其中該自動標示單元及自動分類單元亦可為同一機 台。 13·—種1C基板之等級標示方法,其係包括有·· (a) 接受由一 1C基板生產線所送來之IC基板工件; (b) 以一檢測單元對應ic基板工件進行檢測,針對檢測 結果產生至少一對應之電子資料檔; (C)將電子資料檔送至一中央控制單元以進行記錄,並統 (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製1247曙A8 No. 189, 146, pp. 专利 专利 ) ) ) ) D 六 六 六 六 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 1 1 1 1 1 1 ie ie ie ie A plurality of ic substrate workpieces that have been processed are mounted thereon, and the workpiece of the IC substrate can be moved to the next processing unit; - the detecting unit, (4) the ic substrate is converted to the county, and the result of the inspection is generated into a plurality of electrons. The data center; the central control unit receives the electronic data file transmitted from the detecting unit, performs a recording and processing, classifies the IC substrate workpieces, and transmits the classified electronic data files to the next processing unit; An automatic labeling unit receives the electronic data file processed by the central control unit, and marks the workpiece on the 1C substrate to distinguish its level; and an automatic sorting unit '1C substrate workpiece according to the mark classified by the automatic marking unit Make a stack classification. The grading device for an IC substrate according to the invention of claim 1, wherein the ic substrate workpiece further comprises a plurality of IC substrate units. 3. The rating device of an IC substrate according to claim 1, wherein the detecting unit comprises an electronic testing machine and an automatic visual inspection machine. 4. The classifying device for an IC substrate according to claim 3, wherein the electronic testing machine generates an electronic data file. 5. The classifying device for an IC substrate according to claim 3, wherein the automatic visual inspection machine generates at least one electronic data file. 6. A level marking device for a 1C substrate as described in claim 1 wherein the level discrimination standard of the 1C substrate unit can be applied to the Chinese National Standard (CNS) M specification according to the production requirements (21〇&gt ; 4297 公董) (Please read the note on the back and then fill out this page) Order the Ministry of Economic Affairs, Intellectual Property Bureau, Staff Consumer Cooperatives, Print 12478 Huan, No. 0, 892, 246, Patent Patent Manual 丨 #本) D8 The scope of patent application is different for flexible adjustment. 7. A level marking device for a 1C substrate as described in claim 1, wherein the method of sorting the sorted defective products after the completion of the labeling is direct stacking. 8. A level marking device for a 1C substrate as described in claim 1 of the invention, wherein the method of sorting the sorted defective products after the completion of the labeling is card storage. 9. A level marking device for a 1C substrate as described in claim 1 of the patent application, wherein the method of sorting the separated defective products after the completion of the labeling is the magazine storage. 10. A classifying device for an IC substrate according to claim 1, wherein a central monitoring unit can be used to monitor all the machines of the 1C substrate production line. η. The 1C substrate level marking device of claim 1, wherein the electronic data file of the level can be directly transmitted to a central control unit for monitoring purposes according to the level of the detecting unit. 12. A level marking device for a 1C substrate according to claim 1, wherein the automatic marking unit and the automatic sorting unit may be the same machine. 13. A method for marking the level of a 1C substrate, comprising: (a) accepting an IC substrate workpiece sent from a 1C substrate production line; (b) detecting a workpiece corresponding to the ic substrate by a detecting unit, for detecting As a result, at least one corresponding electronic data file is generated; (C) the electronic data file is sent to a central control unit for recording, and the system is integrated (please read the note on the back side and then fill in the page). Cooperative printing 12478· A8 號第〇八九-二四六〇三專利案之說明書翁本) _ D8 經濟部智慧財產局員工消費合作社印製 六、申請專利範圍 计出1C基板工件上之瑕疵品的座標位置及數量,· (d) 該中央控制單元將瑕巍品的座標位置及數量傳送至一 自動標不單元,再將已送至自動標示單元之1C基板 工件作對應之瑕疵品標示;以及, (e) 该1C基板工件傳送至一自動分類單元,並依據瑕疵 品的數量比例來決定該1C基板工件作一正確的堆疊 分類。 14·如申請專利範圍第13項所述之-種1C基板之等級標示方 法其中步驟(a)之忙基板工件内更係包含有複數個ic 基板單元。 15·如申%專利細第13項所述之—種〖基板之等級標示方 法,其中步驟(b)中之檢測單元包括有一電子測試機及 一自動目檢機。 16·如申吻專利範圍第15項所述之一種ic基板之等級標示方 法,其中該電子測試機產生有一電子資料檔。 17·如申請專利細第15項所述之-種1C基板之等級標示方 法,其中該自動目檢機產生有至少一電子資料檔。 本紙張尺度適用中國國家標準(CNS ) M規格(加卿7公董)12478· A8 No. 189-264, the specification of the patent case Weng Ben) _ D8 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing VI. The scope of application for the patent to calculate the coordinate position of the product on the 1C substrate workpiece And quantity, (d) The central control unit transmits the coordinate position and quantity of the defective product to an automatic labeling unit, and then displays the 1C substrate workpiece that has been sent to the automatic labeling unit as a corresponding product label; and, ( e) The 1C substrate workpiece is transferred to an automatic sorting unit, and the 1C substrate workpiece is determined to be a correct stacking classification according to the number of defective products. 14. A method for marking a 1C substrate as described in claim 13 wherein the busy substrate of the step (a) further comprises a plurality of ic substrate units. 15. The method of classifying the substrate according to the item 13 of the patent of the patent, wherein the detecting unit in the step (b) comprises an electronic testing machine and an automatic visual inspection machine. The method of marking an ic substrate according to item 15 of the patent application, wherein the electronic testing machine generates an electronic data file. 17. The method of classifying a 1C substrate as described in claim 15 wherein the automatic visual inspection machine produces at least one electronic data file. This paper scale applies to the Chinese National Standard (CNS) M specification (plus 7 public)
TW89124603A 2000-11-21 2000-11-21 Device and method for labeling grade of IC substrate TWI247898B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89124603A TWI247898B (en) 2000-11-21 2000-11-21 Device and method for labeling grade of IC substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89124603A TWI247898B (en) 2000-11-21 2000-11-21 Device and method for labeling grade of IC substrate

