1247100 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種量測裝置，特別是有關於一種量測材料 性質的裝置’以同時獲得待測材料的揚氏模數（Young’s modulus)、浦以松比（Poisson’s ratio)及熱膨脹係數（Coefficient of thermal expansion，CTE)，本發明更包括提供一種量測材料性質的 方法。 【先前技術】 美國專利第5,847,283號係提出一種量測待測材料揚氏係數 與熱膨脹係數的方法，如第一圖所示，首先，先選擇一已知機械 性質的材料20,以單點式光學方法30量測該材料中心點變形，沉 積一待測材料10於一已知機械性質的材料20上，同時藉由單點 式光學量測法30量測沉積前後結構中央位置的曲率變化，之後^， 將該完成沉積的結構置入一四點彎矩（four-point bending)的施力 裝置40使其產生變形，即可計算並獲得該待測材料的揚氏係數， 接著，進行熱膨脹係數的量測，首先，加熱50該結構促其產生绳 形，再利用單點式光學量測法30量測結構中央位置的曲率變化< 即可獲得該待測材料的熱膨脹係數。然前述技術存在以下缺點. (1)共需進行多達四次的量測實驗，（2)必須設計一種四點彎矩的^ 力I置’（3)然法獲得材料的浦以松比’（4)僅適用於方形纟士構的、 片，以及（5)只能擷取方形結構試片中央處一點之位移資料。、式 美國專利第6,466,308號係提出一種量測待測材料揚氏 與浦以松比關係及熱膨脹係數的方法，如第二圖所示，首先’、數 溫度T1時，以光學量測法30分別量測兩已知材料性質的圓^於 構(60, 70)其圓心處的變形量，之後，沉積待測材料⑽於上、,、圯結 形結構(6G，7G)上，並續以光學量測法川量測完成沉積後結== 1247100 處的變形，最後，將溫度改變至Τ2，再重複進行上述步驟，即可 獲得該待測材料的楊氏係數與浦以松比關係以及熱膨脹係數。然 前述技術亦有以下缺點：（1)由於待測材料需在不同溫度下，分別 沉積於至少兩個已知材料性質的材料上，遂必須製作至少四片試 片，（2)至少必須進行八次量測實驗，（3)僅能獲得楊氏係數與浦以 松比的關係，無法各別求出，（句僅能擷取圓心處一點的位移資料， 以及（5)僅適用於圓形結構。 奈米壓痕系統是目前量測微奈米材料機械性質的主要方法之 一，在微奈米材料的研究中，奈米壓痕系統具有許多其他測試方 法無可取代的地位，其除了可量測微奈米材料的揚氏模數(Young’s modulus)、硬度（Hardness)、彎矩強度（Bending strength)、破裂韋刀 度（Fracture toughness)、疲勞強度（Fatigue strength)、接合強度 (Adhesion strength)及表面形貌(Topography)等外，更可提供微奈米 材料的奈米磨潤（Nanotribology)參數，應用的領域包含了材料、機 械、電子、生醫及化學等領域，且有越來越蓬勃發展的趨勢，因 此，奈米壓痕系統在目前及未來微奈米相關的研究領域中，勢必 扮演舉足輕重的角色。 雖可預期奈米壓痕系統在未來將扮演關鍵性的地位，然至目 河為止該系統仍存在許多急待相關研究人員克服解決的問題，例 如奈米壓痕系統量測揚氏模數的準確性係取決於對浦以松比的猜 測是否準確，而材料的另一項重要參數_熱膨脹係數，該系統至今 未旎提供任何訊息，因此，若能開發出一種具有原奈米壓痕系統 強大功能，又能克服前述缺點的裝置與方法，使量測的揚氏模數 更為準確及可篁測原系統無法測出的浦以松比及熱膨脹係數，勢 必對業界在提昇量測技術上有相當卓著的貢獻。 【發明内容】 1247100 有鑒於此，本發明提供一種量測材料性質的全新裝置，其藉 由奈米壓痕系統、光學量測法以及多層結構變形理論的結合，同 時量測待測材料的楊氏係數、浦以松比及傳統奈米壓痕系統無法 獲得的熱膨脹係數。本發明更包括提供一種量測材料性質的方法。 本發明之目的係提供一種量測材料性質的裝置，包括：一腔 室，係放置一待測材料；一控溫單元，係調控該腔室内之溫度； 一施力單元，係施力於該待測材料之表面；以及一光學量測單元， 係量測該待測材料之變形分布。 本發明之另一目的係提供一種量測材料性質的方法，包括下 列步驟··結合一待測材料與至少一已知機械性質之材料以形成一 複層材料結構；放置該複層材料結構於一腔室中；藉由一控溫單 元調控該腔室内之溫度至一初始溫度；藉由一施力單元施力於該 待測材料之表面；移動該施力單元使其與該待測材料分離；續藉 由該控溫單元調控該腔室内之溫度至一測試溫度；藉由一光學量 測單元量測該待測材料之變形分布；以及進行理論計算以獲得該 待測材料之楊氏板數、浦以松比及熱膨服係數。 本發明之前述目的或技術特徵，將依據後附圖式加以詳細說 明，惟需明瞭的是，後附圖式及所舉之例，只是做為說明而非在 限制或縮限本發明。 【實施方式】 請參閱第三圖，說明本發明量測材料性質的裝置及方法。首 先，結合一待測材料100與一已知機械性質的材料110以形成一 複層材料結構，該結合方式包括沉積、鑄造、利用黏著劑黏合或 任何可使兩材料結合的方法，待測材料100係為單層，其形狀包 括圓形或方形或任何其他幾何形狀，較佳係為圓形或方形。接著， 1247100 將該複層材料結構置入一腔室120,之後，藉由一控溫單元13〇 調控腔室120内的溫度至一起始溫度，控溫單元13〇透過包括傳 導、對流或輻射方式調控腔室120内的溫度。 接著，藉由一施力單元140施力於待測材料1〇〇的表面，使 待測材料1〇〇表面形成一與施力方向同向的位移，施力單元14〇 係藉由一壓頭150與待測材料100表面接觸，壓頭15〇的材料性 質為已知（如揚氏係數及浦以松比），其硬度需大於待測材料1〇〇， 壓頭150可例如由金剛石所構成，此外，施力單元14〇更包括紀 錄施力量(F)與其在待測材料100表面造成的相對位移⑻，而根據 上述施力量(F)與位移⑻的資料’可從其卸載曲線獲得折合彈性模 數（Reduced Modulus) (Er)值。 完成待測材料表面的施壓實驗後，移開壓頭15〇使施力單元 140人材料刀離，接者，藉由控溫單元13〇再度調控腔室内的 溫度至-測試溫度’本發明提供的起始溫度與顺溫度係、依不同 待測材料而變動，且該起始溫度可大於或小於該測試溫度此時， 由於待測材料_與已知機械性f材料m間的機械性質不匹配 ㈣mat<^’致該兩材料層產生翹曲變形的現象，續以一光學量測 單元160量測待測材料_的變全場(戰。16仏_形分布，社果 可獲得多個包含變形與位置_的數據點，最後，將上述實驗結 果代入多層結構變形理論，並制數值疊代法求取制材料⑽ 相關的材料性質參數’如楊氏係數、浦以松比及熱膨脹係數等資 料。光學早7C 160的光源包括單波長或多波長的光源，另若 待測^料1GG的表面為鏡面，則可湘光學量測法中的平面波干 涉法量測之’而若待騎料⑽的表面為麵面，則湘全像干 涉法或光斑干涉法量測之。 1247100 上述結構變形的理論計算，首先透過例如第（1)式的運算式運 算之： l/Er - [(l-vl2)/El]+[(l-v22)/E2] (1)1247100 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a measuring device, and more particularly to a device for measuring material properties to simultaneously obtain Young's modulus of a material to be tested. The Poisson's ratio and the coefficient of thermal expansion (CTE), the present invention further includes a method of measuring the properties of a material. [Prior Art] U.S. Patent No. 5,847,283 proposes a method for measuring the Young's modulus and thermal expansion coefficient of a material to be tested. As shown in the first figure, first, a material 20 of known mechanical properties is selected first, in a single point manner. The optical method 30 measures the deformation of the center point of the material, deposits a material to be tested 10 on a material 20 of known mechanical properties, and simultaneously measures the curvature change at the central position of the structure before and after deposition by a single-point optical measurement method 30. Then, the deposited structure is placed into a four-point bending force applying device 40 to deform it, and the Young's