1245943 07836twfl .doc/006 94.8.18 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種液晶面板，且特別是有關 於一種液晶面板，在可折彎式印刷線路（Flexible Printed Circuit，FPC )壓合區上，藉由擬接點（dummy joint )與擬端子（dummy pin )之間的連接以避免有效 接點與有效端子之間的電性連接受到外力傷害。 【先前技術】 隨著液晶顯示器技術的快速發展與精進，新一 代的液晶顯示器正朝著高亮度、寬視角、反應速度 快、高影像解析度、全彩化的方向邁進。然而，影響 這些影像特性的因素有很多，包括了液晶分子的結 構、透明電極的性質、彩色濾光片（Color Filter )、 薄膜電晶體（TFT )的結構及其薄膜製程、配向膜 (alignment layer )，甚至後段封裝製程中所採用的封 裝材料、晶粒黏著技術以及構裝方式等。由於液晶顯 示器的高影像解析度需求，以及電子產品的輕薄短小 化趨勢，液晶顯示面板上驅動晶片（driver 1C )的構裝 技術，由晶粒-電路板接合技術（Chip On Board，COB ) 轉變為軟片自動貼合技術（Tape Automated Bonding，TAB )，之後再演進成接腳之間具有微間距 (fine pitch )之晶粒-玻璃接合技術（Chip On Glass， C〇G )。 一般的晶粒-玻璃接合技術（COG )僅是覆晶技 1245943 術（Flip Chip，F/C)的一種應用，而晶粒-破璃接合技 術中的關鍵在於晶粒上凸塊的製作以及可折彎式印 刷線路（Flexible Printed Circuit，FPC )與液晶面板之 間的組裝。 首先請參照第1圖，其繪示為習知液晶面板可 折彎式印刷線路壓合區上，可折彎式印刷線路與圖案 化線路電性連接的示意圖。在晶粒_玻璃接合（C〇g ) 過程中，驅動晶片係藉由其上的凸塊（bump)與液晶 面板100上的圖案化線路102接點電性連接，而驅動 晶片會藉由圖案化線路102與液晶面板10〇上的可折 弓式印刷線路壓合區104連接。傳統液晶面板1〇〇 在可折彎式印刷線路壓合區104上配置有多個接點 1〇6，而可折彎式印刷線路壓合區104上的接點1〇6 係用以與一可折彎式印刷線路（Flexible Printed Circuit ’ FPC )108電性連接。而可折彎式印刷線路壓 合區上的接點106在經過異方性導電膜 3 16( Anisotropic Conductive Film，ACF )盥可折彎式 ㈣，⑽上的端子110連接後即告^成 習知可折¥式印刷線路（Flexible printed Circuit ’ FPC )與可折彎式印刷線路壓合區上的接點 間的電性連接完後，在後續的組裝過程很容易因為外 力而導致邊緣區域的電性連接被破壞，因此影響到產 品的信賴度（Reliability )。 【發明内容】 1245943 07836twfl.doc/006 94.8.18 因此，本發明的目的在提出一種液晶面板，其 於可折彎式印刷線路壓合區上增加配置擬（dummy) 接點，並使用具有對應擬（dummy)端子之可折彎式印 刷線路，藉由擬接點與擬端子之間的連接以避免其他 有效接點與有效端子間的電性連接受到外力的破壞。 為達本發明之上述目的，提出一種液晶面板， 主要係由一第一陣列基板、一第二陣列基板以及一液 晶層所構成。其中，第二陣列基板配置於第一陣列基 板上方，液晶層則配置於第一陣列基板與第二陣列基 板之間。而第一陣列基板上具有一顯示區域以及一非 顯示區域，非顯示區域上配置有至少一晶片黏貼區 域、一圖案化線路以及一可折彎式印刷線路壓合區。 而可折彎式印刷線路（Flexible Printed Circuit，FPC ) 係藉由一可折彎式印刷線路壓合區而與液晶面板連 結。其中，可折彎式印刷線路壓合區上具有多個有效 接點以及至少一個擬接點，而可折彎式印刷線路具有 對應的多個有效端子以及至少一擬端子。擬端子與擬 接點之間的連接可以防止可折彎式印刷線路中的有 效接點或有效端子受到外力的破壞。其中，擬接點係 至少位於折彎式印刷線路壓合區之一侧，擬端子係至 少位於可折彎式印刷線路之一側。 本發明可折彎式印刷線路壓合區上的接點例如 可區分成一第一區塊以及至少一第二區塊。第二區塊 可位於例如第一區外的一側或兩側。其中，第一區塊 1245943 07836twfl.doc/006 94.8.18 上配置有多個有效接點，而第二區塊上配置有至少一 個擬接點。 本發明上述之第二區塊例如係配置於第一區塊 的兩侧。當受到外力時，第二區塊上擬接點與擬端子 之間的連接會先被破壞，而第一區塊上有效接點與有 效端子間的電性連接較不容易受到外力的影響。 第二區塊上的擬接點與可折彎式印刷線路上對 應之擬端子的數目可以為一個至多個。 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 【實施方式】 首先請參照第2圖，其繪示為依照本發明一較 佳貫施例之液晶面板、驅動晶片與可折幫式印刷線路 之間連接的示意圖。液晶面板200主要係由一第一陣 列基板202、一第二陣列基板204以及一液晶層206 所構成，第一陣列基板202例如為一薄膜電晶體陣列 基板（TFT array )，而第二陣列基板204例如為一彩 色濾光片陣列基板（CF array )。其中，第二陣列基板 204例如藉由一間隙物（spacer )203而配置於第一陣 列基板202上方，液晶層206則配置於第一陣列基板 202、第二陣列基板204與間隙物203之間，以構成 一顯示區域208。而第一陣列基板202上，顯示區域 208以外之區域為一非顯示區域210，而非顯示區域 1245943 07836twfl.doc/006 94.8.18 210上例如配置有多個驅動 面板·。可折彎式印刷線路3片二=驅動液晶 膜316’將其内之端 :由異方性導電 零液晶面板上之 ：：：及擬端^ 點306b)連接。驅動a 接點306a及擬接1245943 07836twfl .doc / 006 94.8.18 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a liquid crystal panel, and in particular to a liquid crystal panel, in a flexible printed circuit (Flexible Printed Circuit) (FPC), the connection between the dummy joint and the dummy pin is used to prevent the electrical connection between the effective contact and the effective terminal from being damaged by external forces. [Previous technology] With the rapid development and advancement of liquid crystal display technology, the new generation of liquid crystal display is moving in the direction of high brightness, wide viewing angle, fast response speed, high image resolution, and full color. However, there are many factors that affect these image characteristics, including the structure of liquid crystal molecules, the properties of transparent electrodes, the color filter, the structure of thin film transistors (TFTs), their thin film processes, and the alignment layer. ), And even the packaging materials, die bonding technology, and mounting methods used in the subsequent packaging process. Due to the high image resolution requirements of liquid crystal displays and the trend of thinner, lighter and shorter electronic products, the construction technology of driver ICs on LCD panels is transformed from chip-on-board bonding technology (Chip On Board, COB). It is a tape automatic bonding technology (Tape Automated Bonding, TAB), and then evolved into a chip on glass (COG) technology with a fine pitch between the pins. The general die-glass bonding technology (COG) is only an application of flip chip technology (Flip Chip, F / C). The key in the die-glass bonding technology is the production of bumps on the die and Assembly between a flexible printed circuit (FPC) and a liquid crystal panel. First, please refer to FIG. 1, which is a schematic diagram showing the electrical connection between a bendable printed circuit and a patterned circuit on a conventional bendable printed circuit bonding area of a liquid crystal panel. During the die-glass bonding (C0g) process, the driving chip is electrically connected to the contacts of the patterned circuit 102 on the liquid crystal panel 100 through bumps thereon, and the driving chip is connected by the pattern. The circuit 102 is connected to the bendable printed circuit crimping area 104 on the liquid crystal panel 100. The conventional liquid crystal panel 100 is provided with a plurality of contacts 106 on the bendable printed circuit pressing region 104, and the contacts 106 on the bendable printed circuit pressing region 104 are used to communicate with A flexible printed circuit (FPC) 108 is electrically connected. The contact 106 on the bendable printed circuit bonding area passes through an anisotropic conductive film 3 16 (Anisotropic Conductive Film (ACF)) and can be folded. The terminal 110 on the ridge is connected and it is completed. After the electrical connection between the flexible printed circuit (FPC) and the contacts on the flexible printed circuit bonding area is completed, it is easy to cause the edge area due to external forces in the subsequent assembly process. The electrical connection is broken, thus affecting the reliability of the product (Reliability). [Summary of the Invention] 1245943 07836twfl.doc / 006 94.8.18 Therefore, the object of the present invention is to propose a liquid crystal panel, which adds a dummy contact to a bendable printed circuit bonding area, and uses a corresponding The flexible printed circuit of the dummy terminal can prevent the electrical connection between the other effective contact and the effective terminal from being damaged by external force by the connection between the dummy contact and the dummy terminal. To achieve the above object of the present invention, a liquid crystal panel is proposed, which is mainly composed of a first array substrate, a second array substrate, and a liquid crystal layer. The second array substrate is disposed above the first array substrate, and the liquid crystal layer is disposed between the first array substrate and the second array substrate. The first array substrate has a display area and a non-display area. The non-display area is provided with at least one wafer sticking area, a patterned circuit, and a bendable printed circuit bonding area. The flexible printed circuit (FPC) is connected to the liquid crystal panel through a bendable printed circuit bonding area. Wherein, the bendable printed circuit bonding area has a plurality of effective contacts and at least one pseudo contact, and the bendable printed circuit has a corresponding plurality of effective terminals and at least one pseudo terminal. The connection between the pseudo terminal and the pseudo contact can prevent the effective contact or effective terminal in the bendable printed circuit from being damaged by external force. Among them, the intended contact system is located at least on one side of the bendable printed circuit bonding area, and the intended terminal system is located at least on one side of the bendable printed circuit. The contacts on the bendable printed circuit bonding area of the present invention can be divided into a first block and at least a second block, for example. The second block may be located, for example, on one or both sides outside the first block. Among them, the first block 1245943 07836twfl.doc / 006 94.8.18 is configured with multiple effective contacts, and the second block is configured with at least one pseudo contact. The second block of the present invention is, for example, disposed on both sides of the first block. When an external force is applied, the connection between the pseudo contact and the pseudo terminal on the second block will be destroyed first, and the electrical connection between the effective contact and the effective terminal on the first block will be less susceptible to external forces. The number of pseudo contacts on the second block and corresponding pseudo terminals on the bendable printed circuit may be one to more. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, preferred embodiments are described below in detail with reference to the accompanying drawings, as follows. [Embodiment] Please refer to FIG. 2 first, which is a schematic diagram showing the connection between a liquid crystal panel, a driving chip and a foldable printed circuit according to a preferred embodiment of the present invention. The liquid crystal panel 200 is mainly composed of a first array substrate 202, a second array substrate 204, and a liquid crystal layer 206. The first array substrate 202 is, for example, a thin film transistor array substrate (TFT array), and the second array substrate 204 is, for example, a color filter array substrate (CF array). The second array substrate 204 is disposed above the first array substrate 202 by a spacer 203, and the liquid crystal layer 206 is disposed between the first array substrate 202, the second array substrate 204, and the spacer 203. To form a display area 208. On the first array substrate 202, an area other than the display area 208 is a non-display area 210, instead of a non-display area 1245943 07836twfl.doc / 006 94.8.18 210, for example, a plurality of driving panels are arranged. Three bendable printed circuits, two = driving the liquid crystal film 316 ′, and connecting the inner ends of the printed circuit lines by: anisotropic conductive zero on the liquid crystal panel ::: and the pseudo end ^ point 306b). Drive a contact 306a and the intended connection
與可折彎、式印刷線路曰曰3 〇 8連接則猎由圖案化線路3 0 2 接著請參照第3目，H 佳實施例之液晶面板可折式曰^依二本發明-較 折彎式印刷線路與圖案化線：電性連=合區上，可 =粒-玻璃接合（⑺G)過程中，m圖。在 的凸塊與液晶面板300上 日日片係猎由其上 連接，而驅動晶片會，由g j二，、泉路3 G2接點電性 3 〇 0上的可折f式印^夜曰曰面板 例中，液晶面板300之可拼:j 3〇4連接。本實施 可以區分為式印刷線關合區3〇4 3 14。苴中，第_产/ / 以及至少—第二區塊 的兩端且第如係分佈於第-區塊犯 306a> 上配置有多個有效接點 接點3^4塊3Μ上例如配置有一個或是多個擬 刷線刷線路(FPC)308係、藉由可折彎式印 所伟ί 與液晶面板300連結。本實施例 3:用的：折彎式印刷線路3〇8具有多個有效端子 刷後路f;個Ϊ是多個擬端子_。當可折彎式印 复路308配置於可折彎式印刷線路塵合區304上 1245943 07836twfl.doc/006 94.8.18 時，有效端子31〇a會分別與可折彎式印刷線路壓合 區304上的有效接點3〇6a電性連接，而擬端子31叽 會分別與可折彎式印刷線路壓合區3〇4上的擬接點 306b連接。而上述可折彎式印刷線路壓合區3〇4上 有效接點306a與擬接點306b例如係藉由異方性導電 膜 3 16( Anisotropic Conductive Film，ACF )與可折彎 式印刷線路308上之有效端子310a與擬端子31〇b連 接（參照第2圖）。 、 由於擬接點306b與擬端子31 Ob之間的連接係 為於有效接點306a的兩端，因此當液晶面板在受到 外力時’會先傷及擬接點306b與擬端子310b之間的 連接’而不會直接傷害到有效接點306a與有效端子 310a之間的電性連接。對於液晶面板在組裝上所遭 遇到無法預期之外力破壞，具有更進一步的保護效 果。 綜上所述，本發明之液晶面板至少具有下列Connected to the bendable, printed circuit, said 308, then the patterned circuit 3 0 2 Then please refer to item 3, the LCD panel of the preferred embodiment can be folded ^ according to the present invention-more bendable Printed circuit and patterned line: electrical connection = on the junction area, may = the particle-glass bonding (⑺G) process, m diagram. The bump on the LCD panel 300 is connected with the Japanese-Japanese film system, and the driving chip will be printed by the f-type f-type printed on the electrical connection 300 of the GJ 2 and Quan 3 3 G2. In the example of the panel, the LCD panel 300 can be connected by j 304. This implementation can be divided into the type printing line closing area 304 3 14. In the middle, the _product // and at least the two ends of the second block and the first block are distributed on the first block block 306a > are provided with a plurality of effective contacts 3 ^ 4 block 3M for example One or more quasi-brush-line (FPC) 308 series are connected to the liquid crystal panel 300 through a bendable printed circuit board. This embodiment 3: used: the bent printed circuit 308 has a plurality of effective terminals, and the rear path f is brushed; each frame is a plurality of pseudo terminals. When the bendable printed compound circuit 308 is arranged on the bendable printed circuit dust collecting area 304 1245943 07836twfl.doc / 006 94.8.18, the effective terminal 31〇a will be respectively pressed with the bendable printed circuit crimping area. The effective contact 306a on 304 is electrically connected, and the pseudo terminal 31 叽 is respectively connected with the pseudo contact 306b on the bendable printed circuit pressing area 304. The effective contact 306a and the pseudo contact 306b on the bendable printed circuit press-bonding area 304 are, for example, an anisotropic conductive film 3 16 (Anisotropic Conductive Film, ACF) and the bendable printed circuit 308. The upper effective terminal 310a is connected to the pseudo terminal 31ob (see FIG. 2). Since the connection between the pseudo contact 306b and the pseudo terminal 31 Ob is at both ends of the effective contact 306a, when the LCD panel is subjected to external force, it will first hurt the pseudo contact 306b and the pseudo terminal 310b. Connection 'without directly harming the electrical connection between the effective contact 306a and the effective terminal 310a. The LCD panel is further protected from unforeseen damage during assembly. In summary, the liquid crystal panel of the present invention has at least the following
Wh · 夂 *、、、〇 · 1·本發明之液晶面板，其可折彎式印刷線路麗合 區上之擬接點與可折彎式印刷線路上之擬端子的連 接’可以有效防止外力對其他有效接點與有效端子之 間的電性連接被破壞。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和圍内，當可作些許之更動與潤飾，因此本發明之保講 1245943 07836twfl.doc/006 94.8.18 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖繪示為習知液晶面板可折彎式印刷線路 壓合區上，可折彎式印刷線路與圖案化線路電性連接 的示意圖；以及 第2圖繪示為依照本發明一較佳實施例液晶面 板、驅動晶片與可折％、式印刷線路之間連接的不思、 圖； 第3圖繪示為依照本發明一較佳實施例液晶面 板可折彎式印刷線路壓合區上，可折彎式印刷線路與 圖案化線路電性連接的示意圖。 【主要元件符號說明】 100、300 :液晶面板 102、302 :圖案化線路 104、304 :可折彎式印刷線路壓合區 106 :接點（位於液晶面板上） 108、308 :可折彎式印刷線路 110 :端子（位於可折彎式印刷線路上） 200 ·液晶面板 202 :第一陣列基板 203 :間隙物 204 :第二陣列基板 206 :液晶層 208 :顯示區域 1245943 07836twfl.doc/006 94·8·18 210 :非顯示區域 212 :驅動晶片 306 :接點 306a :有效接點 306b :擬接點 310 ··端子 3 10 a :有效端子Wh · 夂 * ,, 〇 · 1 · The connection of the pseudo-contacts on the bendable printed circuit Lihe area and the pseudo-terminals on the bendable printed circuit of the liquid crystal panel of the present invention can effectively prevent external force The electrical connection between the other effective contacts and the effective terminals is broken. Although the present invention has been disclosed in the preferred embodiment as above, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and decorations without departing from the spirit and scope of the present invention. The guarantee 1254943 07836twfl.doc / 006 94.8.18 The scope shall be determined by the scope of the attached patent application. [Brief description of the drawings] FIG. 1 is a schematic diagram showing the electrical connection between a bendable printed circuit and a patterned circuit on a conventional LCD panel bendable printed circuit bonding area; and FIG. 2 is shown as Figure 3 shows a connection between a liquid crystal panel, a driving chip and a foldable printed circuit according to a preferred embodiment of the present invention; FIG. 3 shows a bendable type of a liquid crystal panel according to a preferred embodiment of the present invention Schematic diagram of the electrical connection between the bendable printed circuit and the patterned circuit in the printed circuit bonding area. [Description of main component symbols] 100, 300: LCD panel 102, 302: Patterned circuit 104, 304: Bendable printed circuit bonding area 106: Contact (located on the LCD panel) 108, 308: Bendable Printed circuit 110: terminal (located on a bendable printed circuit) 200 · LCD panel 202: first array substrate 203: spacer 204: second array substrate 206: liquid crystal layer 208: display area 1245943 07836twfl.doc / 006 94 8.18 210: Non-display area 212: Driver chip 306: Contact 306a: Effective contact 306b: Intended contact 310 Terminal 3 10a: Effective terminal
310b :擬端子 312 ··第一區塊 314 :第二區塊 316 :異方性導電膜（ACF)310b: pseudo terminal 312 ·· first block 314: second block 316: anisotropic conductive film (ACF)
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