1241438 五、發明說明α) 【技術領域】 • 本發明係有關於一種製作導光板模仁的方法，尤其是 種以非印刷方式製造具有優異之表面特性之導光板模仁 的方法。 【先前技術】 、目則導光板之製造方法，可分為印刷方式與無印刷方 式’印刷方式是將高發射光源物質如$ %及L 〇2之印刷材 料，以印刷之方式，適當的分佈於導光板之底面，藉由印 刷材料之特〖生，使光線被導向由正視面發出，並均句的散 佈在叙光區’ &印刷方式，則是於模仁上設計圖樣，導光 板則以模仁為模具，以射屮士、 、绘 射出成形之方法，於導光板上直接 產生圖樣，並利用此圖# ’將光被導向由正視面發出，並 ΐ ΐ:散佈在發光區；由於無印刷式之製造方法，具有品 z 已成為目前主流之製造方法。 . 、+士上 法刀成一種，一種係利用蝕刻 (Etching)之方式，直接於模 田主遑麯制如士、w @ , 上p出圖樣，另一種係利 用丰方法（曝光顯影），其用於製造 圖樣（約為數十# m)之模仁；請參閱「第丄圖」到^ = 圖」，其為習知利用半導體製程製造導光板模仁6之方 法’其係在-玻璃基板1上，塗佈上光阻劑2 (如「第 圖」），利用具有特定圖樣之光罩3 ， 弟1 j ί =上形成相同圖樣之光阻圖樣後(如「第 2圖」、第3圖」）’错由蒸鍍或濺鍍方法在置表 行金屬化處理，於表面鍍上一均勻之金 /、 進 J 屬層4(如「第41241438 V. Description of the invention α) [Technical Field] • The present invention relates to a method for manufacturing a light guide plate mold, especially a method for manufacturing a light guide plate mold with excellent surface characteristics by a non-printing method. [Previous technology] The manufacturing method of the light guide plate can be divided into printing method and non-printing method. The printing method is to print high-emission light source substances such as $% and L 〇2 printing materials, and distribute them appropriately. On the bottom surface of the light guide plate, through the special characteristics of the printed material, the light is guided to be emitted from the front view, and is evenly distributed in the narrative area '& printing method, the pattern is designed on the mold core, the light guide plate The mold core is used as the mold, and the method of shooting and painting is used to directly generate a pattern on the light guide plate, and use this picture # 'to direct the light to be emitted from the front view, and ΐ ΐ: scattered in the light-emitting area ; Due to the non-printing manufacturing method, the product z has become the mainstream manufacturing method. . + + The sword is a kind of sword. One is the method of etching (Etching), which directly prints the pattern of Ru Shi, w @, on the pattern master, and the other is the Feng method (exposure development). It is used to manufacture mold cores of patterns (approximately several tens of meters); please refer to "the first figure" to "^ =", which is a conventional method for manufacturing light guide plate mold core 6 using semiconductor processes. It is based on- On the glass substrate 1, a photoresist 2 (such as "picture") is applied, and a photomask 3 having a specific pattern is used. After the photoresist pattern of the same pattern is formed on the glass substrate (such as "picture 2") ", Figure 3") 'wrong metallization on the surface by evaporation or sputtering method, plating a uniform gold /, into the metal layer 4 (such as "第 4
第6頁 1241438 五、發明說明（2) 1) ’再利用電鑄在金屬層4上沉積一層金屬底座5(如 「第5圖」），將此金屬層4與玻璃基板1與光阻劑2分 Ϊ:)形成一種表面具有圖樣的導光板模仁6(如「第6 =而，此種製法具有以下缺點··沉積金屬底座5之製 良率报低，且因其利用電鑄製程，所以金屬底座 έ不平整，需作二次加工，製程甚。 【内容】 〇糸雜 作方ί：ί主ΐ目的，在提出一種新的導光板模仁之製 合大量生產需求。^寺所而之材料較少’更能符 本發明係在一 + M i l 之Μ Μ & 食屬基板之表面上，形成一層特定圖樣 =有：金屬其層再或=鍍：方法於金屬基板之 声之展声的么®思區域上形成一層厚度不大於非金屬 '二金屬Ϊ之表面i引然後移除非金屬層，最後於金屬基板 出、上利用化㈣以形成1表面層’讓 【實施方法】 明如ί關本發明之詳細說明及技術内$，現就配合圖式說 方法請圖」，到「第10圖」，為依據本發明之 .之步驟包含時製作導光板模仁的斷面造圖，本發明 a •於一金屬基把·！ + 板1 0之表面形成一層特定圖樣之非Page 6 1241438 V. Description of the invention (2) 1) 'Re-use electroforming to deposit a metal base 5 (such as "Figure 5") on the metal layer 4, and use the metal layer 4 and the glass substrate 1 and the photoresist 2 points :) forming a light guide plate mold 6 with a pattern on the surface (such as "No. 6 =, this method has the following disadvantages. The yield of the deposited metal base 5 is low, and it uses the electroforming process. Therefore, the metal base is not flat and needs to be processed twice. The process is very complicated. [Content] 〇 作 Miscellaneous recipe ί: ΐThe main purpose is to propose a new light guide plate mold kernel system to meet mass production needs. And the less material, it is more consistent with the present invention. On the surface of a + M il M & genus substrate, a specific pattern is formed = yes: metal layer or = plating: method on the sound of metal substrate A layer with a thickness not greater than the thickness of the non-metallic 'di-metallic' surface is formed on the area of the Zhansheng®, and then the non-metallic layer is removed. Finally, the metal substrate is used on the metal substrate to form a surface layer. Method] The detailed description of the invention and the technical details are as follows: Please refer to the figure for the method ", to" Figure 10 ", according to the invention. The steps involved in making the light guide plate mold core cross-section mapping, the invention a • on a metal base handle! + Board 1 0 The surface of the
第7頁 1241438 五、發明說明（3) ---- 金屬層9 「 作而成 第7圖」），其係利用微影製程之 * ^ _於°亥金屬基板1 0 ，且無該非金屬層2 0| •非仝® 和用電錢或化學鑛製程鑛上一層厚度不 電鍍厚度的金屬層3 〇(如「第8圖」） 屬 m化予錄製程之特性，其只能在金屬之表面沉 /蜀，因此盆口 Ah 、域沉積金厲? "b在金屬基板1 〇上沒有非金屬層2 、時， ，且當其沉積之金屬厚度不大於非金屬 金屬會覆蓋在非金屬層20上；電鑛或化學鍍 解：材料種類相當的繁多且成熟，常見的有電鍍鎳 比、，、匕學錄）、無電解銅與其他金屬之鍍膜方法， 白可以適用。 、c•移除該非金屬層20(如「第9圖」），可矛 除液’清除液可將非金屬層2 〇溶解且對於金屬層 金屬基板1 0無作用即可，其可為水或蝕刻液等等 d·於該金屬基板1 〇與該金屬層3 〇之表面5 一層表面層40(如「第1 〇圖」），可利用化學鍍 形成，化學鍍的金屬材料可為無電解鎳，無電解鐵 、化學鍍係將待鍍膜之物品浸泡在化學藥品，利用置 '或乳化還原反應，將金屬鹽水溶液的金屬離子析出 |的表面，以完成鍍膜。 根據上述之步驟’即可製作出一種表面覆蓋有 層4〇且具有特定局低起伏（圖樣）之金屬基板1 Q 係利用無電解鎳之鍍膜方法所形成之表面層4 0為 方法製 I蓋之 大於該 ;由於 積金 0之區 層2 0 製程之 、無電 在此處 J用清 3 0與 〇 •形成 之方式 等等； 換反應 於製品 一表面 ，且其 1241438 五、發明說明（4) :磷合金’其表面潤滑度高且耐摩擦、耐腐蝕 為導光板模仁7 〇。 LI 1¾ j 前述步驟a的較佳實施方式， 法，於金屬基板1 〇之表面开I利用曝先顯影之方 2 0，抹夂關。 層特定圖樣之非金屬層 一光阻二：入llslj ’其先在金屬基板10上塗佈 士：：（非金屬層2 〇) ’請再參閱「第"圖」，其利 μ r ^ M M775U1之先罩50覆蓋在已塗了光阻 層(非金屬層20)之金屬基板i 〇，再照 (一般為紫外光）對光阻層（非金屬層 2 2 域加a通土 他 < 荀㉝ζ υ )未文到遮擋之區 =使受到曝光之光阻層（非金屬12 〇)硬化， ;寺定Ξ :液ΐ餘刻作用，即可在金屬基板1〇上形成 示,圖樣之光阻層（非金屬層2 〇 )，如「第7圖」所 知技大的不同在於製程上的簡化，習 .積;去除，而且必須以電鑄製程沉 田知度的金屬底座，製程日丰p q击六g 用破琏I k 表桎野間較長，而本發明並未使 言，i $ I、i日斤，、u 座因此本發明較習知而 其至J兼具郎ii材料與簡化製程之功 :定本：i所ί僅為ί發明的較佳實施例而已，並非用來限 所為=之實細耗即凡依本發明申請專利範圍之内容 斤為的等效變化與修飾’皆應為本發明之技術範·。 1241438 圖式簡單說明 【圖式簡單說明】 第1圖，係習知之方法流程圖一。 第2圖，係習知之方法流程圖二。 第3圖，係習知之方法流程圖三。 第4圖，係習知之方法流程圖四。 第5圖，係習知之方法流程圖五。 第6圖，係習知之方法流程圖六。 第7圖，係本發明之方法流程圖一。 第8圖，係本發明之方法流程圖二。 第9圖，係本發明之方法流程圖三。 第1 0圖，係本發明之方法流程圖四 第1 1圖，係曝光顯影流程圖一。 第1 2圖，係曝光顯影流程圖二。 【圖式符號說明】 習知 1 .....玻璃基板 2 .....光阻劑 3 .....光罩 4 .....金屬層 5 .....金屬底座 6 .....導光板模仁 ^本發明 10.....金屬基板 2 0.....非金屬層Page 7 of 1241438 V. Description of the invention (3) ---- Metal layer 9 ("Figure 7"), which uses the photolithography process * ^ _ ° ° metal substrate 1 0, without the non-metal Layer 2 0 | • A layer of non-electroplated metal layer 3 on non-different ® and electricity or chemical mine processes (such as "Figure 8") is a characteristic of the pre-recording process, which can only be applied to metal The surface sinks / shut, so the basin mouth Ah, the field deposits gold? &Quot; b when there is no non-metal layer 2 on the metal substrate 10, and when the thickness of the deposited metal is not greater than the non-metallic metal, it will cover the non-metallic layer. On the metal layer 20; electric ore or electroless plating: the material types are quite wide and mature, the common methods are electroless nickel plating, electroless copper and other metal coating methods, white can be applied. , C • Remove the non-metallic layer 20 (such as "Figure 9"), and the liquid can be removed. The cleaning solution can dissolve the non-metallic layer 20 and has no effect on the metal layer metal substrate 10, which can be water. Or an etching solution, etc. d. A surface layer 40 (such as "Fig. 10") on the surface of the metal substrate 10 and the metal layer 30 can be formed by electroless plating. Electrolytic nickel, electroless iron, and electroless plating are based on immersing the articles to be coated in chemicals, and using the "reduction" or emulsification reduction reaction, the metal ions of the metal salt aqueous solution are deposited on the surface to complete the coating. According to the above steps, a metal substrate with a layer 40 covered on the surface and a specific low undulation (pattern) can be produced. 1 Q is a surface layer 40 formed by an electroless nickel plating method. It is greater than that; because of the 20 layer process of the MPF 0, no electricity is used here. The method of forming 30 and 0 • is used; etc .; it is reflected on the surface of the product, and its 1241438 V. Description of the invention (4 ): Phosphorous alloy 'has high surface lubricity and resistance to friction and corrosion. LI 1¾ j A preferred embodiment of the foregoing step a, is to open the surface of the metal substrate 10 by using the method of developing first by exposure, and then wipe off. Non-metal layer with a specific pattern of one layer, photoresist two: llslj 'It is first coated on the metal substrate 10 :: (non-metal layer 2 〇)' Please refer to "the " drawing" again, which benefits μ r ^ M M775U1 The first cover 50 covers the metal substrate i 0 coated with a photoresist layer (non-metal layer 20), and then (usually ultraviolet light) is applied to the photoresist layer (non-metal layer 2 2 domain plus a through soil) < 荀 ㉝ζ υ) Unexplained to the blocked area = The exposed photoresist layer (non-metal 12 〇) is hardened; Ξ 定 Ξ: The liquid ions can be formed on the metal substrate 10 after the effect, The patterned photoresist layer (non-metallic layer 20), as known in "Figure 7", differs greatly in the simplification of the process, the product of the product, and the removal of the metal base, which must be based on the electroforming process. In the manufacturing process, Nihon Pq hits 6g with Ik, which means that the gap between the fields is longer, but the present invention does not make use of it, i $ I, idays, and u are more familiar. Lang II materials and the simplification of the process of the process: the final version: i is only a preferred embodiment of the invention, not to limit the actual cost of what = =, that is, according to the invention patent application model The content of pounds of such modifications and equivalent "are art should present invention Van. 1241438 Schematic description [Schematic description] Figure 1, is the first flowchart of the conventional method. Figure 2 is the second flowchart of the conventional method. Figure 3 is the third flowchart of the conventional method. Figure 4 is the fourth flowchart of the conventional method. Figure 5 is the fifth flowchart of the conventional method. Figure 6 is a flowchart of the conventional method. FIG. 7 is a first flowchart of the method of the present invention. FIG. 8 is a second flowchart of the method of the present invention. Figure 9 is the third flowchart of the method of the present invention. FIG. 10 is a flowchart of the method of the present invention. FIG. 11 is a flowchart of the exposure and development. Figure 12 is the second flowchart of exposure and development. [Illustration of Symbols] Convention 1 ..... glass substrate 2 ..... photoresist 3 ..... photomask 4 ..... metal layer 5 ..... metal base 6 ..... Light guide plate mold core ^ The present invention 10 ..... Metal substrate 2 0 ..... Non-metallic layer
第10頁 1241438 圖式簡單說明 3 0.....金屬層 4 0.....表面層 5 0.....光罩 5 0 1 · · · ·不透光部份 6 0.....曝光光線 7 0.....導光板模仁 _Page 10 1241438 Brief description of the drawing 3 0 ..... metal layer 4 0 ..... surface layer 5 0 ..... mask 5 0 1 · · · · opaque part 6 0. .... exposure light 7 0 ..... light guide plate mold _
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