modulus of the material to be tested is calculated and obtained, followed by thermal expansion. The measurement of the coefficient, firstly, heating 50 the structure to promote the formation of a rope shape, and then measuring the curvature change at the central position of the structure by a single-point optical measurement method 30 to obtain the thermal expansion coefficient of the material to be tested. However, the above-mentioned techniques have the following disadvantages: (1) A total of up to four measurement experiments are required, and (2) a four-point bending moment must be designed to set the force to be '(3). '(4) is only applicable to the square gentleman's structure, the piece, and (5) can only take the displacement data of the point at the center of the square structure test piece. U.S. Patent No. 6,466,308 proposes a method for measuring the relationship between Young's and Pusson's ratio and the coefficient of thermal expansion of the material to be tested, as shown in the second figure, first, at the temperature T1, by optical measurement method 30 The deformation of the center of the two known materials is measured respectively (60, 70), and then the material to be tested (10) is deposited on the upper, and the 圯-shaped structure (6G, 7G), and continues The deformation at the deposition == 1247100 is completed by the optical measurement method. Finally, the temperature is changed to Τ2, and the above steps are repeated to obtain the relationship between the Young's modulus of the material to be tested and the Pusong ratio. And the coefficient of thermal expansion. However, the foregoing techniques also have the following disadvantages: (1) Since the material to be tested needs to be deposited on at least two materials of known material properties at different temperatures, at least four test pieces must be produced, and (2) at least must be performed. Eight measurements, (3) can only obtain the relationship between Young's coefficient and Puyisong ratio, can not be found separately, (sentence can only capture the displacement data of a point at the center of the circle, and (5) only applies to the circle The nanoindentation system is one of the main methods for measuring the mechanical properties of micro-nano materials. In the research of micro-nano materials, the nanoindentation system has an irreplaceable position in many other test methods. In addition to the Young's modulus, Hardness, Bending strength, Fracture toughness, Fatigue strength, and joint strength of measurable micro-nano materials Adhesion strength and surface topography, etc., can also provide nano-staining parameters of micro-nano materials, including materials, machinery, electronics, biomedicine and chemistry. And there is a trend of more and more vigorous development. Therefore, the nanoindentation system is bound to play a pivotal role in the current and future research fields related to micro-nano. Although it is expected that the nanoindentation system will play a key role in the future. Sexual status, but until the end of the river, there are still many problems that the urgent need of the relevant researchers to overcome. For example, the accuracy of the nanoindentation system to measure the Young's modulus depends on whether the guess of the Pusong ratio is Accurate, and another important parameter of the material _ thermal expansion coefficient, the system has not provided any information so far, therefore, if it can develop a device with a powerful function of the original nanoindentation system, and can overcome the aforementioned shortcomings, It makes the measured Young's modulus more accurate and can detect the Pusson's ratio and thermal expansion coefficient which cannot be measured by the original system, which is bound to make a considerable contribution to the industry in improving the measurement technology. [Summary] 1247100 In view of this, the present invention provides a novel device for measuring the properties of materials, which is characterized by a nanoindentation system, an optical measurement method, and a multi-layer structure deformation