Publications (1)

Publication Number Publication Date
TWI247898B true TWI247898B (en) 2006-01-21

Family

ID=37400675

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89124603A TWI247898B (en) 2000-11-21 2000-11-21 Device and method for labeling grade of IC substrate

Country Status (1)

Country Link
TW (1) TWI247898B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408381B (en) * 2010-10-07 2013-09-11
TWI494560B (en) * 2013-11-12 2015-08-01 Mpi Corp Method for selecting a die and method for generating a bad die map

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408381B (en) * 2010-10-07 2013-09-11
TWI494560B (en) * 2013-11-12 2015-08-01 Mpi Corp Method for selecting a die and method for generating a bad die map

Similar Documents

Publication Publication Date Title
CN110472524B (en) Invoice information management method and system based on deep learning and readable medium
CN102514768B (en) Wire harness quality detection method
US8836964B2 (en) Queued error reconciliation in a document processing environment
CN108501542B (en) A kind of method of automatic batch printing certificate
JP2009133741A (en) Inspection group data management system
JP2003099837A (en) Paper sheet processor, inspection method for paper sheet processor, and test medium
CN114219799A (en) Intelligent manufacturing defective product analysis method and system
TW442880B (en) Method for automatically classifying the wafer with failure mode
CN110223152A (en) A kind of plate production data acquisition method and system in Furniture manufacture execution system
CN113758524A (en) Circuit board processing monitoring system
TWI247898B (en) Device and method for labeling grade of IC substrate
CN110687496A (en) Modularized rapid electric energy meter sorting device and sorting method
TW202230281A (en) Image reinspection method, computer device, and storage medium
CN104568492B (en) On-line detection device for printing machine breakdown and detection method
CN110322195A (en) A kind of food materials management system
CN215235988U (en) Magnetic material product defect detection equipment based on deep learning
CN113155862B (en) Method for simulating yield of polarizing film coiled material
CN108827368A (en) A kind of fool proof test device and method
CN115269570A (en) Quality analysis method and system based on zero-defect engineering big data
TW201237978A (en) Method of smart defect screen and sample
TW480639B (en) Method and apparatus of the wafer map display for semiconductor test system
JP5613132B2 (en) Refund machine and maintenance system
CN101797563B (en) Sorting machine and sorting testing method
CN213659321U (en) Automatic sorting association printing ticket pasting all-in-one machine
CN117434068B (en) Chip detection method and system

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees