1245358 九、發明說明： 【發明所屬之技術領域】 ^本發明係關於一種半導體構裝設備，尤指一種應用於 半導體構破製程中，晶片與導線架或軟式電路板等載體進 圩打線接口日可，提供黏著晶片之載體承載、吸附固定及導 熱用途之表面多孔性金屬熱板設計。 【先前技術】 在半導體元件的構裝製程中，當晶片黏著於如底面貼 附有耐熱膠片的金屬導線架或是軟式電路板等載體之後， 即需透過打線機對晶片上接點與該載體内引腳以金屬線打 線接口之步驟，當該打線機進行打線接合步驟，為使金 線順利接著於該載體内引腳及晶片，該打線機於其機台上 4對於加熱裝置上方均設有熱板，作為黏著有晶片之载體 之承載、吸附固定及導熱用途。 月j白知應用於打線機的熱板概有兩種，其中··第一 種熱板為多鑽孔式的金屬 板 U如弟五圖所不，該金屬熱 主要係於—金屬板塊上預定的區間依待構裝載 :亡的承載塾（PAD)的位置及數量鑽設適當大小… 抽氣孑L f 9 Ί 、 m —工 处 以連接真空抽氣設備，使其可藉由誃1245358 IX. Description of the invention: [Technical field to which the invention belongs] ^ The present invention relates to a semiconductor fabrication equipment, and more particularly to a semiconductor fabrication process in which a chip is connected to a carrier such as a lead frame or a flexible circuit board. Yes, it provides a surface porous metal hot plate design for carrier support, adsorption and fixation, and heat conduction of adhesive wafers. [Previous technology] In the process of constructing a semiconductor device, after the chip is adhered to a carrier such as a metal lead frame with a heat-resistant film attached on the bottom surface or a flexible circuit board, the chip contacts and the carrier need to be connected through a wire bonding machine. The step of connecting the inner pin to the wire with a metal wire. When the wire bonding machine performs the wire bonding step, in order for the gold wire to continue to the pins and the chip in the carrier, the wire bonding machine is set on the machine 4 above the heating device. There is a hot plate, which is used for carrying, adsorption and heat conduction of the carrier with the wafer attached. There are two types of hot plates applied to wire drawing machines. The first type of hot plate is a multi-drilled metal plate. As shown in Figure 5, the metal heat is mainly on the metal plate. The predetermined interval depends on the structure to be loaded: the location and quantity of the dead load (PAD) are drilled to an appropriate size ... Extraction 孑 L f 9 、, m — the work station is connected to the vacuum extraction equipment, so that it can be used by 誃
真工抽牵j 广q 1 、 VA 打複〃 为別吸住導線架上的各承載墊，以期 丁線I程步驟之順利進行。 惟前多鑽孔式金屬埶拓# 萤髀+ 屬熱板之6又计，因需於板體上各對庫 =承載塾位置處分別鑽孔’故當如導線架、軟式電二 類的载體承載塾分佈越密集時，該金屬熱板的加工相 1245358 對困難’成本相對提高，也使得該多鑽孔式金屬熱板無法 適用该載體之承載墊小及數量多的半導體元件產品。 第二種具透氣性陶瓷的金屬熱板，如第六圖所示，其 主要係於一金屬熱板（3 0 )上設一預定尺寸及深度的開 槽（3 1 )，於開槽（3丄）底部設有真空抽氣孔（圖未 不），再於該開槽（3 1 )中鑲嵌一片透氣性陶瓷片（3 2)，該透氣性陶竞片（3 2)係、一片體中具有複數上下 貫通狀微孔的片體，又該透氣性陶瓷“ 3 2 )之底部並 使用耐熱膠結合於金屬熱板（3 〇 )上，使該透氣性陶：是 片（3 2 )與金屬熱板（3 〇 )、结合一體，藉此，使該金 屬熱板（3 0 )裝設於打線機機台上，可透過該透氣性陶 竟片（3 2 ) |面上的複數微孔吸附該載體的各承載塾， 以期打線製程步驟之順利進行。 前述第二種鑲嵌透氣性陶究片的金屬熱板，因需在全 屬熱板中鑲嵌透氣性陶_泛片，其材料成本高，且金屬執板 與透氣性陶u為異質材料，彼此熱漲冷縮的比例不等， :易造成加熱使用時陶究與金屬間隙太大或太小之製造技 術問題，且黏著於金屬埶 …、板〃陶瓷片間的膠體具有收縮性 面^製造過程中需經：次加卫，方能達到表面之預定平 二度了其製造困難、損壞率高，侧竟片的 f差，易造成生產時溫度異常，造成產品品；不 =二Γ多僅限應用於多鑽孔式的金屬熱板無法使用 之小承載塾的導線架或軟性電路板等载體。再者， 1245358 性陶瓷片上可透 ’造成該熱板應 穩定0 氣的微孔不易均勻控制在勻稱分佈狀態下 用於打線機後可提供的真空吸附效果不甚 【發明内容】 本發明之主要目的在於提供一種表面多孔性的金屬熱 反’用以克服習用各式熱板之成本高、傳熱效果差、吸附 效果不佳等多項缺點。 為達成前揭目的，本發明所提出技術方案主要係該金 熱板上定義出對應於構裝元件面積之單元承載區間，於 單元承載㈣周邊形成減溝槽，並自減溝槽底部設延 伸至熱板底部的抽氣孔，且該單元承載區間上表面形成預 定凹凸面的多孔性表面。 前述的多孔性表面可進一步利用染黑或喷砂手段形成 低反光表面，降低該多孔性表面的反光性。 本發明以其技術方案設計至少可達成以下諸多功效： 1、加工製造容易、成本低：本發明是直接於一金屬 板塊上表面利用表面放電加工技術手段即可輕易地成形出 該凹凸面的多孔性表面，另於板塊上鑽設數個抽氣孔即可 ，使其在加工製造具有簡便性，且可降低製造成本。 2吸附放果佳.本發明金屬熱板之多孔性表面的品 質因可透過放電加工等技術控制於均一的狀態下，使其凹 凸緣分佈勻稱，達到穩定的產品品質，進而於進行真空吸 附作用時，可提供標準值以上的良好吸附效果。 1245358 3、 適用性廣：本發明金屬熱板之設計，不受導線架 承載塾的數里及为佈位置之限制，使其可適用如·· Fpc、 QFN、DFN或LFCSP Series等各式產品，具有較佳的適用 性。 4、 不易損壞：本發明之金屬熱板是採用全金屬板塊 為主體’在正常使用狀態下，可長期使用不易損壞。 【實施方式】 依據如揭技術方案的創意，本發明表面多孔性的金屬 熱板（1 0 )的具體實施例，請配合參閱第一圖所示，其 主要係一金屬材料製造成預定尺寸的金屬板體，該金屬熱 板（10)主要係於其定義的單元承載區間（1 1)上表 面形成預定粗糙度的多孔性表面（丄2 )，該多孔性表面 (1 2 )可利用表面放電加工之技術手段來完成，藉以利 用该凹凸面的多孔性表面（丄2 )中均佈相互連通的凹緣 供作真空抽氣通道之用，又該金屬熱板（丄〇)上表面於 該單兀承載區間（1丄）周邊設有環狀的抽氣溝槽（丄3 )，與多孔性表面（1 2 )周邊的凹緣相連通，該熱板（ 1 0 )於單元承載區間（i丄）相對於抽氣溝槽（丄3 ) 外圍的上表面予以加工磨平成平坦面，另該抽氣溝槽（1 3 )底部複數鑽設延伸至金屬熱板（丄〇 )底部的抽氣孔 (14)。 前述中，該多孔性表面（1 2 )尚可進一步利用染黑 或噴砂手段加工成抗反光表面，用以降低該多孔性表面（ 1245358 1 2 )的反光性。 。引述中，邊金屬熱板（i 〇 )之單元承載區間（1 1 )可為方形或其幾何形狀，於本實施例中，該單元承載區 一、 為方形，該抽氣溝槽（1 3 )則為環繞於該單 一载區間（1 1 )的方形環狀溝槽，如第二、三圖所示 ’该抽氣（1 4 )可為設於該方形抽氣溝槽（丄3 )相 對應兩側槽段的複數縱向盲孔段（14 1)，銜接設於熱 板（1 〇 )橫向閉孔段（工4 2 )以及通往熱板（丄〇 ) -的導通奴（1 4 3 )之組合所構成，使該金屬熱板（ 1 〇 )可以抽氣孔（丄4 )的底部的導通段（丄4 3 )供 作連接真空抽氣設備之用。 本’X明之金屬熱板（；[〇 )於使用時，可應用於底面 W貼有耐熱膠片的金屬導線架或軟性電路板等載體產品於 黏著晶片後，進行打線接合之構裝步驟中，該金屬熱板（ 1 0)主要係裝設半導體構裝設備的打線機台，相對於打 線機台之加熱裝置上方處，3自真空抽氣設備接設導管連 接該金屬熱板（1 〇)底面的抽氣孔（工4)導通段（工 43)，藉此，當黏著晶片之載體（4〇)被輸送至該打 線機的金屬熱板（10)上，其中藉由熱板（10)上表 面之利用染黑或噴砂加工成之抗反光表面，避免對打線機 台上的視覺檢視系統產生干擾，使該載體（4 〇 )黏著晶 :的承載墊可確實定位，之後，冑空抽氣設備受控進行二 氣作用’ <吏该載體（4 0 )之承載墊預定打線區段位於多 1245358 孔性表面（1 2 )處被吸附成平貼固定狀能，# 溝槽（1 3 )外圍區的平坦面，增加载體（$ 〇藉由抽氣 墊放置於熱板（1 Q ) ±之乳密性，使該 被 吸附平貼於熱板（10)上定位，另藉熱*(1二： 方加熱裝置產生的熱傳導至載體爲计 甘+ ;及其上的晶片， 其中因該熱板（1Q)為全金心’而具有良好的献傳導 效果，且可使熱均勻分佈，之後，打 恢炙棧械臂即對晶 上之α接點逐一以金屬線與導線架上相對應之接 打線接合之步驟。 經由前述說明後當可瞭解，本發明之特點主要在於： 該金屬熱板係直接於一金屬板材上表面利用表面放電加工 技術手段輕易地成形出多孔性表φ，配合周邊通往直空抽 氣設備抽氣溝槽之設計，供作半導體元件打線接合時之載 體及導熱用途外…該多孔性表面的品質可以被控制在 均一的狀態下，使其產品品f穩定，1進行真空吸附作用 時可提供標準值以上的良好吸附效果，又該金屬熱板可適 用於各型式以底面貼附有耐熱膠片之導線架或軟性電路板 等為載體之半導體元件，同肖，該金屬熱板是採取全金屬 板塊’在正常使用下不會損壞，且具有良好的熱傳導效果 。再配合參看附件—所示，由該附件—提供的比較表中當 可α邊看出，本發明相較於該二習用熱板，無論是製造成 本或吸附效果、...等方面確具顯著功效增進。 綜上所述，本發明以其創新的金屬熱板構造設計，確 10 1245358 可提供一項優於習用鑽孔式金屬熱板及鑲嵌透氣性陶究片 的金屬熱板之實用設計，故此，本發明深具產業利用價值 ’並符合發明專利要件，爰依法具文提出申請。 【圖式簡單說明】 第一圖係本發明金屬熱板實施例的立體示意圖。 第二圖係本發明金屬熱板實施例的側視剖面示意圖。 第二圖係本發明金屬熱板實施例的俯視平面示意圖。 第四圖係本發明金屬熱板實施例的使用狀態參考圖。 第五圖係習用鑽孔式金屬熱板的立體示意圖。 第六圖係習用鑲嵌透氣性陶瓷片的複合熱板立體示意 圖。 【主要元件符號說明】 (1 1 )單元承載區間 (1 3 )抽氣溝槽 (141)盲孔段 (143)導通段 (21)真空抽氣 (3 1 )開槽 (1 〇)金屬熱板 (1 2 )多孔性表面 (14)抽氣孔 (1 4 2 )閉孔段 (2 0 )金屬熱板 (30)金屬熱板 (3 2 )透氣性陶竟片 (4 0 )載體 附件： -、本發明表面多孔性金屬熱板與習用多鑽孔式金屬 熱板、具透氣性陶瓷片的金屬熱板比較表。 πThe real work is to pull j guang q 1 and VA to make sure that the load-bearing pads on the lead frame are not sucked. However, the former multi-drilled metal 埶 extension # 髀 髀 + is a 6th of the hot plate, because it is necessary to drill holes at the position of each pair of libraries on the board = bearing 'position, so it should be a lead frame, soft electric The denser the distribution of carrier carriers, the higher the cost of the processing phase of the metal hot plate 1245358, which also makes the multi-drilled metal hot plate unsuitable for semiconductor device products with small carrier pads and a large number of carriers. The second type of metal hot plate with air-permeable ceramics, as shown in the sixth figure, is mainly provided with a slot (3 1) of a predetermined size and depth on a metal hot plate (30). 3 丄) A vacuum exhaust hole (not shown in the figure) is provided at the bottom, and a piece of breathable ceramic sheet (3 2) is inlaid in the slot (3 1). The breathable ceramic sheet (3 2) is a piece of body A sheet body having a plurality of through-holes in the top and bottom, and a bottom of the air-permeable ceramic "3 2" is bonded to a metal hot plate (30) with a heat-resistant glue, so that the air-permeable ceramic is a sheet (3 2) It is integrated with the metal hot plate (30), whereby the metal hot plate (30) is installed on the wire drawing machine platform, and the air-permeable ceramic sheet (3 2) can pass through the plural Microporous adsorption of each carrier of the carrier, with a view to the smooth progress of the wire drawing process. The aforementioned second type of metal hot plate inlaid with a breathable ceramic tile needs to be inlaid with a breathable ceramic plate in the hot plate. The material cost is high, and the metal anchor plate and the air-permeable ceramic material u are heterogeneous materials, and the ratios of the thermal expansion and contraction of each other are different. It is easy to cause heating. The manufacturing technical problems of too much or too little gap between ceramics and metal, and the colloids stuck to the metal slabs, slabs, and ceramics have a shrinkable surface. ^ In the manufacturing process, it is necessary to pass through the second guard to achieve the surface predetermined It is flat, which makes it difficult to manufacture, has a high damage rate, and the f of the side plate is poor, which is likely to cause abnormal temperature during production and cause product failure; not equal to Γ, which is limited to multi-drilled metal hot plates that cannot be used. Small carriers that carry maggots or carriers such as flexible circuit boards. In addition, the 1245358 ceramic sheet can be transparent, causing the hot plate to be stable. The micropores of the gas are not easy to control uniformly in a uniformly distributed state. It can be provided after being used on a wire cutter. The vacuum adsorption effect is not very good [Content of the invention] The main purpose of the present invention is to provide a surface porous metal thermal reaction to overcome the shortcomings of conventional hot plates, such as high cost, poor heat transfer effect, poor adsorption effect, etc. In order to achieve the purpose of the previous disclosure, the technical solution proposed in the present invention mainly defines a unit bearing section corresponding to the area of the structural element on the gold hot plate, and forms a reduction groove around the unit bearing㈣, A suction hole extending from the bottom of the reduction groove to the bottom of the hot plate is formed, and the upper surface of the unit bearing section forms a porous surface with a predetermined concave and convex surface. The aforementioned porous surface can be further formed into a low-reflective surface by blackening or sandblasting. Reduce the reflectivity of the porous surface. The present invention can achieve at least the following effects with its technical solution design: 1. Easy processing and low cost: The present invention uses surface discharge processing technology directly on the upper surface of a metal plate. The porous surface of the uneven surface can be easily formed, and several suction holes can be drilled in the plate, which makes it simple and convenient in processing and manufacturing and can reduce manufacturing costs. 2Good adsorption and fruit release. The metal of the present invention The quality of the porous surface of the hot plate can be controlled in a uniform state through techniques such as electrical discharge machining, so that its concave flanges are evenly distributed to achieve stable product quality. In addition, it can provide good quality above the standard value when performing vacuum adsorption. Adsorption effect. 1245358 3. Wide applicability: The design of the metal hot plate of the present invention is not limited by the number of miles carried by the lead frame and the position of the cloth, making it applicable to various products such as Fpc, QFN, DFN or LFCSP Series , Has better applicability. 4. Not easy to damage: The metal hot plate of the present invention uses an all-metal plate as the main body. Under normal use conditions, it can not be easily damaged for a long time. [Embodiment] According to the creative idea of the technical solution of the disclosure, a specific embodiment of the surface porous metal hot plate (1 0) of the present invention, please refer to the first figure, which is mainly a metal material manufactured into a predetermined size. A metal plate body, the metal hot plate (10) is mainly formed on the upper surface of its defined unit bearing section (1 1) to form a porous surface (丄 2) with a predetermined roughness, and the porous surface (1 2) can use the surface The technical means of electrical discharge machining is used, whereby the interconnected concave edges are uniformly distributed in the porous surface (丄 2) of the uneven surface for use as a vacuum extraction channel, and the upper surface of the metal hot plate (丄 〇) is A ring-shaped suction groove (丄 3) is provided around the unit load-bearing section (1 丄), which communicates with the concave edge around the porous surface (1 2), and the hot plate (1 0) is located in the unit load-bearing zone. (I 丄) The upper surface of the periphery of the suction groove (丄 3) is machined and flattened to a flat surface, and the bottom of the suction groove (1 3) is drilled to extend to the bottom of the metal hot plate (丄 〇). Suction hole (14). In the foregoing, the porous surface (1 2) can be further processed into an anti-reflective surface by blackening or sandblasting to reduce the light reflectivity of the porous surface (1245358 1 2). . In the quote, the unit bearing section (1 1) of the edge metal hot plate (i 〇) may be square or its geometric shape. In this embodiment, the unit bearing zone 1 is square, and the exhaust groove (1 3 ) Is a square ring-shaped groove surrounding the single load interval (1 1), as shown in the second and third figures. 'The suction (1 4) may be provided in the square suction groove (丄 3) A plurality of longitudinal blind hole sections (14 1) corresponding to the groove sections on both sides are connected to the horizontal closed hole section (work 4 2) provided on the hot plate (10) and the conduction slave (1) to the hot plate (丄 〇)- 4 3), so that the metal hot plate (10) can be used for connecting the vacuum conduction device (的 4 3) at the bottom of the exhaust hole (丄 4). The 'X Ming metal hot plate (; [〇), when used, can be applied to a carrier product such as a metal lead frame or a flexible circuit board with a heat-resistant film affixed on the bottom surface W after being bonded to the wafer, and a wire bonding process, The metal hot plate (10) is mainly a wire drawing machine equipped with a semiconductor structure. Relative to the heating device of the wire drawing machine, a 3-pipe vacuum pumping device is connected to the metal hot plate (1 0). The suction hole (work 4) on the bottom of the conduction section (work 43), whereby the carrier (40) to which the wafer is adhered is transferred to the metal hot plate (10) of the wire drawing machine, and the hot plate (10) The anti-reflective surface of the upper surface is processed by blackening or sandblasting to avoid interference with the visual inspection system on the wire drawing machine, so that the carrier (40) can adhere to the crystal: the bearing pad can be accurately positioned, and then emptied. The gas equipment is controlled to perform the two-gas effect. ≪ The carrier wire (4 0) of the carrier pad is intended to be wired at 1245358 porous surface (1 2) and is adsorbed into a flat fixed energy, # groove (1 3 ) The flat surface of the peripheral area, increase the carrier ($ 〇 The pad is placed on the hot plate (1 Q) ± for its milk tightness, so that the adsorbed flat is positioned on the hot plate (10), and the heat is also used to heat the heat generated by the square heating device to the carrier: And the wafer thereon, in which the hot plate (1Q) is an all-golden heart, and has a good donating effect, and can evenly distribute the heat, and then restore the stacking arm to the α connection on the crystal Step by step, the metal wire and the corresponding wire bonding step on the lead frame will be understood through the foregoing description, the characteristics of the present invention mainly include: The metal hot plate is directly on the upper surface of a metal plate using surface discharge processing technology The method can easily form a porous table φ, and cooperate with the design of the exhaust groove of the peripheral to the direct air extraction equipment, and it is used as a carrier and heat conduction for semiconductor components when wire bonding. The quality of the porous surface can be controlled at In a uniform state, its product f is stable. 1 It can provide a good adsorption effect above the standard value when vacuum adsorption is performed. The metal hot plate can be applied to various types of lead frames with soft heat-resistant film attached to the bottom surface or flexible The circuit board is a semiconductor component that is a carrier. As with Xiao, the metal hot plate is an all-metal plate that will not be damaged under normal use and has a good heat conduction effect. For cooperation, see the attachment—shown by this attachment— It can be seen from the comparison table provided that, compared with the two conventional hot plates, the present invention does have a significant improvement in efficiency in terms of manufacturing cost or adsorption effect, etc. In summary, the present invention is based on Its innovative metal hot plate structure design does indeed provide a practical design that is superior to the conventional drilled metal hot plate and the metal hot plate inlaid with breathable ceramic tiles. Therefore, the invention has deep industrial application value. It complies with the requirements of the invention patent, and filed an application according to the law. [Brief Description of the Drawings] The first drawing is a schematic perspective view of an embodiment of the metal hot plate of the present invention. The second figure is a schematic side sectional view of an embodiment of a metal hot plate of the present invention. The second figure is a schematic top plan view of an embodiment of a metal hot plate of the present invention. The fourth diagram is a reference diagram of the use state of the metal hot plate embodiment of the present invention. The fifth figure is a perspective view of a conventional drilled metal hot plate. The sixth diagram is a perspective view of a conventional composite hot plate inlaid with a breathable ceramic sheet. [Description of Symbols of Main Components] (1 1) Unit loading section (1 3) Extraction groove (141) Blind hole section (143) Conduction section (21) Vacuum extraction (3 1) Slotted (10) Metal heat Plate (1 2) Porous surface (14) Suction holes (1 4 2) Closed-cell section (2 0) Metal hot plate (30) Metal hot plate (3 2) Breathable ceramic sheet (40) Carrier accessories: -A comparison table of the surface porous metal hot plate of the present invention with a conventional multi-drilled metal hot plate and a metal hot plate with a breathable ceramic sheet. π