theory. At the same time, the Young's modulus, the Puyisong ratio of the material to be tested and the thermal expansion coefficient which cannot be obtained by the conventional nanoindentation system are measured. The present invention further includes providing a method for measuring the properties of the material. The object of the present invention is to provide an amount The device for measuring the properties of the material comprises: a chamber for placing a material to be tested; a temperature control unit for regulating the temperature of the chamber; a force applying unit for applying a force to the surface of the material to be tested; The optical measuring unit measures the deformation distribution of the material to be tested. Another object of the present invention is to provide a method for measuring the properties of a material, comprising the steps of: combining a material to be tested with at least one known mechanical property. Forming a multi-layer material structure; placing the multi-layer material structure in a chamber; adjusting a temperature in the chamber to an initial temperature by a temperature control unit; applying a force to the test unit by a force applying unit a surface of the material; moving the force applying unit to be separated from the material to be tested; and continuing to regulate the temperature in the chamber to a test temperature by the temperature control unit; measuring the optical measuring unit Measuring deformation of the material distribution; and a Young's theoretical plate number is calculated to obtain the materials to be tested, and a ratio of Pu to loose clothing thermal expansion coefficient. The above-mentioned objects and features of the present invention will be described in detail with reference to the accompanying drawings. [Embodiment] Referring to the third figure, an apparatus and method for measuring the properties of a material of the present invention will be described. First, a material to be tested 100 is combined with a material 110 of known mechanical properties to form a multi-layer material structure including deposition, casting, adhesion with an adhesive or any method for bonding the two materials, the material to be tested The 100 series is a single layer having a shape including a circle or a square or any other geometric shape, preferably a circle or a square. Next, 1247100, the multi-layer material structure is placed in a chamber 120, after which the temperature in the chamber 120 is adjusted to a starting temperature by a temperature control unit 13〇, and the temperature control unit 13〇 transmits, includes convection, or radiation. The mode regulates the temperature within the chamber 120. Then, a force applying unit 140 applies a force to the surface of the material to be tested, so that the surface of the material to be tested forms a displacement in the same direction as the direction of the force applied, and the force applying unit 14 is pressed by a pressure. The head 150 is in contact with the surface of the material to be tested 100, and the material properties of the indenter 15〇 are known (such as the Young's coefficient and the Pusson's ratio), and the hardness thereof is required to be larger than the material to be tested, and the indenter 150 may be, for example, diamond. In addition, the force applying unit 14 further includes a recording force (F) and a relative displacement (8) caused by the surface of the material 100 to be tested, and the data from the force (F) and the displacement (8) can be unloaded from the curve. A Reduced Modulus (Er) value is obtained. After the pressure test on the surface of the material to be tested is completed, the indenter 15 is removed, so that the force applying unit 140 is separated from the material, and the temperature is controlled by the temperature control unit 13 to adjust the temperature in the chamber to the test temperature. The initial temperature and the grading system are provided, and vary according to different materials to be tested, and the starting temperature can be greater than or less than the test temperature. At this time, due to the mechanical properties between the material to be tested and the known mechanical material f. Mismatch (4) mat<^' causes the phenomenon of warping deformation of the two material layers, and continues to measure the full field of the material to be tested by an optical measuring unit 160 (the war. 16仏_shaped distribution, the fruit can be obtained more Data points containing deformation and position _, and finally, the above experimental results are substituted into the multi-layer structure deformation theory, and the numerical iteration method is used to obtain the material properties (10) related material properties such as Young's coefficient, Puyisong ratio and thermal expansion. Coefficients and other data. Optical early 7C 160 light source includes single-wavelength or multi-wavelength light source, and if the surface of the material to be measured 1GG is mirror surface, it can be measured by plane wave interferometry in the optical measurement method. The surface of the riding material (10) is faceted The total calculation of the above-mentioned structural deformation is first calculated by the arithmetic expression of the equation (1): l/Er - [(l-vl2)/El] +[(l-v22)/E2] (1)
El及E2分別為壓頭150與待測材料100的揚氏係數，Vi及v2 分別為壓頭150與待測材料100的浦以松比，Er為由前述卸載曲 線獲得的折合彈性模數，其中E卜及Er為已知，遂經過該式的 運算，即可得知待測材料100其E2與v2的關係，再將此關係式代 入多層材料結構變形理論（Deformation theory of multi-layered structure)，以及利用所擷取之多點光學實驗資料數據，進而利用 數值疊代，可分別求出材料的楊氏係數、浦以松比以及熱膨脹係 本發明與習知技術相較，除了突破傳統壓痕測試方法的限制 與瓶頸，不需藉由猜測浦以松比來獲得楊氏係數外，亦可因光學 全域性的特性，擷取位移場多點採樣的實驗資料，再加上結合多 層材料變形理論，遂本發明可精確獲得包括揚氏係數、浦以松比 與熱膨脹係數的相關材料性質，另實驗中的試片結構形狀亦不受 限制，可為方形或圓形的結構組合。 1247100 【圖式簡單說明】 第一圖係美國專利第5,847,283號揭露之步驟流程圖。 第二圖係美國專利第6,466,308號揭露之步驟流程圖。 第三圖係本發明量測材料性質裝置之示意圖。 [主要元件符號對照說明] 10, 80…待測材料 20···已知機械性質材料 30…光學量測法 40···四點彎矩施力裝置 50…加熱步驟 60, 70…圓形試片 100…待測材料 110···已知機械性質材料 120…腔室 130…控溫單元 140…施力單元 150…壓頭 160…光學量測單元 10El and E2 are the Young's modulus of the indenter 150 and the material to be tested 100, respectively, Vi and v2 are the Poisson's ratio of the indenter 150 and the material to be tested 100, respectively, and Er is the reduced elastic modulus obtained by the aforementioned unloading curve. Where E and Er are known, and after the operation of this formula, the relationship between E2 and v2 of the material to be tested 100 can be known, and the relationship is substituted into the deformation theory of multi-layered structure. And using the multi-point optical experimental data obtained, and then using the numerical iteration, the Young's modulus, the Puyisong ratio, and the thermal expansion system of the material can be respectively determined, and the present invention is compared with the conventional technology, except for breaking through the tradition. The limitations and bottlenecks of the indentation test method do not need to obtain the Young's coefficient by guessing the Pusong ratio, or the experimental data of the multi-point sampling of the displacement field due to the optical global characteristics, plus the combination of multiple layers. Material deformation theory, the present invention can accurately obtain the properties of related materials including the Young's modulus, the Pusson's ratio and the thermal expansion coefficient, and the shape of the test piece in the experiment is also not limited, and may be square or circular. Combination structure. 1247100 [Simple description of the drawings] The first figure is a flow chart of the steps disclosed in U.S. Patent No. 5,847,283. The second figure is a flow chart of the steps disclosed in U.S. Patent No. 6,466,308. The third figure is a schematic view of the apparatus for measuring material properties of the present invention. [Main component symbol comparison description] 10, 80... material to be tested 20···known mechanical property material 30... optical measurement method 40··· four-point bending moment urging device 50... heating step 60, 70...circular Test piece 100...material to be tested 110···known mechanical property material 120...chamber 130...temperature control unit 140...force unit 150...indenter 160...optical measurement unit 10