TWI243735B - Method of polishing a substrate, polishing pad with window for the method and the manufacturing method thereof - Google Patents

Abstract

Polishing pads with a window, systems containing such polishing pads, and processes that use such polishing pads are disclosed. For example, a light beam (34) having a wavelength between about 300 and 500 run may be directed through a transparent portion (44) of a polishing surface of a polishing pad (18) during polishing in one of a shallow trench isolation (STI) fabrication process, a spin-on glass fabrication process and a silicon-on-insulator (SOI) fabrication process. As another example, the polishing pad may include a backing layer (116), a polishing layer (120), a solid window (140), and layers of first and second different adhesive materials (150, 160) between the backing layer and the solid window.

Description

1243735 发明 Description of the invention [Technical field to which the invention belongs] The present invention generally relates to a polishing pad having a window, a system including the polishing pad, and a process using the polishing pad. [Previous technology] The process of modern integrated circuit (1C) usually involves forming different material layers and structures on the previously formed layers and structures. However, the underlying features can leave extremely irregularities on the top surface of a substrate being processed, such as ridges, uneven height areas, grooves, ditches, and / or other surface irregularities. These irregularities can cause problems in lithography imaging techniques. Therefore, it is necessary to perform a certain substrate flattening treatment. One method to achieve planarization or topology removal of semiconductor substrates is a chemical mechanical polishing (CMP) process. A conventional chemical mechanical polishing (CMP) process involves treating a substrate with a rotating polishing pad in the presence of a slurry, such as a polishing slurry. In general, it is necessary to detect whether the desired surface flatness or layer thickness has been reached and / or whether the underlying layer has been exposed to determine whether to stop grinding. Several techniques have been developed to detect termination points at the grinding site during the CMP process. For example, an optical monitoring system is used to measure the uniformity of a layer on a substrate in situ during the grinding of the layer. The optical monitoring system may include a light source that directs a light beam to the substrate during grinding, a detector that measures light reflected from the substrate, and a computer that analyzes signals from the detector and calculates Whether the termination point has been reached. In some 3 1243735 CMP systems, the beam is directed to the substrate through a window on the polishing pad. -A mud layer is typically present between the substrate and the upper surface of the window. [Summary of the Invention] In one aspect of the invention, the invention relates to a method for grinding a substrate. In this method, a polished surface with a transparent portion is brought into contact with a substrate that is in a shallow trench isolation (STI) process, a spin-on-glass process, and a mineral (s) on an insulator. 〇1) Grinding is required during one process of the manufacturing process. Relative movement between the abrasive surface and the substrate is caused. A light beam with a wavelength between 300 and 500 nm is guided through the transparent portion of the abrasive surface, and the light beam from the substrate Reflections are detected to determine the end point of a grinding. Embodiments of the invention may include one or more of the following features. The beam mainly contains blue light, such as blue (purple blue) light. The beam may have a wavelength of about 400 nm, such as between 400 and 415 nm, such as a wavelength of 405 nm. Alternatively, the beam may have a wavelength of about 47 Onm. The substrate may have an outermost oxide layer having a thickness of about 2,000 angstroms (person). The polishing process may be one of a shallow trench isolation (STI) process, a spin-on-glass process, and a silicon-on-insulator (S01) process. In another aspect, the present invention relates to a polishing pad having a backing layer with an opening, a polishing layer having an opening aligned with the opening on the backing layer, and a solid made of a first material The window is located in the opening of the abrasive layer, a first adhesive substance 4 1243735 layer between the backing layer and the solid window, and a second adhesive layer between the backing layer and the solid window. The second adhesive substance is different from the first adhesive substance. Embodiments of the invention may include one or more of the following features. A first adhesive substance layer is interposed between the first adhesive substance layer and the second adhesive substance layer. The first adhesive substance includes a polymer, such as an acrylate polymer, a cyanoacrylate polymer, a polyolefin polymer, or a fluorinated polymer. The first adhesive substance may be a double-coated film tape. The first adhesive substance layer and the second adhesive substance layer may be adjacent to each other, the first adhesive substance may be an acrylate polymer, and the second adhesive substance layer may be a primer of a first substance. A part of the backing layer may extend under the opening of the abrasive layer, and the first adhesive substance layer may extend above the backing layer of the part. The first adhesive substance layer includes a polyolefin polymer and the second adhesive substance layer may include an acrylate polymer. In another aspect, the invention relates to a method of constructing a polishing pad. The first and second adhesive substance layers having substantially the same range are inserted into an opening on a polishing pad, and a window of a solid substance is attached to a surface of the first adhesive substance layer. In another aspect, the invention relates to a method of constructing a polishing pad. The surface of a transparent object is improved. The improved method is selected from the group consisting of corona discharge treatment, flame treatment and fluorine gas treatment. The object is fixed in an opening on a grinding layer. The grinding layer Has a ground surface. In another aspect, the invention relates to a method for grinding a substrate. The method includes bringing a ground surface with a transparent portion into contact with a high-quality work layer, and the substrate and the substrate 5 1243735 cause a relative movement between the ground surface and the substrate, a wavelength A light beam between 300 and 500 nm is guided through the transparent portion of the abrasive surface, and the light beam reflected from the substrate is detected to determine a research termination point. In another aspect, the present invention relates to a polishing pad having a polishing layer having a polishing surface and a core window of a substance in the polishing layer. The substance has a surface energy of about 40 mJ / m2 or less. In another aspect, the present invention relates to a polishing pad having a backing layer with an opening, a polishing layer having an opening aligned with the opening in the backing layer, and one bit in the polishing layer. A solid window of the first object in the opening and an adhesive layer between the backing layer and the window. The adhesive substance includes a substance selected from the group consisting of a polyfluorene hydrocarbon polymer and a propylene polymer. In another aspect, the invention relates to a mouth for use on a polishing pad. The window has a transparent solid object having a surface, a first material layer having first and second surfaces, a surface of the first adhesive material layer being disposed to abut the surface of the object, and a first The two adhesive layers have a surface, and the surface of the second adhesive substance layer is arranged such that the second surface of the first adhesive substance layer abuts. The second adhesive substance is the same as the first adhesive substance. In some embodiments, the window polishing pad structures used in these methods exhibit one or more of the following characteristics: good transmittance of energy at specific wavelengths; negligible diffusion; and Scratch and / or abrasion between treatments is very resistant; it has a good flowability of the abrasive high-quality acid window adhesives and non-periodical bodies 6 1243735 (such as mud or water) leak-proof; and / Or has a relatively low refractive index. The CMP system including the window grinding structure can exhibit one or more of the following desirable characteristics: the upper surface of the window is reduced due to scratches and irregular beam scattering and reflection; the window and mud The reflection of the beam at the interface will be reduced; the signal to noise ratio in the signal from the detector can be improved; the leakage of mud around the window will be reduced.

In some embodiments, even if the window is made of a low surface energy substance (e.g., low adhesion to many other substances), at least two of these characteristics (e.g., all characteristics) will still be exhibited . This occurs when the substance making the window has a relatively low surface energy (e.g., polytetrafluoroacetamidine) and when the window substance is in the blue range of the visible spectrum (e.g., from about 400 nm to about 4500 nm, like (About 400 nm to about 4100 nm) is particularly advantageous when it has good transmission properties, and this wavelength range is preferred when a blue laser or a blue LED is used as the light source. The features, objects and advantages of the present invention can be seen from the following description, drawings and patent application scope.

[Embodiment] As shown in FIG. 1, a CMP apparatus 10 includes a polishing head 12 for holding a semiconductor substrate 14 against a polishing pad 18 on a platform 16. The CMP equipment was disclosed in U.S. Patent Nos. 5,73 8,574 and 6,247,998 and U.S. Patent Application No. 10/35 8,852 filed on February 4, 2003 under the name `` Substrate Monitoring During Chemical Mechanical Polishing '' The contents of these patent cases are incorporated herein by reference with reference to 1243735. The polishing pad 18 may be a two-layer pad having a backing layer 20 and a cover layer 22 which border the platform 16. There is an abrasive surface in contact with the substrate. For example, the cover layer 22 may be a durable rough layer (eg, Rodel IC-1000), and the backing layer may be a more compressible layer (eg, Rodel Suba-IV). However, some mules have only one coverage

Layer without backing layer. Alternatively, the abrasive pad may be a fixed abrasive pad in which abrasive particles are held in a receiving medium. Typically, the polishing pad material is wetted with a chemical polishing solution or slurry with a chemical reagent, and a "standard" polishing pad is used to grind the particles. However, some grinding processes are "non-grinding."

A hole 30 is formed on the top surface of the platform 16 and is aligned with a window 26 formed on the polishing pad 18. The window may be a solid transparent insert 44 which is fixed to the cover layer 22. A hole 46 may be formed through the backing layer 20 and aligned with the window 36. Further, at least a part of the hole 36 may be filled with a transparent solid member 31, such as a quartz block. The hole 30 and the window 36 are arranged so that they can see the substrate 14 held by the grinding head 12 during the rotation of the platform regardless of the moving position of the grinding head 12. An optical surveillance system is fixed under the top surface of the platform 16, and the optical surveillance system includes a light source 3 2 (eg, a laser, such as a red laser, a blue laser, or an infrared laser, Or a light emitting diode, such as a red light emitting diode, a blue light emitting diode, or an infrared light emitting diode) and a detector 42 (eg, an optical detector). For example, the 8 1243735

The optical surveillance system can be located in a recess 17 on the platform 16 and can rotate with the platform. Alternatively, the optical surveillance system may be a stationary system located under the platform. The light source 32 transmits a light beam 34 through the hole 30 and the window 36 on the polishing pad 18 to strike the surface of the substrate (eg, a semiconductor substrate) at least while the window 36 is adjacent to the substrate 14. . The light reflected from the substrate forms a resulting beam 60 which is detected by the detector 42. An unillustrated computer receives the measured light intensity from the detector 42 and uses it to determine the end point of the grinding, such as by detecting a sudden change in the reflectivity of a substrate exposed on a new layer , By using the interferometer principle to calculate the thickness removed from the outer layer (for example, a transparent oxide layer), or by monitoring the signal of a predetermined end condition. The slurry applied to the polishing pad 18 during the grinding operation may form a layer 38 between the substrate 14 and the polishing pad 18. However, the interface between the window 36 and the polishing pad 18 is sealed so that the mud 38 does not leak out to the platform 16.

The window 36 should have at least some of the following characteristics: chemical resistance to mud or other substances used in the grinding process; good optical clarity (eg, at least 25% light transmission in the wavelength range of the beam ); A low refractive index (such as less than 1.48); the refractive index is about the same as the refractive index of the mud; no diffusion; and directivity such as optics. The window can be a polymer material such as polyurethane or fluoropolymer. A low refractive index and high optical clarity, about the same as the refractive index of the mud, can reduce reflections from the air / window / water interface and improve the transmittance of light back and forth through the window, thereby improving the signal-to-noise ratio. Optics 9 1243735 The sharpness should be high enough to provide at least about 25% (eg, at least about 50 ° / 〇, at least about 80%, at least about 90%, at least about 95%) of the beam used by the detector Light transmission in the wavelength range. Typical wavelength ranges include the visible spectrum (eg, from about 400 nm to about 800 nm), the purple light spectrum (UV) spectrum (eg, from about 300 nm to about 400 nm), and / or the infrared spectrum (eg From 800 nm to about 1550 nm). In some embodiments, the wavelength range may be within a specific portion of the visible spectrum, such as the blue portion of visible light (eg, from about 400 nm to about 470 nm, from about 400 nm to about 415 nm, from about 400 nm to about 4 1 0 nm, approximately 40 5 nm, or higher than 47 nm). In a certain embodiment of jt b, for the substance, the low wavelength range (eg, less than about 4 15 nm) near blue light and UV light has high light transmittance (eg, at least about 80%, at least about 80%). 90%, at least about 95%) is desired. These low wavelengths are useful when performing optical measurements during "shallow trench insulation" using fixed grinding (FA) or highly selective mud (HSS). Use can produce wavelengths between 400-4 1 5nm The light source of the light beam is advantageous in sti grinding. A STI device has an oxide layer (from the outermost layer) with a thickness of about 1000-2000 angstroms, a nitride layer of 9 to 1 Å (about 200) Angstrom), and the final silicon. During the STI polishing process, the outermost oxide layer is removed from the active area, and the disorder layer is stopped. It is best to remove nitride less than 200 Angstroms. There should be no Any thin oxide layer is removed. Because the nitride layer and the oxide layer have a similar refractive index, the polishing transition period from the oxide layer to the nitride layer will not be affected by the signal from the detector. Make a sudden change.

Herein, the end point detection method in STI grinding is to grind a predetermined amount of lower edge 10 1243735 (interference fringe), and then grind an extra percentage of interference period (referred to herein as "assisted" grind) Step). This should be ground to the desired thickness. Assuming that the number of edges and the cycle percentage of the auxiliary grinding step are appropriately selected, the grinding should be stopped when only a small amount of nitride layer is removed .

However, a potential problem is that the grinding rate fluctuates slightly, even when grinding on the same substrate. If the amount of material removed in the auxiliary grinding step can be reduced, the time at an uncertain grinding rate and the thickness of the removed material can be reduced, and the grinding can be accurately stopped at the desired target thickness .

Compared with the use of a termination point detector with a wavelength in the red spectral range (eg, about 67 nm), a termination point detector with a wavelength of 400-41 5 nm has better peak-to-peak resolution (The amount of material removed between the edges of the interference). In detail, during the grinding of an oxide layer having a refractive index of 1.46, a wavelength of 400-415 nm can provide a peak-to-peak thickness AD of 1400 Angstroms, which is opposite to a peak-to-peak thickness AD of 2400 Angstroms using red light. Because the wavelength of blue (purple blue) light can generate more interference edges on the signal from the detector 42, an interference edge will be more likely to occur near the target thickness and will be removed during the auxiliary grinding step. There will be less material. In addition, since the change in thickness of the oxide layer is relatively small, the possibility of erroneous detection of the termination point is small. For the same reason, it is advantageous to use a light source capable of generating a light number of 400-415 nm for spin-on glass grinding, such as borophosphoric rotation glass (BPS G) grinding and silicon on insulator (SOI) grinding. At BPSG 11 1243735, a spin-on glass is deposited on a nitride layer, and the glass is then ground away without removing too much of the nitride portion (eg, less than 200 angstroms). In an SOI process, a first implanted and oxidized silicon wafer is bonded to a second silicon wafer, and the first silicon substrate is divided to provide a thin implanted silicon layer on On the oxide layer. The outer silicon layer is then polished to flatten the silicon surface without too much silicon itself being removed (eg, less than 50 Angstroms). Because light of blue (purple blue) wavelength can generate more interference edges on the signal from the detector 4 2, an interference edge will be more likely to occur near the target thickness, and the grinding can be stopped more accurately On the target thickness. Since the window of the present invention has a light transmittance of more than 80% in a wavelength range of 400 nm to 410 bm, a UV / blue LED can be used. In contrast, the current window typically has a light transmission of less than 20% in the wavelength range of 40 Onm to 41 Obm. If the refractive index of the window material is low enough to be close to the refraction coefficient of the mud, the reflection at the window / mud interface can be reduced. The refractive index may be less than about 1.48 (e.g., less than about 1.45, less than about 1.4, less than about 1.35, the same refractive index as water). In some embodiments, the refractive index of the window material may be within about 0.007 of the refractive index of the mud (e.g., within about 0.03, within about 0.01). In some embodiments, the refractive index of the window material is within about 5.5% of the refractive index of the mud. The use of this window pad material can increase the true signal and reduce the background signal, thereby improving the signal-to-noise ratio of the optical intensity measurement. The window material may also be an extremely optically directional polymer. 12 1243735 Most polymers are non-isotropic in nature. However, a window material that is molded under low stress may exhibit better optical and other directivity. First-order directional substances can help maintain the polarity of the interrogation beam. The window material can be more isotropic than the polyurethanes traditionally used as window materials.

A hydrophilic substance can help ensure that there is always a layer of mud or water between the substrate and the window. The presence of this layer of mud or water prevents the window / airspace / wafer interface from being created, which can cause severe signal distortion. Although polymer materials tend to be water-repellent, they can be made hydrophobic to become hydrophilic by surface treatments such as roughening or etching. For some applications, however, hydrophobic windows are useful. For example, if a ground substrate has a hydrophilic layer (Si02, Si3N4, etc.) over a hydrophobic layer (polycrystalline silicon, single crystal silicon, etc.), the substrate's tendency to repel water will follow The water-repellent layer was ground away and raised. This change can be detected by the signal strength from the detector.

The window should be hard enough not to be scratched by the substrate. A soft substance (such as a substance having a Shore A hardness) tends to bend under a load from a substrate. The substrate penetrates into the soft window and contacts the periphery of the harder abrasive pad. This can cause scratches and chipping of the window. Therefore, the window should be about the same hardness (or only slightly softer) than the material around the polishing pad. In general, hardnesses in the range of Shore hardness D40-95 (e.g., 40-80) are suitable. Window materials that can be used as windows include silicones, polyurethanes, and halogenated polymers (eg, fluoropolymers). Examples of fluoropolymers include polyvinyl chloride 13 1243735 fluoroethylene (PCTFE), polyfluoroepoxy (PFA), fluorinated ethylene propylene (FEp), polytetrafluoroethylene (PTFE), polypentadecafluorooctyl acrylic Ester (refractive index U39), polytetrafluoroethylene (refractive index 1.350), polyundecyloxyacrylic acid (refractive index 1.3 5 6), polynonafluoropentyl acrylate (refractive index 1.3 60), polyheptafluorobutyl acrylate (refractive index: 3 67), polytrifluorovinyl acetate (refractive index: 1.3 7 5). One commercially available substance with most desired properties is Calthane ND 3200 Polyurethane (Cal Polymer, Long Beach,

California). The substance is a two-part clear non-amber urinary elastomer, and has a light transmission of at least 80% at a wavelength of 3 50nm and longer (wavelength outside the visible light spectrum, such as 700nm) (for a 15 0 mil). The substance has a refractive index of about i. 48. Without being limited to any particular theory, it is generally recognized (as opposed to current polyurethane window materials) that the high light transmission of this polyurethane material is due to the use of polyurethane without internal defects. Although the polyurethanes currently used as windows have no additives, they have internal defects such as bubbles, air gaps, cracks, or micro-regions (such as different crystal structures or directions in small regions), which will make the light diffuse. Or scattering. By making the polyurethanes not have internal depressions, a high degree of optical clarity can be obtained. Another commercially available substance with most desired properties is Conoptic DM-2070 polyurethane (Cytec 01ean, 01ean, New

York). The substance has a light transmittance of at least 80% (for thick plates of 〆150 mil) at a wavelength of 350 nm and longer (wavelength outside the visible light spectrum, such as 700 nm), and Has a hardness of about 45 to 57 Shore 14 1443735 degrees D (slightly softer than "Calthane ND3200"). Examples of commercially available window materials include FEPX6301, FEP X 63 03, FEP X 63 07, PFA 6502N, PFA 65 0 5 N, PFA 6510 N and PFA 6515 N (all of which are available from Dyneon LLC, Oakdale, MN), Neoflon family of PCTFE polymers (available from Daikin America, Inc., Orangeburg, NJ Commercially available) and the Telfon family of PTFE polymers (commercially available from E.I. du Pont de Nemours and Company, Wilmington, DE). The PCTFE of the water-repellent substance is at a wavelength of 300 nm and longer (in the visible light spectrum At an external wavelength, such as 700 nm, it has a light transmittance of at least 80% (for a 32-mil thick board), a refractive index of about 1.3, and a Shore hardness D of about 75 to 80 The hardness is possible. Referring to FIG. 2, in one embodiment, An anti-reflection coating 48 is formed on the bottom surface of the window 36. This anti-reflection coating can reduce the reflection at the interface between the holes 4 6 and the insert 44 to zero, thereby strengthening the substrate from the substrate. Referring to FIG. 3 ', in another embodiment, a top surface 50 of the window 36 is slightly sunken with respect to the abrasive surface 24 of the cover layer 22. The depression is very small and relatively small with respect to the abrasive surface surrounding the radon. Less than 5 mils, such as about 丨 _2 mils. By slightly sinking from the window, the scratches and abrasion of the window surface can be reduced ', thereby improving the consistency of the optical signal throughout the life of the polishing pad. 4B, the outer edge portion 5 2 of the bottom surface 54 of the transparent insert 44 is roughened by 15 1243735 before the insert 4 4 is fixed to the polishing pad 18. The central portion 5 6 surrounded by the edge portion 5 2 It is a smooth surface. Therefore, the edge portion 52 is thicker than the center portion 56. The edge portion can be roughened by etching or mechanical grinding. By bringing the bottom surface 5 (in contact with the backing layer 20) 4 edge roughening, which can improve the window to the grinding In addition, the adhesive that adheres the window to the polishing pad can be selected to provide a strong bond between the cover 22 and the specific material of the insert 44. Figures 5 and 6 show the grinding with a window 140 In another embodiment of the pad 100, the window is made of a substance having a relatively high surface energy, such as at least about 4 2 m J / m2 (eg, at least about 4 4 m J / m2, at least about 45 mJ / m2 , At least about 46mJ / m2). The surface energy of a substance is the energy measured by ASTM D5725-99. Generally, the window 140 is made of one of the aforementioned window materials. The polishing pad 100 includes a backing layer Π0 having an upper surface 112, and a cover layer 120 having a polishing surface 122. An opening 1 1 4 on the backing layer 110 is arranged to align with an opening 1 24 on the cover layer 120 so that the protruding portion 1 1 6 of the layer 1 10 extends under a part of the opening 1 2 4. The backing layer 110 and the cover layer 120 are held together by an adhesive layer 130, which extends along the upper surface 1 12 of the backing layer 110. A window of a solid material 140 is placed in the opening 114 and held in position by the adhesive layer 160. The layer 160 is attached to the adhesive layer 150, which is then adhered to the upper surface 132 of the layer 130. Although the sidewalls of the window 140 are shown flush with the cover layer 120, in some embodiments, there is a gap between the sidewalls of the window 140 and the sidewalls of the cover layer 120. In addition, although the upper surface of thermal via 140 is shown as being flush with the abrasive surface 122 of the cover layer i2 ', in some embodiments, the upper surface may be sunk below the abrasive surface 1 2 2. Generally, the backing layer 110, the cover layer 120, and the adhesive layer 130 may be made of any material suitable for use in a CMP process. For example, the layers η〇, ι20, and 130 can be used with the corresponding layers in the commercially available polishing pads, such as IC_1 00 polishing pads or IC-1010 polishing pads (from Rodel, Phoenix, AZ) Made of the same material. In some embodiments, the backing layer 110 is made of a compressible layer, such as a Suba-IV layer (from Rodel, Phoenix, AZ). In some embodiments, the adhesive layer 130 is made of a double-coated film tape. Commercially available double-coated film tapes are commercially available from 3M (St. Paul, MN) (eg, a member of the 442 family of double-coated film tapes). The adhesive tape forming the layer 130 is also commercially available from Scapa North America (Windsor, CT). In some embodiments, the surface of a substance can be modified (e.g., by corona discharge treatment, flame treatment, and fluorine gas treatment) to increase the surface energy of the substance. In general, the surface energy of a substance with an improved surface falls within the range mentioned above. In general, the adhesive layer 150 is made of a layer that adheres well! 30 and 160. In some embodiments, the adhesive layer 50 is made of one or more polymer adhesives. Examples of polymer adhesives that can form a layer include acrylic polymers, rubber-cured acrylic polymers, and highly viscous acrylic polymers. Examples of acrylate polymers include cyanoacrylate polymers, including rubber-hardened cyanoacrylate 17 1243735 polymers and highly viscous acrylate polymers. Examples of commercially available adhesive polymers that can be made into layer 1 50 include Loctite® 401 adhesive, Loctite® 4 06 adhesive, Loctite® 410 adhesive, and Loctite® 41 1 adhesive (Loctite Corporation, Rocky Hill, CT) °

Generally, the adhesive layer 160 is made of a substance that can adhere well to the layers 140 and 150. Without wishing to be limited by theory, it is generally recognized that the use of substances having these adhesive properties to make the layer 160 can reduce the possibility that the window 140 cannot adhere to the polishing pad 100. This is particularly useful when the window 140 is made of a substance having a relatively low surface energy (e.g., when the window 140 is made of some halogenated polymer ' such as PTFE). It is generally recognized that the use of substances with these adhesive properties to make layer 1 60 can reduce the leakage of liquid (eg, mud or water) from the surface 142 of window 140 to window 140, layer 160, layer 150, and / or under layer 140. possibility. This is particularly advantageous in situations where liquid leakage can interfere with optical measurements (such as the formation of moisture under the window 14 0 ', layer 160, and / or layer 140).

In some embodiments, the adhesive layer 160 is made of one or more polymer adhesives. Examples of polymer adhesives that can be used to make layer 160 include commercially available adhesive polymers that can be used to make layer 160. Examples include Loctite® primer adhesive (available from Loctite Corporation, Rocky Hill, CT). Result), such as Loctite® 7 70 initiator adhesive, Loctite® 770 1 initiator adhesive, Loctite® 793 initiator adhesive 'Loctite® 794 initiator adhesive and Loctite® 795 1 initiator adhesive. In the embodiment, 'Layer 1 60 is made of an initiator of Layer 1 50 (eg, initiator of acrylate polymer, initiator of monocyanoacrylate polymer) 18 1243735 Although some embodiments have been Explanation, but the present invention is not limited to these embodiments. For example, when viewing the mat from above, the shape of the window 36 can be selected as desired (e.g., rectangular plug, a circular plug, an oval plug). As another example, when viewing the mat along a section (eg, the view shown in Figure 1), the shape of the window 36 can be selected as desired (eg, rectangular, tapered, partially rectangular, and partially Cone). As an additional example, in some embodiments, the window 36 is partially supported by the backing layer 20. As another example, in some embodiments, the window 140 is made of a substance having a relatively low surface energy, such as about 40 m J / m2 (eg, about 37 mJ / m2 or less, about 35mJ / m2 or less, about 33mJ / m2 or less, about 31mJ / m2 or less, about 25mJ / m2 or less, about 20mJ / m2 or less, and about 18mJ / m2). A further example is that a part of the opening 1 1 4 in the cover layer 110 can be filled with a transparent solid piece 31, such as a quartz block (eg, in the window 140). As another example, the polishing pad can be made without the layer 150. As a further example, the polishing pad can be made without the layer 160. As another example, an additional adhesive layer (e.g., made from the material of layer 130 mentioned above) may be present on the bottom side of the backing layer 110. Typically, this additional layer does not extend above the opening 114 in the layer 110. 19 1243735 An additional example is that the grinding head and semiconductor substrate can be translated during operation of the MP device. In general, the light source and light detector are arranged such that they can see the substrate during a partial rotation of the platform, regardless of the translation position of the head. As another example, the optical monitoring system in the CMP equipment can be a stationary system under the platform.

An additional example is that a polishing pad may include a cover layer without a backing layer, or a polishing pad may be a fixed polishing pad whose abrasive particles are held in a holding medium. Other embodiments are within the scope of patent applications. [Brief description of the drawings] Fig. 1 is a schematic sectional side view of a polishing station of a chemical mechanical polishing system. Figure 2 is a schematic cross-sectional side view of a polishing pad having an anti-reflective coating on the bottom surface of the window.

Fig. 3 is a schematic cross-sectional side view of a polishing pad in which the window is sunken from the polishing surface. Fig. 4A is a schematic cross-sectional side view of a window having a rough bottom surface. Fig. 4B is a schematic bottom view of a window having a rough bottom surface. Figure 5 is a schematic top view of an embodiment of a polishing pad with a window. Fig. 6 is a sectional view of the polishing pad of Fig. 5. 20 1243735 Numbers in the diagrams in the figures represent the same elements. [Simple description of component representative symbols] 10 CMP equipment 12 Polishing head 14 Semiconductor substrate 16 Platform 18 Polishing pad 20 Backing layer 22 Cover layer 30 Hole 32 Light source 3 1 Transparent solid piece 36 Window 42 Detector 44 Insertion piece 46 Hole 34 Light beam 17 Depression 60 Result beam 38 Mud layer 48 Anti-reflective coating 24 Polished surface 50 Upper surface 52 Outer edge portion 54 Bottom surface 56 Center portion 100 Polishing pad 140 Window 110 Backing layer 112 Upper surface 120 Cover layer 122 Polishing surface 124 Opening 116 Projection 130 Adhesive layer 150 Adhesive layer 132 Upper surface 160 Adhesive layer 142 Surface 21

Claims (1)

1243735 ———— 一 -—— π% September 9th (revised) of the original I No. No. Wei Jihu revised the scope of patents in July of this year and applied for the patents': ....;:.-- ..... κ A method for grinding a substrate, comprising at least: contacting a polishing surface having a transparent portion with a substrate, the substrate to be polished is included in a shallow trench isolation (STI) process 1, a spin coating glass process and an insulating layer over silicon (SOI) process to perform grinding treatment in one of the processes; the relative movement between the grinding surface and the substrate; guide a wavelength between 300 The light beam between nm and 50001111 passes through the transparent part of the grinding surface; and the reflected light beam from the substrate is detected to determine a grinding end point. 2. As described in item 1 of the scope of patent application Method, wherein the light beam is mainly composed of blue light. 3. The method as described in item 2 of the patent application scope, wherein the light beam is mainly composed of blue (purple blue) light. 4. as described in item 1 of the patent application scope. The method described above, wherein the light beam has a wavelength of about 40 nm. The method described in item 4 of the invention, wherein the wavelength is between 400 nm and 415 nm. 22 1243735 6. The method described in item 5 of the scope of patent application, wherein the 405 nm is used. The method according to item 1, wherein the wavelength is about 470 nm. 8. The method according to item 1 of the patent application range, wherein the active region has an outermost oxide layer in the region having 1000 Incoming thickness from Angstroms to 2000 Angstroms. The wavelength is about the light beam. The substrate has an intervening abrasive. 9. The method described in item 1 of the scope of patent application, wherein the method is in the shallow trench isolation (STI) process. One step 10. The method according to item i in the scope of patent application, which is a step in the process of spin coating glass. 11. The method according to item 1 in the scope of patent application, wherein the method is in the insulating layer A step in the process of overlying the silicon layer (S0I) 12. A polishing pad comprising at least: a backing layer having an opening; a polishing layer having a polishing treatment with the opening on the backing layer Handle alignment 23 1243735 A solid window made of a first material, which is located in the opening of the abrasive layer; a first adhesive substance layer between the backing layer and the solid window; and a space between the backing layer and the solid window The second adhesive substance layer between the first adhesive substance and the second adhesive substance is different from the first adhesive substance. 13. The polishing pad according to item 12 of the patent application scope further comprises a third adhesive substance layer interposed between the first adhesive substance. Between the material layer and the second adhesive material layer. 14. The polishing pad according to item 12 of the application, wherein the first adhesive substance comprises a polymer. 1 5 · The polishing pad according to item 12 of the scope of the patent application, wherein the first adhesive substance comprises a group selected from the group consisting of an acrylate polymer, a cyanoacrylate polymer, and a polyolefin polymer. The substance. 16. The polishing pad according to item 12 of the application, wherein the first adhesive substance comprises a double-coated film tape. 1 7 · The polishing pad according to item 12 in the scope of the patent application, wherein the first adhesive substance layer 12 1243735 and the second adhesive substance layer may be adjacent to each other, and the first adhesive substance layer includes an acrylate polymer, The second adhesive substance layer includes a primer of the first substance. 1 8. The polishing pad according to item 12 of the scope of the patent application, wherein a part of the backing layer can extend below the opening of the polishing layer, and the first adhesive substance layer can extend on the backing layer of the part. on. 19. The polishing pad according to item 12 of the patent application scope, wherein the first adhesive substance layer includes a polyolefin polymer and the second adhesive substance layer may include a trimethoprim polymer. 20. The polishing pad according to item 12 of the application, wherein the first substance comprises a fluorinated polymer. 2 1 · The polishing pad according to item 12 of the scope of patent application, wherein the solid window has a light transmittance of at least 80% to a blue light beam. 22. A method of constructing a polishing pad, comprising at least: inserting first and second adhesive substance layers having substantially the same range into an opening on a polishing pad; and attaching a window of a solid substance to the first Adhesive substance layer on one surface. 25 1243735 23.-A method for constructing a grinding mill, which at least comprises: improving the surface of a transparent object, the improvement method is selected from the group consisting of corona discharge treatment, flame treatment and fluorine gas treatment And; fixing the object in an opening on a grinding layer, the grinding layer having a grinding surface. 26